VS-GB75YF120N Datasheet

VS-GB75YF120N
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Vishay Semiconductors
IGBT Fourpack Module, 75 A
FEATURES
• Square RBSOA
• HEXFRED® low Qrr, low switching energy
• Positive VCE(on) temperature coefficient
• Copper baseplate
• Low stray inductance design
• Designed and qualified for industrial market
• UL approved file E78996
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
ECONO2 4PACK
PRODUCT SUMMARY
VCES
BENEFITS
1200 V
• Benchmark efficiency for SMPS appreciation in particular
HF welding
IC at TC = 67 °C
75 A
VCE(on) (typical)
3.4 V
Speed
8 kHz to 30 kHz
Package
ECONO2
Circuit
4 PACK
• Rugged transient performance
• Low EMI, requires less snubbing
• Direct mounting to heatsink space saving
• PCB solderable terminals
• Low junction to case thermal resistance
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Collector to emitter voltage
VCES
Continuous collector current
IC
TEST CONDITIONS
MAX.
UNITS
1200
V
TC = 25 °C
100
TC = 80 °C
67
Pulsed collector current
See fig. C.T.5
ICM
200
Clamped inductive load current
ILM
200
Diode continuous forward current
IF
TC = 25 °C
40
TC = 80 °C
25
Diode maximum forward current
IFM
150
Gate to emitter voltage
VGE
± 20
Maximum power dissipation (IGBT)
PD
Maximum operating junction temperature
TC = 25 °C
480
TC = 80 °C
270
TJ
150
Storage temperature range
TStg
-40 to +125
Isolation voltage
VISOL
AC 2500 (min)
A
V
W
°C
V
Revision: 12-Jun-15
Document Number: 93654
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ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Collector to emitter breakdown voltage
SYMBOL
VBR(CES)
Collector to emitter voltage
VCE(ON)
Gate threshold voltage
VGE(th)
TEST CONDITIONS
VGE = 0 V, IC = 500 μA
Zero gate voltage collector current
VGE(th)/TJ
ICES
Diode forward voltage drop
VFM
Gate to emitter leakage current
IGES
TYP.
MAX.
1200
-
-
IC = 75 A, VGE = 15 V
-
3.4
4.0
IC = 100 A, VGE = 15 V
-
3.8
4.5
IC = 75 A, VGE = 15 V, TJ = 125 °C
-
4.0
4.5
IC = 100 A, VGE = 15 V, TJ = 125 °C
Threshold voltage temperature coefficient
MIN.
UNITS
V
-
4.53
5.1
4.0
5.0
6.0
VCE = VGE, IC = 1 mA (25 °C to 125 °C)
-
-11
-
VGE = 0 V, VCE = 1200 V
-
7
250
VGE = 0 V, VCE = 1200 V, TJ = 125 °C
-
580
2000
IF = 75 A
-
3.9
5.0
IF = 100 A
-
4.43
5.8
IF = 75 A, TJ = 125 °C
-
4.37
5.4
IF = 100 A, TJ = 125 °C
-
5.02
6.4
VGE = ± 20 V
-
-
± 200
nA
MIN.
TYP.
MAX.
UNITS
-
630
-
-
65
-
-
250
-
-
1.51
-
-
2.41
-
-
3.92
-
-
2.25
-
-
3.35
-
-
7.60
-
-
169
-
-
71
-
-
393
-
-
136
-
VCE = VGE, IC = 250 μA
mV/°C
μA
V
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
Total gate charge (turn-on)
QG
Gate to emitter charge (turn-on)
QGE
Gate to collector charge (turn-on)
QGC
Turn-on switching loss
Eon
Turn-off switching loss
Eoff
Total switching loss
Etot
Turn-on switching loss
Eon
Turn-off switching loss
Eoff
Total switching loss
Etot
Turn-on delay time
td(on)
Rise time
Turn-off delay time
Fall time
tr
td(off)
TEST CONDITIONS
IC = 500 A
VCC = 600 V
VGE = 15 V
IC = 50 A, VCC = 600 V
VGE = 15 V, RG = 4.7 , L = 500 μH
TJ = 25 °C (1)
IC = 50 A, VCC = 600 V
VGE = 15 V, RG = 4.7 , L = 500 μH
TJ = 125 °C (1)
IC = 50 A, VCC = 600 V
VGE = 15 V, RG = 4.7 , L = 500 μH
TJ = 125 °C
tf
Reverse bias safe operating area
RBSOA
TJ = 150 °C, IC = 150 A
RG = 10 , VGE = 15 V to 0 V
Short circuit safe operating area
SCSOA
TJ = 150 °C
VCC = 900 V, VP = 1200 V
RG = 10 , VGE = 15 V to 0 V
Diode peak reverse recovery current
Irr
Diode reverse recovery time
trr
Total reverse recovery charge
Qrr
-
-
TJ = 25 °C
-
1.45
2.5
TJ = 125 °C
-
2.35
4.0
-
0.401
0.5
-
0.655
0.8
TJ = 25 °C
-
0.181
0.4
TJ = 125 °C
-
0.54
1.5
TJ = 125 °C
VCC = 600 V
IF = 75 A
dI/dt = 10 A/μs
mJ
ns
Fullsquare
10
TJ = 25 °C
nC
μs
A
μs
μC
Note
(1) Energy losses include “tail” and diode reverse recovery
Revision: 12-Jun-15
Document Number: 93654
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VS-GB75YF120N
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THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
Junction to case IGBT
Junction to case DIODE
Case to sink, flat, greased surface
SYMBOL
MIN.
TYP.
MAX.
RthJC (IGBT)
-
-
0.26
UNITS
RthJC (DIODE)
-
-
1.00
RthCS (MODULE)
-
0.05
-
2.7
-
3.3
Nm
-
170
-
g
Mounting torque (M5)
Weight
°C/W
1000
160
140
100
120
10
IC (A)
TC (°C)
100
80
60
1
40
0.1
20
0
0.01
0
20
40
60
80
100
120
1
10
100
I C (A)
1000
10000
VCE (V)
Fig. 3 - Forward SOA
TC = 25 °C; TJ  150 °C
Fig. 1 - Maximum DC Collector Current vs.
Case Temperature
1000
500
400
I C (A)
PD (W)
100
300
200
10
100
0
1
0
20
40
60
80
100 120 140 160
TC (°C)
Fig. 2 - Power Dissipation vs. Case Temperature
10
100
1000
10000
VCE (V)
Fig. 4 - Reverse Bias SOA
TJ = 150 °C; VGE = 15 V
Revision: 12-Jun-15
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160
Vishay Semiconductors
20
VGE = 18V
VGE = 15V
VGE = 12V
VGE = 9V
140
120
VCE (V)
100
ICE (A)
16
ICE = 75A
ICE = 50A
14
ICE = 25A
18
80
60
12
10
8
6
40
4
20
2
0
0
0
1
2
3
4
5
7
6
9
11
15
17
19
VGE (V)
VCE (V)
Fig. 5 - Typical IGBT Output Characteristics
TJ = 25 °C; tp = 500 μs
Fig. 8 - Typical VCE vs. VGE
TJ = 25 °C
160
20
VGE = 18V
VGE = 15V
VGE = 12V
VGE = 9V
140
120
ICE = 75A
ICE = 50A
18
16
ICE = 25A
14
VCE (V)
100
ICE (A)
13
80
60
12
10
8
6
40
4
20
2
0
0
0
1
2
3
4
5
6
7
7
8
9
11
VCE (V)
15
17
19
VGE (V)
Fig. 6 - Typical IGBT Output Characteristics
TJ = 125 °C; tp = 500 μs
Fig. 9 - Typical VCE vs. VGE
TJ = 125 °C
300
160
140
TJ = 25°C
TJ = 125°C
250
25°C
125°C
120
200
ICE (A)
100
IF (A)
13
80
60
150
100
40
50
20
0
0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
VF (V)
Fig. 7 - Typical Diode Forward Characteristics
tp = 500 μs
5
6
7
8
9
10
11
12
VGE (V)
Fig. 10 - Typical Transfer Characteristics
VCE = 20 V; tp = 500 μs
Revision: 12-Jun-15
Document Number: 93654
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VS-GB75YF120N
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1
1
tdOFF
Switching Time (µs)
TJ = 125°C
ICES (mA)
0.1
0.01
tdON
tF
0.1
tR
TJ = 25°C
0.001
0.01
400
600
800
1000
1200
20
40
60
80
100
120
140
160
IC (A)
VCES (V)
Fig. 11 - Typical Zero Gate Voltage Collector Current
Fig. 14 - Typical Switching Time vs. IC
TJ = 125 °C; L = 200 μH; VCE = 600 V, RG= 5 ; VGE = 15 V
5.5
12
5
10
TJ = 25°C
4.5
125°C
IRR (A)
Vgeth (V)
8
4
TJ = 125°C
3.5
6
4
3
25°C
2
2.5
2
0
0
0.2
0.4
0.6
0.8
1
0
20
60
80
100
dIF/ dt (A/µs)
IC (mA)
Fig. 15 - Typical Diode IREC vs. dIF/dt
VCC = 600 V; IF = 50 A
Fig. 12 - Typical Threshold Voltage
9
800
8
700
7
600
tRR (ns)
6
Energy (mJ)
40
EOFF
5
4
EON
500
125°C
400
300
3
200
2
25°C
100
1
0
0
20
40
60
80
100
120
140
160
IC (A)
Fig. 13 - Typical Energy Loss vs. IC
TJ = 125 °C; L = 200 μH; VCE = 600 V, RG = 5 ; VGE = 15 V
0
20
40
60
80
100
dIF/ dt (A/µs)
Fig. 16 - Typical Diode trr vs. dIF/dt
VCC = 600 V; IF = 50 A
Revision: 12-Jun-15
Document Number: 93654
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Vishay Semiconductors
16
1600
14
125°C
1200
12
1000
10
VGE (V)
QRR (nC)
1400
800
typical value
8
6
600
4
400
25°C
2
200
0
0
0
20
40
60
80
100
0
dIF/ dt (A/µs)
100
200
300
400
500
600
700
QG, Total Gate Charge (nC)
Fig. 17 - Typical Diode Qrr vs. dIF/dt
VCC = 600 V; IF = 50 A
Fig. 18 - Typical Gate Charge vs. VGE
ICE = 5.0 A; L = 600 μH
1
D = 0.50
0.20
Thermal Response (ZthJC )
0.1
0.10
0.05
0.01
0.02
0.01
0.001
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
1E-005
1E-006
1E-005
0.0001
0.001
0.01
0.1
1
10
t1, Rectangular Pulse Duration (s)
Fig. 19 - Maximum Transient Thermal Impedance, Junction to Case (IGBT)
10
Thermal Response (ZthJC )
D = 0.50
0.20
1
0.10
0.1
0.01
0.05
SINGLE PULSE
( THERMAL RESPONSE )
0.02
0.01
0.001
1E-006
1E-005
0.0001
0.001
t1, Rectangular Pulse Duration (s)
Fig. 20 - Maximum Transient Thermal Impedance, Junction to Case (DIODE)
Revision: 12-Jun-15
Document Number: 93654
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VS-GB75YF120N
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Driver
L
+ VCC
-
D.U.T.
0
D +
C -
1K
900 V
D.U.T.
Fig. 21 - Gate Charge Circuit (Turn-Off)
Fig. 23 - S.C. SOA Circuit
L
Diode clamp/
D.U.T.
+
-
80 V
L
+
-
-5V
D.U.T.
D.U.T./
Driver
1000 V
Rg
+
VCC
Rg
Fig. 22 - RBSOA Circuit
Fig. 24 - Switching Loss Circuit
R=
VCC
ICM
D.U.T.
+
VCC
Rg
Fig. 25 - Resistive Load Circuit
Revision: 12-Jun-15
Document Number: 93654
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VS-GB75YF120N
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ORDERING INFORMATION TABLE
Device code
VS-
G
B
75
Y
F
120
N
1
2
3
4
5
6
7
8
1
-
Vishay Semiconductors product
2
-
Insulated gate bipolar transistor (IGBT)
3
-
B = IGBT Generation 5 NPT
4
-
Current rating (75 = 75 A)
5
-
Circuit configuration (Y = Fourpack)
6
-
Package indicator (F = ECONO2)
7
-
Voltage rating (120 = 1200 V)
8
-
Speed/type (N = Ultrafast with reduced diode, speed 8 kHz to 60 kHz)
CIRCUIT CONFIGURATION
21 22
48 49
QB1
QB3
40
28
29
41
5
6
7
QB2
QB4
36
32
37
33
46 47
15
16
17
23 24
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95539
Revision: 12-Jun-15
Document Number: 93654
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Outline Dimensions
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Vishay Semiconductors
ECONO2 4PACK N Series
DIMENSIONS in millimeters
Y2:1
1
Z2:1
0.85
0.6
0.5
1.15 -- 0.02
0.06
0.8 ± 0.03
Ø 6 (x 4)
Ø 4.5
Ø 2.2
13.2 ± 0.15
105 ± 0.1
see note (1)
1.15 -- 0.02
0.06
+ 10
20.5 - 0.5
Ø 2.6
Y
7.5
Z
1.5
17 ± 0.5
X2:1
Ø 5.5 ± 0.05
5 6 7
7.62 7.62
11.43 11.43
21 ± 0.03
21 22
49 48
10.5
45.4 ± 0.2
23 24
29 28
47 46
33 32
42 ± 0.15
37 36
41 40
21 ± 0.03
22.86
19.05
22.86
7.62 11.43
7.62
3.81
0.8 ± 0.03
15 16 17
11.43
15.24
19.05
22.86
19.05
7.5 - 0.3
26.67
39.49
39.49
93 ± 0.15
107.8 ± 0.2
Revision: 21-Mar-13
Document Number: 95539
1
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Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
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requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
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Revision: 02-Oct-12
1
Document Number: 91000