PHILIPS TDA8929T

INTEGRATED CIRCUITS
DATA SHEET
TDA8929T
Controller class-D audio amplifier
Preliminary specification
File under Integrated Circuits, IC01
2001 Dec 11
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
TDA8929T
CONTENTS
15
TEST AND APPLICATION INFORMATION
Test circuit
BTL application
Mode pin
External clock
Reference designs
Reference design bill of material
Curves measured in reference design
1
FEATURES
2
APPLICATIONS
3
GENERAL DESCRIPTION
4
ORDERING INFORMATION
5
QUICK REFERENCE DATA
15.1
15.2
15.3
15.4
15.5
15.6
15.7
6
BLOCK DIAGRAM
16
PACKAGE OUTLINE
7
PINNING
17
SOLDERING
8
FUNCTIONAL DESCRIPTION
17.1
8.1
8.2
8.3
8.3.1
8.3.2
8.3.3
8.4
Controller
Pulse width modulation frequency
Protections
Diagnostic temperature
Diagnostic current
Start-up safety test
Differential audio inputs
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
18
DATA SHEET STATUS
9
LIMITING VALUES
19
DEFINITIONS
10
THERMAL CHARACTERISTICS
20
DISCLAIMERS
11
QUALITY SPECIFICATION
12
DC CHARACTERISTICS
13
AC CHARACTERISTICS
14
SWITCHING CHARACTERISTICS
14.1
Minimum pulse width
2001 Dec 11
17.2
17.3
17.4
17.5
2
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
1
TDA8929T
FEATURES
3
• Operating voltage from ±15 to ±30 V
GENERAL DESCRIPTION
The TDA8929T is the controller of a two-chip set for a high
efficiency class-D audio power amplifier system. The
system is divided into two chips:
• Very low quiescent current
• Low distortion
• TDA8929T; the analog controller chip in a SO24
package
• Fixed gain of 30 dB Single-Ended (SE) or 36 dB
Bridge-Tied Load (BTL)
• TDA8926J/ST/TH or TDA8927J/ST/TH; a digital power
stage in a DBS17P, RDBS17P or HSOP24 power
package.
• Good ripple rejection
• Internal switching frequency can be overruled by an
external clock
With this chip set a compact 2 × 50 W or 2 × 100 W audio
amplifier system can be built, operating with high efficiency
and very low dissipation. No heatsink is required, or
depending on supply voltage and load, a very small one.
The system operates over a wide supply voltage range
from ±15 up to ±30 V and consumes a very low quiescent
current.
• No switch-on or switch-off plop noise
• Diagnostic input for short-circuit and temperature
protection
• Usable as a stereo Single-Ended (SE) amplifier or as a
mono amplifier in Bridge-Tied Load (BTL)
• Start-up safety test, to protect for short-circuits at the
output of the power stage to supply lines
• Electrostatic discharge protection (pin to pin).
2
APPLICATIONS
• Television sets
• Home-sound sets
• Multimedia systems
• All mains fed audio systems
• Car audio (boosters).
4
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
TDA8929T
2001 Dec 11
SO24
DESCRIPTION
plastic small outline package; 24 leads; body width 7.5 mm
3
VERSION
SOT137-1
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
5
TDA8929T
QUICK REFERENCE DATA
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
General; note 1
VP
supply voltage
±15
±25
±30
V
Iq(tot)
total quiescent current
−
20
30
mA
29
30
31
dB
Stereo single-ended configuration
Gv(cl)
closed-loop voltage gain
Zi
input impedance
45
68
−
kΩ
Vn(o)
noise output voltage
−
220
400
µV
SVRR
supply voltage ripple rejection
40
50
−
dB
αcs
channel separation
−
70
−
dB
VOO
DC output offset voltage
−
−
150
mV
Mono bridge-tied load configuration
Gv(cl)
closed-loop voltage gain
35
36
37
dB
Zi
input impedance
23
34
−
kΩ
Vn(o)
noise output voltage
−
280
−
µV
SVRR
supply voltage ripple rejection
−
44
−
dB
VOO
DC output offset voltage
−
−
200
mV
Note
1. VP = ±25 V.
2001 Dec 11
4
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
6
TDA8929T
BLOCK DIAGRAM
VSS1
handbook, full pagewidth
VDD1
1
IN1−
3
R fb
4
WINDOW
COMPARATOR
V/I
IN1+
20
21
2
mute
SGND
SGND
OSC
23
OSCILLATOR
STABILIZER
19
15
MANAGER
22
6
IN2−
DIAGTMP
DIAGCUR
EN2
SGND
11
mute
13
SW2
8
9
V/I
WINDOW
COMPARATOR
14
17
R fb
12
10
18
VDD2
VSSD
MGW148
VSS2(sub)
Fig.1 Block diagram.
2001 Dec 11
STAB
TDA8929T
16
SGND
IN2+
REL1
MODE
SGND
SGND2
SW1
SGND
7
mute
MODE
EN1
5
24
SGND1
PWM1
5
REL2
PWM2
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
7
TDA8929T
PINNING
SYMBOL
PIN
DESCRIPTION
VSS1
1
negative analog supply voltage
channel 1
SGND1
2
signal ground channel 1
VDD1
3
positive analog supply voltage
channel 1
IN1−
4
negative audio input channel 1
IN1+
5
positive audio input channel 1
MODE
6
mode select input
(standby/mute/operating)
OSC
7
oscillator frequency adjustment, or
tracking input
IN2+
8
positive audio input channel 2
IN2−
9
negative audio input channel 2
VDD2
10
positive analog supply voltage
channel 2
SGND2
11
signal ground channel 2
VSS2(sub)
12
negative analog supply voltage
channel 2 (substrate)
SW2
13
digital switch output channel 2
REL2
14
digital control input channel 2
DIAGTMP
15
digital input for temperature limit
error report from power stage
EN2
16
digital control output for enable
channel 2 of power stage
PWM2
17
input for feedback from PWM
output power stage channel 2
VSSD
18
negative digital supply voltage;
reference for digital interface to
power stage
STAB
19
pin for a decoupling capacitor for
internal stabilizer
PWM1
20
input for feedback from PWM
output power stage channel 1
EN1
21
digital control output for enable
channel 1 of power stage
DIAGCUR
22
digital input for current error report
from power stage
REL1
23
digital control input channel 1
SW1
24
digital switch output channel 1
handbook, halfpage
VSS1 1
24 SW1
SGND1 2
23 REL1
VDD1 3
22 DIAGCUR
IN1− 4
21 EN1
IN1+ 5
20 PWM1
19 STAB
MODE 6
TDA8929T
OSC 7
18 VSSD
IN2+ 8
17 PWM2
IN2− 9
16 EN2
VDD2 10
15 DIAGTMP
SGND2 11
14 REL2
VSS2(sub) 12
13 SW2
MGW149
2001 Dec 11
Fig.2 Pin configuration.
6
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
8
TDA8929T
FUNCTIONAL DESCRIPTION
The amplifier system can be switched in three operating
modes via the mode select pin:
The combination of the TDA8926J and the TDA8929T
produces a two-channel audio power amplifier system
using the class-D technology (see Fig.4).
• Standby: with a very low supply current
• Mute: the amplifiers are operational, but the audio signal
at the output is suppressed
In the TDA8929T controller device the analog audio input
signal is converted into a digital Pulse Width Modulation
(PWM) signal. The digital power stage (TDA8926) is used
for driving the low-pass filter and the loudspeaker load. It
performs a level shift from the low-power digital
PWM signal, at logic levels, to a high-power PWM signal
that switches between the main supply lines.
A second-order low-pass filter converts the PWM signal
into an analog audio signal across the loudspeaker.
• On: amplifier fully operational with output signal.
For suppressing pop noise the amplifier will remain
automatically for approximately 220 ms in the mute mode
before switching to operating mode. In this time the
coupling capacitors at the input are fully charged.
Figure 3 shows an example of a switching circuit for driving
pin MODE.
For a description of the power stage see the specification
of the TDA8926.
The TDA8926 can be used for an output power of
2 × 50 W. The TDA8927 should be used for a higher
output power of 2 × 100 W.
8.1
handbook, halfpage
standby/
mute
Controller
mute/on
R
The controller contains (for two audio channels) two Pulse
Width Modulators (PWMs), two analog feedback loops
and two differential input stages. This chip also contains
circuits common to both channels such as the oscillator, all
reference sources, the mode functionality and a digital
timing manager.
MODE
R
SGND
MGW150
The pinning of the TDA8929T and the power stage devices
are designed to have very short and straight connections
between the packages. For optimum performance the
interconnections between the packages must be as short
as possible.
Fig.3 Mode select switch circuitry.
Using this two-chip set an audio system with two
independent amplifier channels with high output power,
high efficiency (90%) for the system, low distortion and a
low quiescent current is obtained. The amplifiers channels
can be connected in the following configurations:
• Mono Bridge-Tied Load (BTL) amplifier
• Stereo Single-Ended (SE) amplifier.
2001 Dec 11
+5 V
7
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
VSS1 VDD1
VDD2 VDD1
13
5
3
1
+25 V
TDA8929T
R fb
TDA8926J
20 PWM1
BOOT1
6
IN1− 4
INPUT
STAGE
Vi(1)
IN1+ 5
SGND1 2
PWM
MODULATOR
mute
STABI
ROSC
OSC 7
REL1 2
24 SW1
SW1 1
21 EN1
EN1 4
19 STAB
22
OSCILLATOR
MANAGER
MODE 6
DRIVER
HIGH
7
OUT1
DRIVER
LOW
VSS1
DIAGCUR
15 DIAGTMP
DIAG 3
TEMPERATURE SENSOR
AND
CURRENT PROTECTION
VDD2
12 BOOT2
MODE
POWERUP 15
SGND
SGND2 11
mute
EN2 14
16 EN2
IN2+ 8
CONTROL
AND
HANDSHAKE
REL2 16
INPUT
STAGE
Vi(2)
DRIVER
HIGH
14 REL2
IN2− 9
SGND
(0 V)
11 OUT2
SW2 17
13 SW2
PWM
MODULATOR
DRIVER
LOW
17 PWM2
R fb
12
VSS2(sub)
10
18
8
VDD2
VSSD
VSS1 VSS2
10
VSSA VDDA
−25 V
VSSA
TDA8929T
Fig.4 Typical application schematic of the class-D system using TDA8929T and the TDA8926J.
MGU387
Preliminary specification
VSSD
handbook, full pagewidth
8
VMODE
CONTROL
AND
HANDSHAKE
STAB 9
SGND
VSSA
23 REL1
Philips Semiconductors
Controller class-D audio amplifier
2001 Dec 11
VDDA
VDDD
VSSA VDDA
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
8.2
TDA8929T
8.3.2
Pulse width modulation frequency
This input is intended to protect against short-circuits
across the loudspeaker load. In the event that the current
limit in the power stage is exceeded, pin DIAGCUR must
be pulled to a LOW level. A LOW level on the diagnostic
current input will immediately force the output pins EN1
and EN2 to a LOW level. The power stage will shut down
within less than 1 µs and the high current is switched off.
In this state the dissipation is very low. Every 220 ms the
controller will attempt to restart the system. If there is still
a short-circuit across the loudspeaker load, the system is
switched off again as soon as the maximum current is
exceeded. The average dissipation will be low because of
this low duty factor. The actual current limiting value is set
by the power stage.
The output signal of the power stage is a PWM signal with
a carrier frequency of approximately 300 kHz. Using a
second-order LC demodulation filter in the application
results in an analog audio signal across the loudspeaker.
This switching frequency is fixed by an external resistor
ROSC connected between pin OSC and VSS. With the
resistor value given in the application diagram, the carrier
frequency is typical 317 kHz. The carrier frequency can be
9
9 × 10
calculated using: f osc = ------------------- [Hz]
R OSC
If two or more class-D systems are used in the same audio
application, it is advised to have all devices working at the
same switching frequency. This can be realized by
connecting all OSC pins together and feed them from an
external oscillator. Using an external oscillator it is
necessary to force pin OSC to a DC-level above SGND for
switching from the internal to an external oscillator. In this
case the internal oscillator is disabled and the PWM will
switch on the external frequency. The frequency range of
the external oscillator must be in the range as specified in
the switching characteristics.
Depending on the type of power stage which is used,
several values are possible:
• TDA8926TH: limit value can be externally adjusted with
a resistor; maximum is 5 A
• TDA8927TH: limit value can be externally adjusted with
a resistor; maximum is 7.5 A
• TDA8926J and TDA8926ST: limit value is fixed at 5 A
• TDA8927J and TDA8927ST: limit value is fixed at 7.5 A.
Application in a practical circuit:
• Internal oscillator: ROSC connected between pin OSC
and VSS
• External oscillator: connect oscillator signal between
pin OSC and pin SGND; delete ROSC.
8.3
Protections
The controller is provided with two diagnostic inputs. One
or both pins can be connected to the diagnostic output of
one or more power stages.
8.3.1
DIAGNOSTIC TEMPERATURE
A LOW level on pin DIAGTMP will immediately force both
pins EN1 and EN2 to a LOW level. The power stage shuts
down and the temperature is expected to drop. If
pin DIAGTMP goes HIGH, pins EN1 and EN2 will
immediately go HIGH and normal operation will be
maintained.
Temperature hysteresis, a delay before enabling the
system again, is arranged in the power stage. Internally
there is a pull-up resistance to 5 V at the diagnostic input
of the controller. Because the diagnostic output of the
power stage is an open-drain output, diagnostic lines can
be connected together (wired-OR). It should be noted that
the TDA8929T itself has no temperature protection.
2001 Dec 11
DIAGNOSTIC CURRENT
9
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
8.3.3
TDA8929T
8.4
START-UP SAFETY TEST
During the start-up sequence, when pin MODE is switched
from standby to mute, the condition at the output terminals
of the power stage are checked. These are the same lines
as the feedback inputs of the controller. In the event of a
short-circuit of one of the output terminals to VDD or VSS
the start-up procedure is interrupted and the system waits
for non-shorted outputs. Because the test is done before
enabling the power stages, no large currents will flow in the
event of a short-circuit. This system protects against
short-circuits at both sides of the output filter to both supply
lines. When there is a short-circuit from the outputs of the
power stage to one of the supply lines, before the
demodulation filter, it will also be detected by the start-up
safety test. Practical use from this test feature can be
found in detection of short-circuits on the printed-circuit
board.
Differential audio inputs
For a high common mode rejection and a maximum
flexibility of application, the audio inputs are fully
differential. By connecting the inputs anti-parallel the
phase of one of the channels is inverted, so that a load can
be connected between the two output filters. In this case
the system operates as a mono BTL amplifier (see Fig.5).
Also in the stereo single-ended configuration it is
recommended to connect the two differential inputs in
anti-phase. This has advantages for the current handling
of the power supply at low signal frequencies.
Remark: this test is only operational prior to or during the
start-up sequence, and not during normal operating.
handbook, full pagewidth
TDA8929T
REL1
IN1 +
OUT1
SW1
IN1 −
EN1
Vi
POWER
STAGE
EN2
IN2 +
SGND
SW2
IN2 −
OUT2
REL2
MGW185
CONTROLLER
Fig.5 Mono BTL application.
2001 Dec 11
10
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
TDA8929T
9 LIMITING VALUES
In accordance with the Absolute Maximum Rate System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
−
±30
V
0
5.5
V
storage temperature
−55
+150
°C
ambient temperature
−40
+85
°C
Tvj
virtual junction temperature
−
150
°C
Ves(HBM)
electrostatic discharge
voltage (HBM)
all pins with respect to VDD (class A) −500
+500
V
all pins with respect to VSS (class A1) −1000
+1000
V
all pins with respect to GND (class B) −2500
+2500
V
−2000
+2000
V
all pins with respect to VDD (class A) −100
+100
V
VP
supply voltage
VMODE(sw)
mode select switch voltage
Tstg
Tamb
referenced to SGND
note 1
all pins with respect to each other
(class B)
Ves(MM)
electrostatic discharge
voltage (MM)
note 2
−100
+100
V
all pins with respect to GND (class B) −300
+300
V
−200
+200
V
all pins with respect to VSS (class B)
all pins with respect to each other
(class B)
Notes
1. Human Body Model (HBM); Rs = 1500 Ω and C = 100 pF.
2. Machine Model (MM); Rs = 10 Ω; C = 200 pF and L = 0.75 µH.
10 THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
CONDITIONS
thermal resistance from junction to ambient
in free air
11 QUALITY SPECIFICATION
In accordance with “SNW-FQ611-part D” if this device is used as an audio amplifier.
2001 Dec 11
11
VALUE
UNIT
65
K/W
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
TDA8929T
12 DC CHARACTERISTICS
VP = ±25 V; Tamb = 25 °C; measured in Fig.10; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VP
supply voltage
Iq(tot)
total quiescent current
Istb
standby current
note 1
VMODE = 0 V
±15
±25
±30
V
−
20
30
mA
−
30
100
µA
Offset
VOO
output offset voltage in system on and mute
∆VOO
delta output offset voltage in
system
on ↔ mute
−
−
150
mV
−
−
80
mV
Mode select input (pin MODE); see Figs 6, 7 and 8
VMODE
input voltage
note 2
0
−
5.5
V
IMODE
input current
VMODE = 5.5 V
−
−
1000
µA
Vth1+
positive threshold voltage 1
standby → mute;
note 2
−
1.6
2.0
V
Vth1−
negative threshold voltage 1
mute → standby;
note 2
0.8
1.0
−
V
VMODE(hys1)
hysteresis voltage 1
(Vth1+) − (Vth1−)
−
600
−
mV
Vth2+
positive threshold voltage 2
mute → on;
note 2
−
3.8
4.0
V
Vth2−
negative threshold voltage 2
on → mute;
note 2
3.0
3.2
−
V
VMODE(hys2)
hysteresis voltage 2
(Vth2+) − (Vth2−)
−
600
−
mV
note 2
−
0
−
V
Audio inputs (pins IN1+, IN1−, IN2+ and IN2−)
VI
DC input voltage
Internal stabilizer (pin STAB)
VO(STAB)
stabilizer output voltage
mute and on;
note 3
11
13
15
V
ISTAB(max)
maximum current on pin STAB mute and on
10
−
−
mA
Enable outputs (pins EN1 and EN2)
VOH
HIGH-level output voltage
referenced to VSS VSTAB − 1.6
VSTAB − 0.7
−
V
VOL
LOW-level output voltage
referenced to VSS 0
−
0.8
V
−
VSTAB
−
V
0
−
1.5
V
−
12
−
kΩ
1.5
V
Current diagnose input (pin DIAGCUR with internal pull-up resistance)
VIH
HIGH-level input voltage
no errors; note 3
VIL
LOW-level input voltage
note 3
Rpu(int)
internal pull-up resistance to
internal digital supply
Temperature diagnose input (pin DIAGTMP with internal pull-up resistance)
VIH
HIGH-level input voltage
no errors; note 3
4
5.5
VIL
LOW-level input voltage
note 3
0
−
2001 Dec 11
12
V
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
SYMBOL
Rpu(int)
PARAMETER
TDA8929T
CONDITIONS
internal pull-up resistance to
internal digital supply
MIN.
TYP.
MAX.
UNIT
−
12
−
kΩ
Switch outputs (pins SW1 and SW2)
VOH
HIGH-level output voltage
note 3
VSTAB − 1.6
VSTAB − 0.7
−
V
VOL
LOW-level output voltage
note 3
0
−
0.8
V
Control inputs (pins REL1 and REL2)
VIH
HIGH-level input voltage
note 3
10
−
VSTAB
V
VIL
LOW-level input voltage
note 3
0
−
2
V
Notes
1. The circuit is DC adjusted at VP = ±15 to ±30 V.
2. Referenced to SGND (0 V).
3. Referenced to VSS.
13 AC CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Stereo single-ended application; note 1
THD
total harmonic distortion
Gv(cl)
closed-loop voltage gain
SVRR
supply voltage ripple rejection
Zi
input impedance
Vn(o)
noise output voltage
Po = 1 W; note 2
fi = 1 kHz
−
0.01
0.05
%
fi = 10 kHz
−
0.1
−
%
29
30
31
dB
on; fi = 100 Hz; note 3
−
55
−
dB
on; fi = 1 kHz; note 3
40
50
−
dB
mute; fi = 100 Hz; note 3
−
55
−
dB
standby; fi = 100 Hz; note 3
−
80
−
dB
45
68
−
kΩ
on; Rs = 0 Ω; B = 22 Hz to 22 kHz
−
220
400
µV
on; Rs = 10 kΩ; B = 22 Hz to 22 kHz
−
230
−
µV
mute; note 4
−
220
−
µV
Po = 10 W; Rs = 0 Ω
−
70
−
dB
αcs
channel separation
∆Gv
channel unbalance
−
−
1
dB
Vo
output signal
mute; Vi = Vi(max) = 1 V (RMS)
−
−
400
µV
CMRR
common mode rejection ratio
Vi = 1 V (RMS)
−
75
−
dB
fi = 1 kHz
−
0.01
0.05
%
fi = 10 kHz
−
0.1
−
%
35
36
37
dB
Mono BTL application; note 5
THD
Gv(cl)
total harmonic distortion
Po = 1 W; note 2
closed-loop voltage gain
2001 Dec 11
13
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
SYMBOL
SVRR
TDA8929T
PARAMETER
supply voltage ripple rejection
Zi
input impedance
Vn(o)
noise output voltage
CONDITIONS
MIN.
TYP.
MAX.
UNIT
on; fi = 100 Hz; note 3
−
49
−
dB
on; fi = 1 kHz; note 3
36
44
−
dB
mute; fi = 100 Hz; note 3
−
49
−
dB
standby; fi = 100 Hz; note 3
−
80
−
dB
23
34
−
kΩ
on; Rs = 0 Ω; B = 22 Hz to 22 kHz
−
280
500
µV
on; Rs = 10 kΩ; B = 22 Hz to 22 kHz
−
300
−
µV
mute; note 4
−
280
−
µV
Vo
output signal
mute; Vi = Vi(max) = 1 V (RMS)
−
−
500
µV
CMRR
common mode rejection ratio
Vi = 1 V (RMS)
−
75
−
dB
Notes
1. VP = ±25 V; fi = 1 kHz; Tamb = 25 °C; measured in Fig.10; unless otherwise specified.
2. THD is measured in a bandwidth of 22 Hz to 22 kHz. When distortion is measured using a low-order low-pass filter
a significantly higher value will be found, due to the switching frequency outside the audio band.
3. Vripple = Vripple(max) = 2 V (p-p); Rs = 0 Ω.
4. B = 22 Hz to 22 kHz and independent of Rs.
5. VP = ±25 V; fi = 1 kHz; Tamb = 25 °C; measured in reference design in Fig.12; unless otherwise specified.
handbook, full pagewidth
on
mute
standby
Vth1−
Vth2−
Vth1+
VMODE(hys1)
Vth2+
VMODE(hys2)
Fig.6 Mode pin selection.
2001 Dec 11
14
VMODE
MGW334
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
TDA8929T
handbook, full pagewidth
audio
switching
VEN
VSTAB
VSS
VMODE
on
4V
mute
2V
0 V (SGND)
standby
110 ms
>110 ms
MGW152
When switching from standby to mute there is a delay of 110 ms before the output starts switching. The audio signal is
available after the mode pin has been set to on, but not earlier than 220 ms after switching to mute.
Fig.7 Mode pin timing from standby to on via mute.
handbook, full pagewidth
audio
switching
VEN
VSTAB
VSS
VMODE
on
4V
0 V (SGND)
standby
110 ms
110 ms
MGW151
When switching from standby to on there is a delay of 110 ms before the output starts switching.
After a second delay of 110 ms the audio signal is available.
Fig.8 Mode pin timing from standby to on.
2001 Dec 11
15
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
TDA8929T
14 SWITCHING CHARACTERISTICS
VP = ±25 V; Tamb = 25 °C; measured in Fig.10; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Switching frequency
oscillator frequency
fosc
ROSC = 30.0 kΩ
309
317
329
kHz
ROSC = 27 kΩ;
see Fig.12
−
360
−
kHz
fosc(r)
oscillator frequency range
note 1
210
−
600
kHz
VOSC
maximum voltage at pin OSC
frequency tracking
−
−
SGND + 12
V
VOSC(trip)
trip level at pin OSC for tracking frequency tracking
−
SGND + 2.5 −
V
ftrack
frequency range for tracking
frequency tracking
200
−
600
kHz
VOSC(ext)
voltage at pin OSC for tracking
note 2
−
5
−
V
Notes
1. Frequency set with ROSC, according to the formula in the functional description.
2. For tracking the external oscillator has to switch around SGND + 2.5 V with a minimum voltage of VOSC(ext).
14.1
Minimum pulse width
The minimum obtainable pulse width of the PWM output signal of a class-D system, sets the maximum output voltage
swing after the demodulation filter and also the maximum output power. Delays in the power stages are the main cause
for the minimum pulse width being not equal to zero. The TDA8926 and TDA8927 power stages have a minimum pulse
width of tW(min) = 220 ns (typical). Using the TDA8929T controller, the effective minimum pulse is reduced by a factor of
two during clipping. For the calculation of the maximum output power at clipping the effective minimum pulse width during
clipping is 0.5tW(min).
For the practical useable minimum and maximum duty factor (δ) which determines the maximum output power:
t W(min) × f osc
t W(min) × f osc
------------------------------- × 100% < δ <  1 – ------------------------------- × 100%
2
2
Using the typical values of the TDA8926 and TDA8927 power stages:
3.5% < δ < 96.5%.
2001 Dec 11
16
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
TDA8929T
The low-pass filter performs the demodulation, so that the
audio signal can be measured with an audio analyzer. For
measuring low distortion values, the speed of the level
shifter is important. Special care has to be taken at a
sufficient supply decoupling and output waveforms without
ringing.
15 TEST AND APPLICATION INFORMATION
15.1
Test circuit
The test diagram in Fig.10 can be used for stand alone
testing of the controller. Audio and mode input pins are
configured as in the application. For the simulation of a
switching output power stage a simple level shifter can be
used. It converts the digital PWM signal from the controller
(switching between VSS and VSS + 12 V level) to a
PWM signal switching between VDD and VSS.
The handshake with the power stage is simulated by a
direct connection of the release inputs (REL1 and REL2)
with the switch outputs (SW1 and SW2) of the controller.
The enable outputs (EN1 and EN2) for waking-up the
power stage are not used here, only the output level and
timing are measured.
A proposal for a simple level shifting circuit is given
in Fig.9.
handbook, full pagewidth
VDD
2 kΩ
10 Ω
33 Ω
BST82
10 nF
1.33 kΩ
switch
0/12 V
PWM
PHC2300
+5 V
20 kΩ
10 kΩ
42 Ω
10 Ω
74LV14
VSS
VSS
MGW154
Fig.9 Level shifter.
2001 Dec 11
17
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
220 nF
Vi(L)
VDD1
1
3
R fb
IN1− 4
SGND1 2
20
PWM1
21
EN1
24
SW1
VDD
WINDOW
COMPARATOR
V/I
IN1+ 5
220 nF
VSS1
0/12 V
SGND
23
30 kHz
LOW-PASS
OSCILLATOR
STABILIZER
mute
MANAGER
19
STAB
15
DIAGTMP
SGND
100 nF
VDD
Vp
VSS
DIAGCUR
18
Vp
MODE
SGND
VSS
TDA8929T
VMODE
SGND
16
EN2
13
SW2
VDD
V
SGND
SGND2 11
mute
IN2+ 8
IN2− 9
LEVEL SHIFTER
0/12 V
V/I
WINDOW
COMPARATOR
14
PWM
30 kHz
LOW-PASS
audio right
audio
analyzer
V
VSS
17
SGND
PWM2
MGW153
R fb
10
18
VDD2
VSSD
47 µF
VDD
VSS
100 nF
Fig.10 Test diagram.
TDA8929T
VSS
Preliminary specification
VSS2(sub)
−30 V/+30 V
REL2
220 nF
12
audio
analyzer
SGND
22
MODE 6
audio left
V
V
SGND
OSC 7
Vi(R)
PWM
VSS
30 kΩ
220 nF
−30 V/+30 V
REL1
100 nF
SGND
LEVEL SHIFTER
mute
SGND
VSS
V
Philips Semiconductors
VDD
47 µF
Controller class-D audio amplifier
dbook, full pagewidth
2001 Dec 11
100 nF
VSS
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
15.2
TDA8929T
15.4
BTL application
External clock
When using the system in a mono BTL application (for
more output power), the inputs of both channels must be
connected in parallel. The phase of one the inputs must be
inverted (see Fig.5). In principle the loudspeaker can be
connected between the outputs of the two single-ended
demodulation filters. For improving the common mode
behavior of the filter, the configuration in Fig.12 is advised.
Figure 11 shows an external clock oscillator circuit.
15.3
The reference design for a two-chip class-D audio
amplifier for TDA8926TH or TDA8927TH and TDA8929T
is shown in Fig.14. The PCB layout is shown in Fig.15.
15.5
Reference designs
The reference design for a two-chip class-D audio
amplifier for TDA8926J or TDA8927J and TDA8929T is
shown in Fig.12. The Printed-Circuit Board (PCB) layout is
shown in Fig.13. The bill of materials is given in Table 1.
Mode pin
For correct operation the switching voltage on pin MODE
should be de-bounced. If this pin is driven by a mechanical
switch an appropriate de-bouncing low-pass filter should
be used. If pin MODE is driven by an electronic circuit or
microcontroller then it should remain, for at least 100 ms,
at the mute voltage level (Vth1+) before switching back to
the standby voltage level.
VDDA
handbook, full pagewidth
R19
5 kΩ
J1
120 pF
C3
1
14
2
13
3
12
mode select
R1
R20
9.1 kΩ
4
HEF4047B 11
5
10
6
9
7
8
39 kΩ
on
mute
off
S1
MODE
6
D1
5V6
C44
220 nF
GND
external clock
TDA8929T
OSC
7
MGW155
Fig.11 External oscillator circuit.
2001 Dec 11
19
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
R19
39 kΩ
R20
3
MODE
6
on
mute
off
R1
GND
OSC
7
TDA8929T
SGND1
GND
SGND2
IN1+
C22
330 pF
IN1−
IN2+
C23
330 pF
R5
10 kΩ
C26
470 nF
R4
10 kΩ
C28
18
EN2
VDDD
IN2−
STAB
C4
220 nF
VSSD
DIAGCUR
CONTROLLER
4
21
8
23
9
20
D2
(7.5 V)
VSSA VSSD
C43
R10
180 pF
22
5
C27
470 nF
R6
10 kΩ
R24
200 kΩ
11
POWERUP
C5
STAB
220 nF
DIAG
J1
J3
QGND
QGND
−25 V
VDD
inputs
5
13
9
10
3
EN1
REL1
REL1
SW1
SW1
8
6
4
2
VDD1
R15
24 Ω
C15
220 nF
C19
1 nF
QGND
OUT2−
2
1
C17
220 nF
C16
470 nF
BOOT1
C9
15 nF
L4
PWM1
R14
5.6 Ω
C13
560 pF
8Ω
BTL
OUT1+
QGND
C20
1 nF
OUT1−
2
Sumida 33 µH
CDRH127-330
7
VDDD
R16
24 Ω
4 or 8 Ω
SE
OUT2+
GND
VSSD
L7
bead
1
C6
220 nF
VSS1
OUT1
1
VDDD
VDD2
C7
220 nF
VSS2
OUT2−
2
C14
470 nF
1
C21
1 nF
QGND
4 or 8 Ω
SE
OUT1+
outputs
VSSD
VDDA
L5
bead
R21
10 kΩ
C32
220 nF
C34
1500 µF
(35 V)
R22
9.1 kΩ
C33
220 nF
C35
1500 µF
(35 V)
VDDD
C36
220 nF
C37
220 nF
C40
47 µF
(35 V)
GND
2
VSS
J2
VSS
TDA8926J
or
TDA8927J
L2
Sumida 33 µH
CDRH127-330
BOOT2
C12
560 pF
3
J4
15
12
U1
n.c.
1
GND
14
C8
15 nF
R13
5.6 Ω
C30
1 nF
input 2
OUT2
POWER STAGE
1 nF
input 1
11
16
1 kΩ
EN1
QGND
+25 V
17
15
R7
10 kΩ
C29
1 nF
SW2
QGND
C18
1 nF
C31
1 nF
bead
L6
VSSD
C38
220 nF
C39
220 nF
C41
47 µF
(35 V)
VSSA
power supply
QGND
MLD633
Fig.12 Two-chip class-D audio amplifier application diagram for TDA8926J or TDA8927J and TDA8929T.
Preliminary specification
R21 and R22 are only necessary in BTL applications with asymmetrical supply.
BTL: remove R6, R7, C23, C26 and C27 and close J5 and J6.
C22 and C23 influence the low-pass frequency response and should be tuned with the real load (loudspeaker).
Inputs floating or inputs referenced to QGND (close J1 and J4) or referenced to VSS (close J2 and J3) for an input signal ground reference.
TDA8929T
handbook, full pagewidth
20
C24
470 nF
2
24
J6
C25
470 nF
19
R12
5.6 Ω
R11
5.6 Ω
REL2
VSSD
C11
560 pF
C10
560 pF
1
PWM2
17
SW2
13
REL2
14
EN2
16
C3
220 nF
J5
12
U2
27 kΩ
VDDD
VSSA
VSS2 VSS1
10
C44
220 nF
S1
VSSA
220 nF
220 nF
VDD1 VDD2
39 kΩ
D1
(5.6 V)
C1
C2
Philips Semiconductors
VDDA
Controller class-D audio amplifier
2001 Dec 11
mode select
VDDA
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
C24
C16
C40
C34
C25
C35
C14
C26
C41
C27
L7
state of D art
Version 21 03-2001
D2
L6
Out1
Out2
L5
S1
VSS
GND
VDD
In1
ON
MUTE
OFF
In2
Silk screen top, top view
Philips Semiconductors
D1
U1
Controller class-D audio amplifier
handbook, full pagewidth
2001 Dec 11
TDA8926J/27J & TDA8929T
Copper top, top view
21
L4
R19
C1
R20
C6
R16
C17
C9
C32 C12
R13
R15
C36
U2
C5
C15
R11
C33 C10
C8
C7
R12
C11
C4 C3
Out2
C19
In1
R5
VSS
In2
J2
C31
J4
QGND
Silk screen bottom, top view
Copper bottom, top view
Fig.13 Printed-circuit board layout for TDA8926J or TDA8927J and TDA8929T.
MLD634
TDA8929T
C18 C30
R6
J3
J1
C20
J6
R7
R4
C29
C28
GND
C37
C39
R21 R22
VDD
J5
Preliminary specification
Out1
C21
C22
C23
R1 C2
R24
L2
C44
C38
C43
C13 R10
R14
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
R1
30 kΩ
R2
D1
(5.6 V)
100 nF
100 nF
MODE
3
6
10
12
R3
GND
OSC
7
U2
27 kΩ
VSSA
VSSD
SW2
REL2
EN2
TDA8929T
SGND1
GND
SGND2
IN1+
C3
330 pF
IN1−
IN2+
C4
330 pF
22
J5
19
2
18
IN2−
VSSD
11
5
CONTROLLER
4
22
21
8
23
9
DIAGCUR
C13
100 nF
VSSA
C15
180 pF
C6
1 µF
R4
10 kΩ
C7
1 µF
R5
10 kΩ
C8
1 µF
R6
10 kΩ
20
C9
C10
1 nF
input 2
J1
J3
QGND
J4
QGND
J2
VSS
inputs
POWERUP
C14
STAB
100 nF STAB
R8
14 TDA8926TH
6
10
2
or
11
TDA8927TH
7
8
DIAG
23
POWER STAGE
EN1
REL1
REL1
SW1
SW1
5
3
24
22
21
LIM
VSSD
17
BOOT2
VDDD
VDD2
C27
100 nF
VSS2
C28
100
nF
C29
100 nF
C31
1500 µF
(35 V)
C38
220 nF
C41
1 nF
C33
15 nF
L3
bead
QGND
OUT2−
C35
560 pF
R17
5.6 Ω
8Ω
BTL
OUT1+
QGND
C42
1 nF
OUT1−
2
Sumida 33 µH
CDRH127-330
L4
R15
5.6 Ω
C39
220 nF
4 or 8 Ω
SE
OUT2+
1
C37
470 nF
BOOT1
C34
560 pF
R16
5.6 Ω
2
C32
1500 µF
(35 V)
VSSD
R14
5.6 Ω
1
GND
C30
100 nF
VSS1
1, 12, 18, 20
OUT2−
2
C36
470 nF
4
n.c.
L2
VDD1
OUT1
C40
1 nF
Sumida 33 µH
CDRH127-330
C26
15 nF
PWM1
1
C43
1 nF
QGND
4 or 8 Ω
SE
OUT1+
outputs
VDDD VSSD
L7
bead
QGND
L5
bead
C16
1 nF
+25 V
input 1
13
n.c.
R7
10 kΩ
1 nF
OUT2
15
U1
EN1
15
C5
1 µF
D2
(7.5 V)
VSSD
QGND
L1
bead
9
16
1 kΩ
24
J6
STAB
R13
5.6 Ω
R12
5.6 Ω
19
VDDD
R18
200 kΩ
C2
220 nF
VSS(sub)
VSSD
C25
560 pF
C24
560 pF
1
PWM2
17
SW2
13
REL2
14
EN2
16
C1
220 nF
S1
VDDD
VSSA
VSS2 VSS1
VDD1 VDD2
39 kΩ
on
mute
off
C11
C12
Philips Semiconductors
VDDA
Controller class-D audio amplifier
2001 Dec 11
mode select
VDDA
−25 V
VDDA
VDDD
VDD
C18
100 nF
R9
10 kΩ
1
GND
R11
5.6 Ω
C19
100 nF
C22
47 µF
(35 V)
C21
100 nF
C23
47 µF
(35 V)
GND
2
3
QGND
VSS
C17
1 nF
R10
9.1 kΩ
bead
L6
C20
100 nF
VSSD
VSSA
power supply
MGW232
Fig.14 Two-chip class-D audio amplifier application diagram for TDA8926TH or TDA8927TH and TDA8929T.
Preliminary specification
R9 and R10 are only necessary in BTL applications with asymmetrical supply.
BTL: remove R6, R7, C4, C7 and C8 and close J5 and J6.
Demodulation coils L2 and L4 should be matched in BTL.
Inputs floating or inputs referenced to QGND (close J1 and J4) or referenced to VSS (close J2 and J3).
TDA8929T
handbook, full pagewidth
QGND
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
TDA8926TH/27TH
TDA8929T
C31
L3
C22
D1
C36
L1
C32
Out1
State of D art
Version 2CTH1
L6
C23
L5
Out2
S1
ON
MU
OFF
VDD GND VSS
In2
In1
Silk screen top, top view
Copper top, top view
Philips Semiconductors
Controller class-D audio amplifier
dbook, full pagewidth
2001 Dec 11
C37
23
R14
R15
C35
L4
C34
Jan 2001
R8
C33
C1 C15 C11 C20
R1 R2
U1
C29
U2
C28
C14
C3 C18
C4
C27
C30
L5
C25
R13
R12
R17 C39 C38 R16
C12 C19
C13
C26
C24
R9
L7
R10 C10
C2
R11
C9
R3 C8
C7
R7
R6
R4
R5
C21
J6
J5
C5
C6
J2
C43 C42 C41 C40 C16 C17
QGND
J4
J3
J1
Copper bottom, top view
TDA8929T
Fig.15 Printed-circuit board layout for TDA8926TH or TDA8927TH and TDA8929T.
Preliminary specification
MGW147
Silk screen bottom, top view
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
15.6
TDA8929T
Reference design bill of material
Table 1
Two-chip class-D audio amplifier PCB (Version 2.1; 03-2001) for TDA8926J or TDA8927J and TDA8929T
(see Figs 12 and 13)
COMPONENT
In1 and In2
DESCRIPTION
VALUE
COMMENTS
2 × Farnell: 152-396
Cinch input connectors
Out1, Out2, VDD, supply/output connectors
GND and VSS
2 × Augat 5KEV-02;
1 × Augat 5KEV-03
S1
on/mute/off switch
PCB switch Knitter ATE 1 E M-O-M
U1
power stage IC
TDA8926J/27J
DBS17P package
U2
controller IC
TDA8929T
SO24 package
L2 and L4
demodulation filter coils
33 µH
2 × Sumida CDRH127-330
3 × Murata BL01RN1-A62
L5, L6 and L7
power supply ferrite beads
C1 and C2
supply decoupling capacitors for
VDD to VSS of the controller
220 nF/63 V
2 × SMD1206
C3
clock decoupling capacitor
220 nF/63 V
SMD1206
C4
12 V decoupling capacitor of the
controller
220 nF/63 V
SMD1206
C5
12 V decoupling capacitor of the power
stage
220 nF/63 V
SMD1206
C6 and C7
supply decoupling capacitors for
VDD to VSS of the power stage
220 nF/63 V
SMD1206
C8 and C9
bootstrap capacitors
15 nF/50 V
2 × SMD0805
C10, C11,
C12 and C13
snubber capacitors
560 pF/100 V
4 × SMD0805
C14 and C16
demodulation filter capacitors
470 nF/63 V
2 × MKT
C15 and C17
resonance suppress capacitors
220 nF/63 V
2 × SMD1206
C18, C19,
C20 and C21
common mode HF coupling capacitors
1 nF/50 V
4 × SMD0805
C22 and C23
input filter capacitors
330 pF/50 V
2 × SMD1206
C24, C25,
C26 and C27
input capacitors
470 nF/63 V
4 × MKT
C28, C29,
C30 and C31
common mode HF coupling capacitors
1 nF/50 V
2 × SMD0805
C32 and C33
power supply decoupling capacitors
220 nF/63 V
2 × SMD1206
C34 and C35
power supply electrolytic capacitors
1500 µF/35 V
2 × Rubycon ZL very low ESR (large
switching currents)
C36, C37,
C38 and C39
analog supply decoupling capacitors
220 nF/63 V
4 × SMD1206
C40 and C41
analog supply electrolytic capacitors
47 µF/35 V
2 × Rubycon ZA low ESR
C43
diagnostic capacitor
180 pF/50 V
SMD1206
C44
mode capacitor
220 nF/63 V
SMD1206
D1
5.6 V zener diode
BZX79C5V6
DO-35
D2
7.5 V zener diode
BZX79C7V5
DO-35
R1
clock adjustment resistor
27 kΩ
SMD1206
2001 Dec 11
24
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
COMPONENT
TDA8929T
DESCRIPTION
VALUE
COMMENTS
R4, R5,
R6 and R7
input resistors
10 kΩ
4 × SMD1206
R10
diagnostic resistor
1 kΩ
SMD1206
R11, R12,
R13 and R14
snubber resistors
5.6 Ω; >0.25 W
4 × SMD1206
R15 and R16
resonance suppression resistors
24 Ω
2 × SMD1206
R19
mode select resistor
39 kΩ
SMD1206
R20
mute select resistor
39 kΩ
SMD1206
R21
resistor needed when using an
asymmetrical supply
10 kΩ
SMD1206
R22
resistor needed when using an
asymmetrical supply
9.1 kΩ
SMD1206
R24
bias resistor for powering-up the power
stage
200 kΩ
SMD1206
15.7
Curves measured in reference design
MLD627
102
handbook, halfpage
MLD628
102
handbook, halfpage
THD+N
(%)
THD+N
(%)
10
10
1
1
(1)
10−1
10−1
(1)
10−2
(2)
(2)
10−2
(3)
10−3 −2
10
10−1
1
10
10−3
10
102
103
Po (W)
2 × 8 Ω SE; VP = ±25 V:
(1) 10 kHz.
103
104
f i (Hz)
105
2 × 8 Ω SE; VP = ±25 V:
(1) Po = 10 W.
(2) Po = 1 W.
(2) 1 kHz.
(3) 100 Hz.
Fig.16 THD + N as a function of output power.
2001 Dec 11
102
Fig.17 THD + N as a function of input frequency.
25
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
TDA8929T
MLD629
102
handbook, halfpage
MLD630
102
handbook, halfpage
THD+N
(%)
THD+N
(%)
10
10
1
1
(1)
(1)
10−1
10−1
(2)
(2)
10−2
10−3 −2
10
10−2
(3)
10−1
1
10
10−3
10
102
103
Po (W)
2 × 4 Ω SE; VP = ±25 V:
(1) 10 kHz.
(2) 1 kHz.
(3) 100 Hz.
102
103
104
f i (Hz)
105
2 × 4 Ω SE; VP = ±25 V:
(1) Po = 10 W.
(2) Po = 1 W.
Fig.18 THD + N as a function of output power.
Fig.19 THD + N as a function of input frequency.
MLD631
102
handbook, halfpage
MLD632
102
handbook, halfpage
THD+N
(%)
THD+N
(%)
10
10
1
1
(1)
(1)
10−1
10−1
(2)
(2)
10−2
10−3 −2
10
10−2
(3)
10−1
1
10
10−3
10
102
103
Po (W)
1 × 8 Ω BTL; VP = ±25 V:
(1) 10 kHz.
103
104
f i (Hz)
105
1 × 8 Ω BTL; VP = ±25 V:
(1) Po = 10 W.
(2) Po = 1 W.
(2) 1 kHz.
(3) 100 Hz.
Fig.20 THD + N as a function of output power.
2001 Dec 11
102
Fig.21 THD + N as a function of input frequency.
26
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
TDA8929T
MLD609
25
MLD610
100
handbook, halfpage
handbook, halfpage
(3)
η
(%)
P
(W)
(1)
(2)
80
20
15
60
(1)
(2)
10
40
(3)
5
0
10−2
20
10−1
1
10
0
103
102
Po (W)
0
VP = ±25 V; fi = 1 kHz:
(1) 2 × 4 Ω SE.
(2) 1 × 8 Ω BTL.
(3) 2 × 8 Ω SE.
60
90
120
150
Po (W)
VP = ±25 V; fi = 1 kHz:
(1) 2 × 4 Ω SE.
(2) 1 × 8 Ω BTL.
(3) 2 × 8 Ω SE.
Fig.22 Power dissipation as a function of output
power.
Fig.23 Efficiency as a function of output power.
MLD611
200
Po
30
MLD612
200
Po
handbook, halfpage
handbook, halfpage
(W)
160
(W)
160
(2)
(2)
120
120
(1)
(3)
(1)
80
80
(3)
(4)
(4)
40
0
10
40
15
20
25
30
0
10
35
15
VP (V)
20
25
30
35
VP (V)
THD + N = 0.5%; fi = 1 kHz:
THD + N = 10%; fi = 1 kHz:
(1) 1 × 4 Ω BTL.
(2) 1 × 8 Ω BTL.
(1) 1 × 4 Ω BTL.
(2) 1 × 8 Ω BTL.
(3) 2 × 4 Ω SE.
(4) 2 × 8 Ω SE.
(3) 2 × 4 Ω SE.
(4) 2 × 8 Ω SE.
Fig.24 Output power as a function of supply
voltage.
Fig.25 Output power as a function of supply
voltage.
2001 Dec 11
27
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
TDA8929T
MLD613
0
handbook, halfpage
αcs
(dB)
αcs
(dB)
−20
−20
−40
−40
−60
−60
(1)
−80
−100
(1)
−80
(2)
10
MLD614
0
handbook, halfpage
102
103
104
f i (Hz)
−100
105
(2)
10
102
103
104
f i (Hz)
105
2 × 8 Ω SE; VP = ±25 V:
(1) Po = 10 W.
(2) Po = 1 W.
2 × 4 Ω SE; VP = ±25 V:
(1) Po = 10 W.
(2) Po = 1 W.
Fig.26 Channel separation as a function of input
frequency.
Fig.27 Channel separation as a function of input
frequency.
MLD615
45
MLD616
45
handbook, halfpage
handbook, halfpage
G
(dB)
G
(dB)
40
40
35
35
(1)
(1)
(2)
30
30
(2)
25
20
(3)
25
(3)
10
102
103
104
f i (Hz)
20
105
VP = ±25 V; Vi = 100 mV;
Rs = 10 kΩ/Ci = 330 pF:
(1) 1 × 8 Ω BTL.
(2) 2 × 8 Ω SE.
(3) 2 × 4 Ω SE.
102
103
104
f i (Hz)
105
VP = ±25 V; Vi = 100 mV;
Rs = 0 Ω:
(1) 1 × 8 Ω BTL.
(2) 2 × 8 Ω SE.
(3) 2 × 4 Ω SE.
Fig.28 Gain as a function of input frequency.
2001 Dec 11
10
Fig.29 Gain as a function of input frequency.
28
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
TDA8929T
MLD617
0
MLD618
0
handbook, halfpage
handbook, halfpage
SVRR
(dB)
SVRR
(dB)
−20
−20
−40
−40
(1)
(1)
−60
−60
(2)
(2)
(3)
(3)
−80
−100
−80
10
102
103
104
f i (Hz)
−100
105
Fig.30 SVRR as a function of input frequency.
2
3
5
4
Vripple (V)
Fig.31 SVRR as a function of Vripple (p-p).
MLD619
MLD620
380
handbook, halfpage
handbook, halfpage
(mA)
fclk
(kHz)
80
372
60
364
40
356
20
348
0
0
1
VP = ±25 V; Vripple with respect to GND:
(1) fripple = 1 kHz.
(2) fripple = 100 Hz.
(3) fripple = 10 Hz.
VP = ±25 V; Vripple = 2 V (p-p) with respect to GND:
(1) Both supply lines in anti-phase.
(2) Both supply lines in phase.
(3) One supply line rippled.
100
Iq
0
10
20
30
340
37.5
VP (V)
0
10
20
40
30
VP (V)
RL = open.
RL = open.
Fig.32 Quiescent current as a function of supply
voltage.
Fig.33 Clock frequency as a function of supply
voltage.
2001 Dec 11
29
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
TDA8929T
MLD622
MLD621
5
Vripple
(V)
5
handbook, halfpage
handbook, halfpage
SVRR
(%)
4
4
3
3
(1)
(1)
2
2
1
0
10−2
1
(2)
10−1
1
10
Po (W)
0
10
102
VP = ±25 V; 1500 µF per supply line; fi = 10 Hz:
(1) 1 × 4 Ω SE.
(2) 1 × 8 Ω SE.
102
103
f i (Hz)
104
VP = ±25 V; 1500 µF per supply line:
(1) Po = 30 W into 1 × 4 Ω SE.
(2) Po = 15 W into 1 × 8 Ω SE.
Fig.34 Supply voltage ripple as a function of output
power.
Fig.35 SVRR as a function of input frequency.
MLD623
10
(2)
MLD624
50
Po
handbook, halfpage
handbook, halfpage
THD+N
(%)
(W)
40
1
(1)
30
10−1
(2)
20
(3)
10−2
10
10−3
100
200
300
400
0
100
500
600
fclk (kHz)
VP = ±25 V; Po = 1 W in 2 × 8 Ω:
(1) 10 kHz.
(2) 1 kHz.
(3) 100 Hz.
300
400
500
600
fclk (kHz)
VP = ±25 V; RL = 2 × 8 Ω; fi = 1 kHz; THD + N = 10%.
Fig.37 Output power as a function of clock
frequency.
Fig.36 THD + N as a function of clock frequency.
2001 Dec 11
200
30
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
TDA8929T
MLD625
150
Iq
handbook, halfpage
Vr(PWM)
(mA)
120
(mV)
800
90
600
60
400
30
200
0
100
MLD626
1000
handbook, halfpage
200
300
400
0
100
500
600
fclk (kHz)
200
300
400
500
600
fclk (kHz)
VP = ±25 V; RL = open.
VP = ±25 V; RL = 2 × 8 Ω.
Fig.38 Quiescent current as a function of clock
frequency.
Fig.39 PWM residual voltage as a function of clock
frequency.
2001 Dec 11
31
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
TDA8929T
16 PACKAGE OUTLINE
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A
X
c
HE
y
v M A
Z
13
24
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
12
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
inches
0.10
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.61
0.60
0.30
0.29
0.050
0.419
0.043
0.055
0.394
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
Z
(1)
θ
8o
0o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT137-1
075E05
MS-013
2001 Dec 11
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
97-05-22
99-12-27
32
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
TDA8929T
If wave soldering is used the following conditions must be
observed for optimal results:
17 SOLDERING
17.1
Introduction to soldering surface mount
packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
17.2
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.
17.3
17.4
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
2001 Dec 11
Manual soldering
33
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
17.5
TDA8929T
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
BGA, HBGA, LFBGA, SQFP, TFBGA
not suitable
suitable(2)
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
not
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
REFLOW(1)
suitable
suitable
suitable
not
recommended(3)(4)
suitable
not
recommended(5)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2001 Dec 11
34
Philips Semiconductors
Preliminary specification
Controller class-D audio amplifier
TDA8929T
18 DATA SHEET STATUS
DATA SHEET STATUS(1)
PRODUCT
STATUS(2)
DEFINITIONS
Objective data
Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
19 DEFINITIONS
20 DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2001 Dec 11
35
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected].
SCA73
© Koninklijke Philips Electronics N.V. 2001
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753503/01/pp36
Date of release: 2001
Dec 11
Document order number:
9397 750 08189