IXYS IXTK250N10

Advance Technical Information
IXTK 250N10
High Current
MegaMOSTMFET
VDSS
ID25
= 100 V
= 250 A
Ω
=
5 mΩ
RDS(on)
N-Channel Enhancement Mode
Symbol
Test conditions
Maximum ratings
VDSS
TJ = 25°C to 150°C
100
V
VDGR
TJ = 25°C to 150°C; RGS = 1.0 MΩ
100
V
VGS
Continuous
±20
V
VGSM
Transient
±30
V
ID25
ID(RMS)
IDM
IAR
TC = 25°C MOSFET chip capability
External lead current limit
TC = 25°C, pulse width limited by TJM
TC = 25°C
250
75
1000
90
A
A
A
A
EAR
EAS
TC = 25°C
TC = 25°C
80
4.0
mJ
J
dv/dt
IS ≤ IDM, di/dt ≤ 100 A/µs, VDD ≤ VDSS
TJ ≤ 150°C, RG = 2 Ω
5
V/ns
PD
TC
730
W
TJ
-55 ... +150
°C
TJM
Tstg
150
-55 ... +150
°C
°C
300
°C
= 25°C
TL
1.6 mm (0.063 in.) from case for 10 s
Md
Mounting torque
Weight
TO-264
0.7/6
10
Symbol Test Conditions
(TJ = 25°C unless otherwise specified)
g
Characteristic Values
Min. Typ.
Max.
VDSS
VGS = 0 V, ID = 1 mA
VGS(th)
V DS = VGS, ID = 250 µA
IGSS
V GS = ±20 V DC, VDS = 0
IDSS
V DS = VDSS
VGS = 0 V
RDS(on)
VGS = 10 V, ID = 90 A
Pulse test, t ≤ 300 ms, duty cycle d ≤ 2%
© 2003 IXYS All rights reserved
Nm/lb.in.
100
2.0
TJ = 25°C
TJ = 125°C
V
4.0
V
±200
nA
50
1
µA
mA
TO-264 AA (IXTK)
D (TAB)
G
D
G = Gate
S = Source
S
D
= Drain
Tab = Drain
Features
•Low RDS (on) HDMOSTM process
•Rugged polysilicon gate cell structure
•International standard package
•Fast switching times
Applications
• Motor controls
• DC choppers
• Switched-mode power supplies
•DC-DC Converters
•Linear Regulators
Advantages
• Easy to mount with one screw
(isolated mounting screw hole)
• Space savings
• High power density
5 mΩ
DS99022(03/03)
IXTK 250N10
Symbol
Test Conditions
(T J = 25°C unless otherwise specified)
gfs
Characteristic values
Min. Typ.
Max.
VDS = 10 V; ID = 90 A, pulse test
75
Ciss
S
7800
pF
3200
pF
C rss
1300
pF
td(on)
35
ns
Coss
VGS = 0 V, VDS = 25 V, f = 1 MHz
110
tr
VGS = 10 V, VDS = 0.5 VDSS, ID = 90 A
td(off)
RG = 1.0 Ω (External)
tf
ns
ns
55
ns
390
Qg(on)
Qgs
40
120
VGS = 10 V, VDS = 0.5 VDSS, ID = 0.5 ID25
Qgd
nC
60
nC
180
nC
0.17 K/W
RthJC
RthCK
0.15
Source-Drain Diode
K/W
TO-264 AA Outline
Dim.
A
A1
A2
b
b1
b2
c
D
E
e
J
K
L
L1
P
Q
Q1
R
R1
S
T
Millimeter
Min.
Max.
4.82
5.13
2.54
2.89
2.00
2.10
1.12
1.42
2.39
2.69
2.90
3.09
0.53
0.83
25.91
26.16
19.81
19.96
5.46 BSC
0.00
0.25
0.00
0.25
20.32
20.83
2.29
2.59
3.17
3.66
6.07
6.27
8.38
8.69
3.81
4.32
1.78
2.29
6.04
6.30
1.57
1.83
Min.
Inches
Max.
.190
.202
.100
.114
.079
.083
.044
.056
.094
.106
.114
.122
.021
.033
1.020
1.030
.780
.786
.215 BSC
.000
.010
.000
.010
.800
.820
.090
.102
.125
.144
.239
.247
.330
.342
.150
.170
.070
.090
.238
.248
.062
.072
Ratings and Characteristics
(TJ = 25°C unless otherwise specified)
Min.
Typ.
Max.
Symbol
Test Conditions
IS
VGS = 0V
ISM
Repetitive; pulse width limited by TJM
VSD
IF = 90 A, VGS = 0 V,
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
t rr
IF = 30A, -di/dt = 100 A/µs, VR = 50 V
Qrr
250
A
1000
A
1.2
V
150
ns
2
µC
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered by one or more
of the following U.S. patents:
4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1 6,259,123B1 6,306,728B1
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025 6,404,065B1 6,162,665
6,534,343