MITSUBISHI MGF4953B

Nov./2006
MITSUBISHI SEMICONDUTOR <GaAs FET>
MGF4953B
SUPER LOW NOISE InGaAs HEMT (Leadless Ceramic Package)
DESCRIPTION
Outline Drawing
The MGF4953B super-low noise HEMT (High Electron Mobility
Transistor) is designed for use in K band amplifiers.
The lead-less ceramic package assures minimum parasitic losses.
FEATURES
Low noise figure
@ f=20GHz
NFmin. = 0.55dB (Typ.)
High associated gain
@ f=20GHz
Gs = 10.5dB (Typ.)
APPLICATION
C to K band low noise amplifiers
Fig.1
MITSUBISHI Proprietary
Not to be reproduced or disclosed
without permission by Mitsubishi Electric
QUALITY GRADE
GG
RECOMMENDED BIAS CONDITIONS
VDS=2V , ID=10mA
ORDERING INFORMATION
Tape & reel
3000pcs./reel
Keep Safety first in your circuit designs!
ABSOLUTE MAXIMUM RATINGS
Symbol
VGDO
VGSO
Parameter
Gate to drain voltage
(Ta=25°C )
Ratings
Unit
-4
V
Gate to source voltage
-4
V
ID
Drain current
60
mA
PT
Tch
Total power dissipation
50
mW
Channel temperature
125
°C
Tstg
Storage temperature
-65 to +125
°C
ELECTRICAL CHARACTERISTICS
Synbol
V(BR)GDO
Parameter
Mitsubishi Electric Corporation puts the maximum
effort into making semiconductor products better
and more reliable , but there is always the
possibility that trouble may occur with them.
Trouble with semiconductors may lead to personal
injury , fire or property damage. Remember to give
due consideration to safety when making your
circuit designs , with appropriate measure such
as (I) placement of substitutive , auxiliary circuits ,
(ii) use of non-flammable material or (iii) prevention
against any malfunction or mishap.
(Ta=25°C )
Test conditions
Limits
Unit
MIN.
TYP.
MAX
-3
--
--
Gate to drain breakdown voltage
IG=-10µA
IGSS
Gate to source leakage current
VGS=-2V,VDS=0V
--
--
50
µA
IDSS
Saturated drain current
VGS=0V,VDS=2V
15
--
60
mA
Gate to source cut-off voltage
VDS=2V,ID=500µA
-0.1
--
-1.5
V
Associated gain
VDS=2V,ID=10mA
9.0
10.5
--
dB
Minimum noise figure
f=20GHz
--
0.55
0.80
dB
VGS(off)
Gs
NFmin.
V
MITSUBISHI
(1/5)
Nov./2006
Nov./2006
MITSUBISHI SEMICONDUTOR <GaAs FET>
MGF4953B
SUPER LOW NOISE InGaAs HEMT (Leadless Ceramic Package)
Fig.1
Unit : mm
Top
Side
+0.20
2.15 -0.10
Bottom
)
05
0.
+0.20
-0.10
20
0±
2.15
②
2-R0.275
J 5
6EG
③
2)
.
(2
①
①
.0
(1
1.2
②
2-
2-
A
2-R0.20
③
②
②
4-
±
55
0.
0.20±0.1
0.80±0.1
20.5
0±
05
0.
(0.30)
Square shape electrode is Drain
(2.30)
from "A" side view
① Gate
② Source
③ Drain
MITSUBISHI
(2/5)
Nov./2006
05
0.
Nov./2006
MITSUBISHI SEMICONDUTOR <GaAs FET>
MGF4953B
SUPER LOW NOISE InGaAs HEMT (Leadless Ceramic Package)
TYPICAL CHARACTERISTICS
(Ta=25°C)
ID vs. VDS
ID VS. VGS
50
50
Ta=25℃
V DS=2V
40
DRAINDrain
CURRENT
D(mA)
(mA)
Current IID
DRAIN CURRENT ID(mA)
Drain Current ID(mA)
Ta=25℃
V GS=-0.1V/STEP
30
20
10
40
30
20
10
0
0
0
1
2
3
-1.00
Drain to Source voltage VDS(V)
DRAIN TO SOURCE VOLTAGE VDS(V)
-0.50
0.00
Gate
Source voltage
V GS(V)
GATE
TO to
SOURCE
VOLTAGE
VGS(V)
NF & Gs VS. ID
13
Ta=25℃
V DS=2V
f=20GHz
雑音指数 NF (dB)
NOISE FIGURE NF(dB)
1.2
1.1
12
11
Gs
1.0
10
0.9
9
0.8
8
0.7
7
NF
0.6
6
0.5
5
0.4
雑音最小電力利得
(dB)
ASSOCIATED
GAINGs Gs(dB)
1.3
4
0
5
10
15
20
ドレイン電流 ID (mA)
DRAIN CURRENT ID(mA)
MITSUBISHI
(3/5)
Nov./2006
Nov./2006
MITSUBISHI SEMICONDUTOR <GaAs FET>
MGF4953B
SUPER LOW NOISE InGaAs HEMT (Leadless Ceramic Package)
S PARAMETERS
(VDS=2V,ID=10mA, Ta=25°C)
Freq.
S11
S21
S12
S22
(GHz)
(mag)
(ang)
(mag)
(ang)
(mag)
(ang)
(mag)
1
0.989
-13.0
4.537
165.8
0.014
78.9
0.637
-9.7
2
0.973
-25.9
4.502
152.9
0.028
71.8
0.629
-19.6
3
4
0.949
0.926
-38.7
-52.0
4.472
4.460
140.4
127.3
0.041
0.054
62.7
53.2
0.621
0.608
-29.2
-39.0
5
0.890
-64.9
4.431
114.9
0.066
44.4
0.592
-48.2
6
7
0.828
0.776
-81.1
-95.6
4.394
4.311
99.8
86.3
0.076
0.085
33.4
24.1
0.539
0.505
-60.1
-70.2
8
0.723
-110.6
4.230
73.2
0.093
15.2
0.469
-80.4
9
10
0.662
0.605
-126.6
-142.6
4.094
3.943
59.9
47.4
0.099
0.102
5.4
-4.0
0.423
0.368
-90.7
-100.2
11
12
0.551
0.514
-158.2
-174.5
3.826
3.740
35.4
23.7
0.102
0.100
-12.9
-19.7
0.318
0.279
-108.8
-116.3
13
0.488
167.0
3.622
11.2
0.099
-28.1
0.232
-126.2
14
15
0.486
0.480
149.0
131.8
3.572
3.512
-1.1
-12.6
0.098
0.094
-32.1
-38.4
0.203
0.169
-138.3
-148.1
16
0.509
113.0
3.425
-26.2
0.099
-43.0
0.148
-175.1
17
18
0.536
0.569
95.1
78.2
3.349
3.226
-39.1
-52.1
0.099
0.100
-49.9
-58.5
0.133
0.132
157.1
120.7
19
0.609
62.7
3.091
-66.1
0.099
-66.5
0.160
92.2
20
21
0.642
0.674
47.3
34.3
2.934
2.752
-79.2
-91.8
0.096
0.091
-75.2
-83.8
0.204
0.250
67.8
50.6
22
0.707
21.1
2.617
-104.8
0.089
-92.5
0.293
37.0
23
24
0.742
0.753
9.2
-2.2
2.471
2.307
-117.4
-130.2
0.082
0.081
-102.8
-111.9
0.350
0.390
23.8
13.5
25
26
0.775
0.803
-12.5
-22.5
2.139
2.008
-142.4
-155.0
0.072
0.069
-118.9
-135.9
0.430
0.474
2.4
-5.7
NOISE PARAMETERS
Freq.
(GHz)
18
20
22
24
26
(VDS=2V,ID=10mA, Ta=25°C)
Γopt
(mag)
0.358
0.372
0.390
0.417
0.473
(ang)
Rn
(ang)
-137.2
-91.0
-47.7
-14.9
10.5
0.12
0.14
0.63
1.05
1.26
NFmin
(dB)
0.51
0.55
0.77
1.05
1.25
Note) Rn is normalized by 50ohm
Board: εr=2.6
thickness=0.4mm
HEMT mount
Drain
4-φ0.4
0.65
Reference Point
2.2mm
1.20
Gate
1.0mm
Reference Point
MITSUBISHI
(4/5)
Nov./2006
Nov./2006
MITSUBISHI SEMICONDUTOR <GaAs FET>
MGF4953B
SUPER LOW NOISE InGaAs HEMT (Leadless Ceramic Package)
Requests Regarding Safety Designs
Mitsubishi Electric constantly strives to raise the level of its quality and reliability. Despite these concerted efforts,
however, there will be occasions when our semiconductor products suffer breakdowns, malfunctions or other problems.
In view of this reality, it is requested that every feasible precaution be taken in the pursuit of redundancy design,
malfunction prevention design and other safety-related designs, to prevent breakdowns or malfunctions in our products
from resulting in accidents involving people, fires, social losses or other problems, thereby upholding the highest levels of
safety in the products when in use by customers.
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MITSUBISHI
(5/5)
Nov./2006