DIODES DMN3029LFG

DMN3029LFG
Green
N-CHANNEL ENHANCEMENT MODE MOSFET
POWERDI®
Product Summary
NEW PRODUCT
ADVANCE INFORMATION
V(BR)DSS
Features
•
Low RDS(ON) – ensures on state losses are minimized
•
Small form factor thermally efficient package enables higher
density end products
8.0A
•
Occupies just 33% of the board area occupied by SO-8 enabling
smaller end product
6.5A
•
100% UIS (Avalanche) rated
RDS(ON)
ID
TA = 25°C
18.6mΩ @ VGS = 10V
26.5mΩ @ VGS = 4.5V
30V
Description
This new generation MOSFET has been designed to minimize the onstate resistance (RDS(on)) and yet maintain superior switching
performance, making it ideal for high efficiency power management
applications.
Applications
•
•
•
•
100% Rg tested
•
•
•
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
•
•
Case: POWERDI3333-8
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram Below
Terminals: Finish ⎯ Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.072 grams (approximate)
•
•
•
Backlighting
DC-DC Converters
Power management functions
•
POWERDI3333-8
Pin 1
S
S
S
1
8
2
7
3
6
4
5
G
D
D
D
D
Top View
Bottom View
Top View
Internal Schematic
Ordering Information (Note 4)
Part Number
DMN3029LFG-7
DMN3029LFG-13
Notes:
Case
POWERDI3333-8
POWERDI3333-8
Packaging
2000 / Tape & Reel
3000 / Tape & Reel
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
N39 = Product marking code
YYWW = Date code marking
YY = Last digit of year (ex: 10 for 2010)
WW = Week code (01 – 53)
POWERDI is a registered trademark of Diodes Incorporated.
DMN3029LFG
Document number: DS35448 Rev. 7 - 2
1 of 7
www.diodes.com
October 2012
© Diodes Incorporated
DMN3029LFG
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Continuous Drain Current (Note 5) VGS = 10V
Steady
State
Continuous Drain Current (Note 6) VGS = 10V
Steady
State
Continuous Drain Current (Note 6) VGS = 10V
t ≤ 10s
Continuous Drain Current (Note 6) VGS = 4.5V
Steady
State
Continuous Drain Current (Note 6) VGS = 4.5V
t ≤ 10s
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
Pulsed Drain Current (Note 7)
Avalanche Current (Notes 7 & 8)
Repetitive Avalanche Energy (Notes 7 & 8) L = 0.1mH
ID
Value
30
±25
5.3
4.2
Unit
V
V
ID
8.0
6.3
A
ID
9.5
7.7
A
ID
6.5
4.9
A
A
IDM
IAR
EAR
7.8
6.2
70
18
16
A
A
mJ
Symbol
PD
RθJA
PD
RθJA
PD
RθJA
TJ, TSTG
Max
1.0
130.6
2.07
62.5
3.0
43.8
-55 to +150
Unit
W
°C/W
W
°C/W
W
°C/W
°C
ID
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient @TA = +25°C (Note 5)
Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient @TA = +25°C (Note 6)
Power Dissipation (Note 6) t ≤ 10s
Thermal Resistance, Junction to Ambient @TA = +25°C (Note 6) t ≤ 10s
Operating and Storage Temperature Range
Notes:
5. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided.
6. Device mounted on 2” x 2” FR-4 PCB with high coverage 2 oz. Copper, single sided.
7. Repetitive rating, pulse width limited by junction temperature.
8. IAR and EAR rating are based on low frequency and duty cycles to keep TJ = +25°C.
100
400
P(PK), PEAK TRANSIENT POIWER (W)
PW = 10µs
RDS(on)
Limited
ID, DRAIN CURRENT (A)
NEW PRODUCT
ADVANCE INFORMATION
Drain-Source Voltage
Gate-Source Voltage
10
DC
PW = 10s
1
PW = 1s
PW = 100ms
PW = 10ms
PW = 1ms
PW = 100µs
0.1
TJ(max) = 150°C
TA = 25°C
Single Pulse
0.01
0.1
1
10
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 1 SOA, Safe Operation Area
100
350
300
Single Pulse
RθJA = 60°C/W
RθJA(t) = r(t) * RθJA
TJ - TA = P * RθJA(t)
250
200
150
100
50
0
0.0001 0.001 0.01
0.1
1
10
100 1,000
t1, PULSE DURATION TIME (sec)
Fig. 2 Single Pulse Maximum Power Dissipation
POWERDI is a registered trademark of Diodes Incorporated.
DMN3029LFG
Document number: DS35448 Rev. 7 - 2
2 of 7
www.diodes.com
October 2012
© Diodes Incorporated
DMN3029LFG
NEW PRODUCT
ADVANCE INFORMATION
r(t), TRANSIENT THERMAL RESISTANCE
1
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.9
D = 0.05
D = 0.02
0.01
D = 0.01
RθJA(t)=r(t) * RθJA
RθJA = 60°C/W
Duty Cycle, D = t1/ t2
D = 0.005
Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
t1, PULSE DURATION TIMES (sec)
Fig. 3 Transient Thermal Resistance
10
100
1,000
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 9)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = +25°C
Gate-Source Leakage
ON CHARACTERISTICS (Note 9)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
30
-
-
0.1
±100
V
μA
nA
VGS = 0V, ID = 250μA
VDS = 30V, VGS = 0V
VGS = ±25V, VDS = 0V
VGS(th)
RDS (ON)
|Yfs|
VSD
1.2
13,5
22
13.0
0.7
1.8
18.6
26.5
1.0
V
Static Drain-Source On-Resistance
0.9
-
VDS = VGS, ID = 250μA
VGS = 10V, ID = 10A
VGS = 4.5V, ID = 7.5A
VDS = 5V, ID = 10A
VGS = 0V, IS = 1A
Ciss
Coss
Crss
Rg
Qg
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
-
580
110
70
2.0
5.3
11.3
1.9
1.9
4.4
4.6
19.5
5.8
3.0
-
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 10)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge VGS = 4.5V
Total Gate Charge VGS = 10V
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes:
mΩ
S
V
pF
Test Condition
VDS = 15V, VGS = 0V,
f = 1.0MHz
Ω
VDS = 0V, VGS = 0V, f = 1MHz
VGS = 4.5V, VDS = 15V, ID = 10A
nC
VGS = 10V, VDS = 15V,
ID = 10A
ns
ns
ns
ns
VGS = 10V, VDS = 15V,
RL = 15Ω, RG = 6Ω
9. Short duration pulse test used to minimize self-heating effect.
10. Guaranteed by design. Not subject to production testing.
POWERDI is a registered trademark of Diodes Incorporated.
DMN3029LFG
Document number: DS35448 Rev. 7 - 2
3 of 7
www.diodes.com
October 2012
© Diodes Incorporated
DMN3029LFG
30
30
VGS = 4.5V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
25
20
VGS = 10V
VGS = 3.5V
15
10
VGS = 3.0V
VGS = 85°C
20
VGS = 150°C
15
10
VGS = 25°C
5
5
VGS = 125°C
VGS = 2.5V
0.032
VGS = 4.5V
0.028
0.024
0.02
0.016
0.012
VGS = 10V
0.008
0.004
0
0
5
10
15
20
25
ID, DRAIN-SOURCE CURRENT (A)
Fig. 6 Typical On-Resistance
vs. Drain Current and Gate Voltage
1.6
30
VGS = 10V
ID = 10A
1.4
VGS = 4.5V
ID = 5A
1.2
1.0
0.8
0.6
-50
0
0
2
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.5
1
1.5
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 4 Typical Output Characteristic
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 8 On-Resistance Variation with Temperature
RDSON, DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0
0
RDSON, DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
NEW PRODUCT
ADVANCE INFORMATION
25
VGS = -55°C
VDS = 5V
VGS = 4.0V
0.5
0.05
1 1.5 2 2.5 3 3.5 4 4.5
VGS, GATE-SOURCE VOLTAGE (V)
Fig. 5 Typical Transfer Characteristic
VGS = 4.5V
5
TA = 150°C
0.045
TA = 125°C
0.04
0.035
0.03
T A = 85°C
0.025
0.02
TA = 25°C
0.015
T A = -55°C
0.01
0.005
0
0
5
10
15
20
25
ID, DRAIN CURRENT (A)
Fig. 7 Typical On-Resistance
vs. Drain Current and Temperature
30
0.04
0.035
VGS = 4.5V
ID = 5A
0.03
0.025
0.02
VGS = 10V
ID = 10A
0.015
0.01
0.005
0
-50
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 9 On-Resistance Variation with Temperature
POWERDI is a registered trademark of Diodes Incorporated.
DMN3029LFG
Document number: DS35448 Rev. 7 - 2
4 of 7
www.diodes.com
October 2012
© Diodes Incorporated
DMN3029LFG
30
1.5
IS, SOURCE CURRENT (A)
VGS(TH), GATE THRESHOLD VOLTAGE (V)
25
ID = 1mA
ID = 250µA
1
0.5
20
T A = 25°C
15
10
5
0
-50
0
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 10 Gate Threshold Variation vs. Ambient Temperature
0
0.2
0.4
0.6
0.8
1.0
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Fig. 11 Diode Forward Voltage vs. Current
10,000
1,000
CISS
COSS
100
CRSS
IDSS, LEAKAGE CURRENT (nA)
f = 1MHz
CT, CAPACITANCE (pF)
NEW PRODUCT
ADVANCE INFORMATION
2
TA = 150°C
1,000
T A = 125°C
100
T A = 85°C
10
TA = 25°C
10
0
4
8
12
16
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 12 Typical Total Capacitance
20
1
0
10
20
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 13 Typical Leakage Current
vs. Drain-Source Voltage
30
POWERDI is a registered trademark of Diodes Incorporated.
DMN3029LFG
Document number: DS35448 Rev. 7 - 2
5 of 7
www.diodes.com
October 2012
© Diodes Incorporated
DMN3029LFG
Package Outline Dimensions
NEW PRODUCT
ADVANCE INFORMATION
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
A
A3
A1
D
D2
L
(4x)
1
Pin 1 ID
4
b2
(4x)
E
E2
8
Z (4x)
5
e
L1
(3x)
b (8x)
POWERDI3333-8
Dim Min Max Typ
D
3.25 3.35 3.30
E
3.25 3.35 3.30
D2 2.22 2.32 2.27
E2 1.56 1.66 1.61
A
0.75 0.85 0.80
A1
0
0.05 0.02
A3
0.203
−
−
b
0.27 0.37 0.32
b2
0.20
−
−
L
0.35 0.45 0.40
L1
0.39
−
−
e
0.65
−
−
Z
0.515
−
−
All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X
G
8
Y2
5
G1
Y1
Y
1
4
Y3
X2
Dimensions
C
G
G1
Y
Y1
Y2
Y3
X
X2
Value (in mm)
0.650
0.230
0.420
3.700
2.250
1.850
0.700
2.370
0.420
C
POWERDI is a registered trademark of Diodes Incorporated.
DMN3029LFG
Document number: DS35448 Rev. 7 - 2
6 of 7
www.diodes.com
October 2012
© Diodes Incorporated
DMN3029LFG
NEW PRODUCT
ADVANCE INFORMATION
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com
POWERDI is a registered trademark of Diodes Incorporated.
DMN3029LFG
Document number: DS35448 Rev. 7 - 2
7 of 7
www.diodes.com
October 2012
© Diodes Incorporated