PHILIPS TEA1083

INTEGRATED CIRCUITS
DATA SHEET
TEA1083; TEA1083A
Call progress monitor for line
powered telephone sets
Product specification
File under Integrated circuits, IC03A
March 1994
Philips Semiconductors
Product specification
Call progress monitor for line powered
telephone sets
TEA1083; TEA1083A
a loudspeaker during on-hook dialling. The TEA1083/83A
is intended for use in conjunction with a transmission
circuit of the TEA1060 family. The device uses a part of the
available line current via the internal supply circuit.
The loudspeaker amplifier, which consists of a preamplifier
and a power amplifier, amplifies the received line signals
from the transmission circuit when enabled via the LSE
input. The loudspeaker amplifier can also be used to
amplify dialling tones from the dialler IC. The power
amplifier contains a push-pull output stage to drive the
loudspeaker in a Single Ended Load (SEL) configuration.
The internal voltage stabilizer can be used to supply
external devices. By activating the power-down (PD) input
of the TEA1083A, the current consumption of the circuit
will be reduced, this enables pulse dialling or flash (register
recall).
An internal start circuit ensures normal start-up of the
transmission IC.
FEATURES
• Internal supply
– Optimum current split-up
– Low constant current (adjustable) in transmission IC
– Nearly all line current available for monitoring
– Stabilized supply voltage
• Loudspeaker amplifier with a fixed gain of 35 dB
• Volume controlled by potentiometer
• Power-down input (TEA1083A only)
• Loudspeaker enable input.
GENERAL DESCRIPTION
The TEA1083/83A is a bipolar IC which has been
designed for use in line powered telephone sets. It is
intended to offer a monitoring facility of the line signal via
QUICK REFERENCE DATA
SYMBOL
PARAMETER
ISUP
input current range
CONDITIONS
VBB
stabilized supply current
ISUP
current consumption
Gv
voltage gain of loudspeaker amplifier
ISUP
minimum input current
Tamb
operating ambient temperature range
PD = HIGH; TEA1083A only
PO = 10 mW (typ) into 50 Ω
MIN.
TYP.
MAX.
UNIT
3.0
−
120
mA
−
2.95
−
V
−
50
−
µA
−
35
−
dB
−
10
−
mA
−25
−
+75
°C
ORDERING INFORMATION
EXTENDED TYPE
NUMBER
PACKAGE
PINS
PIN POSITION
MATERIAL
CODE
TEA1083
8
DIL
PLASTIC
SOT97D(1)
TEA1083A
16
DIL
PLASTIC
SOT38(2)
TEA1083AT
16
SOL
PLASTIC
SOT162AG(3)
Notes
1. SOT97-1; 1998 Jun 18.
2. SOT38-1; 1998 Jun 18.
3. SOT162-1; 1998 Jun 18.
March 1994
2
Philips Semiconductors
Product specification
Call progress monitor for line powered
telephone sets
handbook, full pagewidth
SREF
VSS
LSI1
LSI2
LSE
3
SUP
VBB
2
8
TEA1083; TEA1083A
SUPPLY
STARTCIRCUIT
PREAMPLIFIER
POWER
AMPLIFIER
1
4
5
6
ENABLE
CIRCUIT
7
QLS
TEA1083
MGR045
Fig.1 Block diagram (TEA1083).
SUP
handbook, full pagewidth
VBB
2
SREF
PD
VSS
LSI1
LSI2
LSE
16
3
12
SUPPLY
PD
STARTCIRCUIT
PREAMPLIFIER
POWER
AMPLIFIER
1
8
9
13
3, 5, 6, 7,
10, 11, 14
ENABLE
CIRCUIT
15
TEA1083A
TEA1083AT
MGR046
n.c.
Fig.2 Block diagram (TEA1083A/AT).
March 1994
3
QLS
Philips Semiconductors
Product specification
Call progress monitor for line powered
telephone sets
TEA1083; TEA1083A
handbook, halfpage
handbook, halfpage
VSS 1
8 VBB
SUP 2
7
QLS
6
LSE
5
LSI2
3
LSI1
4
16 VBB
SUP 2
15 QLS
n.c. 3
14 n.c.
SREF 4
13 LSE
TEA1083A
n.c. 5 TEA1083AT 12 PD
TEA1083
SREF
VSS 1
n.c. 6
11 n.c.
n.c. 7
10 n.c.
MGR047
LSI1 8
9
LSI2
MGR048
Fig.3 Pin configuration (TEA1083).
Fig.4 Pin configuration (TEA1083A/AT).
PINNING
SYMBOL
PIN
DIL16
PIN
DIL8
DESCRIPTION
VSS
1
1
negative supply terminal
SUP
2
2
positive supply terminal
n.c.
3
−
not connected
SREF
4
3
supply reference input
n.c.
5
−
not connected
n.c.
6
−
not connected
n.c.
7
−
not connected
LSI1
8
4
loudspeaker amplifier input 1
LSI2
9
5
loudspeaker amplifier input 2
n.c.
10
−
not connected
n.c.
11
−
not connected
PD
12
−
power-down input
LSE
13
6
loudspeaker enable input
n.c.
14
−
not connected
QLS
15
7
loudspeaker amplifier output
VBB
16
8
stabilized supply voltage
March 1994
4
Philips Semiconductors
Product specification
Call progress monitor for line powered
telephone sets
Table 1
TEA1083; TEA1083A
Comparison of the TEA108X family.
PRODUCT
Application area
CONDITIONS
TEA1083
note 1
TEA1083A
call progress monitoring
TEA1085/85A
listening-in
−
X
X
X
X
X
Dynamic limiter
−
−
X
Howling limiter
−
−
X
VBB setting
−
−
X
PD facility
MUTE or LSE facility
note 2
SEL
note 3
X
X
X
BTL
note 3
−
−
X
Number of pins
note 4
8
16
24
Notes
FUNCTIONAL DESCRIPTION
1. A call progress monitor is recommended by the
European Telecommunications Standards Institute
(ETSI) for telephone sets with automatic on-hook
dialling facilities so that audible, or visual, progress of
a call attempt can be monitored. In accordance with
the ETSI (at a frequency of 440 Hz and a line level of
20 dBm (600 Ω)), a minimum level of 50 dBA shall be
guaranteed at a distance of 50 cm from the set. This
corresponds to a minimum level of approximately
100 mV (RMS) (PO ≥ 0.2 mW) across a loudspeaker;
Philips type AD2071/Z50.
The TEA1083/83A is normally used in conjunction with a
transmission circuit of the TEA1060 family. The circuit
must be connected between the positive line terminal
(pin 2) and pin SLPE of the transmission IC. The
transmission characteristics (impedance, gain settings,
etc.) are not affected.
An interconnection between the TEA1083/83A and a
member of the TEA1060 family is illustrated in Fig.5.
Supplies SUP, SREF, VBB and VSS
In Fig.6 the line current is divided into ITR for the
transmission IC and ISUP for the monitoring circuit
TEA1083/83A.
A listening-in set has to offer the user more facilities
e.g. howling limiting to reduce annoying loudspeaker
and line signals. Dynamic limiting of the loudspeaker
signal, with respect to supply conditions, can also be
required. Acoustic output levels for listening-in sets are
approximately 70 to 75 dBA. This corresponds to a
loudspeaker level of approximately 1 mV (RMS)
(PO ≈ 20 mW).
ITR is constant:
ITR = Vint / R20
ISUP = Iline − ICC − ITR
Where:
2. The MUTE function of the TEA1085A has a logic input;
the MUTE function of the TEA1085 has a toggle input.
• Vint is an internal temperature compensated reference
voltage of 500 mV (typ) between pins SUP and SREF
3. SEL: loudspeaker connected in a single-ended-load
configuration
BTL: loudspeaker connected in a bridge-tied-load
configuration
• R20 is a resistor connected between SUP and SREF
• ICC is the internal current consumption of the TEA106X
(approximately 1 mA).
A practical value for resistor R20 is 150 Ω; this produces a
current of approximately 3.3 mA (typ) for ITR and ISUP is
approximately equal to Iline − 4.3 mA.
4. Consult the product specification for the package
outline/s.
March 1994
5
Philips Semiconductors
Product specification
Call progress monitor for line powered
telephone sets
The circuit stabilizes its own supply voltage at VBB.
Transistor TR1 provides the supplies for the internal
circuits. Transistor TR2 is used to minimize signal
distortion on the line by momentarily diverting the input
current to VSS whenever the instantaneous value of the
voltage at VSUP drops below the supply voltage VBB. VBB is
fixed to a typical value of 2.95 V.
The supply at VBB is decoupled with respect to VSS by a
220 µF capacitor (C20).
The maximum voltage swing at the QLS output is
VO(p-p) = 2.5 V (typical with 50 Ω load). The input level
VLSI is approximately 16 mV(rms) and the supply current
ISUP > 11 mA. In this condition the signal is limited by the
available voltage space (VBB). Higher input levels and/or
lower supply currents will result in an increase of the
harmonic distortion due to signal clipping.
With a limit of 2.5 V (p-p), the maximum output swing is
dependent on the supply current and loudspeaker
impedance. It can be approximated, for low distortions, by
the following equation:
The DC voltage (VSUP − VSS) is determined by the
transmission IC and Vint; thus
VSUP − VSS = VLN−SLPE + Vint.
The reference voltage of the transmission IC has to be
adjusted to a level where VSUP − VBB (max) is greater than
400 mV. The minimum voltage space between SUP and
VBB (400 mV) is required to maintain a 'high' efficiency of
the internal supply for mean speech levels. VBB (max) is the
specified maximum level.
VO(p-p) = 2 × (ISUP − ISUPO) × π × RLS
Where;
• VO(p-p) = the peak-to-peak level of the loudspeaker
• RLS = the loudspeaker impedance
• ISUPO = 2.5 mA (typ.)
The internal current consumption of the TEA1083/83A
(ISUP0) is typically 2.5 mA (where VSUP − VSS = 3.6 V).
The current ISUP0 consists of currents IBIAS (approximately
0.4 mA) for the circuitry connected to SUP and IBB0
(approximately 2.1 mA) for the internal circuitry connected
to VBB (see Fig.6).
POWER-DOWN INPUT (PD)
During pulse dialling or register recall (timed loop break)
the telephone line is interrupted, thereby breaking the
supply current to the transmission IC. The capacitor
connected to VBB provides the supply for the
TEA1083/83A during the supply breaks.
LOUDSPEAKER AMPLIFIER (LSI1/LSI2 and QLS)
By making the PD input HIGH during the loop break, the
requirement on the capacitor is eased and, consequently,
the internal current consumption IBB0 (see Fig.5) is
reduced from 2.1 mA to 400 µA typically. Transistors TR1
and TR2 are inhibited during power-down and the bias
current is reduced from approximately 400 µA to
approximately 50 µA with VSUP = 3.6 V in the following
equation:
The TEA1083/83A has symmetrical inputs at LSI1 and
LSI2. The input signal is normally taken from the earpiece
output of the transmission circuit (see Fig.5) and/or from
the signal output of the DTMF generator via a resistive
attenuator.
The attenuation factor must be chosen in accordance with
the output levels from the transmission IC and/or DTMF
generator and, in accordance with the required output
power and permitted signal distortion from the
loudspeaker signal.
ISUP(PD) = IBIAS(PD) = (VSUP − 2Vd)/Ra
Where 3.6 < VSUP < VBB + 3 V
2Vd is the voltage drop across 2 internal diodes
(approximately 1.3 V)
The output QLS drives the loudspeaker as a single-ended
load. The output stage has been optimized for use with a
50 Ω loudspeaker (e.g. Philips type AD2071). The
loudspeaker amplifier is enabled when the LSE input goes
HIGH. The gain of the amplifier is fixed at 35 dB.
Ra is an internal resistor (typical 50 kΩ)
LOUDSPEAKER ENABLE INPUT (LSE)
Volume control of the loudspeaker signal can be obtained
by using a level control at the input (see Fig.5).
March 1994
TEA1083; TEA1083A
The LSE input has a pull-down structure. It switches the
loudspeaker amplifier, in the monitoring condition, by
applying a HIGH level at the input. The amplifier is in the
standby condition when LSE is LOW (input open-circuit or
connected to VSS).
6
Philips Semiconductors
Product specification
Call progress monitor for line powered
telephone sets
TEA1083; TEA1083A
handbook, full pagewidth
VCC
LN
SREF
MIC
PD
QR
LSE
TEA106x
IR
line
VEE
TEA1083
QLS
TEA1083A
LSI1
SLPE
SUP VBB
LSI2 VSS
MGR049
Fig.5 Interconnection with a transmission IC of the TEA106X family.
handbook, full pagewidth
Iline
ISUP
VSUP
ICC
R1
ITR
SUP
R20
TR2
Vint
VCC
IBBO
LN
TR1/TR2
CONTROL
TEA1083
TEA1083A
line
SLPE
IBIAS
C1
C28
VSS
SLPE
R9
VEE
Fig.6 Supply arrangement.
March 1994
VOLTAGE
STABILIZER
SREF
TEA106x
VEE
VBB
TR1
7
MGR050
Philips Semiconductors
Product specification
Call progress monitor for line powered
telephone sets
TEA1083; TEA1083A
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC134)
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
Supply voltage
VSUP
continuous
−
12
V
during switch-on or line interruption
−
13.2
V
VSUP
Repetitive supply voltage from 1 ms to
5 s with 12 Ω current limiting resistor
in series with supply
−
28
V
VSREF
Supply reference voltage
VSS − 0.5
VSUP + 0.5
V
V
Voltage on all other pins
VSS − 0.5
VBB + 0.5
V
ISUP
Supply current
see Fig.6
−
120
mA
Ptot
Total power dissipation
Tamb = 75 °C; Tj = 125 °C
TEA1083
−
500
mW
TEA1083A
−
769
mW
TEA1083AT
−
555
mW
Tstg
Storage temperature range
−40
+125
°C
Tamb
Operating ambient temperature range
−25
+75
°C
Tj
Junction temperature
−
+125
°C
THERMAL RESISTANCE
SYMBOL
Rth j-a
March 1994
PARAMETER
THERMAL RESISTANCE
from junction to ambient in free air (TEA1083)
100 K/W
from junction to ambient in free air (TEA1083A)
65 K/W
from junction to ambient in free air (TEA1083AT)
90 K/W
8
Philips Semiconductors
Product specification
Call progress monitor for line powered
telephone sets
TEA1083; TEA1083A
MGR051
MGR052
handbook, halfpage
handbook, halfpage
120
ISUP
120
ISUP
(mA)
(mA)
100
(1)
100
(2)
(3)
(1)
(2)
80
80
(3)
60
60
40
40
4
2
6
8
10
12
VSUP − VSS (V)
4
2
Fig.8
Fig.7 Safe operating area; see Table 2 (TEA1083).
6
8
10
12
VSUP − VSS (V)
Safe operating areas see Table 3
(TEA1083A).
Table 2
CURVE
MGR053
handbook, halfpage
120
ISUP
Tamb
Ptot
1
55 °C
700 mW
2
65 °C
600 mW
3
75 °C
500 mW
Tamb
Ptot
1
55 °C
1077 mW
2
65 °C
923 mW
3
75 °C
769 mW
Tamb
Ptot
1
55 °C
777 mW
2
65 °C
666 mW
3
75 °C
555 mW
(mA)
Table 3
100
CURVE
(1)
(2)
80
(3)
60
Table 4
40
CURVE
4
2
Fig.9
6
8
10
12
VSUP − VSS (V)
Safe operating area; see Table 4
(TEA1083AT).
March 1994
9
Philips Semiconductors
Product specification
Call progress monitor for line powered
telephone sets
TEA1083; TEA1083A
CHARACTERISTICS
VSUP = 3.6 V; VSS = 0 V; ISUP = 15 mA; VSUP = 0 V (RMS); f = 800 Hz; Tamb = 25 °C; PD = LOW; LSE = HIGH;
loudspeaker amplifier load = 50 Ω; all measurements taken in test circuit Fig.10; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VSUP
Minimum DC input voltage
−
VBB + 0.6
−
V
VSUP−SREF
Internal reference voltage
400
500
600
mV
VBB
Stabilized supply voltage
2.75
2.95
3.15
V
ISUP = 15 mA
∆VBB
Variation of supply voltage
from ISUP = 15 to 120 mA −
15
−
mV
∆VBB/∆T
Variation of supply voltage with
temperature, referred to 25 °C
Tamb = −25 to +75 °C;
Isup = 15 mA
−
±0.2
−
mV/K
ISUP
Minimum operating current
−
2.5
4.0
mA
THD
Distortion of AC signal between
SUP and VEE
VSUP(RMS) = 1 V
−
0.3
−
%
Vno(RMS)
Noise between SUP and VEE
(RMS value)
psophometrically
weighted (P53 curve)
−
−71
−
dBmp
Current consumption in
power-down condition
PD = HIGH
ISUP
VSUP = 3.6 V
−
50
75
µA
IBB
VBB = 2.95 V
−
400
550
µA
Loudspeaker amplifier inputs LSI1 and LSI2
Zi
input impedance (LSI1 and LSI2) single ended
Gv
Voltage gain from LSI1/2 to QLS
∆Gv
Total gain variation with input
signal from 2 mV(RMS) to
10 mV(RMS)
∆G/∆T
Total gain variation with
temperature referred to 25 °C
7.5
9.5
11.5
kΩ
differential (LSI1 to LSI2)
15
19
23
kΩ
ISUP = 15 mA;
Vi = 2 mV (RMS)
34
35
36
dB
−
0.2
−
dB
Tamb = −25 to +75 °C
−
±0.4
−
dB
Output capabilities
VO(p-p)
Maximum output voltage
(peak-to-peak value)
THD = 3%; 50 Ω load
2.0
2.5
−
V
VO(p-p)
Output voltage (peak-to-peak
value)
Vi = 10 mV(RMS);
ISUP = 15 mA;
VSUP−VEE = 1 V (RMS)
−
1.6
−
V
Vno(RMS)
Noise output voltage (RMS
value)
1 kΩ between inputs
LSI1 and LSI2;
psophometrically
weighted (P53 curve)
−
250
−
µV
0
−
0.3
V
1.5
−
VBB
V
−
2.3
2.8
µA
Power-down input (PD) (TEA1083A only)
VIL
LOW level input voltage
VIH
HIGH level input voltage
IPD
Input current
March 1994
PD = HIGH
10
Philips Semiconductors
Product specification
Call progress monitor for line powered
telephone sets
SYMBOL
PARAMETER
TEA1083; TEA1083A
CONDITIONS
MIN.
TYP.
MAX.
UNIT
LSE input
VIL
LOW level input voltage
0
−
0.3
V
VIH
HIGH level input voltage
1.5
−
VBB
V
II
Input current
−
5
10
µA
∆G
Reduction of gain from LSI1/LSI2 LSE = LOW
to QLS
60
80
−
dB
LSE = HIGH
Iin
handbook, full pagewidth
R1
620 Ω
ICC
3
Iline
5
6
R20
150 Ω
ITR
15
2
ISUP
VSUP
A
VSUP − VSREF
IBB
1
VCC
3 (4)
LN
SREF
GAS1
MIC−
GAS2
MIC+
7
8
(13) 6
VCC
(12)
VCC
TEA1060
(8) 4
QR+
VLSI
GAR
VEE STAB
10
C1
100
µF
9
R5
3.6
kΩ
(9) 5
C3
4.7
µF
PD
LSI2
V SUP – SREF
I TR = -----------------------------R20
4. The pin numbers in parenthesis refer to the TEA1083A/AT
5. LSE has to be HIGH to measure the voltage gain
6. PD has to be HIGH to measure in PD conditions
7. The pins not shown in the TEA1060 are left open-circuit
8. An impedance in series with pin SUP (e.g. an ammeter) should
be avoided as it interferes with the values of ITR and ISUP.
March 1994
C21
220
µF VBB
TEA1083
(TEA1083A)
VO
VSS
RLS
50 Ω
MGR054
R9
20 Ω
1. ISUP = IIN − ITR
3.
7 (15)
1 (1)
18
Notes to figure 10
Vo
G v = 20 log ---------V LSI
QLS
LSI1
Fig.10 Test circuit.
2.
8 (16)
VBB
LSE
REG SLPE
16
2 (2)
SUP
11
C20
470
µF
Philips Semiconductors
Product specification
Call progress monitor for line powered
telephone sets
TEA1083; TEA1083A
APPLICATION INFORMATION
An application of the TEA1083/83A, in conjunction with a
member of the TEA1060 family, is illustrated in figure 11.
The TEA1083/83A is used for call progress monitoring
during on-hook dialling. The dialling facilities are
performed by a microcontroller (e.g. PCD3344,
PCD3349).
Only the most important components have been shown.
For detailed information refer to a data sheet of the
TEA1060 family.
The electronic hook switch can be replaced by a
mechanical system (hook switch) with a hold/release
function which is intended for on-hook dialling.
ook, full pagewidth
R1
620 Ω
R2
130 kΩ
15
C5
a/b
11
100 nF
line
R3
3.9 kΩ
b/a
7
8
14
R8
390 Ω
1
VCC
PD
GAR
MIC−
TEA1060
QR
SREF
12
6
R4
5
50 kΩ
C2
10 µF
MIC+
REG
10
Zbal
3 (4)
LN
IR
MUTE
VEE
L1
150 µH
R20
150 Ω
C1
100
µF
DTMF
SLPE
16
C3
4.7
µF
8 (16)
VBB
QLS
47 µF
TEA1083
(TEA1083A)
(12)
6
R21
(15)
C21
7
LSE
PD
(13)
2.2 kΩ
13
C14
150 nF
18
2 (2)
SUP
LSI1
C24
150 nF
4 (8)
C22
220
nF
R22
2.2
kΩ
R9
20 Ω
LSI2
VSS
5 (9)
1 (1)
C23
220
nF
line-interrupter
electronic
hook switch
MUTE
VDD
DP/FL
DTMF
ENABLE
MICROCONTROLLER AND
INTERFACE CIRCUITRY
CRS
cradle switch
VSS
XTAL
MGR055
Pin numbers in parenthesis refer to the TEA1083A/AT.
Fig.11 Application example when the TEA1083/83A is used in conjunction with the TEA1060.
March 1994
12
C20
220
µF
Philips Semiconductors
Product specification
Call progress monitor for line powered
telephone sets
TEA1083; TEA1083A
PACKAGE OUTLINES
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
ME
seating plane
D
A2
A
A1
L
c
Z
w M
b1
e
(e 1)
b
MH
b2
5
8
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches
0.17
0.020
0.13
0.068
0.045
0.021
0.015
0.042
0.035
0.014
0.009
0.39
0.36
0.26
0.24
0.10
0.30
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.045
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT97-1
050G01
MO-001AN
March 1994
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-02-04
13
Philips Semiconductors
Product specification
Call progress monitor for line powered
telephone sets
TEA1083; TEA1083A
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
ME
seating plane
D
A2
A
A1
L
c
e
Z
b1
w M
(e 1)
b
MH
9
16
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.7
0.51
3.7
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
2.54
7.62
3.9
3.4
8.25
7.80
9.5
8.3
0.254
2.2
inches
0.19
0.020
0.15
0.055
0.045
0.021
0.015
0.013
0.009
0.86
0.84
0.26
0.24
0.10
0.30
0.15
0.13
0.32
0.31
0.37
0.33
0.01
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT38-1
050G09
MO-001AE
March 1994
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-10-02
95-01-19
14
Philips Semiconductors
Product specification
Call progress monitor for line powered
telephone sets
TEA1083; TEA1083A
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
D
E
A
X
c
HE
y
v M A
Z
9
16
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
8
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
10.5
10.1
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
inches
0.10
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.41
0.40
0.30
0.29
0.050
0.419
0.043
0.055
0.394
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
Z
(1)
θ
8o
0o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT162-1
075E03
MS-013AA
March 1994
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
15
Philips Semiconductors
Product specification
Call progress monitor for line powered
telephone sets
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
March 1994
TEA1083; TEA1083A
16
Philips Semiconductors
Product specification
Call progress monitor for line powered
telephone sets
TEA1083; TEA1083A
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
March 1994
17
Philips Semiconductors
Product specification
Call progress monitor for line powered
telephone sets
NOTES
March 1994
18
TEA1083; TEA1083A
Philips Semiconductors
Product specification
Call progress monitor for line powered
telephone sets
NOTES
March 1994
19
TEA1083; TEA1083A
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For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1998
SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
415102/00/02/pp20
Date of release: March 1994
Document order number:
9397 750 nnnnn