INTEGRATED CIRCUITS DATA SHEET TDF8771A Triple 8-bit video Digital-to-Analog Converter (DAC) Product specification 2003 Apr 29 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDF8771A FEATURES GENERAL DESCRIPTION • 8-bit resolution The TDF8771A is a triple 8-bit video Digital-to-Analog Converter (DAC). It converts the digital input signals into analog voltage outputs at a maximum conversion rate of 35 MHz. • Sampling rate up to 35 MHz • Internal reference voltage regulator • No deglitching circuit required The DACs are based on resistor-string architecture with integrated output buffers. The output voltage range is determined by a built-in reference source. • Large output voltage range • 1 kΩ output load • Power dissipation only 200 mW The device is fabricated in a 5 V, CMOS process that ensures high functionality with low power dissipation. • Single 5 V power supply • 44-pin QFP package • Operating ambient temperature from −40 to +85 °C. APPLICATIONS • General purpose high-speed digital-to-analog conversion • Digital TV • Graphic display • Desktop video processing. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VDDA analog supply voltage 4.5 5.0 5.5 V VDDD digital supply voltage 4.5 5.0 5.5 V IDDA analog supply current RL = 1 kΩ; note 1 10 30 45 mA IDDD digital supply current fclk = 35 MHz − 3 10 mA Tamb operating ambient temperature −40 − +85 °C INL integral non-linearity fclk = 35 MHz; ramp input − ±0.3 ±1 LSB DNL differential non-linearity fclk = 35 MHz; ramp input − ±0.15 ±0.5 LSB fclk(max) maximum clock frequency 35 − − MHz Ptot total power dissipation 45 200 360 mW RL = 1 kΩ; fclk = 35 MHz; note 1 Note 1. Minimum and maximum data of current and power consumption are measured in worse case conditions: for minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDF8771AH QFP44 2003 Apr 29 DESCRIPTION plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 × 10 × 1.75 mm 2 VERSION SOT307-2 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDF8771A BLOCK DIAGRAM VDDA handbook, full pagewidth RED digital inputs (bits R0 to R3) VDDD 32, 35, 39, 43 4 clock input 7, 27 31 12 to 9 1 reference current input (IREF) 44 RED analog output 40 GREEN analog output 36 BLUE analog output 4 LSB DECODER TDF8771A RED digital inputs (bits R4 to R7) 4 8 5 to 3 GREEN digital inputs (bits G0 to G3) 4 20 to 17 4 MSB DECODER RESISTOR STRING 4 LSB DECODER GREEN digital inputs (bits G4 to G7) 4 16 to 13 BLUE digital inputs (bits B0 to B3) 4 30, 29 4 RESISTOR STRING MSB DECODER 26, 25 4 LSB DECODER BLUE digital inputs (bits B4 to B7) 4 24 to 21 4 RESISTOR STRING MSB DECODER BANDGAP REFERENCE 34, 37, 38, 41 33 2, 42 6, 28 MGX351 not connected reference voltage decoupling input (VREF) Fig.1 Block diagram. 2003 Apr 29 3 VSSA VSSD Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDF8771A PINNING SYMBOL PIN DESCRIPTION IREF 1 reference current input for output buffers VSSA1 2 analog supply ground 1 R7 3 RED digital input data; bit 7 (MSB) R6 4 RED digital input data; bit 6 R5 5 RED digital input data; bit 5 VSSD1 6 digital supply ground 1 VDDD1 7 digital supply voltage 1 R4 8 RED digital input data; bit 4 R3 9 RED digital input data; bit 3 R2 10 RED digital input data; bit 2 R1 11 RED digital input data; bit 1 R0 12 RED digital input data; bit 0 (LSB) G7 13 GREEN digital input data; bit 7 (MSB) G6 14 GREEN digital input data; bit 6 G5 15 GREEN digital input data; bit 5 G4 16 GREEN digital input data; bit 4 G3 17 GREEN digital input data; bit 3 G2 18 GREEN digital input data; bit 2 G1 19 GREEN digital input data; bit 1 G0 20 GREEN digital input data; bit 0 (LSB) B7 21 BLUE digital input data; bit 7 (MSB) B6 22 BLUE digital input data; bit 6 B5 23 BLUE digital input data; bit 5 B4 24 BLUE digital input data; bit 4 B3 25 BLUE digital input data; bit 3 B2 26 BLUE digital input data; bit 2 VDDD2 27 digital supply voltage 2 VSSD2 28 digital supply ground 2 B1 29 BLUE digital input data; bit 1 B0 30 BLUE digital input data; bit 0 (LSB) CLK 31 clock input VDDA1 32 analog supply voltage 1 VREF 33 decoupling input for reference voltage n.c. 34 not connected VDDA2 35 analog supply voltage 2 OUTB 36 BLUE analog output n.c. 37 not connected n.c. 38 not connected VDDA3 39 analog supply voltage 3 OUTG 40 GREEN analog output 2003 Apr 29 4 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) 44 RED analog output 44 OUTR handbook, full pagewidth IREF 1 33 VREF VSSA1 2 32 VDDA1 R7 3 31 CLK R6 4 30 B0 R5 5 29 B1 VSSD1 6 VDDD1 7 27 VDDD2 R4 8 26 B2 R3 9 25 B3 R2 10 24 B4 R1 11 23 B5 28 VSSD2 5 B6 22 B7 21 G0 20 G1 19 G2 18 G3 17 G4 16 G6 14 G7 13 R0 12 TDF8771A Fig.2 Pin configuration. 2003 Apr 29 34 n.c. OUTR 35 VDDA2 analog supply voltage 4 36 OUTB analog supply ground 2 43 42 VSSA2 42 43 VDDA4 VSSA2 VDDA4 37 n.c. not connected 38 n.c. 41 39 VDDA3 n.c. 40 OUTG DESCRIPTION 41 n.c. PIN G5 15 SYMBOL TDF8771A MGX352 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDF8771A LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER MIN. MAX. UNIT VDDA analog supply voltage −0.5 +6.5 V VDDD digital supply voltage −0.5 +6.5 V ∆VDD supply voltage difference between VDDA and VDDD −1.0 +1.0 V Tstg storage temperature −55 +150 °C Tamb operating ambient temperature −40 +85 °C Tj junction temperature − 125 °C THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient in free air VALUE UNIT 75 K/W HANDLING Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. 2003 Apr 29 6 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDF8771A CHARACTERISTICS VDDA = VDDD = 4.5 to 5.5 V; VSSA and VSSD shorted together; VDDA − VDDD = −0.5 to +0.5 V; Tamb = −40 to +85 °C; typical values measured at VDDA = VDDD = 5 V and Tamb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies VDDA analog supply voltage 4.5 5.0 5.5 V VDDD digital supply voltage 4.5 5.0 5.5 V IDDA analog supply current RL = 1 kΩ; note 1 10 30 45 mA IDDD digital supply current fclk = 35 MHz − 3 10 mA Inputs CLOCK INPUT (PIN 31) VIL LOW level input voltage 0 − 1.2 V VIH HIGH level input voltage 2.0 − VDDD V R, G, B DIGITAL INPUTS (PINS 12 TO 8, 5 TO 3, 20 TO 13, 30, 29 AND 26 TO 21) VIL LOW level input voltage 0 − 1.2 V VIH HIGH level input voltage 2.0 − VDDD V − 0.6 0.7 mA REFERENCE CURRENT INPUT FOR OUTPUT BUFFERS (PIN 1) II input current Timing; see Fig.3 fclk(max) maximum clock frequency 35 − − MHz tCPH clock pulse width HIGH 9 − − ns tCPL clock pulse width LOW 9 − − ns tr clock rise time − − 6 ns tf clock fall time − − 6 ns tSU;DAT input data set-up time 4 − − ns tHD;DAT input data hold time 4 − − ns 1.180 1.238 1.305 V Voltage reference (pin 33, referenced to VSSA) VVREF reference voltage Outputs OUTB, OUTG, OUTR ANALOG OUTPUTS (PINS 36, 40 AND 44, REFERENCED TO VSSA) FOR 1 kΩ LOAD; see Table 1 FSR full-scale output voltage range 2.80 3.00 3.18 V Vos offset of analog voltage output − 0.33 − V VO(max) maximum output voltage data inputs = logic 1; note 2 2.95 3.30 3.52 V VO(min) minimum output voltage data inputs = logic 0; note 2 0.05 0.25 0.45 V THD total harmonic distortion fi = 4.43 MHz; fclk = 35 MHz − −47 − dB ZL output load impedance 0.9 1.0 1.1 kΩ 2003 Apr 29 7 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) SYMBOL PARAMETER TDF8771A CONDITIONS MIN. TYP. MAX. UNIT Transfer function (fclk = 35 MHz) INL integral non-linearity ramp input − ±0.3 ±1 LSB DNL differential non-linearity ramp input − ±0.15 ±0.5 LSB αct crosstalk DAC to DAC −50 − − dB MDAC DAC to DAC matching − 1.0 2.8 % Switching characteristics (for 1 kΩ output load); see Fig.4 td input to 50% output delay time full-scale change − 12 − ns ts1 settling time 10% to 90% of full-scale change − 15 − ns ts2 settling time to ±1 LSB − 50 − ns − 1 − LSB⋅ns Output transients (glitches) Vg area for 1 LSB change Notes 1. Minimum and maximum data of current and power consumption are measured in worse case conditions: for minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1. 2. VO is directly proportional to VVREF. Table 1 Input coding and DAC output voltages (typical values) BINARY INPUT DATA (SYNC = BLANK = 0) CODE DAC OUTPUT VOLTAGES (V) OUTB, OUTR, OUTG RL = 1 kΩ 0000 0000 0 0.262 0000 0001 1 0.273 2003 Apr 29 to to to 1000 0000 128 1.731 to to to 1111 1110 254 3.188 1111 1111 255 3.200 8 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDF8771A TIMING ,,,,, ,,,,, t SU; DAT handbook, full pagewidth ,,,,, ,,,,, t HD; DAT V IH data input stable 50 % V IL clock input MBB656 - 1 t CPL t CPH Fig.3 Input timing. handbook, full pagewidth clock input input code (example of a full-scale input data transition) 50 % code 1023 code 0 1 LSB 714 mV (code 1023) 10 % td 50 % Vo 90 % 54 mV (code 0) 1 LSB t s1 t s2 Fig.4 Switching timing. 2003 Apr 29 50 % V IL 9 MDB320 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDF8771A INTERNAL CIRCUITRY 1/1 page = 296 mm (Datasheet) V DDD V DDA DACs resistor string GND V SSA V SSD (a) V DDA 27 mm (b) V DDA V DDA V DD V DD V DD 125 Ω V DD (typ.) GND V SSA MBB658 - 1 (c) (d) (a) Digital inputs; pins 3 to 5, 8 to 26 and 29 to 31. (b) Pin VREF (pin 33). (c) Pin IREF (pin 1). (d) Pins OUTB, OUTG and OUTR (pins 36, 40 and 44). Fig.5 Internal circuitry. 2003 Apr 29 10 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDF8771A APPLICATION INFORMATION 5V handbook, full pagewidth 5V VSSA OUTR OUTG 10 nF 1 kΩ VSSA VDDA4 VSSA2 n.c. 44 VSSA IREF 5V VSSA 43 42 41 VSSA VSSA VDDA3 n.c. 40 OUTB 10 nF 1 kΩ 39 38 n.c. 37 10 nF 1 kΩ VSSA VDDA2 n.c. 36 35 34 VREF 100 nF 1 33 VSSA1 2 32 R7 3 31 CLK R6 4 30 B0 R5 5 29 B1 VSSD1 6 28 VSSD2 VSSA 6.8 kΩ VDDD1 5V TDF8771A VDDA1 5V 10 nF 27 R4 8 26 B2 R3 9 25 B3 R2 10 24 B4 R1 11 23 B5 12 13 14 15 16 17 18 19 20 21 22 R0 G7 G6 G5 G4 G3 G2 G1 G0 B7 B6 MGX353 Analog and digital supplies should be separated and decoupled. Supplies are not connected internally. All ground pins must be connected. One ground plane is preferred although it depends on application. See Figs 7 and 9 for example of anti-aliasing filter. Fig.6 Application diagram. 2003 Apr 29 VSSA VDDD2 7 10 nF VSSD 5V 10 nF 11 VSSD Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDF8771A handbook, full pagewidth 12 µH TDF8771A 125 Ω 12 µH 18 pF 180 Ω OUTR (pin 44) and OUTG (pin 40) and OUTB (pin 36) 56 pF 18 pF 150 pF analog video output (R,G or B) 56 pF 820 Ω analog ground 2.4 V (p-p) MGX354 Fig.7 Example of anti-aliasing filter for 2.4 V output swing. Characteristics of Fig.8 • Order 5; adapted CHEBYSHEV MSA693 0 1/2 page (Datasheet) α (dB) • Ripple ρ ≥ 0.7 dB 22 mm • f at −3 dB = 6.2 MHz • fNOTCH = 10.8 MHz. 40 80 120 160 0 10 20 30 f (MHz) 40 Fig.8 Frequency response for filter shown in Fig.7. 2003 Apr 29 12 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDF8771A handbook, full pagewidth 27 µH TDF8771A 125 Ω 27 µH 6.8 pF 500 Ω OUTR (pin 44) and OUTG (pin 40) and OUTB (pin 36) 27 pF 6.8 pF 68 pF analog ground analog video output (R,G or B) 27 pF 500 Ω 1.5 V (p-p) MGX355 Fig.9 Example of anti-aliasing filter for 1.5 V output swing. Characteristics of Fig.10 • Order 5; adapted CHEBYSHEV MSA694 0 1/2 page (Datasheet) α (dB) • Ripple ρ ≥ 0.25 dB 22 mm • f at −3 dB = 5.6 MHz • fNOTCH = 11.7 MHz. 40 80 120 160 0 10 20 30 40 f i (MHz) Fig.10 Frequency response for filter shown in Fig.9. 2003 Apr 29 13 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDF8771A PACKAGE OUTLINE QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2 c y X A 33 23 34 22 ZE e E HE A A2 wM (A 3) A1 θ bp Lp pin 1 index L 12 44 1 detail X 11 wM bp e ZD v M A D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 2.1 0.25 0.05 1.85 1.65 0.25 0.4 0.2 0.25 0.14 10.1 9.9 10.1 9.9 0.8 12.9 12.3 12.9 12.3 1.3 0.95 0.55 0.15 0.15 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 θ o 10 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 97-08-01 03-02-25 SOT307-2 2003 Apr 29 EUROPEAN PROJECTION 14 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDF8771A If wave soldering is used the following conditions must be observed for optimal results: SOLDERING Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferably be kept: Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. • below 220 °C for all the BGA packages and packages with a thickness ≥ 2.5mm and packages with a thickness <2.5 mm and a volume ≥350 mm3 so called thick/large packages Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. • below 235 °C for packages with a thickness <2.5 mm and a volume <350 mm3 so called small/thin packages. Wave soldering When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. 2003 Apr 29 15 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDF8771A Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE(1) WAVE BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA not suitable suitable(3) DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS not PLCC(4), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP REFLOW(2) suitable suitable suitable not recommended(4)(5) suitable not recommended(6) suitable Notes 1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2003 Apr 29 16 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDF8771A DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2003 Apr 29 17 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDF8771A NOTES 2003 Apr 29 18 Philips Semiconductors Product specification Triple 8-bit video Digital-to-Analog Converter (DAC) TDF8771A NOTES 2003 Apr 29 19 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA75 © Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 753504/01/pp20 Date of release: 2003 Apr 29 Document order number: 9397 750 10875