STTH310/S ® HIGH VOLTAGE ULTRAFAST RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) 3A VRRM 1000 V Tj (max) 175 °C VF (max) 1.42 V FEATURES AND BENEFITS ■ ■ ■ ■ ■ Low forward voltage drop High reliability High surge current capability Soft switching for reduced EMI disturbances Planar technology DO-201AD STTH310 DESCRIPTION The STTH310, which is using ST ultrafast high voltage planar technology, is specially suited for free-wheeling, clamping, snubbering, demagnetization in power supplies and other power switching applications. SMC STTH310S ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 1000 V V(RMS) RMS voltage 700 V IF(AV) Average forward current A IFSM Tstg Tj Forward surge current Tl = 75°C δ =0.5 DO-201AD 3 Tl = 75°C δ =0.5 SMC 3 DO-201AD 55 SMC 45 t = 8.3 ms Storage temperature range Maximum operating junction temperature January 2003 - Ed: 1 A - 50 + 175 °C + 175 °C 1/5 STTH310/S THERMAL PARAMETERS Symbol Rth (j-l) Rth (j-a) Parameter Junction to lead L = 10 mm Junction to ambient L = 10 mm Value Unit DO-201AD 20 °C/W SMC 20 DO-201AD 75 STATIC ELECTRICAL CHARACTERISTICS Symbol Parameter IR Reverse leakage current VF Forward voltage drop Tests conditions VR = 1000V IF = 3 A Min. Max. Unit Tj = 25°C 10 µA Tj = 125°C 50 Tj = 25°C 1.7 Tj = 150°C Typ. 0.98 V 1.42 To evaluate the maximum conduction losses use the following equation : P = 1.20 x IF(AV) + 0.075 x IF2(RMS) DYNAMIC ELECTRICAL CHARACTERISTICS Symbol Tests conditions Min. Typ. Max. Unit trr Reverse recovery time IF = 0.5 A Irr = 0.25 A IR = 1A Tj = 25°C 75 ns tfr Forward recovery time IF = 3 A dIF/dt = 50 A/µs VFR = 1.1 x VF max Tj = 25°C 300 ns 12 V VFP 2/5 Parameter Forward recovery voltage STTH310/S Fig. 1: Conduction losses versus average current. Fig. 2: Forward voltage drop versus forward current. IFM(A) P(W) 100.0 5.5 δ = 0.1 5.0 δ = 0.2 δ = 0.5 Tj=150°C (maximum values) δ = 0.05 4.5 Tj=150°C (typical values) 4.0 δ=1 10.0 3.5 3.0 Tj=25°C (maximum values) 2.5 2.0 1.0 1.5 T 1.0 0.5 IF(AV)(A) δ=tp/T 0.0 0.0 0.5 1.0 1.5 2.0 2.5 VFM(V) tp 0.1 3.0 3.5 Fig. 3-1: Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4, Lleads = 10mm) (DO-201AD). 0.0 Zth(j-c)/Rth(j-c) 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 δ = 0.5 0.5 0.5 0.4 0.4 0.3 δ = 0.2 T 0.1 0.1 tp(s) Single pulse 1.E-01 2.0 2.5 3.0 1.E+00 δ=tp/T 1.E+01 1.E+02 δ = 0.5 δ = 0.2 δ = 0.1 T 0.2 δ = 0.1 0.0 1.5 Zth(j-c)/Rth(j-c) 1.0 0.2 1.0 Fig. 3-2: Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4, S=1cm2) (SMC). 1.0 0.3 0.5 tp Single pulse tp(s) 0.0 1.E+03 1.E-01 1.E+00 1.E+01 δ=tp/T 1.E+02 tp 1.E+03 Fig. 4: Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed circuit board FR4, copper thickness: 35µm). Rth(j-a)(°C/W) 110 100 90 80 70 SMB 60 50 DO-201AD Lleads=10mm 40 30 20 10 S(cm²) 0 0 1 2 3 4 5 3/5 STTH310/S PACKAGE MECHANICAL DATA SMC DIMENSIONS REF. E1 D E Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.41 0.006 0.016 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 D 5.55 6.25 0.218 0.246 L 0.75 1.60 0.030 0.063 A1 A2 C E2 L b FOOTPRINT (in millimeters) 3.3 2.0 4/5 4.2 2.0 STTH310/S PACKAGE MECHANICAL DATA DO-201AD B A E note 1 B E ØD ØC note 1 ØD note 2 DIMENSIONS REF. Millimeters Min. Max. A B ■ Inches Min. Max. 9.50 25.40 NOTES 0.374 1 - The lead diameter ∅ D is not controlled over zone E 2 - The minimum length which must stay straight between the right angles after bending is 0.59"(15 mm) 1.000 C 5.30 0.209 D 1.30 0.051 E 1.25 0.049 Ordering code Marking Package Weight Base qty Delivery mode STTH310 STTH310 DO-201AD 1.12 g 600 Ammopack STTH310S S10 SMC 0.245 g 2500 Tape & reel STTH310RL STTH310 DO-201AD 1.12 g 1900 Tape & reel Epoxy meets UL 94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 5/5