VISHAY SUM110N03-03

SUM110N03-03
New Product
Vishay Siliconix
N-Channel 30-V (D-S) 175_C MOSFET
FEATURES
PRODUCT SUMMARY
V(BR)DSS (V)
rDS(on) (W)
ID (A)a
30
0.0025 @ VGS = 10 V
110a
D
D
D
D
TrenchFETr Power MOSFET
175_C Junction Temperature
Low Thermal Resistance Package
High Threshold Voltage
APPLICATIONS
D
D Automotive 12-V Boardnet
TO-263
G
DRAIN connected to TAB
G
D S
Top View
S
Ordering Information: SUM110N03-03
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
30
Gate-Source Voltage
VGS
"20
Continuous Drain Current (TJ = 175_C)
TC = 25_C
TC = 100_C
Pulsed Drain Current
ID
IDM
Avalanche Current
Repetitive Avalanche Energyb
L = 0.1 mH
TC = 25_C
Maximum Power Dissipationb
TA = 25_C d
Operating Junction and Storage Temperature Range
Unit
V
110a
110a
A
350
IAR
70
EAR
245
mJ
242c
PD
3.75
W
TJ, Tstg
- 55 to 175
_C
Symbol
Limit
Unit
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambient (PCB
Mount)d
Junction-to-Case
RthJA
40
RthJC
0.62
_C/W
Notes
a. Package limited.
b. Duty cycle v 1%.
c. See SOA curve for voltage derating.
d. When mounted on 1” square PCB (FR-4 material).
Document Number: 72260
S-31257—Rev. A, 16-Jun-03
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SUM110N03-03
New Product
Vishay Siliconix
SPECIFICATIONS (TJ =25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
Typ
Max
V(BR)DSS
VDS = 0 V, ID = 250 mA
30
VGS(th)
VDS = VGS, ID = 250 mA
2.5
IGSS
VDS = 0 V, VGS = "20 V
"100
VDS = 24 V, VGS = 0 V
1
Unit
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage
g Drain Current
On-State Drain Currenta
IDSS
V
VDS = 24 V, VGS = 0 V, TJ = 125_C
50
VDS = 24 V, VGS = 0 V, TJ = 175_C
250
ID(on)
VDS w 5 V, VGS = 10 V
rDS(on)
VGS = 10 V, ID = 30 A, TJ = 125_C
120
VGS = 10 V, ID = 30 A
Drain-Source On-State Resistancea
4.5
gfs
VDS = 15 V, ID = 30 A
mA
m
A
0.002
0.0025
0.0037
VGS = 10 V, ID = 30 A, TJ = 175_C
Forward Transconductancea
nA
W
0.0044
15
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Chargeb
Qg
Gate-Source Chargeb
Qgs
Gate-Drain
Chargeb
Turn-On Delay Timeb
Rise Timeb
Turn-Off Delay Timeb
Fall Timeb
12500
VGS = 0 V, VDS = 25 V, f = 1 MHz
1650
pF
970
170
VDS = 15 V,, VGS = 10 V,, ID = 110 A
Qgd
250
57
nC
30
td(on)
20
35
tr
125
190
70
105
25
40
td(off)
VDD = 15 V, RL = 0.18 W
ID ^ 110 A, VGEN = 10 V, RG = 2.5 W
tf
ns
Source-Drain Diode Ratings and Characteristics (TC = 25_C)c
Continuous Current
IS
110
Pulsed Current
ISM
350
Forward Voltagea
VSD
Reverse Recovery Time
IF = 50 A, VGS = 0 V
trr
Peak Reverse Recovery Current
IRM
Reverse Recovery Charge
Qrr
IF = 50 A, di/dt = 100 A/ms
m
A
0.9
1.5
V
70
140
ns
3
4.5
A
0.1
0.31
mC
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Independent of operating temperature.
c. Guaranteed by design, not subject to production testing.
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Document Number: 72260
S-31257—Rev. A, 16-Jun-03
SUM110N03-03
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
250
250
VGS = 10 thru 6 V
200
I D - Drain Current (A)
I D - Drain Current (A)
200
150
5V
100
50
150
100
TC = 125_C
50
25_C
3V
4V
- 55_C
0
0
0
1
2
3
4
5
0
VDS - Drain-to-Source Voltage (V)
2
3
4
5
6
VGS - Gate-to-Source Voltage (V)
Transconductance
On-Resistance vs. Drain Current
280
0.004
240
r DS(on) - On-Resistance ( W )
25_C
TC = - 55_C
g fs - Transconductance (S)
1
200
125_C
160
120
80
0.003
0.002
VGS = 10 V
0.001
40
0
0.000
0
20
40
60
80
100
0
120
20
40
ID - Drain Current (A)
80
100
280
350
ID - Drain Current (A)
Capacitance
Gate Charge
20
16000
V GS - Gate-to-Source Voltage (V)
Ciss
C - Capacitance (pF)
60
12000
8000
4000
Coss
VDS = 15 V
ID = 110 A
16
12
8
4
Crss
0
0
0
5
10
15
20
25
VDS - Drain-to-Source Voltage (V)
Document Number: 72260
S-31257—Rev. A, 16-Jun-03
30
0
70
140
210
Qg - Total Gate Charge (nC)
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SUM110N03-03
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
1.8
100
1.5
I S - Source Current (A)
r DS(on) - On-Resistance (W)
(Normalized)
VGS = 10 V
ID = 30 A
1.2
0.9
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ = 150_C
10
TJ = 25_C
1
0
175
0.3
TJ - Junction Temperature (_C)
1000
0.9
1.2
VSD - Source-to-Drain Voltage (V)
Drain Source Breakdown vs.
Junction Temperature
Avalanche Current vs. Time
40
38
V(BR)DSS (V)
100
I Dav (a)
0.6
IAV (A) @ TA = 25_C
10
ID = 1 mA
36
34
1
32
IAV (A) @ TA = 150_C
0.1
0.00001
0.0001
0.001
0.01
tin (Sec)
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0.1
1
30
- 50
- 25
0
25
50
75
100
125
150
175
TJ - Junction Temperature (_C)
Document Number: 72260
S-31257—Rev. A, 16-Jun-03
SUM110N03-03
New Product
Vishay Siliconix
THERMAL RATINGS
Safe Operating Area
120
1000
100
Limited by rDS(on)
100
I D - Drain Current (A)
I D - Drain Current (A)
Maximum Avalanche and Drain Current
vs. Case Temperature
80
60
40
1 ms
10
1
20
0
10 ms
100 ms
10 ms
100 ms, dc
TA = 25_C
Single Pulse
0.1
0
25
50
75
100
125
150
175
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
TC - Ambient Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Case
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.05
0.1
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (sec)
Document Number: 72260
S-31257—Rev. A, 16-Jun-03
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