pdf

Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Epoxy Resin
Phenol Resin
Subtotal
Item
Cu
Fe
P
Zn
Subtotal
Ag
Item
Sn
LFCSP
5 X 5 X 0.85
32
Pb-free
Molding Compound
% of Compound
85
10
5
Weight (g)
1.90 E-02
2.24 E-03
1.12 E-03
2.24 E-02
PPM
323342
38040
19020
380403
Weight (g)
2.96 E-02
7.12 E-04
9.10 E-06
3.64 E-05
3.03 E-02
PPM
502119
12102
154
618
514994
Internal Leadframe Plating
% of Plating
Weight (g)
5.80 E-04
100
PPM
9854
External Leadframe Plating
% of Plating
Weight (g)
2.23 E-04
100
PPM
3781
Leadframe
% of Leadframe
97.5
2.35
0.03
0.12
Au
Bond Wires
% of Wire
99.99
Weight (g)
7.61 E-04
PPM
12930
Si
Chip
% of Chip
100
Weight (g)
3.93 E-03
PPM
66806
Weight (g)
4.96 E-04
1.65 E-04
6.61 E-04
PPM
8424
2808
11231
Item
Ag Filler
Resin
Subtotal
Die Attach
% of Die Attach
75
25
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected EPA Method 3051A/3052. ICP-OES.
Not Detected EPA Method 3051A/3052. ICP-OES.
Not Detected EPA Method 3051A/3052. ICP-OES.
Not Detected EPA Method 3060A & &196A. UV-VIS.
Not Detected EPA Method 3540C/3550C. GC/MS.
Not Detected EPA Method 3540C/3550C. GC/MS.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
3
Not Detected
Not Detected
Die Attach Paste
Method
EPA Method 3051A/3052. ICP-OES.
EPA Method 3051A/3052. ICP-OES.
EPA Method 3051A/3052. ICP-OES.
EPA Method 3060A & &196A. UV-VIS.
EPA Method 3540C/3550C. GC/MS.
EPA Method 3540C/3550C. GC/MS.
Package Totals
Weight (g)
PPM
1000000
5.89 E-02
AMK-CP-C
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Epoxy Resin
Phenol Resin
Subtotal
Item
Cu
Fe
P
Zn
Subtotal
LFCSP
5 X 5 X0.85
32
Sn/Pb
Molding Compound
% of Compound
85
10
5
Leadframe
% of Leadframe
97.5
2.35
0.03
0.12
Weight (g)
1.90 E-02
2.24 E-03
1.12 E-03
2.24 E-02
PPM
323342
38040
19020
380403
Weight (g)
2.96 E-02
7.12 E-04
9.10 E-06
3.64 E-05
3.03 E-02
PPM
502119
12102
154
618
514994
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
5.80 E-04
100
Sn
Pb
Subtotal
External Leadframe Plating
% of Plating
Weight (g)
1.89 E-04
85
3.34 E-05
15
2.23 E-04
Item
PPM
Die Attach Paste
Method
PPM
Not Detected EPA Method 3051A/3052. ICP-OES.
Not Detected EPA Method 3051A/3052. ICP-OES.
Not Detected EPA Method 3051A/3052. ICP-OES.
3
EPA Method 3060A & &196A. UV-VIS.
Not Detected EPA Method 3540C/3550C. GC/MS.
Not Detected EPA Method 3540C/3550C. GC/MS.
3214
567
3781
Weight (g)
7.61 E-04
PPM
12930
Si
Chip
% of Chip
100
Weight (g)
3.93 E-03
PPM
66806
Weight (g)
4.96 E-04
1.65 E-04
6.61 E-04
PPM
Die Attach
% of Die Attach
75
25
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Bond Wires
% of Wire
99.99
Item
Molding Compound
Method
PPM
Not Detected EPA Method 3051A/3052. ICP-OES.
Not Detected EPA Method 3051A/3052. ICP-OES.
Not Detected EPA Method 3051A/3052. ICP-OES.
Not Detected EPA Method 3060A & &196A. UV-VIS.
Not Detected EPA Method 3540C/3550C. GC/MS.
Not Detected EPA Method 3540C/3550C. GC/MS.
9854
Au
Ag Filler
Resin
Subtotal
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
8424
2808
11231
Package Totals
Weight (g)
PPM
1000000
5.89 E-02
AMK-CP-A
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary