TO -22 0A B PSMN016-100PS N-channel 100V 16 mΩ standard level MOSFET in TO-220 Rev. 3 — 27 September 2011 Product data sheet 1. Product profile 1.1 General description Standard level N-channel MOSFET in a TO220 packages qualified to 175C. This product is designed and qualified for use in a wide range of industrial, communications and domestic equipment. 1.2 Features and benefits High efficiency due to low switching and conduction losses Suitable for standard level gate drive 1.3 Applications DC-to-DC converters Motor control Load switching Server power supplies 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Min Typ Max Unit VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C Conditions - - 100 V ID drain current Tj = 25 °C; VGS = 10 V; see Figure 1 - - 57 A Ptot total power dissipation Tmb = 25 °C; see Figure 2 - - 148 W Tj junction temperature -55 - 175 °C VGS = 10 V; ID = 15 A; Tj = 100 °C; see Figure 12 - - 28.8 mΩ VGS = 10 V; ID = 15 A; Tj = 25 °C; see Figure 13 - 13 16 mΩ VGS = 10 V; ID = 30 A; VDS = 50 V; see Figure 14; see Figure 15 - 15 - nC - 49 - nC - - 101 mJ Static characteristics RDSon drain-source on-state resistance Dynamic characteristics QGD gate-drain charge QG(tot) total gate charge Avalanche ruggedness EDS(AL)S non-repetitive drain-source avalanche energy VGS = 10 V; Tj(init) = 25 °C; ID = 60 A; Vsup ≤ 100 V; unclamped; RGS = 50 Ω PSMN016-100PS NXP Semiconductors N-channel 100V 16 mΩ standard level MOSFET in TO-220 2. Pinning information Table 2. Pinning information Pin Symbol Description 1 G gate 2 D drain 3 S source S source D mounting base; connected to drain mb Simplified outline Graphic symbol mb D G mbb076 S 1 2 3 SOT78 (TO-220AB) 3. Ordering information Table 3. Ordering information Type number PSMN016-100PS Package Name Description Version TO-220AB plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C - 100 V VDGR drain-gate voltage Tj ≤ 175 °C; Tj ≥ 25 °C; RGS = 20 kΩ - 100 V VGS gate-source voltage ID drain current -20 20 V VGS = 10 V; Tmb = 100 °C; see Figure 1 - 40 A VGS = 10 V; Tj = 25 °C; see Figure 1 - 57 A - 230 A IDM peak drain current pulsed; tp ≤ 10 µs; Tmb = 25 °C; see Figure 3 Ptot total power dissipation Tmb = 25 °C; see Figure 2 - 148 W Tstg storage temperature -55 175 °C Tj junction temperature -55 175 °C Tsld(M) peak soldering temperature - 260 °C Source-drain diode IS source current Tmb = 25 °C - 57 A ISM peak source current pulsed; tp ≤ 10 µs; Tmb = 25 °C - 230 A VGS = 10 V; Tj(init) = 25 °C; ID = 60 A; Vsup ≤ 100 V; unclamped; RGS = 50 Ω - 101 mJ Avalanche ruggedness EDS(AL)S non-repetitive drain-source avalanche energy PSMN016-100PS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 27 September 2011 © NXP B.V. 2011. All rights reserved. 2 of 14 PSMN016-100PS NXP Semiconductors N-channel 100V 16 mΩ standard level MOSFET in TO-220 003aag703 80 ID (A) 03aa16 120 Pder (%) 60 80 40 40 20 0 0 0 Fig 1. 50 100 150 200 Tmb (°C) Continuous drain current as a function of mounting base temperature 0 50 100 150 200 Tmb (°C) Fig 2. Normalized total power dissipation as a function of mounting base temperature 001aal388 103 ID (A) Limit RDSon = VDS / ID 102 tp = 10 μs 100 μs 10 DC 1 ms 10 ms 100 ms 1 10−1 1 102 10 103 VDS (V) Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage PSMN016-100PS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 27 September 2011 © NXP B.V. 2011. All rights reserved. 3 of 14 PSMN016-100PS NXP Semiconductors N-channel 100V 16 mΩ standard level MOSFET in TO-220 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Rth(j-mb) thermal resistance from junction to mounting base see Figure 4 thermal resistance from junction to ambient Rth(j-a) [1] [1] Min Typ Max Unit - 0.56 1.01 K/W - 50 - K/W minimum footprint; mounted on a printed-circuit board to ambient 003a ag772 1 Zth (j-mb) (K/W) -1 10 δ = 0.5 0.2 0.1 0.05 10-2 0.02 δ= P 10-3 tp T s ingle s hot t tp T -4 10 1e -6 Fig 4. 10-5 10-4 10-3 10-2 10-1 1 tp (s ) 10 Transient thermal impedance from junction to mounting base as a function of pulse duration; typical values PSMN016-100PS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 27 September 2011 © NXP B.V. 2011. All rights reserved. 4 of 14 PSMN016-100PS NXP Semiconductors N-channel 100V 16 mΩ standard level MOSFET in TO-220 6. Characteristics Table 6. Characteristics Symbol Parameter Conditions Min Typ Max Unit 90 - - V Static characteristics V(BR)DSS drain-source breakdown voltage ID = 0.25 mA; VGS = 0 V; Tj = -55 °C VGS(th) gate-source threshold voltage ID = 0.25 mA; VGS = 0 V; Tj = 25 °C 100 - - V ID = 1 mA; VDS = VGS; Tj = 175 °C; see Figure 10 1 - - V ID = 1 mA; VDS = VGS; Tj = 25 °C; see Figure 11; see Figure 10 2 3 4 V ID = 1 mA; VDS = VGS; Tj = -55 °C; see Figure 10 - - 4.8 V - - 100 µA IDSS drain leakage current VDS = 100 V; VGS = 0 V; Tj = 125 °C VDS = 100 V; VGS = 0 V; Tj = 25 °C - 0.05 5 µA IGSS gate leakage current VGS = 20 V; VDS = 0 V; Tj = 25 °C - 10 100 nA VGS = -20 V; VDS = 0 V; Tj = 25 °C - 10 100 nA drain-source on-state resistance VGS = 10 V; ID = 15 A; Tj = 100 °C; see Figure 12 - - 28.8 mΩ VGS = 10 V; ID = 15 A; Tj = 175 °C; see Figure 12 - 36.4 44.8 mΩ VGS = 10 V; ID = 15 A; Tj = 25 °C; see Figure 13 - 13 16 mΩ f = 1 MHz - 0.9 - Ω ID = 0 A; VDS = 0 V; VGS = 10 V; see Figure 14 - 40 - nC - 49 - nC - 12 - nC - 7.75 - nC - 4.25 - nC RDSon RG internal gate resistance (AC) Dynamic characteristics QG(tot) total gate charge QGS gate-source charge ID = 30 A; VDS = 50 V; VGS = 10 V; see Figure 14; see Figure 15 QGS(th) pre-threshold gate-source charge ID = 30 A; VDS = 50 V; VGS = 10 V; see Figure 14 QGS(th-pl) post-threshold gate-source charge QGD gate-drain charge ID = 30 A; VDS = 50 V; VGS = 10 V; see Figure 14; see Figure 15 - 15 - nC VGS(pl) gate-source plateau voltage VDS = 50 V; see Figure 14; see Figure 15 - 4.5 - V Ciss input capacitance VDS = 50 V; VGS = 0 V; f = 1 MHz; Tj = 25 °C; see Figure 16 - 2404 - pF Coss output capacitance Crss reverse transfer capacitance td(on) turn-on delay time tr rise time td(off) turn-off delay time - 36 - ns tf fall time - 18 - ns PSMN016-100PS Product data sheet VDS = 50 V; RL = 1.7 Ω; VGS = 10 V; RG(ext) = 4.7 Ω; Tj = 25 °C All information provided in this document is subject to legal disclaimers. Rev. 3 — 27 September 2011 - 189 - pF - 113 - pF - 17 - ns - 23 - ns © NXP B.V. 2011. All rights reserved. 5 of 14 PSMN016-100PS NXP Semiconductors N-channel 100V 16 mΩ standard level MOSFET in TO-220 Table 6. Characteristics …continued Symbol Parameter Conditions Min Typ Max Unit - 0.8 1.2 V Source-drain diode VSD source-drain voltage IS = 15 A; VGS = 0 V; Tj = 25 °C; see Figure 17 trr reverse recovery time Qr recovered charge IS = 10 A; dIS/dt = 100 A/µs; VGS = 0 V; VDS = 50 V 001aal315 60 - 54 - ns - 126 - nC 001aal316 80 gfs (S) ID (A) 45 60 30 40 20 15 Tj = 175 °C Tj = 25 °C 0 0 0 2 4 6 0 15 30 45 VGS (V) Fig 5. Transfer Characteristic: drain current as a function of gate-source voltage; typical values Fig 6. 001aal318 4000 60 ID (A) forward transconductance as a function of drain current; typical values 001aal319 30 RDSon (mΩ) C (pF) 25 Ciss 3000 20 2000 Crss 15 1000 10 0 5 0 3 6 9 12 0 VGS (V) Fig 7. Input and revers transfer capacitances as a function of gate-source voltage; typical values PSMN016-100PS Product data sheet 5 10 15 20 VGS (V) Fig 8. Drain-source on-state resistance as a function of gate-source voltage; typical values All information provided in this document is subject to legal disclaimers. Rev. 3 — 27 September 2011 © NXP B.V. 2011. All rights reserved. 6 of 14 PSMN016-100PS NXP Semiconductors N-channel 100V 16 mΩ standard level MOSFET in TO-220 001aal331 60 10.0 8.0 6.0 ID (A) 003aad280 5 VGS(th) (V) 5.5 4 max 45 3 typ 5.2 30 2 min 5.0 15 1 VGS (V) = 4.5 0 −60 0 0 0.5 1 1.5 2 VDS (V) Fig 9. Output characteristics: drain current as a function of drain-source voltage; typical values ID (A) min 10−2 typ 60 120 180 Tj (°C) Fig 10. Gate-source threshold voltage as a function of junction temperature 03aa35 10−1 0 003aad774 3.2 a max 2.4 10−3 1.6 10−4 0.8 10−5 10−6 0 2 4 6 0 -60 VGS (V) Fig 11. Sub-threshold drain current as a function of gate-source voltage PSMN016-100PS Product data sheet 0 60 120 Tj (°C) 180 Fig 12. Normalized drain-source on-state resistance factor as a function of junction temperature All information provided in this document is subject to legal disclaimers. Rev. 3 — 27 September 2011 © NXP B.V. 2011. All rights reserved. 7 of 14 PSMN016-100PS NXP Semiconductors N-channel 100V 16 mΩ standard level MOSFET in TO-220 001aal317 80 VDS RDSon (mΩ) 5.2 VGS (V) = 5.0 5.5 ID 60 VGS(pl) VGS(th) 40 VGS QGS1 20 QGS2 QGS 6.0 8.0 10.0 QGD QG(tot) 003aaa508 0 0 15 30 45 60 ID (A) Fig 13. Drain-source on-state resistance as a function of drain current; typical values 001aal320 10 Fig 14. Gate charge waveform definitions 001aal321 104 VGS (V) VDS = 50 V 8 C (pF) Ciss 20 V 6 80 V 103 4 2 Coss 0 0 20 40 60 102 10−1 QG (nC) Product data sheet 102 10 VDS (V) Fig 15. Gate-source voltage as a function of gate charge; typical values PSMN016-100PS Crss 1 Fig 16. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values All information provided in this document is subject to legal disclaimers. Rev. 3 — 27 September 2011 © NXP B.V. 2011. All rights reserved. 8 of 14 PSMN016-100PS NXP Semiconductors N-channel 100V 16 mΩ standard level MOSFET in TO-220 001aal322 60 IS (A) 45 30 Tj = 175 °C 15 Tj = 25 °C 0 0 0.3 0.6 0.9 1.2 VSD (V) Fig 17. Source (diode forward) current as a function of source-drain (diode forward) voltage; typical values PSMN016-100PS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 27 September 2011 © NXP B.V. 2011. All rights reserved. 9 of 14 PSMN016-100PS NXP Semiconductors N-channel 100V 16 mΩ standard level MOSFET in TO-220 7. Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78 E A A1 p q mounting base D1 D L1(1) L2(1) Q L b1(2) (3×) b2(2) (2×) 1 2 3 b(3×) c e e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b b1(2) b2(2) c D D1 E e L L1(1) L2(1) max. p q Q mm 4.7 4.1 1.40 1.25 0.9 0.6 1.6 1.0 1.3 1.0 0.7 0.4 16.0 15.2 6.6 5.9 10.3 9.7 2.54 15.0 12.8 3.30 2.79 3.0 3.8 3.5 3.0 2.7 2.6 2.2 Notes 1. Lead shoulder designs may vary. 2. Dimension includes excess dambar. OUTLINE VERSION SOT78 REFERENCES IEC JEDEC JEITA 3-lead TO-220AB SC-46 EUROPEAN PROJECTION ISSUE DATE 08-04-23 08-06-13 Fig 18. Package outline SOT78 (TO-220AB) PSMN016-100PS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 27 September 2011 © NXP B.V. 2011. All rights reserved. 10 of 14 PSMN016-100PS NXP Semiconductors N-channel 100V 16 mΩ standard level MOSFET in TO-220 8. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes PSMN016-100PS v.3 20110927 Product data sheet - PSMN016-100PS v.2 - PSMN016-100PS v.1 Modifications: PSMN016-100PS v.2 PSMN016-100PS Product data sheet • Various changes to content. 20110721 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 27 September 2011 © NXP B.V. 2011. All rights reserved. 11 of 14 PSMN016-100PS NXP Semiconductors N-channel 100V 16 mΩ standard level MOSFET in TO-220 9. Legal information 9.1 Data sheet status Document status [1] [2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Preview — The document is a preview version only. The document is still subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 9.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. PSMN016-100PS Product data sheet Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. All information provided in this document is subject to legal disclaimers. Rev. 3 — 27 September 2011 © NXP B.V. 2011. All rights reserved. 12 of 14 PSMN016-100PS NXP Semiconductors N-channel 100V 16 mΩ standard level MOSFET in TO-220 Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. 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In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PSMN016-100PS Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 27 September 2011 © NXP B.V. 2011. All rights reserved. 13 of 14 PSMN016-100PS NXP Semiconductors N-channel 100V 16 mΩ standard level MOSFET in TO-220 11. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 10 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2 Thermal characteristics . . . . . . . . . . . . . . . . . . .4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . .12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Contact information. . . . . . . . . . . . . . . . . . . . . .13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 27 September 2011 Document identifier: PSMN016-100PS