SHENZHENFREESCALE TK4P55D

TK4P55D
Silicon N Channel MOS Type (π-MOSⅦ)
Switching Regulator Applications
1.08±0.2
Low drain-source ON-resistance: RDS (ON) = 1.5 Ω (typ.)
High forward transfer admittance: ⎪Yfs⎪ = 2.0 S (typ.)
Low leakage current: IDSS = 10 μA (max) (VDS = 550 V)
Enhancement-mode: Vth = 2.4 to 4.4 V (VDS = 10 V, ID = 1 mA)
0.58MAX
6.1 ± 0.12
+0.4
−0.6
6.6 ± 0.2
5.34 ± 0.13
10.0
1.01MAX
•
•
•
•
Unit: mm
Absolute Maximum Ratings (Ta = 25°C)
1.14MAX
Drain-source voltage
VDSS
550
V
Gate-source voltage
VGSS
±30
V
(Note 1)
ID
4
Pulse (t = 1 ms)
(Note 1)
IDP
16
Drain power dissipation (Tc = 25°C)
PD
80
W
Single pulse avalanche energy
(Note 2)
EAS
139
mJ
Avalanche current
IAR
4
A
Repetitive avalanche energy (Note 3)
EAR
8
mJ
Channel temperature
Tch
150
°C
Storage temperature range
Tstg
−55 to 150
°C
DC
Drain current
2.29
2
1
+0.25
−0.12
Unit
1.52
Rating
2.3 ± 0.1
Symbol
0.07 ± 0.07
Characteristics
0.76 ± 0.12
3
1.
2.
GATE
DRAIN
(HEAT SINK)
3. SOURCE
A
JEDEC
⎯
JEITA
⎯
TOSHIBA
2-7K1A
Weight : 0.36 g (typ.)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability
Handbook (“Handling Precautions”/“Derating Concept and Methods’’) and individual reliability data (i.e.
reliability test report and estimated failure rate, etc).
Internal Connection
Thermal Characteristics
Characteristics
Symbol
Max
Unit
Thermal resistance, channel to case
Rth (ch-c)
1.56
°C/W
Thermal resistance, channel to ambient
Rth (ch-a)
125
°C/W
2
Note 1: Please use devices on conditions that the channel temperature is below 150°C.
1
Note 2: VDD = 90 V, Tch = 25°C (initial), L = 15 mH, RG = 25 Ω, IAR = 4 A
Note 3: Repetitive rating: pulse width limited by maximum channel temperature
This transistor is an electrostatic sensitive device. Please handle with caution.
1/5
3
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Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Gate leakage current
IGSS
VGS = ±30 V, VDS = 0 V
⎯
⎯
±1
µA
Drain cut-off current
IDSS
VDS = 550 V, VGS = 0 V
⎯
⎯
10
µA
Drain-source breakdown voltage
V (BR) DSS
ID = 10 mA, VGS = 0 V
550
⎯
⎯
V
Vth
VDS = 10 V, ID = 1 mA
2.4
⎯
4.4
V
Gate threshold voltage
Drain-source ON-resistance
RDS (ON)
VGS = 10 V, ID = 2 A
⎯
1.5
1.88
Ω
Forward transfer admittance
⎪Yfs⎪
VDS = 10 V, ID = 2 A
0.5
2.0
⎯
S
Input capacitance
Ciss
⎯
490
⎯
Reverse transfer capacitance
Crss
⎯
3
⎯
Output capacitance
Coss
⎯
55
⎯
⎯
18
⎯
⎯
40
⎯
Rise time
VDS = 25 V, VGS = 0 V, f = 1 MHz
10 V
VGS
0V
tr
Turn-on time
ID = 2 A
ton
Switching time
RL =
100 Ω
50 Ω
Fall time
VOUT
tf
Turn-off time
Duty ≤ 1%, tw = 10 μs
toff
Total gate charge
Qg
Gate-source charge
Qgs
Gate-drain charge
Qgd
ns
⎯
8
⎯
⎯
55
⎯
⎯
11
⎯
⎯
6
⎯
⎯
5
⎯
VDD ≈ 200 V
VDD ≈ 400 V, VGS = 10 V, ID = 4 A
pF
nC
Source-Drain Ratings and Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
(Note 1)
IDR
⎯
⎯
⎯
4
A
(Note 1)
IDRP
⎯
⎯
⎯
16
A
Continuous drain reverse current
Pulse drain reverse current
Forward voltage (diode)
VDSF
IDR = 4 A, VGS = 0 V
⎯
⎯
−1.7
V
Reverse recovery time
trr
IDR = 4 A, VGS = 0 V,
⎯
900
⎯
ns
Reverse recovery charge
Qrr
dIDR/dt = 100 A/µs
⎯
5
⎯
µC
Marking (note 4)
TK4P55D
Part No. (or abbreviation code)
Lot No.*
Note 4: * Weekly code: (Four digits)
Week of manufacture
(01 for first week of year, continuing up to 52 or 53)
Year of manufacture
(The last 2digits of the calendar year)
2/5
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ID – VDS
ID – VDS
8
10
COMMON SOURCE
Tc = 25°C
PULSE TEST
(A)
6.8
6.5
2
6.3
6
1
VGS = 5.6 V
0
0
2
4
6
8
DRAIN-SOURCE VOLTAGE
VDS
7.5
6
7
4
6.5
2
VGS = 6 V
0
0
10
(V)
10
20
ID – VGS
VDS (V)
DRAIN-SOURCE VOLTAGE
(A)
DRAIN CURRENT ID
6
4
25
2
100
4
Tc = −55 °C
6
8
GATE-SOURCE VOLTAGE
VGS
10
20
16
12
8
ID = 4 A
4
2
1
0
0
4
DRAIN-SOURCE ON-RESISTANCE
RDS (ON) (Ω)
FORWARD TRANSFER ADMITTANCE
⎪Yfs⎪ (S)
Tc = −55 °C
25
100
10
1
DRAIN CURRENT ID
3/5
12
16
VGS
20
(V)
RDS (ON) – ID
COMMON SOURCE
VDS = 10 V
PULSE TEST
0.1
0.1
8
GATE-SOURCE VOLTAGE
(V)
10
1
(V)
COMMON SOURCE
Tc = 25℃
PULSE TEST
⎪Yfs⎪ – ID
10
VDS
50
VDS – VGS
COMMON SOURCE
VDS = 10 V
PULSE TEST
2
40
30
DRAIN-SOURCE VOLTAGE
8
0
0
COMMON SOURCE
Tc = 25°C
PULSE TEST
7.8
7
3
8
10
8
DRAIN CURRENT ID
DRAIN CURRENT ID
(A)
4
(A)
COMMON SOURCE
Tc = 25°C
PULSE TEST
VGS = 10 V
1
0.1
0.1
1
10
DRAIN CURRENT ID
(A)
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RDS (ON) – Tc
IDR – VDS
100
4
3
2
ID = 1 A
2
1
COMMON SOURCE
Tc = 25°C
PULSE TEST
10
1
10
1
5
−40
0
40
80
CASE TEMPERATURE
120
Tc
0.1
0
160
(°C)
-0.3
C – VDS
GATE THRESHOLD VOLTAGE
Vth (V)
100
Coss
10
COMMON SOURCE
VGS = 0 V
f = 1 MHz
Tc = 25°C
Crss
1
10
3
2
COMMON SOURCE
1 VDS = 10 V
ID = 1 mA
PULSE TEST
0
−80
100
VDS
4
(V)
−40
VDS (V)
DRAIN-SOURCE VOLTAGE
80
60
40
20
80
CASE TEMPERATURE
40
80
120
Tc
160
(°C)
DYNAMIC INPUT / OUTPUT
CHARACTERISTICS
100
40
0
CASE TEMPERATURE
120
Tc
160
(°C)
500
20
VDS
400
200
16
VDD = 100 V
400
300
12
200
8
COMMON SOURCE
ID = 4 A
Tc = 25°C
PULSE TEST
VGS
100
0
0
4
8
16
12
TOTAL GATE CHARGE
Qg
4
0
20
(V)
(pF)
CAPACITANCE
C
Ciss
PD – Tc
DRAIN POWER DISSIPATION
PD (W)
(V)
Vth – Tc
DRAIN-SOURCE VOLTAGE
4/5
VDS
5
1000
0
0
-1.5
-1.2
DRAIN-SOURCE VOLTAGE
10000
1
0.1
-0.9
-0.6
VGS
0
−80
VGS = 0 V
3
GATE-SOURCE VOLTAGE
4
COMMON SOURCE
VGS = 10 V
PULSE TEST
DRAIN REVERSE CURRENT
IDR (A)
DRAIN-SOURCE ON-RESISTANCE
RDS (ON) ( Ω)
5
(nC)
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NORMALIZED TRANSIENT THERMAL
IMPEDANCE rth (t)/Rth (ch-c)
rth – tw
10
1
Duty=0.5
0.2
PDM
0.1
0.1 0.05
t
SINGLE PULSE
T
0.02
Duty = t/T
Rth (ch-c) = 1.56 °C/W
0.01
0.01
10μ
100μ
1m
10m
PULSE WIDTH
100m
1
tw (s)
SAFE OPERATING AREA
EAS – Tch
200
100
100 μs *
ID
(A)
ID max (continuous)
1 ms *
DC operation
Tc = 25°C
0.1
PULSE Tc = 25°C
CURVES MUST BE DERATED
LINEARLY WITH INCREASE IN
TEMPERATURE.
1
10
120
80
40
0
25
*: SINGLE NONREPETITIVE
0.01
160
50
100
DRAIN-SOURCE VOLTAGE
1000
VDS
(V)
75
100
15 V
150
BVDSS
IAR
0V
VDD
TEST CIRCUIT
RG = 25 Ω
VDD = 90 V, L = 15 mH
5/5
125
CHANNEL TEMPEATURE (INITIAL)
Tch(°C)
VDSS max
DRAIN CURRENT
1
AVALANCHE ENERGY
EAS (mJ)
ID max (pulsed) *
10
0.001
10
VDS
WAVEFORM
Ε AS =
⎛
⎞
1
B VDSS
⎟
⋅ L ⋅ I2 ⋅ ⎜
⎜B
⎟
−
2
V
DD ⎠
⎝ VDSS
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