TK4P60DA MOSFETs Silicon N-Channel MOS (π-MOS) 1. Applications • Switching Voltage Regulators 2. Features (1) Low drain-source on-resistance: RDS(ON) = 1.7 Ω (typ.) (VGS = 10 V) (2) High forward transfer admittance: |Yfs| = 2.2 S (typ.) (3) Low leakage current: IDSS = 10 µA (max) (VDS = 600 V) (4) Enhancement mode: Vth = 2.4 to 4.4 V (VDS = 10 V, ID = 1 mA) 3. Packaging and Internal Circuit 1: Gate 2: Drain (heatsink) 3: Source DPAK unless otherwise specified) 4. Absolute Maximum Ratings (Note) (Ta = 25 25 Characteristics Symbol Rating Unit Drain-source voltage VDSS 600 V Gate-source voltage VGSS ±30 Drain current (DC) (Note 1) ID 3.5 Drain current (pulsed) (Note 1) IDP 14 PD 80 W (Note 2) EAS 132 mJ IAR 3.5 A (Note 3) EAR 8 mJ Power dissipation Single-pulse avalanche energy (Tc = 25) Avalanche current Repetitive avalanche energy Channel temperature Tch 150 Storage temperature Tstg -55 to 150 Note: 1/8 A Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). www.freescale.net.cn 5. Thermal Characteristics Characteristics Symbol Max Unit Channel-to-case thermal resistance Rth(ch-c) 1.56 /W Channel-to-ambient thermal resistance Rth(ch-a) 125 Note 1: Ensure that the channel temperature does not exceed 150. Note 2: VDD = 90 V, Tch = 25 (initial), L = 18.9 mH, RG = 25 Ω, IAR = 3.5 A Note 3: Repetitive rating; pulse width limited by maximum channel temperature. Note: 2/8 This transistor is sensitive to electrostatic discharge and should be handled with care. www.freescale.net.cn 6. Electrical Characteristics unless otherwise specified) 6.1. Static Characteristics (Ta = 25 25 Characteristics Symbol Gate leakage current IGSS Drain cut-off current Drain-source breakdown voltage Test Condition VGS = ±30 V, VDS = 0 V IDSS VDS = 600 V, VGS = 0 V V(BR)DSS Gate threshold voltage Min Typ. Max Unit ±1 µA 10 ID = 10 mA, VGS = 0 V 600 V Vth VDS = 10 V, ID = 1 mA 2.4 4.4 Drain-source on-resistance RDS(ON) VGS = 10 V, ID = 1.8 A 1.7 2.2 Ω Forward transfer admittance |Yfs| VDS = 10 V, ID = 1.8 A 0.6 2.2 S Min Typ. Max Unit 490 pF 3 55 18 unless otherwise specified) 6.2. Dynamic Characteristics (Ta = 25 25 Characteristics Symbol Input capacitance Ciss Reverse transfer capacitance Crss Output capacitance Coss Test Condition VDS = 25 V, VGS = 0 V, f = 1 MHz Switching time (rise time) tr Switching time (turn-on time) ton 40 tf 8 toff 55 Min Typ. Max Unit 11 nC Switching time (fall time) Switching time (turn-off time) See Figure 6.2.1 ns Fig. 6.2.1 Switching Time Test Circuit 6.3. Gate Charge Characteristics (Ta = 25 unless otherwise specified) 25 Characteristics Symbol Test Condition VDD ≈ 400 V, VGS = 10 V, ID = 3.5 A Total gate charge (gate-source plus gate-drain) Qg Gate-source charge Qgs 6 Gate-drain charge Qgd 5 Min Typ. Max Unit 3.5 A unless otherwise specified) 25 6.4. Source-Drain Characteristics (Ta = 25 Characteristics Test Condition Symbol Reverse drain current (DC) (Note 1) Reverse drain current (pulsed) (Note 1) IDR IDRP 14 Diode forward voltage VDSF IDR = 3.5 A, VGS = 0 V -1.7 V Reverse recovery time trr 1000 ns Reverse recovery charge Qrr IDR = 3.5 A, VGS = 0 V dIDR/dt = 100 A/µs 5.0 µC Note 1: Ensure that the channel temperature does not exceed 150. 3/8 www.freescale.net.cn 7. Marking (Note) Fig. 7.1 Marking Note: 4/8 A line under a Lot No. identifies the indication of product Labels. Not underlined: [[Pb]]/INCLUDES > MCV Underlined: [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]] Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. www.freescale.net.cn 8. Characteristics Curves (Note) 5/8 Fig. 8.1 ID - VDS Fig. 8.2 ID - VDS Fig. 8.3 ID - VGS Fig. 8.4 VDS - VGS Fig. 8.5 |Yfs| - ID Fig. 8.6 RDS(ON) - ID www.freescale.net.cn 6/8 Fig. 8.7 RDS(ON) - Ta Fig. 8.8 IDR - VDS Fig. 8.9 Capacitance - VDS Fig. 8.10 Vth - Ta Fig. 8.11 PD - Tc (Guaranteed Maximum) Fig. 8.12 Dynamic Input/Output Characteristics www.freescale.net.cn Fig. 8.13 rth(t)/Rth(ch-c) - tw (Guaranteed Maximum) Fig. 8.14 Safe Operating Area (Guaranteed Maximum) Fig. 8.15 EAS - Tch (Guaranteed Maximum) Fig. 8.16 Test Circuit/Waveform 7/8 www.freescale.net.cn Package Dimensions Unit: mm Weight: 0.36 g (typ.) 8/8 www.freescale.net.cn