STMICROELECTRONICS LCP152DEERL

LCP1521S/LCP152DEE
ASD (Application Specific Devices)
Programmable transient voltage suppressor for SLIC protection
Features
■
Dual programmable transient suppressor
■
Wide negative firing voltage range:
VMGL = -150 V max.
■
Low dynamic switching voltages:
VFP and VDGL
■
Low gate triggering current: IGT = 5 mA max
■
Peak pulse current: IPP = 30 A (10/1000 µs)
■
Holding current: IH = 150 mA min
■
Low space consuming package
Order codes
Description
These devices have been especially designed
to protect new high voltage, as well as classical
SLICs, against transient overvoltages.
Positive overvoltages are clamped by 2 diodes.
Negative surges are suppressed by 2 thyristors,
their breakdown voltage being referenced to -VBAT
through the gate.
Part Number
Marking
LCP1521S
CP152S
LCP1521SRL
CP152S
LCP152DEERL
LCP152
Figure 1.
LCP1521S Functional diagram
TIP
These components present a very low gate
triggering current (IGT) in order to reduce the
current consumption on printed circuit board
during the firing phase.
Benefits
TRISILs™ are not subject to ageing and provide a
fail safe mode in short circuit for a better level of
protection. Trisils are used to ensure equipment
meets various standards such as UL60950,
IEC950 / CSA C22.2, UL1459 and FCC part 68.
Trisils have UL94 V0 approved resin (Trisils are
UL497B approved [file: E136224]).
QFN 3x3 6 leads
LCP152DEE
SO-8
LCP1521S
TIP
1
GATE
GND
NC
GND
RING
RING
Figure 2.
LCP152DEE Functional diagram
TIP
GATE
RING
TIP
GND
NC
RING
TM: TRISIL is a trademark of STMicroelectronics
July 2006
Rev 5
1/11
www.st.com
11
Characteristics
1
LCP1521S/LCP152DEE
Characteristics
Table 1.
Standards compliance
Peak
surge
voltage
(V)
Voltage
waveform
Required
peak
current
(A)
Current
waveform
Minimum serial
resistor to meet
standard (Ω)
GR-1089 Core First level
2500
1000
2/10 µs
10/1000 µs
500
100
2/10 µs
10/1000 µs
12
24
GR-1089 Core
Second level
5000
2/10 µs
500
2/10 µs
24
GR-1089 Core
Intra-building
1500
2/10 µs
100
2/10 µs
0
ITU-T-K20/K21
6000
1500
10/700 µs
150
37.5
5/310 µs
110
0
ITU-T-K20 (IEC 61000-4-2)
8000
15000
1/60 ns
VDE0433
4000
2000
10/700 µs
100
50
5/310 µs
60
10
VDE0878
4000
2000
1.2/50 µs
100
50
1/20 µs
0
0
IEC61000-4-5
4000
4000
10/700 µs
1.2/50 µs
100
100
5/310 µs
8/20 µs
60
0
FCC Part 68,
lightning surge type A
1500
800
10/160 µs
10/560 µs
200
100
10/160 µs
10/560 µs
22.5
15
FCC Part 68,
lightning surge type B
1000
9/720 µs
25
5/320 µs
0
Standard
Table 2.
2/11
0
0
Thermal resistances
Symbol
Rth(j-a)
ESD contact discharge
ESD air discharge
Parameter
Junction to ambient
Value
SO-8
120
QFN
140
Unit
° C/W
LCP1521S/LCP152DEE
Table 3.
Characteristics
Electrical characteristics (Tamb = 25° C)
Symbol
Parameter
I
IGT
Gate triggering current
IH
Holding current
IRM
Reverse leakage current LINE / GND
IRG
Reverse leakage current GATE / LINE
VRM
Reverse voltage LINE / GND
VGT
Gate triggering voltage
VF
Forward drop voltage LINE / GND
VFP
Peak forward voltage LINE / GND
Dynamic switching voltage GATE / LINE
VRG
Reverse voltage GATE / LINE
Table 4.
VRM
VF
V
IRM
IR
VDGL
C
VR
IH
IPP
Capacitance LINE / GND
Absolute ratings (Tamb = 25° C, unless otherwise specified)
Symbol
Value
Unit
Peak pulse current
10/1000 µs
8/20 µs
10/560 µs
5/310 µs
10/160 µs
1/20 µs
2/10 µs
30
100
35
40
50
100
150
A
ITSM
Non repetitive surge peak on-state current
(50Hz sinusoidal)
t = 20 ms
t = 200 ms
t=1s
18
10
7
A
IGSM
Maximum gate current (50Hz sinusoidal)
t = 10 ms
2
A
VMLG
VMGL
Maximum voltage LINE/GND
Maximum voltage GATE/LINE
-40° C < Tamb < +85° C
-40° C < Tamb < +85° C
-150
-150
V
Tstg
Tj
Storage temperature range
Maximum junction temperature
-55 to +150
150
°C
260
°C
IPP
TL
Table 5.
Symbol
tr
tp
Parameter
Maximum lead temperature for soldering during 10 s.
Repetitive peak pulse current
Definition
Rise time (µs)
Pulse duration (µs)
Example
% IPP
100
Pulse waveform
10/1000 µs:
tr = 10 µs
tp = 1000 µs
50
0
tr
tp
t
3/11
Characteristics
LCP1521S/LCP152DEE
Table 6.
Parameters related to the diode LINE / GND (Tamb = 25° C)
Symbol
VF
VFP(1)
1.
Test conditions
IF = 5A
10/700 µs
1.2/50 µs
2/10 µs
See test circuit for VFP
Table 7.
t = 500 µs
RS = 10 Ω
RS = 10 Ω
RS = 62 Ω
1.5 kV
1.5 kV
2.5 kV
Max
Unit
3
V
5
9
30
V
(Figure 4.): RS is the protection resistor located on the line card.
Parameters related to the protection Thyristors (Tamb = 25° C, unless
otherwise specified)
Symbol
Test conditions
Typ
Max
Unit
5
mA
IGT
VGND / LINE = -48 V
0.1
IH
VGATE = -48 V(1)
150
VGT
at IGT
IRG
VRG = -150 V
VRG = -150 V
mA
2.5
V
Tj = 25° C
Tj = 85° C
5
50
µA
IPP = 30 A
IPP = 30 A
IPP = 38 A
7
10
25
V
VGATE = -48 V(2)
VDGL
10/700 µs
1.2/50 µs
2/10 µs
1.5 kV
1.5 kV
2.5 kV
1.
see functional holding current (IH) test circuit
2.
see test circuit for VDG The oscillations with a time duration lower than 50ns are not taken into account.
Table 8.
Parameters related to diode and protection Thyristors (Tamb = 25° C,
unless otherwise specified)
Symbol
IRM
C
4/11
RS = 10 Ω
RS = 10 Ω
RS = 62 Ω
Test conditions
VGATE / LINE = -1 V
VGATE / LINE = -1 V
VRM = -150 V
VRM = -150 V
VR = 50 V bias, VRMS = 1 V, F = 1 MHz
VR = 2 V bias, VRMS = 1 V, F = 1 MHz
Typ
Tj = 25° C
Tj = 85° C
15
35
Max
Unit
5
50
µA
pF
LCP1521S/LCP152DEE
Figure 3.
Characteristics
Functional Holding Current (IH) test circuit: GO-NO GO test
R
Surge generator
VBAT = - 100V
D.U.T
This is a GO-NO GO test which allows to confirm the holding current (IH) level in a functional test circuit.
TEST PROCEDURE:
- Adjust the current level at the IH value by short circuiting the D.U.T.
- Fire the D.U.T. with a surge current: IPP = 10A, 10/1000µs
- The D.U.T. will come back to the off-state within a duration of 50ms max.
Test circuit for VFP and VDGL parameters
Figure 4.
R4
(V is defined in unload condition)
P
TIP
L
R2
RING
R3
VP
R1
C1
C2
G ND
Pulse (µs)
Vp
C1
C2
L
R1
R2
R3
R4
IPP
Rs
tr
tp
(V)
(µF)
(nF)
(µH)
(Ω)
(Ω)
(Ω)
(Ω)
(A)
(Ω)
10
700
1500
20
200
0
50
15
25
25
30
10
1.2
50
1500
1
33
0
76
13
25
25
30
10
2
10
2500
10
0
1.1
1.3
0
3
3
38
62
5/11
Technical information
2
LCP1521S/LCP152DEE
Technical information
Figure 5.
LCP152 concept behavior
Rs1
L1
TIP
GND
-Vbat
V Tip
ID1
IG
T1
Th1
D1
Gate
GND
C
Rs2
VRing
RING
L2
Figure 5. shows the classical protection circuit using the LCP152 crowbar concept. This
topology has been developed to protect the new high voltage SLICs. It allows to program the
negative firing threshold while the positive clamping value is fixed at GND.
When a negative surge occurs on one wire (L1 for example) a current IG flows through the
base of the transistor T1 and then injects a current in the gate of the thyristor Th1. Th1 fires
and all the surge current flows through the ground. After the surge when the current flowing
through Th1 becomes less negative than the holding current IH, then Th1 switches off.
When a positive surge occurs on one wire (L1 for example) the diode D1 conducts and the
surge current flows through the ground.
Figure 6.
Example of PCB layout based on LCP152S protection
To
line side
220 nF
LCP1521S
GND
To
SLIC side
Figure 6. shows the classical PCB layout used to optimize line protection.
The capacitor C is used to speed up the crowbar structure firing during the fast surge edges.
This allows to minimize the dynamical breakover voltage at the SLIC Tip and Ring inputs
during fast strikes. Note that this capacitor is generally present around the SLIC - Vbat pin.
So to be efficient it has to be as close as possible from the LCP152 Gate pin and from the
reference ground track (or plan) (see Figure 6.). The optimized value for C is 220 nF.
The series resitors Rs1 and Rs2 designed in Figure 5. represent the fuse resistors or the
PTC which are mandatory to withstand the power contact or the power induction tests
6/11
LCP1521S/LCP152DEE
Technical information
imposed by the various country standards. Taking into account this fact the actual lightning
surge current flowing through the LCP is equal to:
I surge = V surge / (Rg + Rs)
With:
V surge = peak surge voltage imposed by the standard.
Rg = series resistor of the surge generator
Rs = series resistor of the line card (e.g. PTC)
e.g. For a line card with 30 Ω of series resistors which has to be qualified under GR1089
Core 1000V 10/1000 µs surge, the actual current through the LCP152 is equal to:
I surge = 1000 / (10 + 30) = 25 A
The LCP152 is particularly optimized for the new telecom applications such as the fiber in
the loop, the WLL, the remote central office. In this case, the operating voltages are smaller
than in the classical system. This makes the high voltage SLICs particularly suitable.
The schematics of Figure 7. give the most frequent topology used for these applications.
Figure 7.
Protection of high voltage SLIC
-Vbat
Rs (*)
TIP
Gate
Line
TIP
GND
220nF
GND
GND
SLIC
RING
Rs (*)
RING
LCP152xx
Line card
Rs (*) = PTC or fuse resistor
Figure 8.
Surge peak current versus overload Figure 9.
duration
ITSM(A)
Relative variation of holding
current versus junction
temperature
IH[Tj] / IH[Tj=25°C]
1.3
24
F=50Hz
Tj initial=25°C
1.2
20
1.1
16
1
12
0.9
8
0.8
Tj(°C)
4
0.7
-40
t(s)
-30
-20
-10
0
10
20
30
40
50
60
70
80
90
0
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
7/11
Package information
3
LCP1521S/LCP152DEE
Package information
Table 9.
SO-8 Dimensions
Dimensions
Ref.
Millimeters
Min.
Typ.
A
C
(Seating
Plane)
ccc C
A2
0.25mm
(Gage Plane)
C
k
D
5
E1
1
Typ.
1.75
A1
0.1
A2
1.25
Max.
0.069
0.25
0.004
0.010
0.049
E
4
b
0.28
0.48
0.011
0.019
C
0.17
0.23
0.007
0.009
D
4.80
4.90
5.00
0.189 0.193 0.197
E
5.80
6.00
6.20
0.228 0.236 0.244
E1
3.80
3.90
4.00
0.150 0.154 0.157
e
1.27
0.25
0.50
0.010
0.020
L
0.40
1.27
0.016
0.050
8
0
k°
ccc
Figure 10. Footprint (dimensions in mm)
0.050
h
L1
8/11
Min.
h x 45°
L1
8
Max.
L
A1
e
b
A
Inches
1.04
0
0.041
0.10
8
0.004
LCP1521S/LCP152DEE
Table 10.
Package information
QFN 3x3 6 Leads Package dimensions
DIMENSIONS
Millimeters
REF.
Min.
Typ.
Inches
Max.
Min.
Typ.
Max.
A
0.80
1
0.031
0.040
A1
0
0.05
0
0.002
A2
0.65
0.75
0.026
0.030
A3
20
b
0.33
D
2.90
D2
1.92
E
2.90
E2
1.11
e
L
3
3
0.787
0.43
0.013
3.10
0.114 0.118 0.122
2.12
0.076
3.10
0.114 0.118 0.122
1.31
0.044
0.95
0.20
L1
<
0°
0.018
0.009
0.13
0.20
0.051
0.008
0.24
K
0.083
0.037
0.45
L2
0.017
0.005
0.008
12°
0°
12°
Figure 11. QFN 3x3 6 Leads Footprint dimensions (in mm)
0.95
0.48
1.05
0.35
1.21
0.34
2.02
4.00
9/11
Ordering information
4
LCP1521S/LCP152DEE
Ordering information
Part Number
Marking
LCP1521S
CP152S
LCP1521SRL
(1)
Package
Weight
SO-8
0.11 g
CP152S
LCP152DEERL(1)
LCP152
QFN 3x3 6L
0.022 g
Base qty
Delivery mode
100
Tube
2500
Tape and reel
3000
Tape and reel
1. Preferred device
5
10/11
Revision history
Date
Revision
Description of Changes
Sep-2003
1A
08-Dec-2004
2
1/ Page 2 table 3: Thermal resistances changed from 130° C/W
(SO-8) to 120° C/W and from 170° C/W (QFN) to 140° C/W.
2/ SO-8 and QFN footprint dimensions added.
17-Feb-2005
3
Table 9 on page 4: correction of typo on capacitance unit.
03-May-2005
4
Table 5 on page 3: ITSM value @ t= 1s from 4 A to 4.5 A.
07-Jul-2006
5
Replaced QFN package illustration on page 1. Reformatted
document to current layout standard. Values of ITSM modified in
Table 4. SO-8 package dimensions updated in Table 9.
First issue.
LCP1521S/LCP152DEE
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2006 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
11/11