STMICROELECTRONICS RBO40-40G

RBO40-40G/M/T

REVERSEDBATTERYAND
Application Specific Discretes
A.S.D.TM
OVERVOLTAGEPROTECTIONCIRCUIT (RBO)
FEATURES
PROTECTION AGAINST ”LOAD DUMP” PULSE
40A DIODE TO GUARD AGAINST BATTERY
REVERSAL
MONOLITHIC STRUCTURE FOR GREATER
RELIABILITY
BREAKDOWN VOLTAGE : 24 V min.
CLAMPING VOLTAGE : ± 40 V max.
COMPLIANT WITH ISO / DTR 7637
D2PAK
RBO40-40G
DESCRIPTION
Designed to protect against battery reversal and
load dump overvoltagesin automotiveapplications, this monolithic component offers multiple
functions in the same package :
D1 : reversed battery protection
T1 : clamping against negative overvoltages
T2 : Transil function against ”load dump” effect.
PowerSO-10TM
RBO40-40M
TO220AB
RBO40-40T
FUNCTIONAL DIAGRAM
3
1
2
January 1997 - Ed : 3
1/15
RBO40-40G / RBO40-40M / RBO40-40T
ABSOLUTE MAXIMUM RATINGS
Symbol
IFSM
IF
Parameter
Unit
Non repetitive surge peak forward current
(Diode D1)
tp = 10 ms
120
A
DC forward current (Diode D1)
Tc = 75°C
40
A
80
V
1500
W
- 40 to + 150
150
°C
260
°C
Value
Unit
VPP
Peak load dump voltage (see note 1and 2)
5 pulses (1 minute between each pulse)
PPP
Peak pulse power between Input and Output
(Transil T1)
Tj initial = 25°C
T stg
Tj
Storage temperature range
Maximum junction temperature
10/1000 µs
Maximum lead temperature for soldering during 10 s
at 4.5mm from case for TO220AB
TL
Value
Note 1 : for a surge greater than the maximum value, the device will fail in short-circuit.
Note 2 : see Load Dump curves.
TM : PowerSO-10, TRANSIL and ASD are trademarks of SGS-THOMSON Microelectronics.
THERMAL RESISTANCE
Symbol
Parameter
Rth (j-c)
Junction to case
RBO40-40M
RBO40-40G
RBO40-40T
1.0
1.0
1.0
°C/W
Rth (j-a)
Junction to ambient
RBO40-40T
60
°C/W
D1
I32
1
3
I13
Ipp32
IF
T1
2
T2
IR 32
IR M 32
VC L 31 VB R31 VR M 31
VF 13
IR M 31
IR 31
V13
VR M 32 VB R 32 VC L 32
V32
3
1
Ipp31
2
Ex : VF 13 . between Pin 1 and Pin 3 VBR 32 . between Pin 3 and Pin 2
2/15

RBO40-40G / RBO40-40M / RBO40-40T
Symbol
Parameter
VRM31/VRM32
Stand-off voltage Transil T1 / Transil T2.
VBR31/VBR32
Breakdown voltage Transil T1 / Transil T2.
IR31 /IR32
VCL31 /VCL32
Leakage current Transil T1 / Transil T2.
Clamping voltage Transil T1 / Transil T2.
Forward voltage drop Diode D1.
VF13
IPP
αT
C31 /C32
C13
Peak pulse current.
Temperature coefficient of VBR.
Capacitance Transil T1 / Transil T2.
Capacitance of Diode D1
ELECTRICAL CHARACTERISTICS : DIODE D1 (- 40°C < Tamb < + 85°C)
Symbol
Value
Test Conditions
Min.
Typ.
Max.
Unit
VF 13
IF = 40 A
1.9
V
VF 13
VF 13
1.45
1
V
V
VF 13
IF = 20A
IF = 1 A
IF = 100 mA
0.95
V
C13
F = 1MHz VR= 0 V
3000
pF
ELECTRICAL CHARACTERISTICS : TRANSIL T1 (- 40°C < Tamb < + 85°C)
Symbol
Value
Test Conditions
Min.
Typ.
Max.
Unit
VBR 31
IR = 1 mA
22
35
V
VBR 31
IRM 31
IR = 1 mA, Tamb = 25°C
VRM = 20 V
VRM = 20 V, Tamb = 25°C
24
32
100
V
µA
10
40
µA
V
9
10-4/°C
pF
IRM 31
VCL 31
αT
C 31
IPP =37.5A,Tj initial = 25°C
10/1000µs
Temperature coefficient of VBR
F = 1MHz
VR = 0 V
3000
ELECTRICAL CHARACTERISTICS : TRANSIL T2 (- 40°C < Tamb < + 85°C)
Symbol
Test Conditions
VBR 32
VBR 32
IR = 1 mA
IR = 1 mA, Tamb = 25°C
IRM 32
VRM = 20 V
VRM = 20 V, Tamb = 25°C
IRM 32
VCL 32
αT
C32
Value
Min.
Typ.
22
24
IPP = 20 A (note 1)
Temperature coefficient of VBR
F = 1MHz
VR = 0 V
8000
Max.
Unit
35
32
V
V
100
µA
10
40
9
µA
V
-4
10 /°C
pF
Note 1 : One pulse, see pulse definition in load dump test generator circuit.
3/15

RBO40-40G / RBO40-40M / RBO40-40T
PRODUCT DESCRIPTION
3
1
The RBO has 3 functionsintegrated on the same
chip.
D1 : “Diode function” in order to protect against
reversed battery operation.
T2 : “Transil function” in order to protect against
positive surge generated by electric systems
(ignition, relay. ...).
T1 : Protectionfor motor drive application
(See below).
2
BASIC APPLICATION
* The monolithic multi-function protection
(RBO) has been developed to protect
sensitive semicond uctors in car electronic
modules against both overvoltage and
battery reverse.
* In addition, the RBO circuit prevents
overvoltages generated by the module from
affecting the car supply network.
MOTOR DRIVER APPLICATION
BATTERY
Filter
D1
T2
MOTOR
T1
RBO
DEVICE
MOTOR CONTROL
In this application, one half of the motor drive circuit is supplied through the “RBO” and is thus protected
as per its basic function application.
The second part is connected directly to the “car supply network” and is protected as follows :
- For positive surges : T2 (clamping phase) and D1 in forward-biased.
- For negative surges : T1 (clamping phase) and T2 in forward-biased.
4/15

RBO40-40G / RBO40-40M / RBO40-40T
PINOUT configuration in D2PAK :
- Input
(1) : Pin 1
- Output (3) : Pin 3
- Gnd
(2) : Connected to base Tab
Marking
D1
T2
T1
: Logo, date code, RBO40-40G
TAB
PINOUT configuration in PowerSO-10 :
- Input
(1) : Pin 1 to 5
- Output (3) : Pin 6 to 10
- Gnd
(2) : Connected to base Tab
Marking
Pin 1
: Logo, date code, RBO40-40M
Input (1)
D1
Output (3)
T2
T1
Pin 6
Gnd (2)
Tab
TOP VIEW
PINOUT configuration in TO220AB :
- Input
(1) : Pin 1
- Output (3) : Pin 3
- GND
(2) : Connected to base Tab
D1
T2
Marking
T1
: Logo, date code, RBO40-40T
(TAB)
5/15

RBO40-40G / RBO40-40M / RBO40-40T
LOAD DUMP TEST GENERATOR CIRCUIT (SCHAFFNER NSG 506 C). Issued from ISO / DTR 7637.
Open circuit (voltage curve)
(pulse test n°5)
Corresponding current wave with D.U.T.
I
t
tr
U(V)
Ipp
offset
10% / 13.5V
90%
Vs
10%
Vbat
Ipp/2
t
0
0
Impulse
tp = 40ms
t
N°5
Vs (V)
66.5
Vbat (V)
13.5
Ri (Ω)
2
t (ms)
200 (*)
tr (ms)
<10
Number
5
60s between each pulse
(*) Generator setting
CALIBRATION METHOD FOR SCHAFFNER NSG 506 C
1) With open circuit (generator is in open circuit):
- calibrate Vs
2) With short circuit (generator is in short circuit):
- calibrate Ri (Ri = 2Ω)
3) With D.U.T.
- calibrate tp (tp = 40ms @ Ipp/2)
Typical Voltage curve (open circuit)
Typical Voltage and Current curve with D.U.T.
typ. Vpp
typ. VCL
Ipp
20ms/div.
5.0V/div.
VBat
20ms/div.
10.0V/div.
6/15

20ms/div.
3A/div.
RBO40-40G / RBO40-40M / RBO40-40T
Fig. 1 : Peak pulse power versus exponential
pulse duration (Tj initial = 85°C).
Fig. 2-1 : Clamping voltage versus peak pulse
current (Tj initial = 85°C).
Exponential waveform tp = 40 ms and tp = 1 ms
(TRANSIL T2).
VCL(V)
Ppp(kW)
10.0
45.0
5.0
42.5
2.0
40.0
Transil T2
tp = 40ms
1.0
37.5
Transil T1
0.5
0.2
0.1
32.5
tp(ms)
1
2
5
10
20
50
100
Fig. 2-2 : Clamping voltage versus peak pulse
current (Tj initial = 85°C).
Exponential waveform tp = 1 ms and tp = 20 µs
(TRANSIL T1).
55
tp = 1ms
35.0
Ipp(A)
30.0
0.1
0.2
0.5
1
2
5
10
20
50
100
Fig. 3 : Relative variation of peak pulse power
versus junction temperature.
Ppp[Tj]/Ppp[Tj initial=85 °C]
VCL(V)
1.20
50
1.00
45
0.80
40
tp = 1ms
0.60
tp = 20µs
35
0.40
30
25
0.20
1
2
5
Ipp(A)
10
20
Tj initial (°C)
50
100
200
500
0.00
0
25
50
75
100
125
150
175
7/15

RBO40-40G / RBO40-40M / RBO40-40T
Fig. 4 : Relative variation of thermal impedance
junction to case versus pulse duration.
Fig. 5-1 : Peak forward voltage drop versus peak
forward current (typical values) - (TRANSIL T2).
VFM(V)
Zth(j-c)/Rth(j-c)
2.0
1.0
1.8
1.6
0.5
1.4
1.2
Tj = 25°°C
1.0
0.2
0.8
tp (s)
0.1
1E-3
1E-2
Tj = 150°°C
0.6
1E-1
1E+0
1E+1
Fig. 5-2 : Peak forward voltage drop versus peak
forward current (typical values) - (DIODE D1).
IFM(A)
0.4
0.1
0.2
0.5
1
2
5
VFM(V)
3.0
2.5
2.0
Tj = 25°°C
1.0
Tj = 150°°C
IFM(A)
0.5
0.1
0.2
0.5
1
2
5
10
20
50
100
ORDERING INFORMATION
RBO
40
-
40
M
Package :
M = PowerSO-10
G = D2PAK
T = TO220AB
Reversed Battery &
Overvoltage protection
IF(AV) = 40 A
8/15

20
50
Fig. 6 : Relative variation of leakage current
versus junction temperature.
3.5
1.5
10
VCL = 40V
100
RBO40-40G / RBO40-40M / RBO40-40T
PACKAGE MECHANICAL DATA
D2PAK Plastic
DIMENSIONS
REF.
A
E
C2
L2
D
L
A
A1
A2
B
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
4.30
2.49
0.03
0.70
B2
L3
A1
B2
R
C
B
G
A2
2.0 MIN.
FLAT ZONE
V2
4.60
2.69
0.23
0.93
0.169
0.098
0.001
0.027
1.40
0.181
0.106
0.009
0.037
0.055
C
C2
D
E
0.45
1.21
8.95
10.00
0.60
1.36
9.35
10.28
0.017
0.047
0.352
0.393
0.024
0.054
0.368
0.405
G
4.88
5.28 0.192
0.208
L
L2
L3
15.00
1.27
1.40
15.85 0.590
1.40 0.050
1.75 0.055
0.624
0.055
0.069
R
V2
0.40
0°
0.016
8°
0°
8°
2
FOOT-PRINT D PAK
16.90
10.30
5.08
1.30
3.70
8.90
9/15

RBO40-40G / RBO40-40M / RBO40-40T
SOLDERING RECOMMENDATION
The soldering process causes considerable
thermal stress to a semiconductor component.
This has to be minimized to assure a reliable and
extended lifetime of the device. The PowerSO-10
package can be exposed to a maximum
temperature of 260°C for 10 seconds. However a
proper soldering of the package could be done at
215°C for 3 seconds. Any solder temperature
profile should be within these limits. As reflow
techniques are most common in surface mounting,
typical heating profiles are given in Figure 1,either
for mounting on FR4 or on metal-backed boards.
For each particular board, the appropriate heat
profile has to be adjusted experimentally. The
present proposal is just a starting point. In any
case, the following precautions have to be
considered :
- always preheat the device
- peak temperatureshould be at least 30 °C
higher than the melting point of the solder
alloy chosen
- thermal capacity of the base substrate
Voids pose a difficult reliability problem for large
surface mount devices. Such voids under the
package result in poor thermal contact and the
high thermal resistance leads to component
failures. The PowerSO-10 is designed from
scratch to be solely a surface mount package,
hence symmetry in the x- and y-axis gives the
package excellent weight balance. Moreover, the
PowerSO-10offers the uniquepossibility to control
easily the flatness and quality of the soldering
process. Both the top and the bottom soldered
edges of the package are accessible for visual
inspection (soldering meniscus).
Coplanarity between the substrate and the
package can be easily verified. The quality of the
solder joints is very important for two reasons : (I)
poor quality solder joints result directly in poor
reliability
and (II) solder thickness affects the
thermal resistance significantly. Thus a tight
control of this parameter results in thermally
efficient and reliable solder joints.
Fig. 1 : Typical reflow soldering heat profile
Temperature (o C)
250
245 oC
215oC
200
Soldering
Epoxy FR4
board
150
Preheating
Cooling
100
Metal-backed
board
50
0
0
40
80
120
160
200
Time (s)
10/15

240
280
320
360
RBO40-40G / RBO40-40M / RBO40-40T
SUBSTRATES AND MOUNTING INFORMATION
The use of epoxy FR4 boards is quite common for
surface mounting techniques, however, their poor
thermal conduction compromises the otherwise
outstanding thermal performance of the
PowerSO-10. Some methods to overcome this
limitation are discussed below.
One possibility to improve the thermal conduction
is the use of large heat spreader areas at the
copper layer of the PC board. This leads to a
reduction of thermal resistance to 35 °C for 6 cm2
of the board heatsink (see fig. 2).
Use of copper-filled through holes on conventional
FR4 techniques will increase the metallization and
decrease thermal resistance accordingly. Using
a configurationwith 16 holes under the spreader of
the package with a pitch of 1.8 mm and a diameter
of 0.7 mm, the thermal resistance (junction heatsink) can be reduced to 12°C/W (see fig. 3).
Beside the thermal advantage, this solution allows
multi-layer boards to be used. However, a
drawback of this traditional material prevents its
use in very high power, high current circuits. For
instance, it is not advisable to surface mount
devices with currents greater than 10 A on FR4
boards. A Power Mosfet or Schottky diode in a
surface mount power package can handle up to
around 50 A if better substrates are used.
Fig. 2 : Mounting on epoxy FR4 head dissipation by extending the area of the copper layer
Copper foil
FR4 board
Fig. 3 : Mounting on epoxy FR4 by using copper-filled through holes for heat transfer
Copper foil
FR4 board
heatsink
heat transfer
11/15

RBO40-40G / RBO40-40M / RBO40-40T
A new technology available today is IMS - an
Insulated Metallic Substrate. This offers greatly
enhanced thermal characteristics for surface
mount components. IMS is a substrate consisting
of three different layers, (I) the base material which
is available as an aluminium or a copper plate, (II)
a thermal conductive dielectrical layer and (III) a
copper foil, which can be etched as a circuit layer.
Using this material a thermal resistance of 8°C/W
2
with 40 cm of board floating in air is achievable
(see fig. 4). If even higher power is to be dissipated
an external heatsink could be applied which leads
to an Rth (j-a) of 3.5°C/W (see Fig. 5), assuming
that Rth (heatsink-air) is equal to Rth
(junction-heatsink). This is commonly applied in
practice, leading to reasonable heatsink
dimensions. Often power devices are defined by
considering the maximum junction temperature of
the device. In practice , however, this is far from
being exploited. A summary of various power
management capabilities is made in table 1 based
on a reasonable delta T of 70°C junction to air.
The PowerSO-10 concept also represents an
attractive alternative to C.O.B. techniques.
PowerSO-10 offers devices fully tested at low
and high temperature. Mounting is simple - only
conventional SMT is required - enabling the users
to get rid of bond wire problems and the problem to
control the high temperature soft soldering as well.
An optimized thermal management is guaranteed
through PowerSO-10 as the power chips must in
any case be mounted on heat spreaders before
being mounted onto the substrate.
Fig. 4 : Mounting on metal backed board
Fig. 5 : Mounting on metal backed board with an
external heatsink applied
Copper foil
FR4 board
Copper foil
Insulation
Aluminium
Aluminium
heatsink
TABLE 1
PowerSo-10 package mounted on
Rth (j-a)
P Diss
1.FR4 using the recommended pad-layout
50 °C/W
1.5 W
2.FR4 with heatsink on board (6cm2)
35 °C/W
2.0 W
3.FR4 with copper-filled through holes and external heatsink applied
12 °C/W
5.8 W
4. IMS floating in air (40 cm2)
8 °C/W
8.8 W
3.5 °C/W
20 W
5. IMS with external heatsink applied
12/15

RBO40-40G / RBO40-40M / RBO40-40T
PACKAGE MECHANICAL DATA
B
0.10A B
10
H
6
E3 E1
E2
E
1
5
SEATING
PLANE
e
B
A
DETAIL ”A”
C
0.25 M
Q
D
D1
h
A
F
SEATING
PLANE
A1
A1
L
DETAIL ”A”
a
E4
REF.
DIMENSIONS
Millimeters
Inches
Min. Typ. Max.
Min. Typ.
DIMENSIONS
REF.
Max.
A
3.35
3.65 0.131
0.143
A1
B
C
D
0.00
0.40
0.35
9.40
0.10 0.00
0.60 0.0157
0.55 0.0137
9.60 0.370
0.0039
0.0236
0.0217
0.378
D1
E
7.40
9.30
7.60 0.291
9.50 0.366
0.299
0.374
E1
E2
7.20
7.20
7.40 0.283
7.60 0.283
0.291
0.299
Millimeters
Min. Typ. Max.
Inches
Min. Typ.
6.35 0.240
6.10 0.232
Max.
E3
E4
e
6.10
5.90
F
1.25
1.35 0.0492
0.0531
H
h
L
Q
13.80
14.40 0.543
0.567
a
0°
1.27
0.05
0.50
1.20
0.250
0.240
0.019
1.80 0.0472
1.70
0.0708
0.067
8°
0°
8°
13/15

RBO40-40G / RBO40-40M / RBO40-40T
FOOT PRINT
MOUNTING PAD LAYOUT
RECOMMENDED
HEADER SHAPE
Dimensions in millimeters
Dimensions in millimeters
SHIPPING TUBE
DIMENSIONS (mm)
C
TYP
B
A
Surface mount film taping : contact sales office
14/15

A
B
C
Length tube
18
12
0,8
532
Quantity per tube
50
RBO40-40G / RBO40-40M / RBO40-40T
PACKAGE MECHANICAL DATA
TO220AB Plastic
REF.
A
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
14.23
a1
15.87
0.560
4.50
0.625
0.177
a2
B
b1
b2
12.70
10.20
0.64
1.15
14.70
10.45
0.96
1.39
0.500
0.402
0.025
0.045
0.579
0.411
0.038
0.055
C
4.48
4.82
0.176
0.190
c1
c2
e
0.35
2.10
2.29
0.65
2.70
2.79
0.020
0.083
0.090
0.026
0.106
0.110
F
I
5.85
3.55
6.85
4.00
0.230
0.140
0.270
0.157
L
l2
l3
2.54
1.45
0.80
3.00
1.75
1.20
0.100
0.057
0.031
0.118
0.069
0.047
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectronics.
 1997 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Morocco
The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
15/15
