SOT1427-1

BG
A1
59
LF
SOT1427-1
plastic low profile fine-pitch ball grid array package; 159 balls
8 February 2016
Package information
1. Package summary
Terminal position code
B (bottom)
Package type descriptive code
LFBGA159
Package type industry code
LFBGA159
Package style descriptive code
FBGA (fine-pitch ball grid array)
Package style suffix code
NA (not applicable)
Package body material type
P (plastic)
Mounting method type
S (surface mount)
Issue date
26-7-2014
Table 1. Package summary
Symbol
Parameter
Min
Typ
Nom
Max
Unit
D
package length
11.9
-
12
12.9
mm
E
package width
11.9
-
12
12.1
mm
A
seated height
1.25
-
1.35
1.5
mm
e
nominal pitch
-
-
0.8
-
m
n2
actual quantity of termination
-
-
159
-
SOT1427-1
NXP Semiconductors
plastic low profile fine-pitch ball grid array
package; 159 balls
2. Package outline
LFBGA159: plastic low profile fine-pitch ball grid array package; 159 balls
D
B
SOT1427-1
A
ball A1
index area
A
A2
A1
E
detail X
e1
C
e
b
1/2 e
Øv
Øw
P
N
M
L
K
J
H
G
F
E
D
C
B
A
ball A1
index area
C A B
C
e2
1/2 e
1
2
3
4
5
6
7
8
9
10
11
12
13
14
X
10 mm
scale
Dimensions (mm are the original dimensions)
mm
A
A1
y
e
0
Unit
y1 C
A2
b
D
E
e
e1
e2
v
w
y
y1
max 1.50 0.40 1.10 0.50 12.1 12.1
nom 1.35 0.35 1.00 0.45 12.0 12.0 0.80 10.4 10.4 0.15 0.08 0.12 0.10
min 1.25 0.30 0.95 0.40 11.9 11.9
sot1427-1_po
Outline
version
SOT1427-1
References
IEC
JEDEC
JEITA
European
projection
Issue date
14-07-18
14-07-26
MO-205
Fig. 1. Package outline LFBGA159 (SOT1427-1)
SOT1427-1
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
2/5
SOT1427-1
NXP Semiconductors
plastic low profile fine-pitch ball grid array
package; 159 balls
3. Soldering
Footprint information for reflow soldering of LFBGA159 package
SOT1427-1
Hx
P
P
Hy
see detail X
recommend stencil thickness: 0.1 mm
solder land (SL)
solder paste deposit (SP)
solder land plus solder paste
SL = SP
solder resist opening (SR)
SR
occupied area
detail X
Dimensions in mm
P
SL
SP
SR
Hx
Hy
0.8
0.4
0.4
0.5
12.3
12.3
Issue date
14-11-28
15-06-15
sot1427-1_fr
Fig. 2. Reflow soldering footprint for LFBGA159 (SOT1427-1)
SOT1427-1
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
3/5
SOT1427-1
NXP Semiconductors
plastic low profile fine-pitch ball grid array
package; 159 balls
4. Legal information
Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
SOT1427-1
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
4/5
SOT1427-1
NXP Semiconductors
plastic low profile fine-pitch ball grid array
package; 159 balls
5. Contents
1. Package summary........................................................ 1
2. Package outline............................................................ 2
3. Soldering....................................................................... 3
4. Legal information......................................................... 4
©
NXP Semiconductors N.V. 2016. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 8 February 2016
SOT1427-1
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
5/5
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