PHILIPS TDA8926J

INTEGRATED CIRCUITS
DATA SHEET
TDA8926
Power stage 2 × 50 W class-D
audio amplifier
Preliminary specification
Supersedes data of 2002 Feb 07
2002 Oct 10
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
CONTENTS
TDA8926
15
TEST AND APPLICATION INFORMATION
15.1
15.2
15.3
15.4
15.5
15.6
BTL application
Package ground connection
Output power
Reference design
Reference design bill of material
Curves measured in reference design
16
PACKAGE OUTLINE
17
SOLDERING
17.1
Introduction to soldering through-hole mount
packages
Soldering by dipping or by solder wave
Manual soldering
Suitability of through-hole mount IC packages
for dipping and wave soldering methods
1
FEATURES
2
APPLICATIONS
3
GENERAL DESCRIPTION
4
QUICK REFERENCE DATA
5
ORDERING INFORMATION
6
BLOCK DIAGRAM
7
PINNING
8
FUNCTIONAL DESCRIPTION
8.1
8.2
8.2.1
8.2.2
8.3
Power stage
Protection
Overtemperature
Short-circuit across the loudspeaker terminals
BTL operation
17.2
17.3
17.4
18
DATA SHEET STATUS
9
LIMITING VALUES
19
DEFINITIONS
10
THERMAL CHARACTERISTICS
20
DISCLAIMERS
11
QUALITY SPECIFICATION
12
DC CHARACTERISTICS
13
AC CHARACTERISTICS
14
SWITCHING CHARACTERISTICS
14.1
Duty factor
2002 Oct 10
2
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
1
TDA8926
FEATURES
3
• High efficiency (>94%)
The TDA8926 is the switching power stage of a two-chip
set for a high efficiency class-D audio power amplifier
system. The system is split into two chips:
• Operating voltage from ±15 to ±30 V
• Very low quiescent current
• TDA8926J: a digital power stage in a DBS17P power
package
• High output power
• Short-circuit proof across the load, only in combination
with controller TDA8929T
• TDA8929T: the analog controller chip in a SO24
package.
• Diagnostic output
With this chip set a compact 2 × 50 W audio amplifier
system can be built, operating with high efficiency and very
low dissipation. No heatsink is required, or depending on
supply voltage and load, a very small one. The system
operates over a wide supply voltage range from
±15 up to ±30 V and consumes a very low quiescent
current.
• Usable as a stereo Single-Ended (SE) amplifier or as a
mono amplifier in Bridge-Tied Load (BTL)
• Electrostatic discharge protection (pin to pin)
• Thermally protected, only in combination with controller
TDA8929T.
2
GENERAL DESCRIPTION
APPLICATIONS
• Television sets
• Home-sound sets
• Multimedia systems
• All mains fed audio systems
• Car audio (boosters).
4
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
±15
±25
±30
V
General; VP = ±25 V
VP
supply voltage
Iq(tot)
total quiescent current
no load connected
−
35
45
mA
η
efficiency
Po = 30 W
−
94
−
%
RL = 8 Ω; THD = 10%; VP = ±25 V
30
37
−
W
RL = 4 Ω; THD = 10%; VP = ±21 V
40
50
−
W
RL = 8 Ω; THD = 10%; VP = ±21 V
80
100
−
W
Stereo single-ended configuration
Po
output power
Mono bridge-tied load configuration
Po
5
output power
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
TDA8926J
2002 Oct 10
NAME
DESCRIPTION
VERSION
DBS17P
plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
SOT243-1
3
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
6
TDA8926
BLOCK DIAGRAM
VDD2 VDD1
handbook, full pagewidth
13
TDA8926J
EN1
SW1
REL1
STAB
DIAG
POWERUP
EN2
SW2
REL2
4
1
2
5
6
DRIVER
HIGH
CONTROL
AND
HANDSHAKE
7
OUT1
DRIVER
LOW
9
temp
3
TEMPERATURE SENSOR
AND
current
CURRENT PROTECTION
15
14
17
16
VSS1
VDD2
12
BOOT2
DRIVER
HIGH
CONTROL
AND
HANDSHAKE
11
OUT2
DRIVER
LOW
8
10
VSS1 VSS2
Fig.1 Block diagram.
2002 Oct 10
BOOT1
4
MGW137
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
7
TDA8926
PINNING
SYMBOL
PIN
DESCRIPTION
SW1
1
digital switch input; channel 1
REL1
2
digital control output; channel 1
DIAG
3
digital open-drain output for
overtemperature and overcurrent
report
handbook, halfpage
SW1
1
REL1
2
DIAG
3
EN1
4
VDD1
5
BOOT1
6
EN1
4
digital enable input; channel 1
VDD1
5
positive power supply; channel 1
BOOT1
6
bootstrap capacitor; channel 1
OUT1
7
PWM output; channel 1
VSS1
8
negative power supply; channel 1
OUT1
7
STAB
9
decoupling internal stabilizer for
logic supply
VSS1
8
STAB
9
VSS2
10
negative power supply; channel 2
OUT2
11
PWM output; channel 2
BOOT2
12
bootstrap capacitor; channel 2
VDD2
13
positive power supply; channel 2
EN2
14
digital enable input; channel 2
POWERUP
15
enable input for switching on
internal reference sources
REL2
16
digital control output; channel 2
SW2
17
digital switch input; channel 2
TDA8926J
VSS2 10
OUT2 11
BOOT2 12
VDD2 13
EN2 14
POWERUP 15
REL2 16
SW2 17
MGW141
Fig.2 Pin configuration.
2002 Oct 10
5
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
8
TDA8926
8.2
FUNCTIONAL DESCRIPTION
Temperature and short-circuit protection sensors are
included in the TDA8926. The protection circuits are
operational only in combination with the controller
TDA8929T. In the event that the maximum current or
maximum temperature is exceeded the diagnostic output
is activated. The controller has to take appropriate
measures by shutting down the system.
The combination of the TDA8926J and the TDA8929T
controller produces a two-channel audio power amplifier
system using the class-D technology (see Fig.3). In the
TDA8929T controller the analog audio input signal is
converted into a digital Pulse Width Modulation (PWM)
signal.
The power stage TDA8926 is used for driving the low-pass
filter and the loudspeaker load. It performs a level shift
from the low-power digital PWM signal, at logic levels, to a
high-power PWM signal that switches between the main
supply lines. A 2nd-order low-pass filter converts the
PWM signal into an analog audio signal across the
loudspeaker.
8.2.1
8.2.2
SHORT-CIRCUIT ACROSS THE LOUDSPEAKER
TERMINALS
Power stage
When the loudspeaker terminals are short-circuited this
will be detected by the current protection. If the output
current exceeds the maximum output current of 5 A, then
pin DIAG becomes LOW. The controller should shut down
the system to prevent damage. Using the controller
TDA8929T the system is shut down within 1 µs, and after
220 ms it will attempt to restart the system again. During
this time the dissipation is very low, therefore the average
dissipation during a short circuit is practically zero.
The power stage contains the high-power DMOS
switches, the drivers, timing and handshaking between the
power switches and some control logic. For protection, a
temperature sensor and a maximum current detector are
built-in on the chip.
For interfacing with the controller chip the following
connections are used:
• Switch (pins SW1 and SW2): digital inputs; switching
from VSS to VSS + 12 V and driving the power DMOS
switches
• Release (pins REL1 and REL2): digital outputs;
switching from VSS to VSS + 12 V; follow SW1 and SW2
with a small delay
• Enable (pins EN1 and EN2): digital inputs; at a level of
VSS the power DMOS switches are open and the PWM
outputs are floating; at a level of VSS + 12 V the power
stage is operational and controlled by the switch pin if
pin POWERUP is at VSS + 12 V
• Power-up (pin POWERUP): must be connected to a
continuous supply voltage of at least VSS + 5 V with
respect to VSS
• Diagnostics (pin DIAG): digital open-drain output; pulled
to VSS if the temperature or maximum current is
exceeded.
2002 Oct 10
OVERTEMPERATURE
If the junction temperature (Tj) exceeds 150 °C, then
pin DIAG becomes LOW. The diagnostic pin is released if
the temperature is dropped to approximately 130 °C, so
there is a hysteresis of approximately 20 °C.
For a description of the controller, see data sheet
“TDA8929T, Controller class-D audio amplifier”.
8.1
Protection
6
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VSS1 VDD1
3
1
+25 V
VDD2 VDD1
13
5
TDA8929T
R fb
TDA8926J
20 PWM1
BOOT1
6
IN1− 4
INPUT
STAGE
Vi(1)
IN1+ 5
SGND1 2
PWM
MODULATOR
mute
STABI
ROSC
OSC 7
REL1 2
24 SW1
SW1 1
21 EN1
EN1 4
19 STAB
22
OSCILLATOR
VMODE
7
OUT1
DRIVER
LOW
MANAGER
VSS1
DIAGCUR
15 DIAGTMP
DIAG 3
MODE 6
CONTROL
AND
HANDSHAKE
DRIVER
HIGH
STAB 9
SGND
VSSA
23 REL1
TEMPERATURE SENSOR
AND
CURRENT PROTECTION
VDD2
12 BOOT2
MODE
POWERUP 15
Philips Semiconductors
Power stage 2 × 50 W class-D audio
amplifier
2002 Oct 10
VDDA
VDDD
VSSA VDDA
7
SGND
SGND2 11
mute
EN2 14
16 EN2
IN2+ 8
CONTROL
SW2 17
AND
HANDSHAKE
16
REL2
13 SW2
INPUT
STAGE
Vi(2)
PWM
MODULATOR
14 REL2
IN2− 9
DRIVER
HIGH
SGND
(0 V)
11 OUT2
DRIVER
LOW
17 PWM2
R fb
12
VSS2(sub)
10
18
8
VDD2
VSSD
VSS1 VSS2
10
VSSA VDDA
−25 V
TDA8926
Fig.3 Typical application schematic of the class-D system using controller TDA8929T and the TDA8926J.
MGU387
Preliminary specification
VSSA
handbook, full pagewidth
VSSD
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
8.3
TDA8926
BTL operation
In this way the system operates as a mono BTL amplifier
and with the same loudspeaker impedance a four times
higher output power can be obtained.
BTL operation can be achieved by driving the audio input
channels of the controller in the opposite phase and by
connecting the loudspeaker with a BTL output filter
between the two outputs (pins OUT1 and OUT2) of the
power stage (see Fig.4).
For more information see Chapter 15.
VDD2 VDD1
handbook, full pagewidth
13
5
TDA8926J
EN1
SW1
REL1
STAB
DIAG
POWERUP
EN2
SW2
REL2
4
1
2
CONTROL
AND
HANDSHAKE
6
DRIVER
HIGH
7 OUT1
DRIVER
LOW
9
temp
3
TEMPERATURE SENSOR
AND
current
CURRENT PROTECTION
15
14
17
16
VSS1
VDD2
12
CONTROL
AND
HANDSHAKE
SGND
(0 V)
BOOT2
DRIVER
HIGH
11 OUT2
DRIVER
LOW
8
10
VSS1 VSS2
Fig.4 Mono BTL application.
2002 Oct 10
BOOT1
8
MGU385
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
TDA8926
9 LIMITING VALUES
In accordance with the Absolute Maximum Rate System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VP
supply voltage
−
±30
V
VP(sc)
supply voltage for
short-circuits across the load
−
±30
V
IORM
repetitive peak current in
output pins
−
5
A
Tstg
storage temperature
−55
+150
°C
Tamb
ambient temperature
−40
+85
°C
Tvj
virtual junction temperature
−
150
°C
Ves(HBM)
electrostatic discharge
voltage (HBM)
all pins with respect to VDD (class 1a) −500
+500
V
all pins with respect to VSS (class 1a) −1500
+1500
V
−1500
+1500
V
all pins with respect to VDD (class B) −250
+250
V
all pins with respect to VSS (class B)
−250
+250
V
all pins with respect to each other
(class B)
−250
+250
V
note 1
all pins with respect to each other
(class 1a)
Ves(MM)
electrostatic discharge
voltage (MM)
note 2
Notes
1. Human Body Model (HBM); Rs = 1500 Ω; C = 100 pF.
2. Machine Model (MM); Rs = 10 Ω; C = 200 pF; L = 0.75 µH.
10 THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
in free air
40
K/W
Rth(j-c)
thermal resistance from junction to case
in free air
1.0
K/W
11 QUALITY SPECIFICATION
In accordance with “SNW-FQ611-part D” if this device is used as an audio amplifier (except for ESD, see also Chapter 9).
2002 Oct 10
9
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
TDA8926
12 DC CHARACTERISTICS
VP = ±25 V; Tamb = 25 °C; measured in test diagram of Fig.6; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VP
supply voltage
Iq(tot)
total quiescent current
note 1
±15
±25
±30
no load connected
−
35
45
mA
outputs floating
−
5
10
mA
11
13
15
V
V
Internal stabilizer logic supply (pin STAB)
VO(STAB)
stabilizer output voltage
Switch inputs (pins SW1 and SW2)
VIH
HIGH-level input voltage
referenced to VSS
10
−
VSTAB
V
VIL
LOW-level input voltage
referenced to VSS
0
−
2
V
Control outputs (pins REL1 and REL2)
VOH
HIGH-level output voltage
referenced to VSS
10
−
VSTAB
V
VOL
LOW-level output voltage
referenced to VSS
0
−
2
V
Diagnostic output (pin DIAG, open-drain)
VOL
LOW-level output voltage
IDIAG = 1 mA; note 2
0
−
1.0
V
ILO
output leakage current
no error condition
−
−
50
µA
Enable inputs (pins EN1 and EN2)
VIH
HIGH-level input voltage
referenced to VSS
−
9
VSTAB
V
VIL
LOW-level input voltage
referenced to VSS
0
5
−
V
VEN(hys)
hysteresis voltage
−
4
−
V
II(EN)
input current
−
−
300
µA
Switching-on input (pin POWERUP)
VPOWERUP
operating voltage
referenced to VSS
5
−
12
V
II(POWERUP)
input current
VPOWERUP = 12 V
−
100
170
µA
Temperature protection
Tdiag
temperature activating diagnostic VDIAG = VDIAG(LOW)
150
−
−
°C
Thys
hysteresis on temperature
diagnostic
−
20
−
°C
VDIAG = VDIAG(LOW)
Notes
1. The circuit is DC adjusted at VP = ±15 to ±30 V.
2. Temperature sensor or maximum current sensor activated.
2002 Oct 10
10
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
TDA8926
13 AC CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Single-ended application; note 1
Po
output power
RL = 8 Ω; VP = ±25 V
THD = 0.5%
25(2)
30
−
W
THD = 10%
30(2)
37
−
W
THD = 0.5%
−
40
−
W
THD = 10%
−
52
−
W
THD = 0.5%
30(2)
40
−
W
THD = 10%
40(2)
50
−
W
fi = 1 kHz
−
0.01
0.05
%
fi = 10 kHz
−
0.1
−
%
29
30
31
dB
Po = 30 W; fi = 1 kHz; note 4
−
94
−
%
RL = 8 Ω; THD = 0.5%
70(2)
80
−
W
RL = 8 Ω; THD = 10%
80(2)
100
−
W
fi = 1 kHz
−
0.01
0.05
%
fi = 10 kHz
−
0.1
−
%
RL = 8 Ω; VP = ±30 V
RL = 4 Ω; VP = ±21 V
THD
total harmonic distortion
Gv(cl)
closed-loop voltage gain
η
efficiency
Po = 1 W; note 3
Mono BTL application; note 5
Po
THD
output power
total harmonic distortion
Gv(cl)
closed loop voltage gain
η
efficiency
Po = 1 W; note 3
Po = 30 W; fi = 1 kHz; note 4
35
36
37
dB
−
94
−
%
Notes
1. VP = ±25 V; RL = 8 Ω; fi = 1 kHz; fosc = 310 kHz; Rs = 0.1 Ω (series resistance of filter coil); Tamb = 25 °C; measured
in reference design (SE application) shown in Fig.7; unless otherwise specified.
2. Indirectly measured; based on Rds(on) measurement.
3. Total Harmonic Distortion (THD) is measured in a bandwidth of 22 Hz to 22 kHz. When distortion is measured using
a low-order low-pass filter a significantly higher value will be found, due to the switching frequency outside the audio
band.
4. Efficiency for power stage; output power measured across the loudspeaker load.
5. VP = ±21 V; RL = 8 Ω; fi = 1 kHz; fosc = 310 kHz; Rs = 0.1 Ω (series resistance of filter coil); Tamb = 25 °C; measured
in reference design (BTL application) shown in Fig.7; unless otherwise specified.
2002 Oct 10
11
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
TDA8926
14 SWITCHING CHARACTERISTICS
VP = ±25 V; Tamb = 25 °C; measured in Fig.6; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
PWM outputs (pins OUT1 and OUT2); see Fig.5
tr
rise time
−
30
−
ns
tf
fall time
−
30
−
ns
tblank
blanking time
−
70
−
ns
tPD
propagation delay
from pin SW1 (SW2) to
pin OUT1 (OUT2)
−
20
−
ns
tW(min)
minimum pulse width
note 1
−
220
270
ns
Rds(on)
on-resistance of the output
transistors
−
0.2
0.3
Ω
Note
1. When used in combination with controller TDA8929T, the effective minimum pulse width during clipping is 0.5tW(min).
14.1
Duty factor
For the practical useable minimum and maximum duty factor (δ) which determines the maximum output power:
t W(min) × f osc
t W(min) × f osc
------------------------------- × 100% < δ <  1 – ------------------------------- × 100%
2
2
Using the typical values: 3.5% < δ < 96.5%.
2002 Oct 10
12
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
TDA8926
1/f osc
handbook, full pagewidth
VDD
PWM
output
(V)
0V
VSS
tr
tf
t blank
t PD
VSTAB
VSW
(V)
VSS
VSTAB
VREL
(V)
VSS
MGW145
100 ns
Fig.5 Timing diagram PWM output, switch and release signals.
2002 Oct 10
13
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5
6
BOOT1
7
OUT1
12 kΩ
EN1 4
SW1 1
REL1 2
CONTROL
AND
HANDSHAKE
DRIVER
HIGH
15 nF
DRIVER
LOW
STAB 9
temp
DIAG 3
14
12 V
POWERUP 15
TEMPERATURE SENSOR
AND
current
CURRENT PROTECTION
EN2 14
100
nF
SW2 17
REL2 16
V
VEN
VSW1
12 V
0
V
VREL1 VSTAB
V
CONTROL
AND
HANDSHAKE
V
VDIAG VSW2
VREL2
12 V
0
VOUT1 V
VSS1
2VP
VDD2
12
BOOT2
11
OUT2
DRIVER
HIGH
Philips Semiconductors
13
TDA8926J
Power stage 2 × 50 W class-D audio
amplifier
VDD1
15 TEST AND APPLICATION INFORMATION
dbook, full pagewidth
2002 Oct 10
VDD2
15 nF
DRIVER
LOW
8
10
VSS1
VSS2
VOUT2 V
MGW183
Preliminary specification
TDA8926
Fig.6 Test diagram.
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
15.1
TDA8926
BTL application
When using the system in a mono BTL application (for more output power), the inputs of both channels of the PWM
modulator must be connected in parallel; the phase of one of the inputs must be inverted. In principle the loudspeaker
can be connected between the outputs of the two single-ended demodulation filters.
15.2
Package ground connection
The heatsink of the TDA8926J is connected internally to VSS.
15.3
Output power
The output power in single-ended applications can be estimated using the formula
2
RL
------------------------------------------------ × V P × ( 1 – t W(min) × f osc )
( R L + R ds(on) + R s )
= -------------------------------------------------------------------------------------------------------------------------2 × RL
P o(1%)
[ V P × ( 1 – t W(min) × f osc ) ]
The maximum current I O(max) = --------------------------------------------------------------- should not exceed 5 A.
R L + R ds(on) + R s
The output power in BTL applications can be estimated using the formula
2
RL
---------------------------------------------------------- × 2V P × ( 1 – t W(min) × f osc )
R L + 2 × ( R ds(on) + R s )
= ---------------------------------------------------------------------------------------------------------------------------------------2 × RL
P o(1%)
[ 2V P × ( 1 – t W(min) × f osc ) ]
The maximum current I O(max) = -------------------------------------------------------------------- should not exceed 5 A.
R L + 2 × ( R ds(on) + R s )
Where:
RL = load impedance
Rs = series resistance of filter coil
Po(1%) = output power just at clipping
The output power at THD = 10%: Po(10%) = 1.25 × Po(1%).
15.4
Reference design
The reference design for a two-chip class-D audio amplifier for TDA8926J and controller TDA8929T is shown in Fig.7.
The Printed-Circuit Board (PCB) layout is shown in Fig.8. The bill of materials is given in Table 1.
2002 Oct 10
15
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R19
39 kΩ
R20
D1
(5.6 V)
MODE
3
6
R1
OSC
10
7
TDA8929T
SGND1
GND
SGND2
IN1+
C22
330 pF
IN1−
IN2+
C23
330 pF
J5
R4
10 kΩ
2
R6
10 kΩ
18
C29
1 nF
4
21
8
23
9
20
GND
−25 V
inputs
14
15
12
U1
TDA8926J
or
TDA8927J
5
13
9
10
3
1 kΩ
POWER STAGE
EN1
REL1
REL1
SW1
SW1
8
6
4
2
VDD
QGND
C18
1 nF
L2
Sumida 33 µH
CDRH127-330
C14
470 nF
VDDD
1
R15
24 Ω
C15
220 nF
VDD2
QGND
OUT2−
GND
VSSD
C17
220 nF
C16
470 nF
BOOT1
C9
15 nF
R16
24 Ω
7
L4
R14
5.6 Ω
C13
560 pF
VDDD
8Ω
BTL
OUT1+
QGND
C20
1 nF
OUT1−
2
Sumida 33 µH
CDRH127-330
PWM1
4 or 8 Ω
SE
OUT2+
1
VSS1
L7
bead
C19
1 nF
2
C6
220 nF
C7
220 nF
VSS2
OUT2−
2
BOOT2
VDD1
OUT1
1
C8
15 nF
C12
560 pF
1
C21
1 nF
QGND
4 or 8 Ω
SE
OUT1+
outputs
VSSD
VDDA
L5
bead
R21
10 kΩ
C32
220 nF
C34
1500 µF
(35 V)
R22
9.1 kΩ
C33
220 nF
C35
1500 µF
(35 V)
VDDD
C36
220 nF
C37
220 nF
C40
47 µF
(35 V)
C39
220 nF
C41
47 µF
(35 V)
GND
2
VSS
J2
VSS
220 nF
DIAG
OUT2
n.c.
3
QGND
STAB
11
16
R13
5.6 Ω
C30
1 nF
input 2
C5
EN1
QGND
J4
POWERUP
17
15
1
input 1
D2
(7.5 V)
VSSA VSSD
C43
R10
180 pF
DIAGCUR
CONTROLLER
+25 V
QGND
VDDD
C4
220 nF
22
5
R7
10 kΩ
C28
J3
EN2
STAB
11
C27
470 nF
1 nF
J1
SW2
REL2
R24
200 kΩ
VSSD
R12
5.6 Ω
R11
5.6 Ω
C31
1 nF
bead
L6
VSSD
C38
220 nF
VSSA
power supply
QGND
MLD633
Fig.7 Two-chip class-D audio amplifier application diagram for TDA8926J and controller TDA8929T.
Preliminary specification
R21 and R22 are necessary only in BTL applications with asymmetrical supply.
BTL: remove R6, R7, C23, C26 and C27 and close J5 and J6.
C22 and C23 influence the low-pass frequency response and should be tuned with the real load (loudspeaker).
Inputs floating or inputs referenced to QGND (close J1 and J4) or referenced to VSS (close J2 and J3) for an input signal ground reference.
TDA8926
handbook, full pagewidth
16
C26
470 nF
19
24
IN2−
J6
R5
10 kΩ
1
PWM2
17
SW2
13
REL2
14
EN2
16
VSSD
C11
560 pF
C10
560 pF
C3
220 nF
C24
470 nF
12
U2
27 kΩ
VSSA
VDDD
VSSA
VSS2 VSS1
C44
220 nF
S1
GND
C25
470 nF
220 nF
220 nF
VDD1 VDD2
39 kΩ
on
mute
off
C1
C2
Philips Semiconductors
VDDA
Power stage 2 × 50 W class-D audio
amplifier
2002 Oct 10
mode select
VDDA
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C24
C16
C40
C34
C25
C35
C14
C26
C41
C27
L7
state of D art
Version 21 03-2001
D2
L6
Out1
Out2
L5
S1
VSS
GND
VDD
In1
ON
MUTE
OFF
In2
Silk screen top, top view
Copper top, top view
Philips Semiconductors
D1
U1
Power stage 2 × 50 W class-D audio
amplifier
handbook, full pagewidth
2002 Oct 10
TDA8926J/27J & TDA8929T
17
L4
R19
C1
R20
C6
R16
C17
C9
C32 C12
R13
R15
C36
U2
C5
C15
R11
C33 C10
C8
C7
R12
C11
C4 C3
Out2
C19
In1
R5
VSS
In2
J2
C18 C30
C31
R6
J3
J1
C20
J6
R7
R4
C29
C28
GND
C37
C39
R21 R22
VDD
J5
J4
Silk screen bottom, top view
Copper bottom, top view
Fig.8 Printed-circuit board layout for TDA8926J and controller TDA8929T.
MLD634
TDA8926
QGND
Preliminary specification
Out1
C21
C22
C23
R1 C2
R24
L2
C44
C38
C43
C13 R10
R14
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
15.5
TDA8926
Reference design bill of material
Table 1
Two-chip class-D audio amplifier PCB (Version 2.1; 03-2001) for TDA8926J and TDA8929T (see
Figs 7 and 8)
COMPONENT
In1 and In2
DESCRIPTION
VALUE
COMMENTS
2 × Farnell: 152-396
Cinch input connectors
Out1, Out2, VDD, supply/output connectors
GND and VSS
2 × Augat 5KEV-02;
1 × Augat 5KEV-03
S1
on/mute/off switch
PCB switch Knitter ATE 1 E M-O-M
U1
power stage IC
TDA8926J/27J
DBS17P package
U2
controller IC
TDA8929T
SO24 package
L2 and L4
demodulation filter coils
33 µH
2 × Sumida CDRH127-330
L5, L6 and L7
power supply ferrite beads
C1 and C2
supply decoupling capacitors for
VDD to VSS of the controller
220 nF/63 V
2 × SMD1206
C3
clock decoupling capacitor
220 nF/63 V
SMD1206
C4
12 V decoupling capacitor of the
controller
220 nF/63 V
SMD1206
C5
12 V decoupling capacitor of the power 220 nF/63 V
stage
SMD1206
C6 and C7
supply decoupling capacitors for
VDD to VSS of the power stage
SMD1206
3 × Murata BL01RN1-A62
220 nF/63 V
C8 and C9
bootstrap capacitors
15 nF/50 V
2 × SMD0805
C10, C11,
C12 and C13
snubber capacitors
560 pF/100 V
4 × SMD0805
C14 and C16
demodulation filter capacitors
470 nF/63 V
2 × MKT
C15 and C17
resonance suppress capacitors
220 nF/63 V
2 × SMD1206
C18, C19,
C20 and C21
common mode HF coupling capacitors 1 nF/50 V
4 × SMD0805
C22 and C23
input filter capacitors
330 pF/50 V
2 × SMD1206
C24, C25,
C26 and C27
input capacitors
470 nF/63 V
4 × MKT
C28, C29,
C30 and C31
common mode HF coupling capacitors 1 nF/50 V
2 × SMD0805
C32 and C33
power supply decoupling capacitors
220 nF/63 V
2 × SMD1206
C34 and C35
power supply electrolytic capacitors
1500 µF/35 V
2 × Rubycon ZL very low ESR (large
switching currents)
C36, C37,
C38 and C39
analog supply decoupling capacitors
220 nF/63 V
4 × SMD1206
C40 and C41
analog supply electrolytic capacitors
47 µF/35 V
2 × Rubycon ZA low ESR
C43
diagnostic capacitor
180 pF/50 V
SMD1206
C44
mode capacitor
220 nF/63 V
SMD1206
D1
5.6 V Zener diode
BZX79C5V6
DO-35
D2
7.5 V Zener diode
BZX79C7V5
DO-35
R1
clock adjustment resistor
27 kΩ
SMD1206
2002 Oct 10
18
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
COMPONENT
TDA8926
DESCRIPTION
VALUE
COMMENTS
10 kΩ
4 × SMD1206
diagnostic resistor
1 kΩ
SMD1206
snubber resistors
5.6 Ω; >0.25 W
4 × SMD1206
R15 and R16
resonance suppression resistors
24 Ω
2 × SMD1206
R19
mode select resistor
39 kΩ
SMD1206
R20
mute select resistor
39 kΩ
SMD1206
R21
resistor needed when using an
asymmetrical supply
10 kΩ
SMD1206
R22
resistor needed when using an
asymmetrical supply
9.1 kΩ
SMD1206
R24
bias resistor for powering-up the power 200 kΩ
stage
SMD1206
R4, R5,
R6 and R7
input resistors
R10
R11, R12,
R13 and R14
2002 Oct 10
19
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
15.6
TDA8926
Curves measured in reference design
MLD627
102
handbook, halfpage
MLD628
102
handbook, halfpage
THD+N
(%)
THD+N
(%)
10
10
1
1
(1)
10−1
10−1
(1)
10−2
(2)
(2)
10−2
(3)
10−3 −2
10
10−1
1
10
10−3
10
102
103
Po (W)
2 × 8 Ω SE; VP = ±25 V.
(1) 10 kHz.
(2) 1 kHz.
(3) 100 Hz.
Fig.9
102
103
104
f i (Hz)
105
2 × 8 Ω SE; VP = ±25 V.
(1) Po = 10 W.
(2) Po = 1 W.
Total harmonic distortion plus noise as a
function of output power.
Fig.10 Total harmonic distortion plus noise as a
function of input frequency.
MGU859
102
handbook, halfpage
MLD630
102
handbook, halfpage
THD+N
(%)
THD+N
(%)
10
10
1
1
(1)
10−1
(1)
10−1
(2)
(2)
(3)
10−2
10−3
10−2
10−1
1
10
10−2
10−3
10
102
103
Po (W)
102
103
104
f i (Hz)
105
2 × 4 Ω SE; VP = ±21 V.
(1) 10 kHz.
(2) 1 kHz.
(3) 100 Hz.
(1) Po = 10 W.
(2) Po = 1 W.
Fig.11 Total harmonic distortion plus noise as a
function of output power.
Fig.12 Total harmonic distortion plus as a function
of input frequency.
2002 Oct 10
2 × 4 Ω SE; VP = ±21 V.
20
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
TDA8926
MGU860
102
handbook, halfpage
MLD632
102
handbook, halfpage
THD+N
(%)
THD+N
(%)
10
10
1
1
(1)
10−1
(1)
10−1
(2)
(2)
10−2
10−3
10−2
10−2
(3)
10−1
1
10−3
10
102
103
Po (W)
10
102
103
104
f i (Hz)
105
1 × 8 Ω BTL; VP = ±21 V.
(1) 10 kHz.
(2) 1 kHz.
(3) 100 Hz.
1 × 8 Ω BTL; VP = ±21 V.
(1) Po = 10 W.
(2) Po = 1 W.
Fig.13 Total harmonic distortion plus noise as a
function of output power.
Fig.14 Total harmonic distortion plus noise as a
function of input frequency.
MGU855
25
MGU856
100
handbook, halfpage
handbook, halfpage
η
(%)
P
(W)
(1)
(3)
(2)
80
20
60
15
(1)
(2)
40
10
(3)
5
0
10−2
20
10−1
1
10
0
103
102
Po (W)
0
VP = ±21 V; fi = 1 kHz.
(1) 2 × 4 Ω SE.
(2) 1 × 8 Ω BTL.
(3) 2 × 8 Ω SE.
40
60
80
100
Po (W)
VP = ±21 V; fi = 1 kHz.
(1) 2 × 4 Ω SE.
(2) 1 × 8 Ω BTL.
(3) 2 × 8 Ω SE.
Fig.15 Power dissipation as a function of output
power.
2002 Oct 10
20
Fig.16 Efficiency as a function of output power.
21
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
TDA8926
MGU857
200
Po
MGU858
200
Po
handbook, halfpage
handbook, halfpage
(W)
160
(W)
160
120
120
80
80
(1)
(1)
(2)
(3)
(2)
(3)
40
40
0
10
15
20
25
30
0
10
35
15
20
25
30
35
VP (V)
VP (V)
THD + N = 0.5%; fi = 1 kHz.
(1) 1 × 8 Ω BTL.
(2) 2 × 4 Ω SE.
(3) 2 × 8 Ω SE.
THD + N = 10%; fi = 1 kHz.
(1) 1 × 8 Ω BTL.
(2) 2 × 4 Ω SE.
(3) 2 × 8 Ω SE.
Fig.17 Output power as a function of supply
voltage.
Fig.18 Output power as a function of supply
voltage.
MLD613
0
αcs
MLD614
0
αcs
handbook, halfpage
handbook, halfpage
(dB)
(dB)
−20
−20
−40
−40
−60
−80
−100
−60
(1)
(1)
−80
(2)
10
102
103
104
f i (Hz)
−100
105
(2)
10
102
103
104
f i (Hz)
105
2 × 8 Ω SE; VP = ±21 V.
2 × 4 Ω SE; VP = ±21 V.
(1) Po = 10 W.
(2) Po = 1 W.
(1) Po = 10 W.
(2) Po = 1 W.
Fig.19 Channel separation as a function of input
frequency.
Fig.20 Channel separation as a function of input
frequency.
2002 Oct 10
22
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
TDA8926
MLD615
45
MLD616
45
handbook, halfpage
handbook, halfpage
G
(dB)
G
(dB)
40
40
35
35
(1)
(1)
(2)
30
30
(2)
25
20
(3)
25
(3)
10
102
103
104
f i (Hz)
20
105
VP = ±21 V; Vi = 100 mV; Rs = 10 kΩ/Ci = 330 pF.
(1) 1 × 8 Ω BTL.
(2) 2 × 8 Ω SE.
(3) 2 × 4 Ω SE.
103
104
f i (Hz)
105
VP = ±21 V; Vi = 100 mV; Rs = 0 Ω.
(1) 1 × 8 Ω BTL.
(2) 2 × 8 Ω SE.
(3) 2 × 4 Ω SE.
Fig.21 Gain as a function of input frequency.
Fig.22 Gain as a function of input frequency.
MLD617
0
102
10
MLD618
0
handbook, halfpage
handbook, halfpage
SVRR
(dB)
SVRR
(dB)
−20
−20
−40
−40
(1)
(1)
−60
−60
(2)
(2)
(3)
(3)
−80
−100
−80
10
102
103
104
f i (Hz)
−100
105
0
1
2
3
4
5
Vripple(p-p) (V)
VP = ±21 V; Vripple(p-p) = 2 V.
(1) Both supply lines in antiphase.
(2) Both supply lines in phase.
(3) One supply line rippled.
VP = ±21 V.
(1) fripple = 1 kHz.
(2) fripple = 100 Hz.
(3) fripple = 10 Hz.
Fig.23 Supply voltage ripple rejection as a function
of input frequency.
Fig.24 Supply voltage ripple rejection as a function
of ripple voltage (peak-to-peak value).
2002 Oct 10
23
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
TDA8926
MLD619
100
Iq
handbook, halfpage
(mA)
fclk
(kHz)
80
372
60
364
40
356
20
348
0
0
MLD620
380
handbook, halfpage
10
20
30
340
37.5
VP (V)
0
10
20
30
40
VP (V)
RL = open-circuit.
RL = open-circuit.
Fig.25 Quiescent current as a function of supply
voltage.
Fig.26 Clock frequency as a function of supply
voltage.
MLD622
MLD621
5
Vripple
(V)
5
handbook, halfpage
handbook, halfpage
SVRR
(%)
4
4
3
3
(1)
(1)
2
2
1
0
10−2
1
(2)
10−1
1
10
Po (W)
0
10
102
(2)
102
103
f i (Hz)
104
VP = ±21 V; 1500 µF per supply line; fi = 10 Hz.
VP = ±21 V; 1500 µF per supply line.
(1) 1 × 4 Ω SE.
(2) 1 × 8 Ω SE.
(1) Po = 30 W into 1 × 4 Ω SE.
(2) Po = 15 W into 1 × 8 Ω SE.
Fig.27 Supply voltage ripple as a function of output
power.
Fig.28 Supply voltage ripple rejection as a function
of input frequency.
2002 Oct 10
24
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
TDA8926
MLD623
10
MLD624
50
Po
handbook, halfpage
handbook, halfpage
THD+N
(%)
(W)
40
1
(1)
30
10−1
(2)
20
(3)
10−2
10
10−3
100
200
300
400
0
100
500
600
fclk (kHz)
200
300
400
500
600
fclk (kHz)
VP = ±21 V; Po = 1 W in 2 × 8 Ω.
(1) 10 kHz.
(2) 1 kHz.
(3) 100 Hz.
VP = ±21 V; RL = 2 × 8 Ω; fi = 1 kHz; THD + N = 10%.
Fig.29 Total harmonic distortion plus noise as a
function of clock frequency.
Fig.30 Output power as a function of clock
frequency.
MLD625
150
Iq
handbook, halfpage
Vr(PWM)
(mA)
120
(mV)
800
90
600
60
400
30
200
0
100
MLD626
1000
handbook, halfpage
200
300
400
0
100
500
600
fclk (kHz)
200
300
400
500
600
fclk (kHz)
VP = ±25 V; RL = open-circuit.
VP = ±25 V; RL = 2 × 8 Ω.
Fig.31 Quiescent current as a function of clock
frequency.
Fig.32 PWM residual voltage as a function of clock
frequency.
2002 Oct 10
25
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
TDA8926
16 PACKAGE OUTLINE
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
SOT243-1
non-concave
Dh
x
D
Eh
view B: mounting base side
d
A2
B
j
E
A
L3
L
Q
c
1
v M
17
e1
Z
bp
e
e2
m
w M
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A2
bp
c
D (1)
d
Dh
E (1)
e
mm
17.0
15.5
4.6
4.4
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
12.2
11.8
2.54
e1
e2
1.27 5.08
Eh
j
L
L3
m
Q
v
w
x
Z (1)
6
3.4
3.1
12.4
11.0
2.4
1.6
4.3
2.1
1.8
0.8
0.4
0.03
2.00
1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
97-12-16
99-12-17
SOT243-1
2002 Oct 10
EUROPEAN
PROJECTION
26
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
TDA8926
The total contact time of successive solder waves must not
exceed 5 seconds.
17 SOLDERING
17.1
Introduction to soldering through-hole mount
packages
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our “Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
17.2
17.3
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
17.4
Manual soldering
Suitability of through-hole mount IC packages for dipping and wave soldering methods
SOLDERING METHOD
PACKAGE
DIPPING
DBS, DIP, HDIP, SDIP, SIL
WAVE
suitable(1)
suitable
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
2002 Oct 10
27
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
TDA8926
18 DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
Development
DEFINITION
I
Objective data
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Production
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
19 DEFINITIONS
20 DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2002 Oct 10
28
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
TDA8926
NOTES
2002 Oct 10
29
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
TDA8926
NOTES
2002 Oct 10
30
Philips Semiconductors
Preliminary specification
Power stage 2 × 50 W class-D audio
amplifier
TDA8926
NOTES
2002 Oct 10
31
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected]
SCA74
© Koninklijke Philips Electronics N.V. 2002
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753503/02/pp32
Date of release: 2002
Oct 10
Document order number:
9397 750 09591