STMICROELECTRONICS VNQ5050KTR-E

VNQ5050K-E
QUAD CHANNEL HIGH SIDE DRIVER
FOR AUTOMOTIVE APPLICATIONS
ADVANCE DATA
Table 1. General Features
TYPE
VNQ5050K-E
Figure 1. Package
VCC
RDS(on)
Iout
41V
50mΩ (*)
12A
(*) Per channel
OUTPUT CURRENT: 12A
3.0 V CMOS COMPATIBLE INPUT
■ STATUS DISABLE
■ ON STATE OPEN LOAD DETECTION
■ OFF STATE OPEN LOAD DETECTION
■ OUTPUT STUCK TO VCC DETECTION
■ OPEN DRAIN STATUS OUTPUT
■ UNDERVOLTAGE SHUT-DOWN
■
■
PowerSSO-24
OVERVOLTAGE CLAMP
■ THERMAL SHUT DOWN
■ CURRENT AND POWER LIMITATION
■ VERY LOW STAND-BY CURRENT
■ PROTECTION AGAINST LOSS OF GROUND
AND LOSS OF VCC
■ VERY LOW ELECTROMAGNETIC
SUSCEPTIBILITY
■ OPTIMIZED ELECTROMAGNETIC EMISSION
■ REVERSE BATTERY PROTECTION (**)
■ IN COMPLIANCE WITH THE 2002/95/EC
EUROPEAN DIRECTIVE
■
The device detects open load condition both in on
and off state, when STAT_DIS is left open or
driven low. Output shorted to VCC is detected in
the off state.
When STAT_DIS is driven high, the STATUS pin
is in a high impedance condition.
Output current limitation protects the device in
overload condition. In case of long duration overload, the device limits the dissipated power to safe
level up to thermal shut-down intervention. . Thermal shut-down with automatic restart allows the
device to recover normal operation as soon as
fault condition disappears.
DESCRIPTION
The VNQ5050K-E is a monolithic device made
using STMicroelectronics VIPower technology. It
is intended for driving resistive or inductive loads
with one side connected to ground. Active VCC pin
voltage clamp protects the device against low
energy
spikes
(see
ISO7637
transient
compatibility table).
Table 2. Order Codes
Package
Tube
Tape and Reel
PowerSSO-24
VNQ5050K-E
VNQ5050KTR-E
Note: (**) See application schematic at page 9.
Rev. 2
March 2005
This is preliminary information on a new product now in development. Details are subject to change without notice.
1/13
VNQ5050K-E
Figure 2. Block Diagram
VCC
OUTPUT1
GND
VCC
CLAMP
UNDERVOLTAGE
INPUT1
CLAMP 1
CONTROL & PROTECTION
STATUS2 EQUIVALENT TO
CHANNEL1
DRIVER 1
STAT_DIS
VCC
INPUT2
STATUS1
OUTPUT2
LOGIC
INPUT2
OVERTEMP. 1
CURRENT LIMITER 1
VCC
INPUT3
CONTROL & PROTECTION
STATUS3 EQUIVALENT TO
CHANNEL1
STATUS2
OPENLOAD ON 1
OUTPUT3
INPUT3
STATUS3
OPENLOAD OFF 1
INPUT4
VCC
INPUT4
CONTROL & PROTECTION
STATUS4 EQUIVALENT TO
CHANNEL1
PWRLIM 1
OUTPUT4
STATUS4
Table 3. Pin Function
Name
VCC
OUTPUTn
Function
Battery connection
Power output
GND
Ground connection. Must be reverse battery protected by an external diode/resistor network
INPUTn
Voltage controlled input pin with hysteresis, CMOS compatible. Controls output switch state
STATUSn
Open drain digital diagnostic pin
STAT_DIS
Active high CMOS compatible pin, to disable the STATUS pin
Figure 3. Current and Voltage Conventions
IS
VCC
ISD
VFn (*)
IOUTn
STAT_DIS
OUTPUTn
VSD
VOUTn
IINn
ISTATn
INPUTn
STATUSn
VINn
VSTATn
GND
IGND
(*) VFn = VCC - VOUTn during reverse battery condition
2/13
VCC
VNQ5050K-E
Figure 4. Configuration Diagram (Top View) & Suggested Connections For Unused and n.c. Pins
VCC
GND
INPUT1
STATUS1
INPUT2
STATUS2
INPUT3
STATUS3
INPUT4
STATUS4
STAT_DIS
VCC
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
OUTPUT1
OUTPUT1
OUTPUT1
OUTPUT2
OUTPUT2
OUTPUT2
OUTPUT3
OUTPUT3
OUTPUT3
OUTPUT4
OUTPUT4
OUTPUT4
TAB = VCC
Connection / Pin Status
Floating
X
To Ground
N.C.
X
X
Output
X
Input
X
Through 10KΩ resistor
Table 4. Absolute Maximum Ratings
Symbol
VCC
Parameter
DC Supply Voltage
Value
Unit
41
V
- VCC
Reverse DC Supply Voltage
- 0.3
V
- IGND
DC Reverse Ground Pin Current
- 200
mA
Internally Limited
A
- 15
A
DC Input Current
+10/-1
mA
ISTAT
DC Status Current
+10/-1
mA
VESD
Electrostatic discharge (R=1.5kΩ; C=100pF)
2000
V
IOUT
- IOUT
IIN
Tj
Tstg
DC Output Current
Reverse DC Output Current
Junction Operating Temperature
-40 to 150
°C
Storage Temperature
- 55 to 150
°C
Value
1.7
52 (1)
Unit
°C/W
°C/W
Table 5. Thermal Data
Symbol
Rthj-case
Rthj-amb
Parameter
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Note: 1. When mounted on a standard single-sided FR-4 board with 1 cm2 of Cu (at least 35µm thick) connected to TAB.
3/13
VNQ5050K-E
ELECTRICAL CHARACTERISTICS (8V<VCC<36V; -40°C< Tj <150°C, unless otherwise specified)
Table 6. Power Section
Symbol
Parameter
VCC
Operating supply voltage
VUSD
Test Conditions
Min.
Typ.
Max.
Unit
4.5
13
36
V
Undervoltage shut-down
3
4.5
V
VUSDhyst
Undervoltage shut-down
hysteresis
0.5
RON (**)
On state resistance
IOUT=2A; Tj=25°C
50
mΩ
IOUT=2A; Tj=150°C
IOUT=2A; VCC=5V; Tj=25°C
100
mΩ
65
mΩ
46
52
V
2 (2)
5 (2)
µA
8
14
mA
Vclamp
Clamp Voltage
IS=20 mA
IS
Supply current
Off State; VCC=13V; VIN=VOUT=0V;
Tj=25°C
41
On State; VIN=5V; VCC=13V; IOUT=0A
IL(off1) (**)
Off state output current
IL(off2) (**)
Off state output current
V
VIN=VOUT=0V; VCC=13V; Tj=25°C
0
3
µA
VIN=VOUT=0V; VCC=13V; Tj=125°C
0
5
µA
-75
0
µA
VIN=0V; VOUT= 4V
Note: (**) Per each channel.
Note: 2. PowerMOS leakage included.
Table 7. Switching (VCC=13V)
Symbol
Parameter
td(on)
Turn-on Delay Time
td(off)
Test Conditions
RL=6.5Ω
Min.
Typ.
15
Max.
Unit
µs
Turn-off Delay Time
RL=6.5Ω
40
µs
dVOUT/dt(on)
Turn-on Voltage Slope
RL=6.5Ω
0.3
V/µs
dVOUT/dt(off)
Turn-off Voltage Slope
RL=6.5Ω
0.35
V/µs
WON
Switching energy
losses at turn-on
RL=6.5Ω
TBD
mJ
WOFF
Switching energy
losses at turn-off
RL=6.5Ω
TBD
mJ
4/13
VNQ5050K-E
ELECTRICAL CHARACTERISTICS (continued)
Table 8. Status Pin (VSD=0)
Symbol
VSTAT
ILSTAT
CSTAT
VSCL
Parameter
Test Conditions
Status Low Output Voltage ISTAT= 1.6 mA, VSD=0V
Normal Operation or VSD=5V,
Status Leakage Current
VSTAT= 5V
Status Pin Input
Normal Operation or VSD=5V,
Capacitance
VSTAT= 5V
ISTAT= 1mA
Status Clamp Voltage
ISTAT= - 1mA
Min
Typ
5.5
Max
0.5
Unit
V
10
µA
100
pF
TBD
-0.7
V
V
Table 9. Protections (see note 3)
Symbol
Parameter
Test Conditions
IlimH
DC Short circuit current
IlimL
Short circuit current
ing thermal cycling
TTSD
Shutdown temperature
dur-
TR
Reset temperature
TRS
Thermal reset of STATUS
THYST
tSDL
VDEMAG
VON
VCC=13V
Min.
Typ.
Max.
Unit
12
18
24
A
24
A
5V<VCC<36V
VCC=13V
7
TR<Tj<TTSD
150
200
TRS + 1 TRS + 5
°C
7
Tj>TTSD
°C
20
Turn-off output voltage
clamp
IOUT=2A; VIN=0; L=6mH
Output voltage drop
IOUT=0.1A (see fig. 6)
limitation
Tj= -40°C...+150°C
VCC-41
°C
°C
135
Thermal hysteresis
(TTSD-TR)
Status Delay in Overload
Conditions
175
A
VCC-46 VCC-52
25
µs
V
mV
Note: 3. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be
used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration
and number of activation cycles
Table 10. Openload Detection
Symbol
IOL
tDOL(on)
tPOL
VOL
tDSTKON
Parameter
Openload ON State
Detection Threshold
Openload ON State
Detection Delay
Delay between INPUT
falling edge and STATUS
rising edge in Openload
condition
Openload OFF State
Voltage Detection
Threshold
Output Short Circuit to Vcc
Detection Delay at Turn Off
Test Conditions
VIN = 5V , 8V<Vcc<18V
Min
Typ
Max
Unit
10
40
70
mA
200
µs
IOUT = 0A, VCC=13V
IOUT = 0A
VIN = 0V, 8V<VCC<16V
200
500
1000
µs
2
3
4
V
tPOL
µs
180
5/13
VNQ5050K-E
Figure 5.
OPEN LOAD STATUS TIMING (without external pull-up)
IOUT < IOL
VIN
OPEN LOAD STATUS TIMING (with external pull-up)
IOUT < IOL
VIN
VOUT > VOL
VOUT < VOL
VSTAT
VSTAT
tDOL(on)
tDOL(on)
tPOL
OVER TEMP STATUS TIMING
OUTPUT STUCK TO Vcc
Tj > TTSD
IOUT > IOL
VIN
VOUT > VOL
VIN
VSTAT
VSTAT
tDOL(on)
tSDL
tDSTKON
Figure 6.
Vcc-Vout
Tj=150oC
Tj=25oC
Tj=-40oC
Von
Von/Ron(T)
6/13
Iout
tSDL
VNQ5050K-E
ELECTRICAL CHARACTERISTICS (continued)
Table 11. Logic Input
Symbol
Parameter
VIL
Input Low Level
IIL
Low Level Input Current
VIH
Input High Level
IIH
High Level Input Current
VI(hyst)
Input Hysteresis Voltage
VICL
Input Clamp Voltage
VSDL
STAT_DIS low level
voltage
ISDL
Low level STAT_DIS
current
VSDH
STAT_DIS high level voltage
ISDH
High level STAT_DIS
current
VSD(hyst)
STAT_DIS hysteresis voltage
VSDCL
STAT_DIS clamp voltage
Test Conditions
Min.
VIN = 0.9V
Typ.
Max.
Unit
0.9
V
µA
1
2.1
V
VIN = 2.1V
10
0.25
V
5.5
IIN = 1mA
IIN = -1mA
TBD
-0.7
µA
2.1
V
10
0.25
µA
V
5.5
ISD=-1mA
V
1
VSD=2.1V
ISD=1mA
V
V
0.9
VSD=0.9V
µA
TBD
-0.7
V
V
Table 12. Truth Table
CONDITIONS
Normal Operation
Current Limitation
Overtemperature
Undervoltage
Output Voltage > VOL
Output Current < IOL
INPUTn
OUTPUTn
STATUSn (VSD=0V) (1)
L
H
L
H
L
H
L
H
L
H
L
H
L
H
L
X
L
L
L
L
H
H
L
H
H
H
H
H
H
L
X
X
L(2)
H
H(3)
L
Note: 1. If the VSD is high, the STATUS pin is in a high impedance.
2. The STATUS pin is low with a delay equal to tDSTKON after INPUT falling edge.
3. The STATUS pin becomes high with a delay equal to tPOL after INPUT falling edge.
7/13
VNQ5050K-E
Figure 7. Switching Characteristics
VOUT
90%
80%
dVOUT/dt(off)
dVOUT/dt(on)
10%
tr
tf
t
INPUT
td(on)
td(off)
t
Table 13. Electrical Transient Requirements
ISO T/R 7637/1
Test Pulse
1
2
3a
3b
4
5
ISO T/R 7637/1
Test Pulse
1
2
3a
3b
4
5
CLASS
C
E
8/13
I
II
TEST LEVELS
III
-25 V
+25 V
-25 V
+25 V
-4 V
+26.5 V
-50 V
+50 V
-50 V
+50 V
-5 V
+46.5 V
-75 V
+75 V
-100 V
+75 V
-6 V
+66.5 V
I
C
C
C
C
C
C
TEST LEVELS RESULTS
II
III
C
C
C
C
C
C
C
C
C
C
E
E
IV
-100 V
+100 V
-150 V
+100 V
-7 V
+86.5 V
Delays and
Impedance
2 ms 10 Ω
0.2 ms 10 Ω
0.1 µs 50 Ω
0.1 µs 50 Ω
100 ms, 0.01 Ω
400 ms, 2 Ω
IV
C
C
C
C
C
E
CONTENTS
All functions of the device are performed as designed after exposure to disturbance.
One or more functions of the device are not performed as designed after exposure to disturbance
and cannot be returned to proper operation without replacing the device.
VNQ5050K-E
Figure 8. Application Schematic
+5V
+5V
VCC
Rprot
STAT_DIS
Dld
Rprot
INPUTn
Rprot
STATUSn
µC
OUTPUTn
GND
RGND
VGND
DGND
Note: Channels 2, 3 and 4 have the same internal circuit as channel 1.
GND PROTECTION
REVERSE BATTERY
NETWORK
AGAINST
Solution 1: Resistor in the ground line (RGND only). This
can be used with any type of load.
The following is an indication on how to dimension the
RGND resistor.
1) RGND ≤ 600mV / (IS(on)max).
2) RGND ≥ (−VCC) / (-IGND)
where -IGND is the DC reverse ground pin current and can
be found in the absolute maximum rating section of the
device datasheet.
Power Dissipation in RGND (when VCC<0: during reverse
battery situations) is:
PD= (-VCC)2/RGND
This resistor can be shared amongst several different
HSDs. Please note that the value of this resistor should
be calculated with formula (1) where IS(on)max becomes
the sum of the maximum on-state currents of the different
devices.
Please note that if the microprocessor ground is not
shared by the device ground then the RGND will produce a
shift (IS(on)max * RGND) in the input thresholds and the
status output values. This shift will vary depending on
how many devices are ON in the case of several high side
drivers sharing the same RGND.
If the calculated power dissipation leads to a large
resistor or several devices have to share the same
resistor then ST suggests to utilize Solution 2 (see
below).
Solution 2: A diode (DGND) in the ground line.
A resistor (RGND=1kΩ) should be inserted in parallel to
DGND if the device drives an inductive load.
This small signal diode can be safely shared amongst
several different HSDs. Also in this case, the presence of
the ground network will produce a shift (j600mV) in the
input threshold and in the status output values if the
microprocessor ground is not common to the device
ground. This shift will not vary if more than one HSD
shares the same diode/resistor network.
LOAD DUMP PROTECTION
Dld is necessary (Voltage Transient Suppressor) if the
load dump peak voltage exceeds to VCC max DC rating.
The same applies if the device is subject to transients on
the VCC line that are greater than the ones shown in the
ISO T/R 7637/1 table.
µC I/Os PROTECTION:
If a ground protection network is used and negative
transient are present on the VCC line, the control pins will
be pulled negative. ST suggests to insert a resistor (Rprot)
in line to prevent the µC I/Os pins to latch-up.
The value of these resistors is a compromise between the
leakage current of µC and the current required by the
HSD I/Os (Input levels compatibility) with the latch-up
limit of µC I/Os.
-VCCpeak/Ilatchup ≤ Rprot ≤ (VOHµC-VIH-VGND) / IIHmax
Calculation example:
For VCCpeak= - 100V and Ilatchup ≥ 20mA; VOHµC ≥ 4.5V
5kΩ ≤ Rprot ≤ 65kΩ.
Recommended Rprot value is 10kΩ.
9/13
VNQ5050K-E
Figure 9. Waveforms
NORMAL OPERATION
INPUT
STAT_DIS
LOAD CURRENT
STATUS
UNDERVOLTAGE
VUSDhyst
VCC
VUSD
INPUT
STAT_DIS
LOAD CURRENT
undefined
STATUS
OPEN LOAD with external pull-up
INPUT
STAT_DIS
VOUT >VOL
LOAD VOLTAGE
VOL
STATUS
OPEN LOAD without external pull-up
INPUT
STAT_DIS
LOAD VOLTAGE
IOUT<IOL
LOAD CURRENT
tPOL
STATUS
RESISTIVE SHORT TO Vcc, NORMAL LOAD
INPUT
STAT_DIS
IOUT>IOL
LOAD VOLTAGE
VOUT >VOL
VOL
STATUS
tDSTKON
OVERLOAD OPERATION
Tj
TTSD
TR
TRS
INPUT
STAT_DIS
ILIMH
ILIML
LOAD CURRENT
STATUS
current power
limitation limitation
thermal cycling
SHORTED LOAD
10/13
NORMAL LOAD
VNQ5050K-E
PACKAGE MECHANICAL
Table 14. PowerSSO-24™ Mechanical Data
Symbol
millimeters
Min
Typ
Max
A
1.9
2.22
A2
1.9
2.15
a1
0
0.07
b
0.34
c
0.23
0.32
D
10.2
10.4
E
7.4
7.6
0.4
e
0.8
e3
8.8
0.46
G
0.1
G1
0.06
H
10.1
h
L
10.5
0.4
0.55
N
0.85
10º
X
3.9
4.3
Y
6.1
6.5
Figure 10. PowerSSO-24™ Package Dimensions
11/13
VNQ5050K-E
REVISION HISTORY
Table 1. Revision History
12/13
Date
Revision
Description of Changes
Oct. 2004
1
- First issue.
Mar. 2005
2
- Minor changes
VNQ5050K-E
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of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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13/13