HGTG12N60C3D Data Sheet December 2001 24A, 600V, UFS Series N-Channel IGBT with Anti-Parallel Hyperfast Diode The HGTG12N60C3D is a MOS gated high voltage switching device combining the best features of MOSFETs and bipolar transistors. The device has the high input impedance of a MOSFET and the low on-state conduction loss of a bipolar transistor. The much lower on-state voltage drop varies only moderately between 25oC and 150oC. The IGBT used is the development type TA49123. The diode used in anti parallel with the IGBT is the development type TA49061. Features • 24A, 600V at TC = 25oC • Typical Fall Time . . . . . . . . . . . . . . . . 210ns at TJ = 150oC • Short Circuit Rating • Low Conduction Loss • Hyperfast Anti-Parallel Diode Packaging JEDEC STYLE TO-247 The IGBT is ideal for many high voltage switching applications operating at moderate frequencies where low conduction losses are essential. E C G Formerly Developmental Type TA49117. Ordering Information PART NUMBER HGTG12N60C3D PACKAGE TO-247 BRAND G12N60C3D NOTE: When ordering, use the entire part number. Symbol C G E Fairchild CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS 4,364,073 4,417,385 4,430,792 4,443,931 4,466,176 4,516,143 4,532,534 4,587,713 4,598,461 4,605,948 4,620,211 4,631,564 4,639,754 4,639,762 4,641,162 4,644,637 4,682,195 4,684,413 4,694,313 4,717,679 4,743,952 4,783,690 4,794,432 4,801,986 4,803,533 4,809,045 4,809,047 4,810,665 4,823,176 4,837,606 4,860,080 4,883,767 4,888,627 4,890,143 4,901,127 4,904,609 4,933,740 4,963,951 4,969,027 ©2001 Fairchild Semiconductor Corporation HGTG12N60C3D Rev. B HGTG12N60C3D Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified Collector to Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .BVCES Collector Current Continuous At TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IC25 At TC = 110oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IC110 Average Diode Forward Current at 110oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I(AVG) Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ICM Gate to Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGES Gate to Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VGEM Switching Safe Operating Area at TJ = 150oC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SSOA Power Dissipation Total at TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD Power Dissipation Derating TC > 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG Maximum Lead Temperature for Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL Short Circuit Withstand Time (Note 2) at VGE = 15V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .tSC Short Circuit Withstand Time (Note 2) at VGE = 10V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . tSC HGTG12N60C3D 600 UNITS V 24 12 15 96 ±20 ±30 24A at 600V 104 0.83 -40 to 150 260 4 13 A A A A V V W W/oC oC oC µs µs CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. VCE(PK) = 360V, TJ = 125oC, RG = 25Ω. Electrical Specifications TC = 25oC, Unless Otherwise Specified PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS Collector to Emitter Breakdown Voltage BVCES IC = 250µA, VGE = 0V 600 - - V Emitter to Collector Breakdown Voltage BVECS IC = 10mA, VGE = 0V 15 25 - V - - 250 µA - - 2.0 mA - 1.65 2.0 V - 1.85 2.2 V - Collector to Emitter Leakage Current ICES TC = 25oC TC = 150oC TC = 25oC TC = 150oC TC = 25oC TC = 150oC TC = 25oC 1.80 2.2 V - 2.0 2.4 V 3.0 5.0 6.0 V - - ±100 nA VCE(PK) = 480V 80 - - A VCE(PK) = 600V 24 - - A IC = IC110, VCE = 0.5 BVCES - 7.6 - V IC = IC110, VCE = 0.5 BVCES VGE = 15V - 48 55 nC VGE = 20V - 62 71 nC VCE = BVCES VCE = BVCES Collector to Emitter Saturation Voltage VCE(SAT) IC = IC110, VGE = 15V IC = 15A, VGE = 15V Gate to Emitter Threshold Voltage Gate to Emitter Leakage Current Switching SOA Gate to Emitter Plateau Voltage On-State Gate Charge Current Turn-On Delay Time Current Rise Time Current Turn-Off Delay Time Current Fall Time VGE(TH) IGES VGE = ±20V SSOA TJ = 150oC, VGE = 15V, RG = 25Ω, L = 100µH VGEP QG(ON) td(ON)I trI td(OFF)I tfI Turn-On Energy EON Turn-Off Energy (Note 3) EOFF Diode Forward Voltage VEC ©2001 Fairchild Semiconductor Corporation IC = 250µA, VCE = VGE TJ = 150oC, ICE = IC110, VCE(PK) = 0.8 BVCES, VGE = 15V, RG = 25Ω, L = 100µH IEC = 12A - 14 - ns - 16 - ns - 270 400 ns - 210 275 ns - 380 - µJ - 900 - µJ - 1.7 2.0 V HGTG12N60C3D Rev. B HGTG12N60C3D Electrical Specifications TC = 25oC, Unless Otherwise Specified (Continued) PARAMETER SYMBOL Diode Reverse Recovery Time trr Thermal Resistance RθJC TEST CONDITIONS MIN TYP MAX UNITS IEC = 12A, dIEC/dt = 100A/µs - 34 42 ns IEC = 1.0A, dIEC/dt = 100A/µs - 30 37 ns IGBT - - 1.2 oC/W Diode - - 1.5 oC/W NOTE: 3. Turn-Off Energy Loss (EOFF) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse, and ending at the point where the collector current equals zero (ICE = 0A). The HGTG12N60C3D was tested per JEDEC Standard No. 24-1 Method for Measurement of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss. Turn-On losses include diode losses. 80 DUTY CYCLE <0.5%, VCE = 10V PULSE DURATION = 250µs 70 60 50 TC = 150oC 40 TC = 25oC 30 TC = -40oC 20 10 0 4 6 8 10 12 14 ICE, COLLECTOR TO EMITTER CURRENT (A) ICE, COLLECTOR TO EMITTER CURRENT (A) Typical Performance Curves PULSE DURATION = 250µs, DUTY CYCLE <0.5%, TC = 25oC 80 VGE= 15.0V 60 50 10.0V 40 30 9.0V 8.5V 20 8.0V 10 7.0V 0 0 VGE, GATE TO EMITTER VOLTAGE (V) PULSE DURATION = 250µs DUTY CYCLE <0.5%, VGE = 10V 70 60 50 40 TC = -40oC 30 TC = 150oC 20 TC = 25oC 10 0 0 1 2 3 4 5 VCE, COLLECTOR TO EMITTER VOLTAGE (V) FIGURE 3. COLLECTOR TO EMITTER ON-STATE VOLTAGE ©2001 Fairchild Semiconductor Corporation 7.5V 2 4 6 8 VCE, COLLECTOR TO EMITTER VOLTAGE (V) 10 FIGURE 2. SATURATION CHARACTERISTICS ICE, COLLECTOR TO EMITTER CURRENT (A) ICE, COLLECTOR TO EMITTER CURRENT (A) FIGURE 1. TRANSFER CHARACTERISTICS 80 12.0V 70 80 PULSE DURATION = 250µs DUTY CYCLE <0.5%, VGE = 15V 70 TC = -40oC 60 TC = 25oC 50 40 TC = 150oC 30 20 10 0 0 1 2 3 4 VCE, COLLECTOR TO EMITTER VOLTAGE (V) 5 FIGURE 4. COLLECTOR TO EMITTER ON-STATE VOLTAGE HGTG12N60C3D Rev. B HGTG12N60C3D VGE = 15V 20 15 10 5 0 25 50 75 100 125 TC , CASE TEMPERATURE (oC) 150 20 120 ISC 100 15 80 10 60 5 10 VGE = 10V VGE = 15V TJ = 150oC, RG = 25Ω, L = 100mH, VCE(PK) = 480V 300 VGE = 15V VGE = 10V 200 100 10 5 10 15 20 25 5 30 10 15 20 25 30 ICE , COLLECTOR TO EMITTER CURRENT (A) ICE , COLLECTOR TO EMITTER CURRENT (A) FIGURE 7. TURN-ON DELAY TIME vs COLLECTOR TO EMITTER CURRENT FIGURE 8. TURN-OFF DELAY TIME vs COLLECTOR TO EMITTER CURRENT 300 200 TJ = 150oC, RG = 25Ω, L = 100µH, VCE(PK) = 480V TJ = 150oC, RG = 25Ω, L = 100µH, VCE(PK) = 480V 100 VGE = 10V VGE = 15V 10 tfI , FALL TIME (ns) trI , TURN-ON RISE TIME (ns) 12 13 14 VGE , GATE TO EMITTER VOLTAGE (V) FIGURE 6. SHORT CIRCUIT WITHSTAND TIME td(OFF)I , TURN-OFF DELAY TIME (ns) td(ON)I , TURN-ON DELAY TIME (ns) 50 20 20 15 11 400 TJ = 150oC, RG = 25Ω, L = 100µH, VCE(PK) = 480V 30 40 tSC FIGURE 5. MAXIMUM DC COLLECTOR CURRENT vs CASE TEMPERATURE 100 140 VCE = 360V, RG = 25Ω, TJ = 125oC ISC, PEAK SHORT CIRCUIT CURRENT(A) ICE , DC COLLECTOR CURRENT (A) 25 (Continued) tSC , SHORT CIRCUIT WITHSTAND TIME (µs) Typical Performance Curves 200 VGE = 10V or 15V 100 90 5 80 5 10 15 20 25 ICE , COLLECTOR TO EMITTER CURRENT (A) FIGURE 9. TURN-ON RISE TIME vs COLLECTOR TO EMITTER CURRENT ©2001 Fairchild Semiconductor Corporation 30 5 10 15 20 25 30 ICE , COLLECTOR TO EMITTER CURRENT (A) FIGURE 10. TURN-OFF FALL TIME vs COLLECTOR TO EMITTER CURRENT HGTG12N60C3D Rev. B HGTG12N60C3D Typical Performance Curves 3.0 EOFF , TURN-OFF ENERGY LOSS (mJ) TJ = 150oC, RG = 25Ω, L = 100µH, VCE(PK) = 480V 1.5 VGE = 10V 1.0 VGE = 15V 0.5 0 5 10 15 25 20 TJ = 150oC, RG = 25Ω, L = 100µH, VCE(PK) = 480V 2.5 2.0 1.5 VGE = 10V OR 15V 1.0 0.5 0 30 5 ICE , COLLECTOR TO EMITTER CURRENT (A) fMAX , OPERATING FREQUENCY (kHz) TJ = 150oC, TC = 75oC RG = 25Ω, L = 100µH 100 VGE = 10V VGE = 15V fMAX1 = 0.05/(tD(OFF)I + tD(ON)I) fMAX2 = (PD - PC)/(EON + EOFF) 10 PD = ALLOWABLE DISSIPATION PC = CONDUCTION DISSIPATION (DUTY FACTOR = 50%) RθJC = 1.2oC/W 1 5 10 20 100 60 LIMITED BY CIRCUIT 40 20 0 0 1500 1000 500 COES 0 5 10 15 20 VCE, COLLECTOR TO EMITTER VOLTAGE (V) FIGURE 15. CAPACITANCE vs COLLECTOR TO EMITTER VOLTAGE ©2001 Fairchild Semiconductor Corporation 100 200 300 400 500 600 25 FIGURE 14. SWITCHING SAFE OPERATING AREA VCE , COLLECTOR TO EMITTER VOLTAGE (V) C, CAPACITANCE (pF) CIES 0 30 VCE(PK), COLLECTOR TO EMITTER VOLTAGE (V) FREQUENCY = 1MHz CRES 25 80 30 FIGURE 13. OPERATING FREQUENCY vs COLLECTOR TO EMITTER CURRENT 2000 20 TJ = 150oC, VGE = 15V, RG = 25Ω, L = 100µH ICE, COLLECTOR TO EMITTER CURRENT (A) 2500 15 FIGURE 12. TURN-OFF ENERGY LOSS vs COLLECTOR TO EMITTER CURRENT ICE, COLLECTOR TO EMITTER CURRENT (A) FIGURE 11. TURN-ON ENERGY LOSS vs COLLECTOR TO EMITTER CURRENT 200 10 ICE , COLLECTOR TO EMITTER CURRENT (A) IG(REF) = 1.276mA, RL = 50Ω, TC = 25oC 15 600 480 12 VCE = 600V 360 9 240 6 VCE = 400V VCE = 200V 120 3 0 0 10 20 30 40 QG , GATE CHARGE (nC) 50 60 VGE, GATE TO EMITTER VOLTAGE (V) 2.0 EON , TURN-ON ENERGY LOSS (mJ) (Continued) 0 FIGURE 16. GATE CHARGE WAVEFORMS HGTG12N60C3D Rev. B HGTG12N60C3D ZθJC , NORMALIZED THERMAL RESPONSE Typical Performance Curves (Continued) 100 0.5 0.2 t1 0.1 10-1 PD 0.05 t2 0.02 0.01 DUTY FACTOR, D = t1 / t2 PEAK TJ = (PD X ZθJC X RθJC) + TC SINGLE PULSE 10-2 10-5 10-4 10-3 10-2 10-1 t1 , RECTANGULAR PULSE DURATION (s) 100 101 FIGURE 17. IGBT NORMALIZED TRANSIENT THERMAL IMPEDANCE, JUNCTION TO CASE 50 TC = 25oC, dIEC/dt = 100A/µs 40 30 tr , RECOVERY TIMES (ns) IEC , FORWARD CURRENT (A) 40 100oC 20 150oC 25oC 10 trr 30 ta 20 tb 10 0 0 0 0.5 1.0 1.5 2.5 2.0 5 0 3.0 15 20 IEC , FORWARD CURRENT (A) VEC , FORWARD VOLTAGE (V) FIGURE 18. DIODE FORWARD CURRENT vs FORWARD VOLTAGE DROP 10 FIGURE 19. RECOVERY TIMES vs FORWARD CURRENT Test Circuit and Waveform L = 100µH 90% RHRP1560 10% VGE EOFF RG = 25Ω EON VCE + - 90% VDD = 480V ICE 10% td(OFF)I tfI trI td(ON)I FIGURE 20. INDUCTIVE SWITCHING TEST CIRCUIT ©2001 Fairchild Semiconductor Corporation FIGURE 21. SWITCHING TEST WAVEFORMS HGTG12N60C3D Rev. B HGTG12N60C3D Handling Precautions for IGBTs Operating Frequency Information Insulated Gate Bipolar Transistors are susceptible to gate-insulation damage by the electrostatic discharge of energy through the devices. When handling these devices, care should be exercised to assure that the static charge built in the handler’s body capacitance is not discharged through the device. With proper handling and application procedures, however, IGBTs are currently being extensively used in production by numerous equipment manufacturers in military, industrial and consumer applications, with virtually no damage problems due to electrostatic discharge. IGBTs can be handled safely if the following basic precautions are taken: Operating frequency information for a typical device (Figure 13) is presented as a guide for estimating device performance for a specific application. Other typical frequency vs collector current (ICE) plots are possible using the information shown for a typical unit in Figures 4, 7, 8, 11 and 12. The operating frequency plot (Figure 13) of a typical device shows fMAX1 or fMAX2 whichever is smaller at each point. The information is based on measurements of a typical device and is bounded by the maximum rated junction temperature. 1. Prior to assembly into a circuit, all leads should be kept shorted together either by the use of metal shorting springs or by the insertion into conductive material such as “ECCOSORBD LD26” or equivalent. 2. When devices are removed by hand from their carriers, the hand being used should be grounded by any suitable means, for example, with a metallic wristband. 3. Tips of soldering irons should be grounded. 4. Devices should never be inserted into or removed from circuits with power on. 5. Gate Voltage Rating - Never exceed the gate-voltage rating of VGEM. Exceeding the rated VGE can result in permanent damage to the oxide layer in the gate region. 6. Gate Termination - The gates of these devices are essentially capacitors. Circuits that leave the gate opencircuited or floating should be avoided. These conditions can result in turn-on of the device due to voltage buildup on the input capacitor due to leakage currents or pickup. 7. Gate Protection - These devices do not have an internal monolithic Zener Diode from gate to emitter. If gate protection is required an external Zener is recommended. ©2001 Fairchild Semiconductor Corporation fMAX1 is defined by fMAX1 = 0.05/(tD(OFF)I + tD(ON)I). Deadtime (the denominator) has been arbitrarily held to 10% of the on-state time for a 50% duty factor. Other definitions are possible. tD(OFF)I and tD(ON)I are defined in Figure 21. Device turn-off delay can establish an additional frequency limiting condition for an application other than TJM. tD(OFF)I is important when controlling output ripple under a lightly loaded condition. fMAX2 is defined by fMAX2 = (PD - PC)/(EOFF + EON). The allowable dissipation (PD) is defined by PD = (TJM - TC)/RθJC. The sum of device switching and conduction losses must not exceed PD . A 50% duty factor was used (Figure 13) and the conduction losses (PC) are approximated by PC = (VCE x ICE)/2. EON and EOFF are defined in the switching waveforms shown in Figure 21. EON is the integral of the instantaneous power loss (ICE x VCE) during turn-on and EOFF is the integral of the instantaneous power loss during turn-off. All tail losses are included in the calculation for EOFF; i.e. the collector current equals zero (ICE = 0). HGTG12N60C3D Rev. B TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ Bottomless™ CoolFET™ CROSSVOLT™ DenseTrench™ DOME™ EcoSPARK™ E2CMOSTM EnSignaTM FACT™ FACT Quiet Series™ FAST FASTr™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™ ISOPLANAR™ LittleFET™ MicroFET™ MicroPak™ MICROWIRE™ OPTOLOGIC™ OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerTrench QFET™ QS™ QT Optoelectronics™ Quiet Series™ SILENT SWITCHER SMART START™ STAR*POWER™ Stealth™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ TruTranslation™ UHC™ UltraFET VCX™ STAR*POWER is used under license DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant into support device or system whose failure to perform can the body, or (b) support or sustain life, or (c) whose be reasonably expected to cause the failure of the life failure to perform when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. H4