2SK3544 TOSHIBA Field-Effect Transistor Silicon N-Channel MOS Type (π-MOS V) 2SK3544 Unit: mm Switching Regulator Applications • • • • Low drain-source ON-resistance: RDS (ON) = 0.29 Ω (typ.) High forward transfer admittance: |Yfs| = 5.8 S (typ.) Low leakage current: IDSS = 100 μA (max) (VDSS = 450 V) Enhancement mode: Vth = 3.0 to 5.0 V (VDS = 10 V, ID = 1 mA) Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Drain–source voltage VDSS 450 V Drain–gate voltage (RGS = 20 kΩ) VDGR 450 V Gate–source voltage VGSS ±30 V DC (Note 1) ID 13 Pulse (Note 1) IDP 52 Drain power dissipation (Tc = 25°C) PD 100 W Single-pulse avalanche energy (Note 2) EAS 350 mJ Avalanche current IAR 13 A Repetitive avalanche energy (Note 3) EAR 4.5 mJ Channel temperature Tch 150 °C Storage temperature range Tstg −55 to 150 °C Drain current A JEDEC ― JEITA ― TOSHIBA 2-9F1C Weight: 0.74 g (typ.) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Thermal Characteristics Characteristics Thermal resistance, channel to case 4 Symbol Max Unit Rth (ch-c) 1.25 °C/W 1 Note 1: Ensure that the channel temperature does not exceed 150°C. Note 2: VDD = 90 V, Tch = 25°C (initial), L = 3.46 mH, RG = 25 Ω, IAR = 13 A 3 Note 3: Repetitive rating: pulse width limited by maximum channel temperature This transistor is an electrostatic-sensitive device. Handle with care. 1 2009-09-29 2SK3544 Electrical Characteristics (Ta = 25°C) Characteristics Symbol Typ. Max Unit VGS = ±25 V, VDS = 0 V ⎯ ⎯ ±10 μA V (BR) GSS IG = ±10 μA, VDS = 0 V ±30 ⎯ ⎯ V IDSS VDS = 450 V, VGS = 0 V ⎯ ⎯ 100 μA Drain cutoff current Drain–source breakdown voltage Min IGSS Gate leakage current Gate–source breakdown voltage Test Condition V (BR) DSS ID = 10 mA, VGS = 0 V 450 ⎯ ⎯ V Vth VDS = 10 V, ID = 1 mA 3.0 ⎯ 5.0 V Gate threshold voltage Drain–source ON-resistance RDS (ON) VGS = 10 V, ID = 6 A ⎯ 0.29 0.4 Ω Forward transfer admittance ⎪Yfs⎪ VDS = 10 V, ID = 6 A 3.0 5.8 ⎯ S Input capacitance Ciss ⎯ 1600 ⎯ Reverse transfer capacitance Crss ⎯ 17 ⎯ Output capacitance Coss ⎯ 220 ⎯ ⎯ 28 ⎯ ⎯ 45 ⎯ Rise time VDS = 25 V, VGS = 0 V, f = 1 MHz tr ton Switching time Fall time tf Turn-off time Duty < = 1%, tw = 10 μs toff Total gate charge Qg Gate–source charge Qgs Gate–drain charge Qgd Output RL = 33.3 Ω 10 Ω Turn-on time ID = 6 A 10 V VGS 0V pF ns ⎯ 10 ⎯ ⎯ 56 ⎯ ⎯ 34 ⎯ ⎯ 19 ⎯ ⎯ 15 ⎯ VDD ∼ − 200 V VDD ∼ − 360 V, VGS = 10 V, ID = 13 A nC Source–Drain Ratings and Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ. Max Unit Continuous drain reverse current (Note 1) IDR ⎯ ⎯ ⎯ 13 A Pulse drain reverse current IDRP ⎯ ⎯ ⎯ 52 A (Note 1) Forward voltage (diode) VDSF IDR = 13 A, VGS = 0 V ⎯ ⎯ −1.7 V Reverse recovery time trr IDR = 13 A, VGS = 0 V, ⎯ 300 ⎯ ns Reverse recovery charge Qrr dIDR/dt = 100 A/μs ⎯ 3.4 ⎯ μC Marking K3544 Note 4: A dot marking for identifying the indication of product Labels. Part No. (or abbreviation code) [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]] Lot No. Note 4 Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 2 2009-09-29 2SK3544 ID – VDS Common source Tc = 25°C Pulse test ID – VDS 20 7.5 10 Drain current ID (A) 8 15 7.0 6 4 6.5 VGS = 6.0 V 2 15 10 8.5 Common source Tc = 25°C Pulse test 8.25 16 7.25 Drain current ID (A) 10 8 12 7.5 8 7 6.5 4 VGS = 6 V 0 0 2 4 6 Drain–source voltage 8 0 0 10 VDS (V) 10 20 Drain–source voltage ID – VGS VDS (V) 25 10 Tc = −55°C 100 6 9 Gate–source voltage Common source Tc = 25°C Pulse test 6 ID = 13 A 4 6 2 3 VGS (V) 4 8 (Ω) (S) Forward transfer admittance ⎪Yfs⎪ 10 Drain–source ON-resistance RDS (ON) Tc = −55°C 25 100 1 1 16 20 VGS (V) RDS (ON) – ID VDS = 20 V 0.1 0.1 12 Gate–source voltage ⎪Yfs⎪ – ID Pulse test VDS (V) 8 0 0 12 50 Common source 50 VDS – VGS 20 0 3 40 10 Common source VDS = 20 V Pulse test Drain–source voltage Drain current ID (A) 30 30 10 100 Drain current ID (A) 10 Common source Tc = 25°C Pulse test 1 VGS = 10 V 15 0.1 0.1 1 10 100 Drain current ID (A) 3 2009-09-29 2SK3544 RDS (ON) – Tc IDR – VDS 1.0 100 Common source Pulse test 6 ID = 13 A 0.6 Tc = 25°C 3 0.4 0.2 Pulse test 10 1 10 3 1 5 −40 0 40 80 Case temperature Tc 120 0.1 0 160 (°C) −0.2 −0.4 Vth (V) Ciss Gate threshold voltage Capacitance C (pF) 1000 Coss Common 10 source VGS = 0 V f = 1 MHz Crss 1 10 100 Drain–source voltage Common source VDS = 10 V ID = 1 mA Pulse test 5 4 3 2 1 0 −80 Tc = 25°C 1 0.1 −40 0 40 80 Case temperature Tc 1000 PD – Tc 160 (°C) Dynamic input/output characteristics 500 VDS (V) 160 Drain–source voltage 120 80 40 80 120 VDS (V) 200 40 −1.2 VDS (V) 6 100 −1 Vth – Tc Capacitance – VDS Drain power dissipation PD (W) −0.8 Drain–source voltage 10000 0 0 −0.6 120 Case temperature Tc 160 400 300 (°C) VDD = 90 V VDS 16 12 VGS 200 20 180 360 8 4 100 0 0 200 Common source ID = 13 A Tc = 25°C Pulse test 10 20 30 40 VGS (V) 0 −80 VGS = 0, −1 V Gate–source voltage 0.8 (A) VGS = 10 V Drain reverse current IDR Drain–source ON-resistance RDS (ON) (Ω) Common source 0 50 Total gate charge Qg (nC) 4 2009-09-29 2SK3544 rth – tw Normalized transient thermal impedance rth (t)/Rth (ch-c) 10 1 Duty = 0.5 0.2 PDM 0.1 0.1 t 0.05 0.02 0.01 T Duty = t/T Rth (ch-c) = 1.25°C/W Single Pulse 単発 0.01 10 μ 100 μ 1m 10 m Pulse width 100 m tw 1 10 (s) EAS – Tch Safe operating area 400 100 ID max (pulse) * 30 ID max (continuous) 100 μs * (A) 10 Drain current ID Avalanche energy EAS (mJ) 50 1 ms * 5 3 DC operation Tc = 25°C 1 0.5 300 200 100 0 25 0.3 50 75 100 125 150 Channel temperature (initial) Tch (°C) * Single nonrepetitive pulse Tc = 25°C 0.1 Curves must be derated linearly 0.05 0.03 with increase in temperature. 3 10 30 Drain–source voltage VDSS max 100 300 15 V 1000 BVDSS IAR −15 V VDS (V) VDD Test circuit RG = 25 Ω VDD = 90 V, L = 3.46 mH 5 VDS Waveform Ε AS = ⎛ ⎞ 1 B VDSS ⎟ ⋅ L ⋅ I2 ⋅ ⎜ ⎜B ⎟ 2 − ⎝ VDSS VDD ⎠ 2009-09-29 2SK3544 RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS. • Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 6 2009-09-29