STMICROELECTRONICS STP55NE06LFP

STP55NE06L
STP55NE06LFP
N - CHANNEL ENHANCEMENT MODE
” SINGLE FEATURE SIZE ” POWER MOSFET
TYPE
STP55NE06L
STP55NE06LF P
■
■
■
■
■
■
V DSS
R DS(on)
ID
60 V
60 V
< 0.022 Ω
< 0.022 Ω
55 A
28 A
TYPICAL RDS(on) = 0.018 Ω
EXCEPTIONAL dV/dt CAPABILTY
100% AVALANCHE TESTED
LOW GATE CHARGE 100 oC
HIGH dV/dt CAPABILITY
APPLICATION ORIENTED
CHARACTERIZATION
1
DESCRIPTION
This Power Mosfet is the latest development of
SGS-THOMSON unique ”Single Feature Size”
process whereby a single body is implanted on a
strip layout structure. The resulting transistor
shows extremely high packing density for low onresistance, rugged avalanche characteristics and
less critical alignment steps therefore a remarkable manufacturing reproducibility.
2
3
3
2
1
TO-220
TO220FP
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
■
DC MOTOR CONTROL
■
DC-DC & DC-AC CONVERTERS
■
SYNCHRONOUS RECTIFICATION
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Valu e
STP55NE06L
V DS
Unit
ST P55NE06LFP
Drain-source Voltage (V GS = 0)
60
V
V DGR
Drain- gate Voltage (R GS = 20 kΩ)
60
V
V GS
Gate-source Voltage
± 15
o
V
ID
Drain Current (continuous) at Tc = 25 C
55
28
A
ID
o
Drain Current (continuous) at Tc = 100 C
39
20
A
Drain Current (pulsed)
220
220
A
IDM (•)
P t ot
o
Total Dissipation at T c = 25 C
130
35
W
Derating Factor
0.86
0.23
W/ C

2000
V
V ISO
Insulation W ithstand Voltage (DC)
dV/dt
Peak Diode Recovery voltage slope
T stg
Tj
Storage Temperature
Max. O perating Junction Temperature
(•) Pulse width limited by safe operating area
December 1997
7
o
V/ns
-65 to 175
o
C
175
o
C
( 1) ISD ≤ 55 A, di/dt ≤ 300 A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX
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STP55NE06LFP
THERMAL DATA
R t hj-ca se
R t hj- amb
R thc- si nk
Tl
Thermal Resistance Junction-case
Max
T O-220
T O-220F P
1.15
4.28
Thermal Resistance Junction-ambient
Max
Thermal Resistance Case-sink
Typ
Maximum Lead Temperature For Soldering Purpose
62.5
0.5
300
o
C/W
o
C/W
C/W
o
C
o
AVALANCHE CHARACTERISTICS
Symb ol
Parameter
I AR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T j max, δ < 1%)
E AS
Single Pulse Avalanche Energy
o
(starting Tj = 25 C, I D = I AR , V DD = 25 V)
Max Valu e
Unit
55
A
250
mJ
ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)
OFF
Symb ol
V (BR)DSS
I DSS
I GSS
Parameter
Drain-source
Breakdown Voltage
Test Cond ition s
I D = 250 µA
Zero Gate Voltage
V DS = Max Rating
Drain Current (V GS = 0) V DS = Max Rating
o
C
Gate-body Leakage
Current (V DS = 0)
Min.
Typ .
Max.
60
VGS = 0
Un it
V
Tc = 125
V GS = ± 15 V
1
10
µA
µA
± 100
nA
ON (∗)
Symb ol
Parameter
Test Cond ition s
ID = 250 µA
V GS(th)
Gate T hreshold Voltage V DS = VGS
R DS( on)
Static Drain-source O n
Resistance
V GS = 5 V ID = 27.5 A
V GS = 10 V ID = 27.5 A
ID(o n)
On State Drain Current
V DS > I D(on) x R DS(on) max
V GS = 10 V
Min.
Typ .
Max.
Un it
1
1.7
2.5
V
0.022
0.019
0.028
0.022
Ω
55
A
DYNAMIC
Symb ol
g fs (∗)
C iss
C oss
C rss
2/6
Parameter
Test Cond ition s
Forward
Transconductance
V DS > I D(on) x R DS(on) max
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V DS = 25 V
f = 1 MHz
I D =27.5 A
VGS = 0
Min.
Typ .
20
30
2800
375
100
Max.
Un it
S
3750
500
140
pF
pF
pF
STP55NE06LFP
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symb ol
Parameter
Test Cond ition s
t d(on)
tr
Turn-on T ime
Rise Time
V DD = 30 V
R G =4.7 Ω
Qg
Q gs
Q gd
Total G ate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = 48 V
Min.
ID = 27.5 A
V GS = 5 V
ID = 55 A
V GS = 5 V
Typ .
Max.
Un it
40
100
55
140
ns
ns
40
13
20
55
nC
nC
nC
Typ .
Max.
Un it
25
40
65
35
55
90
ns
ns
ns
Typ .
Max.
Un it
55
220
A
A
1.5
V
SWITCHING OFF
Symb ol
t r(Vof f)
tf
tc
Parameter
Off-voltage Rise Time
Fall Time
Cross-over T ime
Test Cond ition s
Min.
V DD = 48 V I D = 55 A
R G =4.7 Ω VGS = 5 V
SOURCE DRAIN DIODE
Symb ol
Parameter
Test Cond ition s
I SD
I SDM (•)
Source-drain Current
Source-drain Current
(pulsed)
V SD (∗)
Forward O n Voltage
I SD = 55 A
Reverse Recovery
Time
Reverse Recovery
Charge
Reverse Recovery
Current
I SD = 55 A
V DD = 30 V
t rr
Q rr
I RRM
Min.
V GS = 0
di/dt = 100 A/µs
o
Tj = 150 C
65
ns
180
nC
5.5
A
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
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STP55NE06LFP
TO-220 MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
D1
0.107
1.27
0.050
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.067
F2
1.14
1.70
0.044
0.067
G
4.95
5.15
0.194
0.203
G1
2.4
2.7
0.094
0.106
H2
10.0
10.40
0.393
0.409
14.0
0.511
0.551
L2
16.4
L4
0.645
13.0
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.2
6.6
0.244
0.260
L9
3.5
3.93
0.137
0.154
DIA.
3.75
3.85
0.147
0.151
D1
C
D
A
E
L5
H2
G
G1
F1
L2
F2
F
Dia.
L5
L9
L7
L6
4/6
L4
P011C
STP55NE06LFP
TO-220FP MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
4.4
4.6
0.173
0.181
B
2.5
2.7
0.098
0.106
D
2.5
2.75
0.098
0.108
E
0.45
0.7
0.017
0.027
F
0.75
1
0.030
0.039
F1
1.15
1.7
0.045
0.067
F2
1.15
1.7
0.045
0.067
G
4.95
5.2
0.195
0.204
G1
2.4
2.7
0.094
0.106
H
10
10.4
0.393
0.409
L2
16
0.630
28.6
30.6
1.126
1.204
L4
9.8
10.6
0.385
0.417
L6
15.9
16.4
0.626
0.645
L7
9
9.3
0.354
0.366
Ø
3
3.2
0.118
0.126
B
D
A
E
L3
L3
L6
F
F1
L7
F2
H
G
G1
¯
1 2 3
L2
L4
5/6
STP55NE06LFP
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectonics.
 1997 SGS-THOMSON Microelectronics - Printed in Italy - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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