<IGBT Modules> CM400ST-24S1 HIGH POWER SWITCHING USE INSULATED TYPE Collector current IC .............…..............................… 4 0 Collector-emitter voltage VCES ..............................… BRIDGE 1 2 0 AC SWITCH 6 5 Maximum junction temperature T v j m a x ........................ 1 7 ●Flat base Type ●Copper base plate ●Tin plating pin terminals ●RoHS Directive compliant* 0A 0V 0V 5 °C fourpack (BRIDGE & AC SWITCH) APPLICATION 3level inverter, UPS, PV OUTLINE DRAWING & INTERNAL CONNECTION Dimension in mm TERMINAL t=0.8 SECTION A Tolerance otherwise specified P C Cs2 Tr2 Division of Dimension N Di2 Cs1 Es4 Tr1 G2 Di4 Di1 G1 G4 Es23 Tr4 Es1 Cs4 Di3 G3 Tr3 NTC Cs3 AC Publication Date : April 2015 CMH-10632 1 Ver.1 TH1 TH2 3 Tolerance 0.5 to ±0.2 over 3 to 6 ±0.3 over 6 to 30 ±0.5 over 30 to 120 ±0.8 over 120 to 400 ±1.2 <IGBT Modules> CM400ST-24S1 HIGH POWER SWITCHING USE INSULATED TYPE MAXIMUM RATINGS (Tvj=25 °C, unless otherwise specified) BRIDGE PART IGBT/DIODE (Tr1, Tr4, Di1, Di4) Rating Unit VCES Symbol Collector-emitter voltage G-E short-circuited 1200 V VGES Gate-emitter voltage C-E short-circuited ± 20 V IC Item Conditions DC, TC=103 °C Collector current ICRM Ptot IE IERM (Note1) 400 Pulse, Repetitive, VGE15 V Total power dissipation (Note1) (Note2, 4) TC=25 °C DC Emitter current (Note3) A 800 (Note2, 4) 2340 (Note2) W 400 Pulse, Repetitive (Note3) A 800 AC SWITCH PART IGBT/DIODE (Tr2, Tr3, Di2, Di3) Symbol Item Conditions Rating Unit VCES Collector-emitter voltage G-E short-circuited 650 V VGES Gate-emitter voltage C-E short-circuited ± 20 V IC DC, TC=95°C Collector current ICRM Ptot IE IERM (Note1) 400 Pulse, Repetitive, VGE15 V Total power dissipation (Note1) (Note2, 4) TC=25 °C DC Emitter current (Note3) A 800 (Note2, 4) 1415 (Note2) W 400 Pulse, Repetitive (Note3) A 800 MODULE Symbol Item Conditions Rating Unit V Visol Isolation voltage Terminals to base plate, RMS, f=60 Hz, AC 1 min 4000 Tv jmax Maximum junction temperature Instantaneous event (overload) 175 TCmax Maximum case temperature (Note4) 125 Tv jop Operating junction temperature Continuous operation (under switching) -40 ~ +150 Tst g Storage temperature - -40 ~ +125 °C °C ELECTRICAL CHARACTERISTICS (T v j =25 °C, unless otherwise specified) BRIDGE PART IGBT/DIODE (Tr1, Tr4, Di1, Di4) Symbol Item Conditions Min. Limits Typ. Max. Unit ICES Collector-emitter cut-off current VCE=VCES, G-E short-circuited - - 1.0 mA IGES Gate-emitter leakage current VGE=VGES, C-E short-circuited - - 0.5 μA V G E (t h ) Gate-emitter threshold voltage IC=40mA, VCE=10 V 5.4 6.0 6.6 V V C E sa t (Terminal) Collector-emitter saturation voltage V C E sa t (Chip) Cies IC=400 A, VGE=15 V, T v j =25 °C - 1.80 2.25 Auxiliary Terminal T v j =125 °C - 2.00 - (Note5) T v j =150 °C - 2.05 - IC=400 A, VGE=15 V, T v j =25 °C - 1.70 2.15 Chip T v j =125 °C - 1.90 - (Note5) T v j =150 °C - 1.95 - - - 40 - - 8.0 - - 0.67 - 840 - - - 700 Input capacitance Coes Output capacitance Cres Reverse transfer capacitance QG Gate charge td(on) Turn-on delay time tr Rise time td(off) Turn-off delay time tf Fall time VCE=10 V, G-E short-circuited VCC/2=300 V, IC=400A, VGE=15 V VCC/2=300 V, IC=400 A, VGE=±15 V, RG=1.6 Ω, Inductive load VEC (Note1) (Terminal) Emitter-collector voltage VEC (Note1) (Chip) Publication Date : April 2015 CMH-10632 - 200 - 600 - - 150 IE=400 A, G-E short-circuited, T v j =25 °C - 2.60 3.40 Auxiliary Terminal T v j =125 °C - 2.16 - (Note5) T v j =150 °C - 2.10 - IE=400 A, G-E short-circuited, T v j =25 °C - 2.50 3.30 Chip T v j =125 °C - 2.06 - (Note5) T v j =150 °C - 2.00 - 2 Ver.1 - V V nF nC ns V V <IGBT Modules> CM400ST-24S1 HIGH POWER SWITCHING USE INSULATED TYPE ELECTRICAL CHARACTERISTICS (Cont; T v j =25 °C, unless otherwise specified) BRIDGE PART IGBT/DIODE (Tr1, Tr4, Di1, Di4) Symbol (Note1) trr Item Conditions Reverse recovery time VCC/2=300 V, IE=400 A, VGE=±15 V, Reverse recovery charge RG=0 Ω(Tr2/Tr3), Inductive load Eon Turn-on switching energy per pulse VCC/2=300 V, IC=IE=400A, E of f Turn-off switching energy per pulse VGE=±15 V, T v j =150 °C, (Note1) Qrr (Note1) Err RG(Tr1,4) =1.6 Ω RG(Tr2,3) =0 Ω Min. - Limits Typ. - Max. 250 - 16 - - 17.0 - - 23.5 - Unit ns μC mJ Reverse recovery energy per pulse Inductive load - 7.0 - mJ R CC'+EE' Internal lead resistance Main terminals-chip, per switch, TC=25 °C (Note4) - - 0.25 mΩ rg Internal gate resistance Per switch - 4.9 - Ω Min. - Limits Typ. - Max. 1.0 AC SWITCH PART IGBT/DIODE (Tr2, Tr3, Di2, Di3) Symbol Item Conditions ICES Collector-emitter cut-off current VCE=VCES, G-E short-circuited IGES Gate-emitter leakage current VGE=VGES, C-E short-circuited V G E (t h ) Gate-emitter threshold voltage IC=40mA, VCE=10 V (Terminal) Collector-emitter saturation voltage V C E sa t (Chip) Cies Input capacitance Coes Output capacitance Cres Reverse transfer capacitance QG Gate charge td(on) Turn-on delay time tr Rise time td(off) Turn-off delay time tf Fall time - - 0.5 μA 6.0 6.6 V T v j =25 °C - 1.35 1.75 Auxiliary Terminal T v j =125 °C - 1.43 - (Note5) T v j =150 °C - 1.45 - IC=400 A, VGE=15 V, T v j =25 °C - 1.25 1.65 Chip T v j =125 °C - 1.33 - (Note5) T v j =150 °C - 1.35 - VCE=10 V, G-E short-circuited VCC/2=300 V, IC=400 A, VGE=15 V VCC/2=300 V, IC=400 A, VGE=±15 V, RG=0 Ω, Inductive load VEC (Note1) (Terminal) Emitter-collector voltage VEC (Note1) (Chip) mA 5.4 IC=400 A, VGE=15 V, V C E sa t Unit - - 48 - - 3.1 - - 0.9 - 1450 - - - 350 - - 150 - - 500 - - 300 IE=400 A, G-E short-circuited, T v j =25 °C - 2.00 2.80 Auxiliary Terminal T v j =125 °C - 1.95 - (Note5) T v j =150 °C - 1.90 - IE=400A, G-E short-circuited, T v j =25 °C - 1.90 2.70 Chip T v j =125 °C - 1.85 - (Note5) T v j =150 °C V V nF nC ns V V - 1.80 - Reverse recovery time VCC/2=300 V, IE=400 A, VGE=±15 V, - - 200 ns Reverse recovery charge RG=1.6 Ω(Tr1/Tr4), Inductive load - 16 - μC Eon Turn-on switching energy per pulse VCC/2=300 V, IC=IE=400 A, E of f Turn-off switching energy per pulse VGE=±15 V, T v j =150 °C, Reverse recovery energy per pulse Inductive load Main terminals-chip, per switch, TC=25 °C (Note4) (Note1) trr (Note1) Qrr Err (Note1) R CC'+EE' Internal lead resistance rg Internal gate resistance RG(Tr2,3) =0 Ω Per switch RG(Tr1,4) =1.6 Ω - 0.2 - - 21.2 - - 15.3 - mJ - - 0.25 mΩ - 1.5 - Ω Min. 4.85 Limits Typ. 5.00 Max. 5.15 -7.3 - +7.8 - 3375 - K - - 10 mW mJ NTC THERMISTOR PART Symbol R25 Item Conditions Zero-power resistance TC=25 °C (Note4) ∆R/R Deviation of resistance R100=493 Ω, TC=100 °C B(25/50) B-constant Approximate by equation P25 Power dissipation TC=25 °C Publication Date : April 2015 CMH-10632 (Note4) 3 Ver.1 (Note4) (Note6) Unit kΩ % <IGBT Modules> CM400ST-24S1 HIGH POWER SWITCHING USE INSULATED TYPE THERMAL RESISTANCE CHARACTERISTICS Symbol Item Conditions Rth(j -c)Q (Note4) Junction to case, per half bridge IGBT Rth(j -c)D Rth(j -c)Q (Note4) Junction to case, per half bridge DIODE Thermal resistance Junction to case, per AC switch IGBT Rth(j -c)D Junction to case, per AC switch DIODE Rth(c-s) Case to heat sink, per 1 module, Thermal grease applied (Note4, 7) Contact thermal resistance (Note4) (Note4) Min. - Limits Typ. - Max. 0.064 Unit - - 0.105 - - 0.106 - - 0.165 - 0.011 - Limits Typ. 4.0 Max. 4.5 N·m K/W K/W MECHANICAL CHARACTERISTICS Symbol Item Conditions Unit Mt Mounting torque Main terminals M 6 screw Min. 3.5 Ms Mounting torque Mounting to heat sink M 5 screw 2.5 3.0 3.5 N·m m mass - - 560 - g Terminal to terminal 14.4 - - Terminal to base plate 16.7 - - ds Creepage distance da Clearance ec Flatness of base plate Terminal to terminal 8.0 - - Terminal to base plate 16.7 - - -50 - +100 On the centerline X, Y (Note8) mm mm μm Note1. 2. 3. 4. Represent ratings and characteristics of the anti-parallel, emitter-collector free wheeling diode (DIODE). Junction temperature (T v j ) should not increase beyond T v j m a x rating. Pulse width and repetition rate should be such that the device junction temperature (T v j ) dose not exceed T v j m a x rating. Case temperature (TC) and heat sink temperature (T s ) are defined on the each surface (mounting side) of base plate and heat sink just under the chips. Refer to the figure of chip location. 5. Pulse width and repetition rate should be such as to cause negligible temperature rise. R 25 1 1 ) /( ) 6. B ( 25 / 50 ) ln( R 50 T25 T50 -:Concave +:Convex R25: resistance at absolute temperature T25 [K]; T25=25 [°C]+273.15=298.15 [K] R50: resistance at absolute temperature T50 [K]; T50=50 [°C]+273.15=323.15 [K] 7. Typical value is measured by using thermally conductive grease of λ=0.9 W/(m·K). 8. The base plate (mounting side) flatness measurement points (X, Y) are as follows of the following figure. Y X mounting side mounting side -:Concave mounting side +:Convex RECOMMENDED OPERATING CONDITIONS Symbol Item V C C /2 (DC) Supply voltage Applied across each of N to M and M to P VGEon Gate (-emitter drive) voltage Applied across emitter to gate of each IGBT RG External gate resistance Publication Date : April 2015 CMH-10632 Limits Conditions Per switch 4 Ver.1 Min. Typ. Max. Unit - 300 425 V 13.5 15.0 16.5 V Tr1, Tr4 1.6 - 16 Tr2, Tr3 0 - 16 Ω <IGBT Modules> CM400ST-24S1 HIGH POWER SWITCHING USE INSULATED TYPE CHIP LOCATION (Top view) Dimension in mm, tolerance: ±1 mm Tr1/Tr4: BRIDGE IGBT, Tr2/Tr3: AC SWITCH IGBT, Di1/Di4: BRIDGE DIODE, Di2/Di3: AC SWITCH DIODE, Th: NTC thermistor.r Publication Date : April 2015 CMH-10632 5 Ver.1 <IGBT Modules> CM400ST-24S1 HIGH POWER SWITCHING USE INSULATED TYPE -VGE vGE P G Es iE AC Tr1,Di1 Tr3 Di3 C Tr4,Di4 G C +VGE 0 RG -VGE Es Tr2 Di2 E Es G 0 iC t 90 % + -VGE iC N E VCC C C +VGE vC vGE G 0V + Load E 90 % ~ ~ C ~ ~ TEST CIRCUIT AND WAVEFORMS 10% 0A tr td(on) tf td(off) t Switching test circuit and waveforms (BRIDGE PART switching) C -VGE P iE G Es E iC AC Tr1,Di1 Tr3 Di3 C Tr4,Di4 G C -VGE G Es N E Tr2 Di2 iE + Load IE VCC C C E + 0.5×I r r -VGE t r r , Q r r test waveform iE vCE 0 iC iC VCC 0.1×ICM 0.1×VCC ICM VCC t ti 0 t Irr Switching test circuit and waveforms (AC SWITCH PART switching) ICM trr 0A Es G RG +VGE 0 -VGE Q r r =0.5×I r r ×t rr 0.1×VCC vEC vCE 0.02×ICM ti IEM t VCC 0A t 0V t ti IGBT Turn-on switching energy IGBT Turn-off switching energy DIODE Reverse recovery energy Turn-on / Turn-off switching energy and Reverse recovery energy test waveforms (Integral time instruction drawing) Publication Date : April 2015 CMH-10632 6 Ver.1 <IGBT Modules> CM400ST-24S1 HIGH POWER SWITCHING USE INSULATED TYPE TEST CIRCUIT C V P C IC G Es VGE =15V Tr1 E Tr3 Di3 C Tr4 Di4 G Tr2 Di2 Es G E Es Tr3 Di3 Tr4 Di4 G Es IC E C Tr1 C Tr4 Di4 P C IC E G Es Tr1 Di1 C Tr4 Di4 G C G Es Tr3 Di3 E Tr2 Di2 Es E C C P E C G C V N V G Short- Es circuited Tr3 Di3 E Tr2 Tr2 Di2 E C Es G G C C E Short-circuited G Es Tr2 Di2 Es G C IE E V N Di4 C P Es C Tr4 Di4 Es G Tr3 Di3 G C VGE=15V VGE=15V G N Es E N Tr2 Di2 C Di2 IE E Tr1 Di1 AC C E C Tr4 Di4 Es G V Tr3 Di3 G C V G Short- Es circuited Short-circuited P G AC C Tr3 E Tr2 Di2 E Es G VGE=15V N Di3 VEC characteristics test circuit (AC SWITCH PART) 7 Ver.1 E Tr1 Di1 C V CEsa t characteristics test circuit (AC SWITCH PART) Publication Date : April 2015 CMH-10632 Tr3 Di3 Tr4 Di4 IE Es Tr4 Di4 Es G Shortcircuited V =15V GE Tr1 Di1 C E N G AC C AC VEC characteristics test circuit (BRIDGE PART) IC E C E Tr1 Di1 Di1 G AC Tr2 Di2 Short-circuited Tr4 G Es G C V CEsa t characteristics test circuit (BRIDGE PART) C Es Tr3 Di3 P G AC C E V N E Tr1 Di1 Short-circuited G N Tr2 Di2 Es G C VGE =15V Short-circuited IE Es AC C Es G C E C E C P G Tr1 Di1 C C V G AC Di1 P C C <IGBT Modules> CM400ST-24S1 HIGH POWER SWITCHING USE INSULATED TYPE PERFORMANCE CURVES BRIDGE PART OUTPUT CHARACTERISTICS (TYPICAL) T v j =25 °C COLLECTOR-EMITTER SATURATION VOLTAGE CHARACTERISTICS (TYPICAL) (Chip) VGE=15 V 800 VGE=20 V 15 V 12 V 600 11 V 500 400 10 V 300 200 T v j =150 °C 3 COLLECTOR-EMITTER SATURATION VOLTAGE VCEsat (V) COLLECTOR CURRENT IC (A) 700 9V T v j =125 °C 2.5 2 T v j =25 °C 1.5 1 0.5 100 0 0 0 2 4 6 8 COLLECTOR-EMITTER VOLTAGE VCE 10 0 100 (V) 300 400 500 600 700 800 FREE WHEELING DIODE FORWARD CHARACTERISTICS (TYPICAL) (Chip) G-E short-circuited 10 (Chip) 1000 IC=800 A 8 (A) T v j =125 °C IC=400 A EMITTER CURRENT IE (V) T v j =25 °C 200 COLLECTOR CURRENT IC (A) COLLECTOR-EMITTER SATURATION VOLTAGE CHARACTERISTICS (TYPICAL) COLLECTOR-EMITTER SATURATION VOLTAGE VCEsat (Chip) 3.5 6 IC=160 A 4 T v j =150 °C 100 T v j =25 °C 2 10 0 6 8 10 12 14 16 18 0 20 GATE-EMITTER VOLTAGE VGE (V) Publication Date : April 2015 CMH-10632 8 Ver.1 0.5 1 1.5 2 EMITTER-COLLECTOR VOLTAGE 2.5 3 VEC (V) 3.5 <IGBT Modules> CM400ST-24S1 HIGH POWER SWITCHING USE INSULATED TYPE PERFORMANCE CURVES BRIDGE PART HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) VCE=300 V, VGE=±15 V, RG=1.6 Ω(Tr1/Tr4), INDUCTIVE LOAD ---------------: T v j =150 °C, - - - - -: T v j =125 °C VCE=300 V, VGE=±15 V, IC=400 A, INDUCTIVE LOAD ---------------: T v j =150 °C, - - - - -: T v j =125 °C 1000 1000 td(off) td(on) 100 tr td(off) 10 10 100 1000 0.1 COLLECTOR CURRENT IC (A) 1 10 EXTERNAL GATE RESISTANCE HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) VCE=300 V, VGE=±15 V, RG=1.6 (Tr1/Tr4) Ω, INDUCTIVE LOAD, PER PULSE ---------------: T v j =150 °C, - - - - -: T v j =125 °C 100 RG (Tr1/Tr4) (Ω) HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) VCE=300 V, VGE=±15 V, IC=400 A, INDUCTIVE LOAD, PER PULSE ---------------: T v j =150 °C, - - - - -: T v j =125 °C 100 SWITCHING ENERGY (mJ) 10 E off Eon 1 0.1 REVERSE RECOVERY ENERGY (mJ) 100 REVERSE RECOVERY ENERGY (mJ) (ns) tf 100 10 SWITCHING ENERGY (mJ) tr SWITCHING TIME tr, tf (ns) (ns) SWITCHING TIME td(on), tr, td(off), tf td(on) SWITCHING TIME tr SWITCHING TIME td(on), tr, td(off) tf (ns) tf E off Eon 10 1 0.01 10 100 0.1 1000 COLLECTOR CURRENT IC (A) EMITTER CURRENT IE (A) Publication Date : April 2015 CMH-10632 9 Ver.1 1 EXTERNAL GATE RESISTANCE 10 RG (Tr1/Tr4) (Ω) 100 <IGBT Modules> CM400ST-24S1 HIGH POWER SWITCHING USE INSULATED TYPE PERFORMANCE CURVES BRIDGE PART HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) VCE=300 V, VGE=±15 V, RG=0 Ω (Tr2/Tr3), INDUCTIVE LOAD, PER PULSE ---------------: T v j =150 °C, - - - - -: T v j =125 °C HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) VCE=300 V, VGE=±15 V, IE=400 A, INDUCTIVE LOAD, PER PULSE ---------------: T v j =150 °C, - - - - -: T v j =125 °C Err 1 0.1 0.01 100 1000 VCE=300 V, VGE=±15 V, RG=0 Ω (Tr2/Tr3), INDUCTIVE LOAD ---------------: T v j =150 °C, - - - - -: T v j =125 °C Irr trr EMITTER CURRENT IE EMITTER CURRENT IE Publication Date : April 2015 CMH-10632 (A) (A) 10 Ver.1 (ns) 1 EXTERNAL GATE RESISTANCE FREE WHEELING DIODE REVERSE RECOVERY CHARACTERISTICS (TYPICAL) t r r (ns) Err 0.1 COLLECTOR CURRENT IE (A) (A) 10 1 10 Irr SWITCHING TIME tr, tf (ns) 10 REVERSE RECOVERY ENERGY (mJ) 100 SWITCHING TIME tr REVERSE RECOVERY ENERGY (mJ) 100 10 RG (Tr2/Tr3) (Ω) 100 <IGBT Modules> CM400ST-24S1 HIGH POWER SWITCHING USE INSULATED TYPE PERFORMANCE CURVES AC SWITCH PART OUTPUT CHARACTERISTICS (TYPICAL) T v j =25 °C COLLECTOR-EMITTER SATURATION VOLTAGE CHARACTERISTICS (TYPICAL) (Chip) VGE=15 V 800 15 V VGE=20 V 11 V 3 COLLECTOR-EMITTER SATURATION VOLTAGE VCEsat (V) COLLECTOR CURRENT IC (A) 700 600 12 V 10 V 500 400 300 9V 200 2.5 T v j =150 °C 2 1.5 T v j =125 °C 1 0.5 100 0 0 0 2 4 6 8 COLLECTOR-EMITTER VOLTAGE VCE 10 0 100 (V) 300 400 500 600 700 800 FREE WHEELING DIODE FORWARD CHARACTERISTICS (TYPICAL) (Chip) G-E short-circuited 10 (Chip) 1000 (A) IC=800 A 8 IC=400 A EMITTER CURRENT IE (V) T v j =25 °C 200 COLLECTOR CURRENT IC (A) COLLECTOR-EMITTER SATURATION VOLTAGE CHARACTERISTICS (TYPICAL) COLLECTOR-EMITTER SATURATION VOLTAGE VCEsat (Chip) 3.5 6 IC=160 A 4 100 T v j =125 °C 2 0 10 6 8 10 12 14 16 18 20 0 GATE-EMITTER VOLTAGE VGE (V) Publication Date : April 2015 CMH-10632 11 Ver.1 0.5 1 1.5 2 EMITTER-COLLECTOR VOLTAGE 2.5 3 VEC (V) 3.5 <IGBT Modules> CM400ST-24S1 HIGH POWER SWITCHING USE INSULATED TYPE PERFORMANCE CURVES AC SWITCH PART HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) VCE=300 V, VGE=±15 V, RG=0 Ω(Tr2/Tr3), INDUCTIVE LOAD ---------------: T v j =150 °C, - - - - -: T v j =125 °C VCE=300 V, VGE=±15 V, IC=400 A, INDUCTIVE LOAD ---------------: T v j =150 °C, - - - - -: T v j =125 °C 1000 1000 tf td(on) td(off) tr (ns) tr tf SWITCHING TIME tr, tf 100 SWITCHING TIME td(on), tr, td(off), tf (ns) td(on) SWITCHING TIME tr SWITCHING TIME td(on), tr, td(off) tf (ns) (ns) td(off) 100 10 10 10 100 1000 0.1 COLLECTOR CURRENT IC (A) 1 10 EXTERNAL GATE RESISTANCE HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) VCE=300 V, VGE=±15 V, RG=0 (Tr2/Tr3) Ω, INDUCTIVE LOAD, PER PULSE ---------------: T v j =150 °C, - - - - -: T v j =125 °C 100 RG (Tr2/Tr3) (Ω) HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) VCE=300 V, VGE=±15 V, IC=400 A, INDUCTIVE LOAD, PER PULSE ---------------: T v j =150 °C, - - - - -: T v j =125 °C 100 100 E off 1 0.1 Eon 0.01 REVERSE RECOVERY ENERGY (mJ) 10 SWITCHING ENERGY (mJ) REVERSE RECOVERY ENERGY (mJ) SWITCHING ENERGY (mJ) Eon E off 10 1 0.1 10 100 0.1 1000 COLLECTOR CURRENT IC (A) EMITTER CURRENT IE (A) Publication Date : April 2015 CMH-10632 12 Ver.1 1 EXTERNAL GATE RESISTANCE 10 RG (Tr2/Tr3) (Ω) 100 <IGBT Modules> CM400ST-24S1 HIGH POWER SWITCHING USE INSULATED TYPE PERFORMANCE CURVES AC SWITCH PART HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) VCE=300 V, VGE=±15 V, RG=1.6 Ω (Tr1/Tr4), INDUCTIVE LOAD, PER PULSE ---------------: T v j =150 °C, - - - - -: T v j =125 °C HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) VCE=300 V, VGE=±15 V, IE=400 A, INDUCTIVE LOAD, PER PULSE ---------------: T v j =150 °C, - - - - -: T v j =125 °C 0.1 10 100 1000 VCE=300 V, VGE=±15 V, RG=1.6 Ω (Tr1/Tr4), INDUCTIVE LOAD ---------------: T v j =150 °C, - - - - -: T v j =125 °C 1000 Irr trr 100 10 10 100 1000 EMITTER CURRENT IE EMITTER CURRENT IE Publication Date : April 2015 CMH-10632 (A) (A) 13 Ver.1 1 EXTERNAL GATE RESISTANCE FREE WHEELING DIODE REVERSE RECOVERY CHARACTERISTICS (TYPICAL) t r r (ns) Err 0.1 COLLECTOR CURRENT IE (A) (A) 10 1 0.01 Irr SWITCHING TIME tr, tf 1 REVERSE RECOVERY ENERGY (mJ) (ns) Err SWITCHING TIME tr REVERSE RECOVERY ENERGY (mJ) 10 (ns) 100 100 10 RG (Tr1/Tr4) (Ω) 100 <IGBT Modules> CM400ST-24S1 HIGH POWER SWITCHING USE INSULATED TYPE PERFORMANCE CURVES BRIDGE PART CAPACITANCE CHARACTERISTICS (TYPICAL) GATE CHARGE CHARACTERISTICS (TYPICAL) G-E short-circuited, T v j =25 °C VCC=600 V, IC=400 A, Tvj=25 °C 20 100 GATE-EMITTER VOLTAGE VGE (V) Cies CAPACITANCE (nF) 10 Coes 1 Cres 0.1 0.01 15 10 5 0 0.1 1 10 COLLECTOR-EMITTER VOLTAGE 100 VCE 0 200 (V) 400 600 GATE CHARGE 800 QG 1000 1200 (nC) AC SWITCH PART CAPACITANCE CHARACTERISTICS (TYPICAL) GATE CHARGE CHARACTERISTICS (TYPICAL) G-E short-circuited, T v j =25 °C VCC=300 V, IC=400 A, Tvj=25 °C 20 100 GATE-EMITTER VOLTAGE VGE (V) Cies CAPACITANCE (nF) 10 1 Coes Cres 0.1 0.01 15 10 5 0 0.1 1 10 COLLECTOR-EMITTER VOLTAGE Publication Date : April 2015 CMH-10632 100 VCE 0 (V) 1000 GATE CHARGE 14 Ver.1 500 1500 QG (nC) 2000 <IGBT Modules> CM400ST-24S1 HIGH POWER SWITCHING USE INSULATED TYPE PERFORMANCE CURVES COMMON PART TRANSIENT THERMAL IMPEDANCE CHARACTERISTICS (MAXIMUM) Single pulse, TC=25 °C NORMALIZED TRANSIENT THERMAL RESISTANCE Z t h ( j - c ) B R I D G E PA RT: R t h ( j - c ) Q =0.064 K/W, R t h ( j - c ) D =0.105 K/W A C SW I T C H PA RT: R t h ( j - c ) Q =0.106 K/W, R t h ( j - c ) D =0.165 K/W 10 1 0.1 0.01 0.001 0.00001 0.0001 0.001 0.01 TIME 0.1 1 10 (S) NTC THERMISTOR PART TEMPERATURE CHARACTERISTICS (TYPICAL) RESISTANCE R (kΩ) 100 10 1 0.1 -50 -25 0 25 50 75 100 125 TEMPERATURE T (°C) Publication Date : April 2015 CMH-10632 15 Ver.1 <IGBT Modules> CM400ST-24S1 HIGH POWER SWITCHING USE INSULATED TYPE Keep safety first in your circuit designs! Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials •These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party. •Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. •All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Mitsubishi Electric Corporation by various means, including the Mitsubishi Semiconductor home page (www.MitsubishiElectric.com/semiconductors/). •When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability or other loss resulting from the information containedherein. •Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. •The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials. •If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. •Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for further details on these materials or the products contained therein. © 2015 MITSUBISHI ELECTRIC CORPORATION. ALL RIGHTS RESERVED. Publication Date : April 2015 CMH-10632 16 Ver.1