SN65LVDS108 8-PORT LVDS REPEATER SLLS399A – NOVEMBER 1999 – REVISED MARCH 2000 D D D D D D D D D D D D DBT PACKAGE (TOP VIEW) One Line Receiver and Eight Line Drivers Configured as an 8-Port LVDS Repeater Line Receiver and Line Drivers Meet or Exceed the Requirements of ANSI EIA/TIA-644 Standard Designed for Signaling Rates up to 622 Mbps Enabling Logic Allows Individual Control of Each Driver Output, Plus all Outputs Low-Voltage Differential Signaling With Typical Output Voltage of 350 mV and a 100Ω Load Electrically Compatible With LVDS, PECL, LVPECL, LVTTL, LVCMOS, GTL, BTL, CTT, SSTL, or HSTL Outputs With External Termination Networks Propagation Delay Times < 4.7 ns Output Skew Less Than 300 ps and Part-to-Part Skew Less Than 1.5 ns Total Power Dissipation at 200 MHz Typically Less Than 330 mW With 8 Channels Enabled Driver Outputs or Receiver Input Equals High Impedance When Disabled or With VCC < 1.5 V Bus-Pin ESD Protection Exceeds 12 kV Packaged in Thin Shrink Small-Outline Package With 20-mil Terminal Pitch GND VCC GND NC ENM ENA ENB ENC END A B ENE ENF ENG ENH NC GND VCC GND 1 38 2 37 3 36 4 35 5 34 6 33 7 32 8 31 9 30 10 29 11 28 12 27 13 26 14 25 15 24 16 23 17 22 18 21 19 20 ANC AY AZ BY BZ CY CZ DY DZ EY EZ FY FZ GY GZ HY HZ NC NC description The SN65LVDS108 is configured as one differential line receiver connected to eight differential line drivers. Individual output enables are provided for each output and an additional enable is provided for all outputs. The line receivers and line drivers implement the electrical characteristics of low-voltage differential signaling (LVDS). LVDS, as specified in EIA/TIA-644, is a data signaling technique that offers low power, low noise emission, high noise immunity, and high switching speeds. It can be used to transmit data at speeds up to at least 622 Mbps and over relatively long distances. (Note: The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media, the noise coupling to the environment, and other system characteristics.) The intended application of this device, and the LVDS signaling technique, is for point-to-point or point-to-multipoint (distributed simplex) baseband data transmission on controlled impedance media of approximately 100 Ω. The transmission media may be printed-circuit board traces, backplanes, or cables. The large number of drivers integrated into the same silicon substrate, along with the low pulse skew of balanced signaling, provides extremely precise timing alignment of the signals being repeated from the inputs. This is particularly advantageous for implementing system clock or data distribution trees. The SN65LVDS108 is characterized for operation from –40°C to 85°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2000, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN65LVDS108 8-PORT LVDS REPEATER SLLS399A – NOVEMBER 1999 – REVISED MARCH 2000 logic diagram (positive logic) AY ENA AZ ENM BY BZ ENB CY CZ ENC DY END DZ A B EY ENE EZ FY FZ ENF GY GZ ENG HY HZ ENH selection guide to LVDS splitter The SN65LVDS108 is one member of a family of LVDS splitters and repeaters. A brief overview of the family is provided in the following table. LVDS SPLITTER AND REPEATER FAMILY NUMBER OF INPUTS NUMBER OF OUTPUTS SN65LVDS104 1 LVDS 4 LVDS 16-pin D 4-Port LVDS Repeater SN65LVDS105 1 LVTTL 4 LVDS 16-pin D 4-Port TTL-to-LVDS Repeater SN65LVDS108 1 LVDS 8 LVDS 38-pin DBT 8-Port LVDS Repeater SN65LVDS109 2 LVDS 8 LVDS 38-pin DBT Dual 4-Port LVDS Repeater SN65LVDS116 1 LVDS 16 LVDS 64-pin DGG 16-Port LVDS Repeater SN65LVDS117 2 LVDS 16 LVDS 64-pin DGG Dual 8-Port LVDS Repeater DEVICE 2 PACKAGE POST OFFICE BOX 655303 COMMENTS • DALLAS, TEXAS 75265 SN65LVDS108 8-PORT LVDS REPEATER SLLS399A – NOVEMBER 1999 – REVISED MARCH 2000 FUNCTION TABLE OUTPUTS INPUTS VID = VA – VB X ENM ENx xY xZ L X Z Z X X L Z Z VID ≥ 100 mV –100 mV < VID < 100 mV H H H L H H ? ? VID ≤–100 mV H H L H H = high level, L = low level, Z = high impedance, X = don’t care, ? = indeterminate equivalent input and output schematic diagrams VCC VCC VCC 300 kΩ (ENM Only) 300 kΩ 300 kΩ 50 Ω Enable Inputs A Input 10 kΩ 5Ω Y or Z Output 7V B Input 7V 300 kΩ 7V 7V (ENx Only) absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 4 V Input voltage range, Enable inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6 V A, B, Y or Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 4 V Electrostatic discharge, Y, Z, and GND (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . Class 3, A:12 kV, B: 500 V All pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 3, A: 4 kV, B: 400 V Continuous power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential I/O bus voltages, are with respect to network ground terminal. 2. Tested in accordance with MIL-STD-883C Method 3015.7. DISSIPATION RATING TABLE PACKAGE TA ≤ 25°C POWER RATING DERATING FACTOR‡ ABOVE TA = 25°C TA = 85°C POWER RATING DBT 1277 mW 10.2 mW/°C 644 mW ‡ This is the inverse of the junction-to-ambient thermal resistance when board-mounted (low-k) with no air flow. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN65LVDS108 8-PORT LVDS REPEATER SLLS399A – NOVEMBER 1999 – REVISED MARCH 2000 recommended operating conditions MIN NOM Supply voltage, VCC 3 3.3 High-level input voltage, VIH 2 0.1 V Ť Common-mode input voltage, VIC ID 2 Operating free-air temperature, TA UNIT 3.6 V V Low-level input voltage, VIL Magnitude of differential input voltage, VID MAX 0.8 V 3.6 V V Ť Ť 2.4 – ID 2 Ť V VCC – 0.8 85 –40 V °C electrical characteristics over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS VITH+ VITH– Positive-going differential input voltage threshold VOD Differential output voltage magnitude ∆VOD Change in differential output voltage magnitude between logic states VOC(SS) Steady-state common-mode output voltage ∆VOC(SS) Change in steady-state common-mode output voltage between logic states VOC(PP) Peak-to-peak common-mode output voltage ICC Supply current II Input current (A or B inputs) II(OFF) IIH Power-off input current (A or B inputs) IIL Low-level input current (enables) IOS Short circuit output current Short-circuit IOZ IO(OFF) High-impedance output current CIN Input capacitance (A or B inputs) CO Output capacitance (Y or Z outputs) Negative-going differential input voltage threshold See Figure 1 and Table 1 RL= 100 Ω Ω, VID= ±100 mV, mV See Figure 1 and Figure 2 See Figure 3 Enabled, High-level input current (enables) Power-off output current 247 340 –50 50 1.125 1.375 –50 50 50 150 62 85 8 12 –2 UNIT mV 454 –20 –1.2 mV V mV mA µA 20 µA ±20 µA VIL = 0.8 V VOY or VOZ = 0 V ±10 µA VOD = 0 V VO = 0 V or VCC ±12 VCC = 1.5 V, VIH = 2 V VI = 2.4 V VCC = 1.5 V, VO = 3.6 V VI = 0.4 sin (4E6πt) + 0.5 V POST OFFICE BOX 655303 MAX –100 RL = 100 Ω VI = 0 V VI = 2.4 V TYP† 100 Disabled VI = 0.4 sin (4E6πt) + 0.5 V, Disabled † All typical values are at 25°C and with a 3.3 V supply. 4 MIN • DALLAS, TEXAS 75265 ±24 mA ±1 µA ±1 µA 5 9.4 pF SN65LVDS108 8-PORT LVDS REPEATER SLLS399A – NOVEMBER 1999 – REVISED MARCH 2000 switching characteristics over recommended operating conditions (unless otherwise noted) MIN TYP† MAX tPLH tPHL Propagation delay time, low-to-high-level output 1.6 2.8 4.5 Propagation delay time, high-to-low-level output 1.6 2.8 4.5 tr tf Differential output signal rise time 0.3 0.8 1.2 0.3 0.8 1.2 150 500 PARAMETER tsk(p) tsk(o) TEST CONDITIONS RL = 100 Ω, CL = 10 pF, See Figure 4 Differential output signal fall time Pulse skew (|tPHL - tPLH|)‡ Output skew§ 300 tsk(pp) tPZH Part-to-part skew# tPZL tPHZ Propagation delay time, high-impedance-to-low-level output 1.5 Propagation delay time, high-impedance-to-high-level output See Figure 5 Propagation delay time, high-level-to-high-impedance output 5.7 15 7.7 15 3.2 15 UNIT ns ns ps ns ns tPLZ Propagation delay time, low-level-to-high-impedance output 3.2 15 ns † All typical values are at 25°C and with a 3.3 V supply. ‡ tsk(p) is the magnitude of the time difference between the tPLH and tPHL of any output of a single device. § tsk(o) is the magnitude of the time difference between the tPLH or tPHL measured at any two outputs. # tsk(pp) is the magnitude of the time difference in propagation delay times between any specified terminals of two devices when both devices operate with the same supply voltages, at the same temperature, and have identical packages and test circuits. PARAMETER MEASUREMENT INFORMATION IIA IIB VID IOY A Y B Z VIA IOZ VOD VOY VOZ VIB VOC (VOY + VOZ)/2 Figure 1. Voltage and Current Definitions POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SN65LVDS108 8-PORT LVDS REPEATER SLLS399A – NOVEMBER 1999 – REVISED MARCH 2000 PARAMETER MEASUREMENT INFORMATION Table 1. Receiver Minimum and Maximum Input Threshold Test Voltages APPLIED VOLTAGES RESULTING DIFFERENTIAL INPUT VOLTAGE RESULTING COMMONMODE INPUT VOLTAGE VIA 1.25 V VIB 1.15 V VID 100 mV VIC 1.2 V 1.15 V 1.25 V -100 mV 1.2 V 2.4 V 2.3 V 100 mV 2.35 V 2.3 V 2.4 V -100 mV 2.35 V 0.1 V 0V 100 mV 0.05 V 0V 0.1 V -100 mV 0.05 V 1.5 V 0.9 V 600 mV 1.2 V 0.9 V 1.5 V -600 mV 1.2 V 2.4 V 1.8 V 600 mV 2.1 V 1.8 V 2.4 V -600 mV 2.1 V 0.6 V 0V 600 mV 0.3 V 0V 0.6 V -600 mV 0.3 V 3.75 kΩ Y 100 Ω 3.75 kΩ VOD Input Z ± 0 V ≤ VTEST ≤ 2.4 V Figure 2. VOD Test Circuit 49.9 Ω ± 1% (2 Places) Y Input Input VI 1.4 V VI 1V Z 50 pF VOC(PP) VOC VOC(SS) VO NOTE A: All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate (PRR) = 0.5 Mpps, pulsewidth = 500 ±10 ns. CL includes instrumentation and fixture capacitance within 0,06 mm of the D.U.T. The measurement of VOC(PP) is made on test equipment with a –3 dB bandwidth of at least 300 MHz. Figure 3. Test Circuit and Definitions for the Driver Common-Mode Output Voltage 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN65LVDS108 8-PORT LVDS REPEATER SLLS399A – NOVEMBER 1999 – REVISED MARCH 2000 PARAMETER MEASUREMENT INFORMATION A Y B Z Input 1.4 V 1.2 V 1V VIB Input VIA tPLH VOD tPHL 100 Ω ± 1 % VOD(H) Output CL = 10 pF (2 Places) 100% 80% 0V VOD(L) 20% 0% tf tr NOTE A: All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate (PRR) = 50 Mpps, pulsewidth = 10 ±0.2 ns . CL includes instrumentation and fixture capacitance within 0,06 mm of the D.U.T. Figure 4. Test Circuit, Timing, and Voltage Definitions for the Differential Output Signal Y 1 V or 1.4 V 49.9 Ω ± 1% (2 Places) Z 1.4 V or 1 V 1.2 V CL = 10 pF ENM (2 Places) ENx Inputs VOY VOZ 2V 1.4 V 0.8 V Input VOY or VOZ tPZH tPHZ 100%, ≅ 1.4 V 50% 0%, 1.2 V tPZL tPLZ 100%, 1.2 V VOZ 50% or 0%, ≅ 1 V VOY NOTE A: All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate (PRR) = 0.5 Mpps, pulsewidth = 500 ±10 ns . CL includes instrumentation and fixture capacitance within 0,06 mm of the D.U.T. Figure 5. Enable and Disable Time Circuit and Definitions POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 SN65LVDS108 8-PORT LVDS REPEATER SLLS399A – NOVEMBER 1999 – REVISED MARCH 2000 TYPICAL CHARACTERISTICS SUPPLY CURRENT vs SWITCHING FREQUENCY LOW-TO-HIGH PROPAGATION DELAY TIME vs FREE-AIR TEMPERATURE I CC – Supply Current – mA 120 VCC = 3.6 V 100 VCC = 3 V 80 VCC = 3.3 V 60 40 20 All Outputs Loaded and Enabled 0 0 50 100 150 200 250 300 3.8 t PLH – Low-To-High Propagation Delay Time – ns 140 3.7 3.6 3.5 VCC = 3.3 V 3.4 VCC = 3 V VCC = 3.6 V 3.3 3.2 3.1 –50 350 –25 0 Figure 6 Figure 7 t PHL – High-To-Low Propagation Delay Time – ns HIGH-TO-LOW PROPAGATION DELAY TIME vs FREE-AIR TEMPERATURE 3.7 3.6 3.5 3.4 3.3 VCC = 3.3 V VCC = 3.6 V VCC = 3 V 3.2 3.1 3.0 2.9 –50 –25 0 25 50 75 TA – Free–Air Temperature – °C Figure 8 8 25 50 TA – Free–Air Temperature – °C f – Frequency – MHz POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 100 75 100 SN65LVDS108 8-PORT LVDS REPEATER SLLS399A – NOVEMBER 1999 – REVISED MARCH 2000 TYPICAL CHARACTERISTICS Figure 9. Typical Differential Eye Pattern at 400 Mbps POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 SN65LVDS108 8-PORT LVDS REPEATER SLLS399A – NOVEMBER 1999 – REVISED MARCH 2000 APPLICATION INFORMATION The SN65LVDS108 device solves several problems common to the distribution of timing critical clock and data signals. These problems include: D D D D D Excessive skew between the signal paths Noise pickup over long signaling paths High power consumption Control of which signal paths are enabled or disabled Elimination of radiation from unterminated lines Buffering and splitting the signal on the same silicon die minimizes corruption of the timing relation between the copies of the signal. Buffering and splitting the signal in separate devices will introduce considerably higher levels of uncontrolled timing skew between the signals. Higher speed operation and more timing tolerance for other components of the system is enabled by the tighter system timing budgets provided by the single die implementations of the SN65LVDS108. The use of LVDS signaling technology for both the inputs and the outputs provides superior common-mode and noise tolerance compared to single-ended I/O technologies. This is particularly important because the signals that are being distributed must be transmitted over longer distances, and at higher rates, than can be accommodated with single-ended I/Os. In addition, LVDS consumes considerably less power than other high-performance differential signaling schemes. The enable inputs provided for each output may be used to turn on or off any of the paths. This function is required to prevent radiation of signals from the unterminated signal lines on open connectors when boards or devices are being swapped in the end equipment. The individual channel enables are also required if redundant paths are being utilized for reliability reasons. The following diagram shows how an input signal is being identically repeated out two of the available outputs. A third output is shown in the disabled state. SOURCE EQUIPMENT/ BOARD n-PORT REPEATER DESTINATION EQUIPMENT/ BOARD #1 Output Pair Disabled DESTINATION EQUIPMENT/ BOARD #2 DESTINATION EQUIPMENT/ BOARD #n Figure 10. LVDS Repeating Splitter Application Example Showing Individual Path Control 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN65LVDS108 8-PORT LVDS REPEATER SLLS399A – NOVEMBER 1999 – REVISED MARCH 2000 APPLICATION INFORMATION A LVDS receiver can be used to receive various other types of logic signals. Figure 12 through Figure 20 show the termination circuits for SSTL, HSTL, GTL, BTL, LVPECL, PECL, CMOS, and TTL. VDD 25 Ω 50 Ω A 50 Ω 1/2 VDD B 0.1 µF LVDS Receiver Figure 11. Stub-Series Terminated (SSTL) or High-Speed Transceiver Logic (HSTL) VDD 50 Ω A 50 Ω B 1.35 V < VTT < 1.65 V 0.1 µF LVDS Receiver Figure 12. Center-Tap Termination (CTT) 1.14 V < VTT < 1.26 V VDD 1 kΩ 50 Ω 50 Ω A B 2 kΩ 0.1 µF LVDS Receiver Figure 13. Gunning Transceiver Logic (GTL) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11 SN65LVDS108 8-PORT LVDS REPEATER SLLS399A – NOVEMBER 1999 – REVISED MARCH 2000 APPLICATION INFORMATION Z0 Z0 A B 1.47 V < VTT < 1.62 V 0.1 µF LVDS Receiver Figure 14. Backplane Transceiver Logic (BTL) 3.3 V 3.3 V 50 Ω 120 Ω 120 Ω 33 Ω ECL A 50 Ω 33 Ω B 51 Ω 51 Ω LVDS Receiver Figure 15. Low-Voltage Positive Emitter-Coupled Logic (LVPECL) 12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN65LVDS108 8-PORT LVDS REPEATER SLLS399A – NOVEMBER 1999 – REVISED MARCH 2000 APPLICATION INFORMATION 5V 5V 82 Ω 50 Ω 82 Ω 100 Ω ECL A 50 Ω 100 Ω B 33 Ω 33 Ω LVDS Receiver Figure 16. Positive Emitter-Coupled Logic (PECL) 3.3 V 3.3 V 7.5 kΩ A B 7.5 kΩ 0.1 µF LVDS Receiver Figure 17. 3.3-V CMOS POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 13 SN65LVDS108 8-PORT LVDS REPEATER SLLS399A – NOVEMBER 1999 – REVISED MARCH 2000 APPLICATION INFORMATION 5V 5V 10 kΩ 560 Ω A B 560 Ω 3.32 kΩ 0.1 µF LVDS Receiver Figure 18. 5-V CMOS 5V 5V 10 kΩ 470 Ω A B 3.3 V 4.02 kΩ 0.1 µF Figure 19. TTL 14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 LVDS Receiver SN65LVDS108 8-PORT LVDS REPEATER SLLS399A – NOVEMBER 1999 – REVISED MARCH 2000 MECHANICAL DATA DBT (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 30 PINS SHOWN 0,50 0,27 0,17 30 16 0,08 M 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 15 0°– 8° 0,75 0,50 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 28 30 38 44 50 A MAX 7,90 7,90 9,80 11,10 12,60 A MIN 7,70 7,70 9,60 10,90 12,40 DIM 4073252/D 09/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 15 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof. Copyright 2000, Texas Instruments Incorporated