Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy Resin Phenol Resin Subtotal Item Cu Fe P Zn Subtotal Ag Item Sn LFCSP 5 X 5 X 0.85 32 Pb-free Molding Compound % of Compound 85 10 5 Weight (g) 1.90 E-02 2.24 E-03 1.12 E-03 2.24 E-02 PPM 323342 38040 19020 380403 Weight (g) 2.96 E-02 7.12 E-04 9.10 E-06 3.64 E-05 3.03 E-02 PPM 502119 12102 154 618 514994 Internal Leadframe Plating % of Plating Weight (g) 5.80 E-04 100 PPM 9854 External Leadframe Plating % of Plating Weight (g) 2.23 E-04 100 PPM 3781 Leadframe % of Leadframe 97.5 2.35 0.03 0.12 Au Bond Wires % of Wire 99.99 Weight (g) 7.61 E-04 PPM 12930 Si Chip % of Chip 100 Weight (g) 3.93 E-03 PPM 66806 Weight (g) 4.96 E-04 1.65 E-04 6.61 E-04 PPM 8424 2808 11231 Item Ag Filler Resin Subtotal Die Attach % of Die Attach 75 25 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3060A & &196A. UV-VIS. Not Detected EPA Method 3540C/3550C. GC/MS. Not Detected EPA Method 3540C/3550C. GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected 3 Not Detected Not Detected Die Attach Paste Method EPA Method 3051A/3052. ICP-OES. EPA Method 3051A/3052. ICP-OES. EPA Method 3051A/3052. ICP-OES. EPA Method 3060A & &196A. UV-VIS. EPA Method 3540C/3550C. GC/MS. EPA Method 3540C/3550C. GC/MS. Package Totals Weight (g) PPM 1000000 5.89 E-02 AMK-CP-C Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy Resin Phenol Resin Subtotal Item Cu Fe P Zn Subtotal LFCSP 5 X 5 X0.85 32 Sn/Pb Molding Compound % of Compound 85 10 5 Leadframe % of Leadframe 97.5 2.35 0.03 0.12 Weight (g) 1.90 E-02 2.24 E-03 1.12 E-03 2.24 E-02 PPM 323342 38040 19020 380403 Weight (g) 2.96 E-02 7.12 E-04 9.10 E-06 3.64 E-05 3.03 E-02 PPM 502119 12102 154 618 514994 Ag Internal Leadframe Plating % of Plating Weight (g) 5.80 E-04 100 Sn Pb Subtotal External Leadframe Plating % of Plating Weight (g) 1.89 E-04 85 3.34 E-05 15 2.23 E-04 Item PPM Die Attach Paste Method PPM Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3051A/3052. ICP-OES. 3 EPA Method 3060A & &196A. UV-VIS. Not Detected EPA Method 3540C/3550C. GC/MS. Not Detected EPA Method 3540C/3550C. GC/MS. 3214 567 3781 Weight (g) 7.61 E-04 PPM 12930 Si Chip % of Chip 100 Weight (g) 3.93 E-03 PPM 66806 Weight (g) 4.96 E-04 1.65 E-04 6.61 E-04 PPM Die Attach % of Die Attach 75 25 Item Pb Cd Hg Cr+6 PBB PBDE PPM Bond Wires % of Wire 99.99 Item Molding Compound Method PPM Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3060A & &196A. UV-VIS. Not Detected EPA Method 3540C/3550C. GC/MS. Not Detected EPA Method 3540C/3550C. GC/MS. 9854 Au Ag Filler Resin Subtotal Item Pb Cd Hg Cr+6 PBB PBDE 8424 2808 11231 Package Totals Weight (g) PPM 1000000 5.89 E-02 AMK-CP-A Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary