PHILIPS PCD3311CP

INTEGRATED CIRCUITS
DATA SHEET
PCD3311C; PCD3312C
DTMF/modem/musical-tone
generators
Product specification
Supersedes data of May 1990
File under Integrated Circuits, IC03
1996 Nov 21
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
CONTENTS
1
FEATURES
2
GENERAL DESCRIPTION
3
QUICK REFERENCE DATA
4
ORDERING INFORMATION
5
BLOCK DIAGRAM
6
PINNING INFORMATION
6.1
6.2
6.3
6.4
6.5
6.6
Pinning PCD3311CP
Pin description PCD3311CP
Pinning PCD3311CT
Pin description PCD3311CT
Pinning PCD3312C
Pin description PCD3312C
7
FUNCTIONAL DESCRIPTION
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
General
Clock/oscillator connection
Mode selection (PCD3311C)
Data inputs (PCD3311C)
Strobe input (PCD3311C )
I2C-bus clock and data inputs
Address input
I2C-bus data configuration
Tone output
Power-on reset
Tables of Input and output
8
I2C-BUS INTERFACE
8.1
8.2
8.3
8.4
8.5
8.5.1
8.5.2
Bit transfer
Start and stop conditions
System configuration
Acknowledge
Timing specifications
Standard mode
Low-speed mode
9
HANDLING
10
LIMITING VALUES
11
CHARACTERISTICS
12
APPLICATION INFORMATION
13
PACKAGE OUTLINES
14
SOLDERING
14.1
14.2
14.2.1
14.2.2
14.3
14.3.1
14.3.2
14.3.3
Introduction
DIP
Soldering by dipping or by wave
Repairing soldered joints
SO
Reflow soldering
Wave soldering
Repairing soldered joints
1996 Nov 21
2
PCD3311C; PCD3312C
15
DEFINITIONS
16
LIFE SUPPORT APPLICATIONS
17
PURCHASE OF PHILIPS I2C COMPONENTS
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
1
used, and a separate microcontroller is required to control
the devices.
FEATURES
• DTMF, modem and musical tone generation
Both the devices can interface to I2C-bus compatible
microcontrollers for serial input. The PCD3311C can also
interface directly to all standard microcontrollers,
accepting a binary coded parallel input.
• Stabilized output voltage level
• Low output distortion with on-chip filtering conforming to
CEPT recommendations
• Latched inputs for data bus applications
With their on-chip voltage reference the PCD3311C and
PCD3312C provide constant output amplitudes which are
independent of the operating supply voltage and ambient
temperature.
• I2C-bus compatible
• Selection of parallel or serial (I2C-bus) data input
(PCD3311C).
2
An on-chip filtering system assures a very low total
harmonic distortion in accordance with CEPT
recommendations.
GENERAL DESCRIPTION
The PCD3311C and PCD3312C are single-chip silicon
gate CMOS integrated circuits. They are intended
principally for use in telephone sets to provide the
dual-tone multi-frequency (DTMF) combinations required
for tone dialling systems. The various audio output
frequencies are generated from an on-chip 3.58 MHz
quartz crystal-controlled oscillator. A separate crystal is
3
PCD3311C; PCD3312C
In addition to the standard DTMF frequencies the devices
can also provide:
• Twelve standard frequencies used in simplex modem
applications for data rates from 300 to 1200 bits per
second
• Two octaves of musical scales in steps of semitones.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
VDD
operating supply voltage
2.5
−
6.0
UNIT
V
IDD
operating supply current
−
−
0.9
mA
Istb
standby current
−
−
3
µA
VHG(RMS)
DTMF HIGH group output voltage level (RMS value)
158
192
205
mV
VLG(RMS)
DTMF LOW group output voltage level (RMS value)
125
150
160
mV
Gv
pre-emphasis (voltage gain) of group
1.85
2.10
2.35
dB
THD
total harmonic distortion
−
−25
−
dB
Tamb
operating ambient temperature
−25
−
+70
°C
4
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
PCD3311CP
DIP14
PCD3311CT
PCD3312CP
PCD3312CT
1996 Nov 21
DESCRIPTION
VERSION
plastic dual in-line package; 14 leads (300 mil)
SOT27-1
SO16
plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
DIP8
plastic dual in-line package; 8 leads (300 mil)
SOT97-1
SO8
plastic small outline package; 8 leads; body width 7.5 mm
SOT176-1
3
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
5
PCD3311C; PCD3312C
BLOCK DIAGRAM
handbook, full pagewidth
OSCI
2(4)
1(3)
D5
D4
D3
D2
D1/SDA
D0/SCL
STROBE
3
14(2)
HIGH
GROUP
DIVIDER
4
VSS
13(1)
CLOCK
GENERATOR
OSCILLATOR
MODE
VDD
OSCO
DAC
HIGH
12
11
10
9(8)
INPUT
CONTROL
LOGIC
DIVIDER
SELECTION
(ROM)
SWITCHED
CAPACITOR
BANDGAP
VOLTAGE
REFERENCE
(5)6
ADDER
8(7)
SWITCHED RESISTOR
CAPACITOR CAPACITOR
DAC
LOW
LOW
GROUP
DIVIDER
5
TONE
PCD3311C
PCD3312C
7(6)
MGG543
A0
The un-parenthesised numbers are for the PCD3311CP, those in parenthesis for the PCD3312C.
Fig.1 Block diagram.
6
6.1
PINNING INFORMATION
6.2
Pinning PCD3311CP
Pin description PCD3311CP
SYMBOL
PIN
TYPE
OSCI
1
I
oscillator input
OSCO
2
O
oscillator output
MODE
3
I
mode select input (selects
I2C or parallel data input)
D5
4
I
parallel data input
STROBE
5
I
strobe input (for loading
data in parallel mode)
TONE
6
O
frequency output (DTMF,
modem, musical tones)
A0
7
I
slave address input (to be
connected to VDD or VSS)
D0/SCL
8
I
parallel data input or
I2C-bus clock line
D1/SDA
9
I
parallel data input or
I2C-bus data line
D2 − D4
10 − 12
I
parallel data inputs
VSS
13
P
negative supply
VDD
14
P
positive supply
handbook, halfpage
OSCI
1
14 VDD
OSCO
2
13 VSS
MODE
3
12 D4
D5
4
PCD3311CP 11 D3
STROBE
5
10 D2
TONE
6
9
D1/SDA
A0
7
8
D0/SCL
DESCRIPTION
MGG508
Fig.2 Pin configuration PCD3311CP.
1996 Nov 21
4
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
6.3
Pinning PCD3311CT
PCD3311C; PCD3312C
6.4
Pin description PCD3311CT
SYMBOL
PIN
TYPE
OSCI
1
I
oscillator input
OSCO
2
O
oscillator output
MODE
3
I
mode select input (selects
I2C or parallel data input)
D5
4
I
parallel data input
n.c.
5
−
not connected
STROBE
6
I
strobe input (for loading
data in parallel mode)
TONE
7
O
frequency output (DTMF,
modem, musical tones)
A0
8
I
slave address input (to be
connected to VDD or VSS)
D0/SCL
9
I
parallel data input or
I2C-bus clock line
D1/SDA
10
I
parallel data input or
I2C-bus data line
D2, D3
11, 12
I
parallel data inputs
n.c.
13
−
not connected
D4
14
I
parallel data input
VSS
15
P
negative supply
VDD
16
P
positive supply
handbook, halfpage
OSCI
1
16 VDD
OSCO
2
15 VSS
MODE
3
14 D4
D5
4
13 n.c.
n.c.
5
12 D3
STROBE
6
11 D2
TONE
7
10 D1/SDA
A0
8
9
PCD3311CT
D0/SCL
MGG509
Fig.3 Pin configuration PCD3311CT.
6.5
Pinning PCD3312C
6.6
Pin description PCD3312C
SYMBOL
handbook, halfpage
VSS
1
8
SDA
VDD
2
7
SCL
OSCI
3
6
A0
OSCO
4
5
TONE
PCD3312C
MGG510
Fig.4 Pin configuration PCD3312C.
1996 Nov 21
5
DESCRIPTION
PIN
TYPE
DESCRIPTION
VSS
1
P
negative supply
VDD
2
P
positive supply
OSCI
3
I
oscillator input
OSCO
4
O
oscillator output
TONE
5
O
frequency output (DTMF,
modem, musical tones)
A0
6
I
slave address input (to be
connected to VDD or VSS)
SCL
7
I
I2C-bus clock line
SDA
8
I
I2C-bus data line
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
7
7.1
FUNCTIONAL DESCRIPTION
7.4
A code representing the required tones is sent to the
Divider Selection ROM which selects the correct division
ratio in both of the Frequency Dividers (or in one divider, if
only a single tone is required).
D4 and D5 are used to select between DTMF dual, DTMF
single, modem and musical tones (see Table 1). D0, D1,
D2 and D3 select the tone combination or single tone
within the selected application. They also, in combination
with D4, select the standby mode. See Tables 2, 3, 4
and 5.
The Oscillator circuit provides a square wave of frequency
3.58 MHz. Each Frequency Divider divides the frequency
of the Oscillator to give a serial digital square wave with a
frequency simply related to that of the required tone.
PCD 3312C has no parallel data pins as data input is via
the I2C-bus.
The output from each Frequency Divider goes to a DAC,
which is also fed by a clock derived from the oscillator.
Using these two signals, the DAC produces an
approximate sine wave of the required frequency, with an
amplitude derived from the Voltage Reference.
Table 1
D5
D4
APPLICATION
LOW HIGH DTMF dual tones (all 16 combinations)
The output from the Adder goes through two stages of Low
Pass Filters to give a smoothed tone (single or dual), and
finally to the TONE output.
HIGH LOW modem tones
HIGH HIGH musical tones
7.5
Clock/oscillator connection
Strobe input (PCD3311C )
The STROBE input (with internal pull-down) allows the
loading of parallel data into D0 to D5 when MODE is HIGH.
The timebase for the PCD3311C and PCD3312C is a
crystal-controlled oscillator, requiring a 3.58 MHz quartz
crystal to be connected between OSCI and OSCO.
Alternatively, the OSCI input can be driven from an
external clock of 3.58 MHz.
The data inputs must be stable preceding the
positive-going edge of the strobe pulse (active HIGH).
Input data are loaded at the negative-going edge of the
strobe pulse and then the corresponding tone (or standby
mode) is provided at the TONE output. The output remains
unchanged until the negative-going edge of the next
STROBE pulse (for new data) is received. Figure 5 is an
example of the timing relationship between STROBE and
the data inputs.
Mode selection (PCD3311C)
The MODE input selects the data input mode for the
PCD3311C. When MODE is connected to VDD (HIGH),
data can be received in the parallel mode. When
connected to VSS (LOW) or left open, data can be received
via the serial I2C-bus.
When MODE is LOW, data is received serially via the
I2C-bus.
PCD 3312C has no MODE input as data input is via the
I2C-bus only.
1996 Nov 21
Use of D5 and D4 to select application
LOW LOW DTMF single tones; musical tones;
standby
The output from the DAC goes to an Adder where, for
DTMF, it is combined with the output from the other DAC.
7.3
Data inputs (PCD3311C)
Inputs D0, D1, D2, D3, D4 and D5 are used in the parallel
data input mode of the PCD3311C. Inputs D0 and D1 are
also used in serial input mode when they act as the SCL
and SDA inputs respectively. Inputs D0 and D1 have no
internal pull-down or pull-up resistors and must not be left
open in any application. Inputs D2, D3, D4 and D5 have
internal pull-down.
General (see Fig.1)
The Input Control Logic decodes the input data to
determine whether DTMF, modem or musical tones are
selected; and which particular tone or combination of
tones is required.
7.2
PCD3311C; PCD3312C
6
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
PCD3311C; PCD3312C
tSPW
handbook, full pagewidth
90%
10%
STROBE
tDS
tDH
D0
D1
D2
D3
D4
D5
ttone (ON)
TONE
oscillator OFF
MGG511
Fig.5
7.6
oscillator ON
output tones
Timing of STROBE, parallel data inputs and TONE output (770 Hz + 1477 Hz in example) in the parallel
mode (MODE = HIGH).
I2C-bus clock and data inputs
7.8
SCL and SDA are the serial clock and serial data inputs
according to the I2C-bus specification, see Chapter 8.
SCL and SDA must be pulled up externally to VDD.
The slave address in the serial mode consists of 7 bits: 6
bits internally fixed, 1 externally set via A0. in the serial
mode, the same input data codes are used as in the
parallel mode. See Tables 2, 3, 4 and 5.
Address input
Address input A0 defines the least significant bit of the
I2C-bus address of the device (see Fig.6). The first 6 bits
of the address are fixed internally. By tying the A0 of each
device to VDD (HIGH) and VSS (LOW) respectively, two
different PCD3311C or PCD3312C devices can be
individually addressed on the bus.
7.9
Tone output
The single and dual tones provided at the TONE output are
first filtered by an on-chip switched-capacitor filter,
followed by an active RC low-pass filter. The filtered tones
fulfil the CEPT recommendations for total harmonic
distortion of DTMF tones. An on-chip reference voltage
provides output tone levels independent of the supply
voltage. Tables 3, 4 and 5 give the frequency deviation of
the output tones with respect to the standard DTMF,
modem and music frequencies.
Whether one or two devices are used, A0 must be
connected to VDD or VSS.
1996 Nov 21
I2C-bus data configuration (see Fig.6)
The PCD3311C and PCD3312C are always slave
receivers in the I2C-bus configuration. The R/W bit in is
thus always LOW, indicating that the master
(microcontroller) is writing.
For the PCD3311C, SCL and SDA are combined with
parallel inputs D0 and D1 respectively - D0/SCL and
D1/SDA operate serially only when MODE is LOW.
7.7
oscillator ON
no output tone
7
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
PCD3311C; PCD3312C
acknowledge
from slave
handbook, full pagewidth
MSB
S
0
acknowledge
from slave
R/W
1
0
0
1
0
A0
0
A
X
X
D5
D4
slave address
D3
D2
D1
D0
A
P
data
internal STROBE
for data latching
MGG512
Fig.6 I2C-bus data format.
7.10
Power-on reset
In order to avoid an undefined state when the power is switched ON, the devices have an internal reset circuit which sets
the standby mode (oscillator OFF).
7.11
TABLES OF INPUT AND OUTPUT
The specified output tones are obtained when a 3.579545 MHz crystal is used.
In each table, the logical states for the input data lines are related to voltage levels as follows:
1 = HIGH = VDD
0 = LOW = VSS
X = don’t care
Table 2
Input data for no output tone, TONE in 3-state
D5
D4
D3
D2
D1
D0
HEX(1)
OSCILLATOR
X
0
0
0
0
0
00 or 20
ON
X
0
0
0
0
1
01 or 21
OFF
X
0
0
0
1
0
02 or 22
OFF
X
0
0
0
1
1
03 or 23
OFF
Note
1. The alternative HEX values depend on the value of D5.
1996 Nov 21
8
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
Table 3
D5
PCD3311C; PCD3312C
Input data and output for DTMF tones
D4
D3
D2
D1
D0
HEX
TONE
STANDARD
OUTPUT
SYMBOL FREQUENCY
FREQ.
Hz
Hz
FREQUENCY
DEVIATION
%
Hz
08
−
697
697.90
+0.13
+0.90
1
09
−
770
770.46
+0.06
+0.46
0
0A
−
852
850.45
−0.18
−1.55
1
1
0B
−
941
943.23
+0.24
+2.23
1
0
0
0C
−
1209
1206.45
−0.21
−2.55
1
0
1
0D
−
1336
1341.66
+0.42
+5.66
1
1
1
0
0E
−
1477
1482.21
+0.35
+5.21
0
1
1
1
1
0F
−
1633
1638.24
+0.32
+5.24
1
0
0
0
0
10
0
941+1336
−
−
−
1
0
0
0
1
11
1
697+1209
−
−
−
0
0
1
0
0
0
0
0
1
0
0
0
0
1
0
1
0
0
1
0
0
0
1
0
0
1
0
0
0
0
0
0
1
0
0
1
0
12
2
697+1336
−
−
−
0
1
0
0
1
1
13
3
697+1477
−
−
−
0
1
0
1
0
0
14
4
770+1209
−
−
−
0
1
0
1
0
1
15
5
770+1336
−
−
−
0
1
0
1
1
0
16
6
770+1477
−
−
−
0
1
0
1
1
1
17
7
852+1209
−
−
−
0
1
1
0
0
0
18
8
852+1336
−
−
−
0
1
1
0
0
1
19
9
852+1477
−
−
−
0
1
1
0
1
0
1A
A
697+1633
−
−
−
0
1
1
0
1
1
1B
B
770+1633
−
−
−
0
1
1
1
0
0
1C
C
852+1633
−
−
−
0
1
1
1
0
1
1D
D
941+1633
−
−
−
0
1
1
1
1
0
1E
*
941+1209
−
−
−
0
1
1
1
1
1
1F
#
941+1477
−
−
−
Table 4
D5
Input data and output for modem tones
D4
D3
D2
D1
D0
HEX
STANDARD
FREQUENCY
TONE
OUTPUT
FREQ.
Hz
Hz
FREQUENCY
DEVIATION
%
Hz
1
0
0
1
0
0
24
1300
1296.94
−0.24
−3.06
1
0
0
1
0
1
25
2100
2103.14
+0.15
+3.14
1
0
0
1
1
0
26
1200
1197.17
−0.24
−2.83
1
0
0
1
1
1
27
2200
2192.01
−0.36
−7.99
1
0
1
0
0
0
28
980
978.82
−0.12
−1.18
1
0
1
0
0
1
29
1180
1179.03
−0.08
−0.97
1996 Nov 21
9
TELECOM.
STANDARD
V.23
Bell 202
V.21
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
D5
D4
D3
D2
D1
D0
HEX
PCD3311C; PCD3312C
STANDARD
FREQUENCY
TONE
OUTPUT
FREQ.
Hz
Hz
FREQUENCY
DEVIATION
%
Hz
1
0
1
0
1
0
2A
1070
1 073.33
+0.31
+3.33
1
0
1
0
1
1
2B
1270
1265.30
−0.37
−4.70
1
0
1
1
0
0
2C
1650
1655.66
+0.34
+5.66
1
0
1
1
0
1
2D
1850
1852.77
+0.15
+2.77
1
0
1
1
1
0
2E
2 025
2021.20
−0.19
−3.80
1
0
1
1
1
1
2F
2225
2223.32
−0.08
−1.68
Table 5
D5
TELECOM.
STANDARD
Bell 103
V.21
Bell 103
Input/output for musical tones
D4
D3
D2
D1
D0
HEX
NOTE
STD. FREQ.
BASED ON
A4 = 440 Hz
TONE
OUTPUT
FREQUENCY
Hz
Hz
1
1
0
0
0
0
30
D#5
622.3
622.5
1
1
0
0
0
1
31
E5
659.3
659.5
1
1
0
0
1
0
32
F5
698.5
697.9
1
1
0
0
1
1
33
F#5
740.0
741.1
1
1
0
1
0
0
34
G5
784.0
782.1
1
1
0
1
0
1
35
G#5
830.6
832.3
1
1
0
1
1
0
36
A5
880.0
879.3
1
1
0
1
1
1
37
A#5
932.3
931.9
1
1
1
0
0
0
38
B5
987.8
985.0
1
1
1
0
0
1
39
C6
1046.5
1044.5
1
1
1
0
1
0
3A
C#6
1108.7
1111.7
1
0
1
0
0
1
29
D6
1174.7
1179.0
1
1
1
0
1
1
3B
D#6
1244.5
1245.1
1
1
1
1
0
0
3C
E6
1318.5
1318.9
1
1
1
1
0
1
3D
F6
1396.9
1402.1
0
0
1
1
1
0
0E
F#6
1480.0
1482.2
1
1
1
1
1
0
3E
G6
1568.0
1572.0
1
0
1
1
0
0
2C
G#6
1661.2
1655.7
1
1
1
1
1
1
3F
A6
1760.0
1768.5
0
0
0
1
0
0
04
A#6
1864.7
1875.1
0
0
0
1
0
1
05
B6
1975.5
1970.0
1
0
0
1
0
1
25
C7
2093.0
2103.1
1
0
1
1
1
1
2F
C#7
2217.5
2223.3
0
0
1
1
1
0
06
D7
2349.3
2358.1
0
0
0
1
1
1
07
D#7
2489.0
2470.4
1996 Nov 21
10
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
8
PCD3311C; PCD3312C
I2C-BUS INTERFACE
The I2C-bus is for two-way communication between different ICs or modules. It uses only two lines, a serial data line
(SDA) and a serial clock line (SCL), both of which are bi-directional. Both lines must be connected to a positive supply
via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus
is not busy.
8.1
Bit transfer (see Fig.7)
One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period
of the clock pulse as changes in the data line at this time will be interpreted as control signals.
SDA
SCL
change
of data
allowed
data line
stable;
data valid
MBC621
Fig.7 Bit transfer.
8.2
Start and stop conditions (see Fig.8)
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line, while the
clock is HIGH is defined as the start condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is
defined as the stop condition (P).
SDA
SDA
SCL
SCL
S
P
START condition
STOP condition
Fig.8 Start and stop conditions.
1996 Nov 21
11
MBC622
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
8.3
PCD3311C; PCD3312C
System configuration (see Fig.9)
A device generating a message is a ‘transmitter’, a device receiving a message is the ‘receiver’. The device that controls
message transfer is the ‘master’ and the devices that are controlled by the master are the ‘slaves’.
SDA
SCL
MASTER
TRANSMITTER /
RECEIVER
SLAVE
TRANSMITTER /
RECEIVER
SLAVE
RECEIVER
MASTER
TRANSMITTER /
RECEIVER
MASTER
TRANSMITTER
MBA605
Fig.9 System configuration.
8.4
Acknowledge
The number of data bytes transferred between the start and stop conditions from transmitter to receiver is not limited.
Each byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the
transmitter whereas the master generates an extra acknowledge after the reception of each byte. Also a master must
generate an acknowledge after reception of each byte that has been clocked out of the slave transmitter. The device that
acknowledges has to pull down the SDA line during the acknowledge-related clock pulse. Set-up and hold times must
be taken into account to ensure that the SDA line is stable LOW during the whole HIGH period of the
acknowledge-related clock pulse. A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event the transmitter must leave the data
line HIGH to enable the master to generate the stop condition.
DATA OUTPUT
BY TRANSMITTER
not acknowledge
DATA OUTPUT
BY RECEIVER
acknowledge
SCL FROM
MASTER
1
2
8
9
S
START
CONDITION
MBC602
Fig.10 Acknowledgment on the I2C-bus.
1996 Nov 21
12
clock pulse for
acknowledgement
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
8.5
PCD3311C; PCD3312C
Timing specifications
The PCD3311C and PCD3312C accept data input from a microcontroller and are ‘slave receivers’ when operating via
the I2C-bus. They support the ‘standard’ and ‘low-speed’ modes of the I2C-bus, but not the ‘fast’ mode detailed in “The
I2C-bus and how to use it” document order no. 9398 393 40011. The timing requirements for the devices are described
in Sections 8.5.1 and 8.5.2.
8.5.1
STANDARD MODE
Masters generate a bus clock with a maximum frequency of 100 kHz. Detailed timing is shown in Fig.11, where the two
signal levels are LOW = VIL and HIGH = VIH, see Chapter 11. Figure 12 shows a complete data transfer in standard
mode. The time symbols are explained in Table 6.
handbook, full pagewidth
SDA
t LOW
t BUF
tf
SCL
t HD;STA
tr
t HD;DAT
t HIGH
t SU;DAT
SDA
MBC764
t SU;STA
Fig.11 Standard mode timing.
1996 Nov 21
13
t SU;STO
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
PCD3311C; PCD3312C
handbook, full pagewidth
SDA
SCL
1-7
8
START ADDRESS
CONDITION
R/W
9
ACK
1-7
8
DATA
9
ACK
1-7
START ADDRESS
CONDITION
8
9
R/W
ACK
STOP
MBC765
Clock LOW minimum = 4.7 µs; clock HIGH minimum = 4 µs.
The dashed line is the acknowledgment of the receiver.
Mark-to-space ratio = 1 : 1 (LOW-to-HIGH).
Maximum number of bytes is unrestricted.
Premature termination of transfer is allowed by generation of STOP condition.
Acknowledge clock bit must be provided by master.
Fig.12 Complete data transfer in standard mode.
Table 6
Explanation of time symbols used in Fig.11
SYMBOL
PARAMETER
REMARKS
MIN.
MAX.
UNIT
fSCL
SCL clock frequency
tSW
tolerable pulse spike width
−
100
ns
tBUF
bus free time
The time that the bus is free (SDA is HIGH)
before a new transmission is initiated by SDA
going LOW.
4.7
−
µs
tSU;STA
set-up time repeated START
Only valid for repeated start code.
4.7
−
µs
tHD;STA
hold time START condition
The time between SDA going LOW and the first 4.0
valid negative-going transition of SCL.
−
µs
tLOW
SCL LOW time
The LOW period of the SCL clock.
4.7
−
µs
tHIGH
SCL HIGH time
The HIGH period of the SCL clock.
4.0
−
µs
tr
rise time SDA and SCL
−
1.0
µs
tf
fall time SDA and SCL
−
0.3
µs
tSU;DAT
data set-up time
250
−
ns
tHD;DAT
data hold time
0
−
ns
tSU;STO
set-up time STOP condition
4.0
−
µs
8.5.2
0
100
kHz
LOW-SPEED MODE
Masters generate a bus clock with a maximum frequency of 2 kHz; a minimum LOW period of 105 µs and a minimum
HIGH period of 365 µs. The mark-to-space ratio is 1 : 3 LOW-to-HIGH. Detailed timing is shown in Fig.13, where the two
signal levels are LOW = VIL and HIGH = VIH, see Chapter 11. Figure 14 shows a complete data transfer in low-speed
mode.The time symbols are explained in Table 7.
1996 Nov 21
14
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
PCD3311C; PCD3312C
handbook, full pagewidth
SDA
tLOW
tBUF
tf
SCL
tHD;STA
tr
tHIGH
tSU;DAT
tHD;DAT
SDA
tSU;STA
tSU;STO
MGG545
Fig.13 Low-speed mode timing.
handbook, full pagewidth
R/W
SDA
SCL
START
CONDITION
START BYTE
DUMMY
REPEATED
ACKNOWLEDGE START
CONDITION
ADDRESS
Clock LOW minimum = 130 µs ±25 µs; clock HIGH minimum 390 µs ±25 µs.
Mark-to-space ratio = 1 : 3 (LOW-to-HIGH).
Start byte 0000 0001.
Maximum number of bytes = 6.
Premature termination of transfer not allowed.
Acknowledge clock bit must be provided by master.
Fig.14 Complete data transfer in low speed mode.
1996 Nov 21
15
ACKNOWLEDGE STOP
CONDITION
MGG546
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
Table 7
PCD3311C; PCD3312C
Explanation of time symbols used in Fig.13
SYMBOL
PARAMETER
REMARKS
MIN.
MAX.
UNIT
fSCL
SCL clock frequency
0
2
kHz
tSW
tolerable pulse spike width
−
100
ns
tBUF
bus free time
The time that the bus is free (SDA is
HIGH) before a new transmission is
initiated by SDA going LOW.
105
−
µs
tSU;STA
set-up time repeated START
Only valid for repeated start code.
105
155
µs
tHD;STA
hold time START condition
The time between SDA going LOW and
the first valid negative-going transition of
SCL.
365
415
µs
tLOW
SCL LOW time
The LOW period of the SCL clock.
105
155
µs
tHIGH
SCL HIGH time
The HIGH period of the SCL clock.
365
−
µs
tr
rise time SDA and SCL
−
1.0
µs
tf
fall time SDA and SCL
−
0.3
µs
tSU;DAT
data set-up time
250
−
ns
tHD;DAT
data hold time
0
−
ns
tSU;STO
set-up time STOP condition
105
155
µs
9
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, it is good practice to take
normal precautions appropriate to handling MOS devices (see “Handbook IC03, Section: General, Handling MOS
devices”).
1996 Nov 21
16
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
PCD3311C; PCD3312C
10 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VDD
supply voltage
−0.8
+8.0
V
VI
all input voltages
−0.8
VDD + 0.8
V
II
DC input current
−10
+10
mA
IO
DC output current
−10
+10
mA
Ptot
total power dissipation
−
300
mW
PO
power dissipation per output
−
50
mW
IDD
supply current through pin VDD
−50
+50
mA
ISS
supply current through pin VSS
−50
+50
mA
Tstg
storage temperature
−65
+150
°C
Tamb
operating ambient temperature
−25
+70
°C
11 CHARACTERISTICS
VDD = 2.5 to 6.0 V; VSS = 0 V; Tamb = −25 to +70 °C; all voltages with respect to VSS; fxtal = 3.58 MHz (gmL);
maximum series resistance = 50 Ω; unless otherwise specified.
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
2.5
−
6.0
V
no output tone
−
50
100
µA
single output tone
−
0.5
0.8
mA
VDD
operating supply voltage
IDD
operating supply current (note 1)
dual output tone
Istb
TYP
static standby current (note 2)
−
0.6
0.9
mA
−
−
3
µA
Inputs/outputs (SDA)
D0 TO D5; MODE; STROBE
VIL
LOW level input voltage
0
−
0.3VDD
V
VIH
HIGH level input voltage
0.7VDD
−
VDD
V
−30
−150
−300
nA
D2 TO D5 MODE; STROBE; A0
IIL
pull-down input current; VI = VDD
SCL (D0); SDA (D1)
IOL
LOW level output current (SDA); VOL = 0.4 V
3
−
−
mA
fSCL
SCL clock frequency
−
−
100
kHz
Ci
input capacitance; VI = VSS
−
−
7
pF
ti
allowable input spike pulse width
−
−
100
ns
1996 Nov 21
17
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
SYMBOL
PCD3311C; PCD3312C
PARAMETER
MIN.
TYP
MAX.
UNIT
TONE output (see test circuit, Fig.15)
VHG(RMS)
DTMF output voltage (RMS), HIGH group
158
192
205
mV
VLG(RMS)
DTMF output voltage (RMS), LOW group
125
150
160
mV
−
V
VDC
DC voltage level
−
1⁄
Gv
voltage gain (pre-emphasis) of group
1.85
2.10
2.35
dB
THD
Total Harmonic Distortion; Tamb = 25 °C
−
−25
−
dB
dual tone (note 3)
−
−29
−
dB
output impedance
−
0.1
0.5
kΩ
maximum allowable amplitude at OSCI
−
−
VDD − VSS V
modem tone (note 4)
Zo
2 VDD
OSCI input
VOSC(p-p)
Timing (VDD = 3 V)
tOSC(ON)
oscillator start-up time
−
3
−
ms
tTONE(ON)
TONE start-up time (note 5)
−
0.5
−
ms
tSPW
STROBE pulse width (note 6)
400
−
−
ns
tDS
data set-up time (note 6)
150
−
−
ns
tDH
data hold time (note 6)
100
−
−
ns
Notes
1. Oscillator ON; VDD = 3 V; crystal connected between OSCI and OSCO; D0/SCL and D1/SDA connected via
resistance of 5.6 kΩ to VDD; all other pins left open.
2. As note 1, but with oscillator OFF.
3. Related to the level of the LOW group frequency component, according to CEPT recommendations.
4. Related to the level of the fundamental frequency.
5. Oscillator must be running.
6. Values are referenced to the 10% and 90% levels of the relevant pulse amplitudes, with a total voltage swing from
VSS to VDD.
handbook, halfpage
1 µF
VDD
TONE
PCD3311C
PCD3312C
50 pF
VSS
10 kΩ
MGG513
Fig.15 TONE output test circuit.
1996 Nov 21
18
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
MGG514
1.6
PCD3311C; PCD3312C
MGG515
300
handbook, halfpage
handbook, halfpage
Istb
(µA)
Tamb =
IDD
Tamb =
−25 ˚C
(µA)
−25 ˚C
1.2
+25 ˚C
200
+25 ˚C
+70 ˚C
+70 ˚C
0.8
100
0.4
0
0
0
2
4
6
VDD (V)
0
8
MGG516
1.5
6 V
8
DD (V)
MGG517
6
handbook, halfpage
Tamb =
−25 ˚C
IDD
(mA)
4
Fig.17 Operating supply current as a function of
supply voltage; oscillator ON, no output at
TONE.
Fig.16 Standby supply current as a function of
supply voltage; oscillator OFF.
handbook, halfpage
2
Tamb = −25 ˚C
II
+25 ˚C
+70 ˚C
(µA)
+25 ˚C
4
1
+70 ˚C
2
0.5
0
0
0
2
4
0
6 V
8
DD (V)
Fig.18 Operating supply current as a function of
supply voltage; oscillator ON, dual tone at
TONE.
1996 Nov 21
1
2
VI (V)
3
Fig.19 Pull-down input current as a function of
input voltage; VDD = 3 V.
19
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
PCD3311C; PCD3312C
MGG518
−11
VTONE
handbook, halfpage
VTONE
Tamb =
(dBm)
(dB)
−25 ˚C
−12
MGG519
0.4
handbook, halfpage
HIGH GROUP
+25 ˚C
Tamb =
0
+70 ˚C
−25 ˚C
+25 ˚C
−13
−0.4
−14
+70 ˚C
−25 ˚C
+25 ˚C
LOW GROUP
+70 ˚C
−15
0
2
4
VDD (V)
−0.8
106
6
Fig.20 DTMF output voltage levels as a function of
operating supply voltage; RL = 1 MΩ.
105
104
RL (Ω)
Fig.21 Dual tone output voltage level as a function
of output load resistance.
MGG520
handbook, full pagewidth
0
level
(dBm)
−20
CS203
−40
−60
−80
−100
0
1
2
3
4
handbook, full pagewidth
5
frequency (kHz)
MGG521
0
level
(dBm)
−20
−40
−60
CS203
−80
−100
0
10
20
30
40
frequency (kHz)
50
Fig.22 Typical frequency spectrum of a dual tone signal after flat-band amplification of 6 dB.
1996 Nov 21
103
20
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
PCD3311C; PCD3312C
12 APPLICATION INFORMATION
VSS
handbook, halfpage
1
2 3 A
4
5 6 B
7
8 9 C
0
D
VDD
mute
GENERAL
PURPOSE
MICROCONTROLLER
(4 or 8-BIT)
data bus
OSCI OSCO STROBE
D0
PCD3311C TONE
D5
MODE VDD VSS
MBH669
Fig.23 PCD3311C driven by microcontroller with parallel data bus.
VSS
handbook, halfpage
1
2 3 A
4
5 6 B
7
8 9 C
0
D
VDD
mute
TELEPHONY
MICROCONTROLLER
PCF84C21A
OSCI OSCO
3.58 MHz
I2C bus
4 pF
OSCI OSCO
SCL
PCD3312C TONE
SDA
A0
VSS
VDD
MGG544
Fig.24 PCD3312C driven by microcontroller PCF84C21A. The PCF84C21A is a single-chip 8-bit microcontroller
with 2 kbytes ROM and I2C-bus. The same application is possible with the PCD3311C with MODE = VSS.
1996 Nov 21
21
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
PCD3311C; PCD3312C
13 PACKAGE OUTLINES
DIP14: plastic dual in-line package; 14 leads (300 mil)
SOT27-1
ME
seating plane
D
A2
A
A1
L
c
e
Z
w M
b1
(e 1)
b
MH
8
14
pin 1 index
E
1
7
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.13
0.53
0.38
0.36
0.23
19.50
18.55
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
2.2
inches
0.17
0.020
0.13
0.068
0.044
0.021
0.015
0.014
0.009
0.77
0.73
0.26
0.24
0.10
0.30
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT27-1
050G04
MO-001AA
1996 Nov 21
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-03-11
22
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
PCD3311C; PCD3312C
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
D
E
A
X
c
HE
y
v M A
Z
9
16
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
8
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
10.5
10.1
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.9
0.4
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.41
0.40
0.30
0.29
0.050
0.42
0.39
0.055
0.043
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
inches
0.10
Z
(1)
θ
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT162-1
075E03
MS-013AA
1996 Nov 21
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-24
23
o
8
0o
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
PCD3311C; PCD3312C
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
ME
seating plane
D
A2
A
A1
L
c
Z
w M
b1
e
(e 1)
b
MH
b2
5
8
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches
0.17
0.020
0.13
0.068
0.045
0.021
0.015
0.042
0.035
0.014
0.009
0.39
0.36
0.26
0.24
0.10
0.30
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.045
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT97-1
050G01
MO-001AN
1996 Nov 21
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-02-04
24
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
PCD3311C; PCD3312C
SO8: plastic small outline package; 8 leads; body width 7.5 mm
SOT176-1
D
E
A
X
c
y
HE
v M A
Z
8
5
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
4
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
7.65
7.45
7.6
7.4
1.27
10.65
10.00
1.45
1.1
0.45
1.1
1.0
0.25
0.25
0.1
2.0
1.8
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.30
0.29
0.30
0.29
0.050
0.42
0.39
0.057
0.043
0.018
0.043
0.039
0.01
0.01
0.004
0.079
0.071
inches
0.10
θ
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
91-08-13
95-02-25
SOT176-1
1996 Nov 21
EUROPEAN
PROJECTION
25
o
8
0o
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
14 SOLDERING
14.1
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
14.3.2
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
14.2
14.2.1
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
14.3
14.3.1
14.3.3
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1996 Nov 21
WAVE SOLDERING
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
14.2.2
PCD3311C; PCD3312C
26
Philips Semiconductors
Product specification
DTMF/modem/musical-tone generators
PCD3311C; PCD3312C
15 DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
16 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
17 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1996 Nov 21
27
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© Philips Electronics N.V. 1996
SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
417021/1200/02/pp28
Date of release: 1996 Nov 21
Document order number:
9397 750 01155