NEC UPD16856

DATA SHEET
MOS INTEGRATED CIRCUIT
µPD16856
MONOLITHIC CD-ROM 3-PHASE SPINDLE MOTOR DRIVER
The µPD16856 is a CD-ROM 3-phase spindle motor driver consisting of a CMOS controller and MOS bridge
outputs.
By employing 3-phase full-wave PWM as the drive method and MOS FETs at the output stage, it has been
possible to reduce the power consumption of the µPD16856 ever further than the conventional linear drive drivers
that use bipolar transistors.
By using a 30-pin shrink SOP package, a more compact-size has been achieved.
FEATURES
•
Supply voltage for controller block: 5 V, supply voltage for output block: 12 V
3 V input available for the input interface
•
Low on-state resistance (total on-state resistance of upper and lower MOS FETs) RON = 1.3 Ω (TYP.)
•
Low power consumption due to 3-phase full-wave PWM drive method
•
On-chip hole bias switch (linked with STB pin)
•
On-chip IND (FG) pulse switching function, 1-phase output or 3-phase composite output
•
START/STOP pin included, acting as a brake during STOP
•
Standby pins included, turning off internal circuit in standby
•
Low current consumption: IDD = 3 mA (Max.), IDD (ST) = 1 µA (Max.)
•
On-chip thermal shutdown circuit
•
On-chip current limiting circuit; reference voltage can be set externally
•
On-chip low voltage malfunction prevention circuit
•
On-chip reverse rotation prevention circuit
•
30-pin plastic shrink SOP (300 mil)
ORDERING INFORMATION
Part Number
µPD16856GS
Package
30-pin shrink SOP (0.8-mm pitch, 300 mil)
The information in this document is subject to change without notice.
Document No. S13447EJ1V0DS00 (1st edition)
Date Published April 1999 N CP(K)
Printed in Japan
©
1999
µPD16856
ABSOLUTE MAXIMUM RATINGS (TA = 25°°C)
Parameter
Symbol
Supply voltage
Input voltage
Instantaneous output current
Note 1
Ratings
Unit
VDD
−0.5 to +6.0
V
VM
−0.5 to +13.5
V
VIN
−0.5 to VDD + 0.5
V
±2.0
A/phase
IDR (pulse)
Note 2
Conditions
PW ≤ 5 ms, Duty ≤ 30%
Power consumption
PT
1.0
W
Peak channel temperature
TCH (MAX)
150
°C
Storage temperature range
Tstg
−55 to +150
°C
Notes 1. Allowable current per phase while on-board
2. When mounted on glass epoxy board (100 mm × 100 mm × 1 mm)
RECOMMENDED OPERATING RANGE
Parameter
Supply voltage
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
VDD
4.5
5.0
5.5
V
VM
10.8
12.0
13.2
V
±0.5
A/Phase
±1.5
A/Phase
10
15
mA
±2.5
±5
mA
Output current (DC)
IDR (DC)
Instantaneous output current
IDR (pulse)
Hole bias current
IHB
IND pin output current
IFG
0
CL pin input voltage
VCL
0.1
0.4
V
Operating temperature
range
TA
−20
75
°C
2
PW ≤ 5 ms, Duty ≤ 10%
Data Sheet S13447EJ1V0DS00
µPD16856
ELECTRICAL SPECIFICATIONS (UNLESS OTHERWISE SPECIFIED, TA = 25°°C, VDD = 5 V, VM = 12 V)
Parameter
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
1.5
3.0
mA
1.0
µA
VDD
V
0.8
V
[General]
Current consumption 1 (during operation)
IDD
Current consumption (in standby)
IDD
STB = VDD
STB = GND
(ST)
[ST/SP, STB, REV, FGsel]
Input voltage, high
VIH
Input voltage, low
VIL
Input pull-down resistor
RIND
1.8
120
kΩ
75
kHz
[Controller block]
Triangle wave oscillation frequency
fPWM
CT = 100 pF
[Hole amplifier]
Common mode input voltage range
VHch
1.0
Hysteresis voltage
VHhys
Input bias current
IHbias
VH = 2.5 V
3.5
15
V
mV
1.0
µA
0.5
V
[Hole bias block]
Hole bias voltage
VHB
IHB = 10 mA
IND-pin voltage, high
VFG_H
IFG = −2.5 mA
IND-pin voltage, low
VFG_L
IFG = +2.5 mA
Output on-state resistance (upper stage +
lower stage)
RON
IDR = 200 mA
TA = −20°C to +75°C
Leakage current during OFF
IDR (OFF)
In standby
Output turn-on time
tONH
RM = 5 Ω
Output turn-off time
tOFFH
Star connection
0.3
[FG output]
4.0
V
0.5
V
1.8
Ω
10
µA
1.0
2.0
µs
1.0
2.0
µs
[Output block]
1.3
[Torque command]
Control reference input voltage range
ECR
0.3
4.0
V
Control input voltage range
EC
0.3
4.0
V
Input current
IIN
50
µA
30
Note
Input voltage difference
ECR-EC
DUTY = 100%
1.0
V
Dead zone (+)
EC_d+
1.5 V ≤ ECR ≤ 2.5 V
0
50
100
mV
Dead zone (−)
EC_d−
1.5 V ≤ ECR ≤ 2.5 V
0
−50
−100
mV
+15
mV
[Overcurrent detection block]
Input offset voltage
−15
VIO
Note Dead zone not included.
Remarks 1. The thermal shutdown circuit (T.S.D.) operates with TCH > 150°C.
2. The low-voltage malfunction prevention circuit (UVLO) operates with a voltage of 4 VTYP.
Data Sheet S13447EJ1V0DS00
3
µPD16856
PIN FUNCTIONS
Package: 30-pin Shrink SOP (300 mil)
IND
STB
VM
VM
OUT2
RF
RF
OUT1
VM
VM
OUT0
RF
RF
ISEN
CL
Pin No.
1
Caution
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
Pin Name
Pin Function
IND
Index signal output pin
2
STB
Standby operation input pin
3
VM
Supply input pin for motor block (12 V)
4
VM
Supply input pin for motor block (12 V)
5
OUT2
Motor connection pin
6
RF
3-phase bridge common pin
7
RF
3-phase bridge common pin
8
OUT1
Motor connection pin
Supply input pin for motor block (12 V)
9
VM
10
VM
Supply input pin for motor block (12 V)
11
OUT0
Motor connection pin
12
RF
3-phase bridge common pin
13
RF
3-phase bridge common pin
14
ISEN
Sense resistor connection pin
15
CL
Overcurrent detection voltage input pin
16
GND
GND pin
17
REV
Reverse rotation input pin (reverse brake pin)
18
ST/SP
Start/stop input pin
19
FGsel
IND pulse selection pin
20
HB
Hole bias pin
21
H0−
Hole signal input pin
22
H0+
Hole signal input pin
23
H1−
Hole signal input pin
24
H1+
Hole signal input pin
25
H2−
Hole signal input pin
26
H2+
Hole signal input pin
27
CT
Oscillation frequency setup capacitor connection pin
28
VDD
Controller block supply input pin (5 V)
29
ECR
Control reference voltage input pin
30
EC
Control voltage input pin
When there is more than one pin of the same kind of pin (VM and RF), all pins should be connected
to their targets.
4
EC
ECR
VDD
CT
H2+
H2–
H1+
H1–
H0+
H0–
HB
FGsel
ST/SP
REV
GND
Data Sheet S13447EJ1V0DS00
µPD16856
BLOCK DIAGRAM
IND 1
30 EC
STB 2
29 ECR
28 VDD
VM 3
UVLO
OSC
VM 4
27 CT
Q5
T.S.D
OUT2 5
+
26 H2+
Q6
RF 6
Phase
excitation
pulse
generator
RF 7
–
+
25 H2–
24 H1+
Q3
–
OUT1 8
23 H1–
Q4
VM 9
+
–
VM 10
22 H0+
21 H0–
Q1
OUT0 11
20 HB
Q2
RF 12
Ganged
with STB
RF 13
ISEN 14
18 ST/SP
Reverse
rotation
detection
circuit
CL 15
Caution
19 FGsel
17 REV
16 GND
When there is more than one pin of the same kind of pin (VM and RF), all pins should be connected
to their targets.
Data Sheet S13447EJ1V0DS00
5
µPD16856
TOTAL POWER DISSIPATION VS. AMBIENT TEMPERATURE CHARACTERISTICS
PT vs. TA Characteristics
1.4
While mounted on a 100 mm ×
100 mm × 1.0 mm glass epoxy board
Total power dissipation PT (W)
1.2
25˚C
1.0 W
1.0
125˚C/W
0.8
0.6
0.4
0.2
75˚C
0
–20
0
25
50
75
100
125
150
Ambient temperature TA (˚C)
Remark
It is possible to apply a maximum of 1 W of power when the ambient temperature is 25°C or lower.
When the ambient temperature is higher than 25°C, derate based on the above chart.
It is possible to apply 0.6 W to the IC when the ambient temperature is 75°C, which is within recommended
ambient temperature conditions.
6
Data Sheet S13447EJ1V0DS00
µPD16856
STANDARD CHARACTERISTICS CURVES (UNLESS OTHERWISE SPECIFIED, TA = 25°°C)
IDD and IDD (ST) vs. VDD Characteristics
IIN vs. VDD Characteristics (EC and ECR pins)
Torque command block input current IIN (µA)
Circuit current IDD (mA)
Circuit current in standby IDD (ST) (µA)
2.0
IDD
1.0
0
4.5
IDD (ST)
5.0
50
EC, ECR = 4 V
40
30
IIN
20
10
0
4.5
5.5
Controller block supply voltage VDD (V)
5.0
Controller block supply voltage VDD (V)
VHhys vs. VDD Characteristics
(Hole Amplifier Input)
VIH and VIL vs. VDD Characteristics
(ST/SP, REV, STB, and FGsel pins)
2.0
20
Hole amplifier hysteresis voltage VHhys (mV)
Input voltage, high VIH (V)
Input voltage, low VIL (V)
5.5
1.5
VIH
VIL
1.0
4.5
5.0
VH = 2.5 V
VHhys
15
10
4.5
5.5
Controller block supply voltage VDD (V)
5.0
5.5
Controller block supply voltage VDD (V)
fPWM vs. VDD Characteristics
RON vs. TA Characteristics
100
1.5
fPWM
50
VIL
0
4.5
VDD = 5 V
Output on-state resistance RON (Ω)
PWM oscillation frequency fPWM (kHz)
CT = 100 pF
5.0
5.5
Controller block supply voltage VDD (V)
RON
1.0
0.5
30
40
50
60
70
Operating ambient temperature TA (V)
Data Sheet S13447EJ1V0DS00
7
µPD16856
FUNCTION OPERATION TABLE
(1) ST/SP = “H”
Input Signal
Circuit Operation Mode
CMP0
CMP1
CMP2
PWM
H
H
L
H
Operation
H
H
L
L
Brake
H
L
L
H
Operation
H
L
L
L
Brake
H
L
H
H
Operation
H
L
H
L
Brake
L
L
H
H
Operation
L
L
H
L
Brake
L
H
H
H
Operation
L
H
H
L
Brake
L
H
L
H
Operation
L
H
L
L
Brake
Source → Sink
W→V
W→U
V→U
V→W
U→W
U→V
Brake: Regenerates via the high-side Pch MOS FET channel.
(2) ST/SP = “L”
Input Signal
Circuit Operation Mode
CMP0
CMP1
CMP2
PWM
−
−
−
−
Short brake
Short brake: Turns the high-side MOS FET on and the low-side MOS FET off.
(3) Torque Command
The curve shown below is the relationship to torque of the difference (ECR – EC) between the control reference
voltage (ECR) and the control voltage (EC).
Duty cycle
Normal direction torque
100%
→ ECR–EC
(–)
(+)
–100%
Reverse direction torque
Reverse Rotation Pin Voltage (REV)
L
ECR > EC
ECR < EC
8
Note Stops after detecting reverse rotation
H
Reverse rotation
The reverse drive current flows in the high-side Pch
Stop
MOS FET channel on reverse rotation.
Note
Normal rotation
Note
Reverse rotation
Data Sheet S13447EJ1V0DS00
µPD16856
(4) Standby Mode
The setting of the standby mode allows the power supply in the device to be turned off forcibly.
The status of outputs from pins in standby is high impedance (H-bridge all OFF). In addition it is possible to
reduce the circuit current since the internal oscillation block stops.
When the stop operation is executed by the standby pin during normal operation, the motor is stopped by inertia
force.
When the normal status is reset, it takes several tens of µs to be activated.
STB Pin
Operation Mode
H
Normal operation mode
L
Standby mode
Data Sheet S13447EJ1V0DS00
9
µPD16856
TIMING CHART
(1)
Hole Signal Input
H0
H1
H2
(2) CMP Signal (FGsel = L: IND1, FGsel = H: IND2)
CMP0
CMP1
CMP2
IND1
IND2
(3) Selection of Output MOS FET Drive and Comparator (A Blank Indicates Switch OFF)
Q1
SW
SW
Q2
SW
SW
Q3
SW
Q4
SW
Q5
ON
Q6
10
ON
ON
ON
ON
SW
SW
SW
SW
ON
SW
SW
SW
SW
ON
SW
SW
SW
SW
ON
ON
Data Sheet S13447EJ1V0DS00
ON
ON
SW
SW
SW
SW
ON
SW
SW
SW
SW
ON
µPD16856
(4) Motor Drive Waveform
OUT0
OUT1
OUT2
PWM
PWM
PWM
PWM
PWM
Data Sheet S13447EJ1V0DS00
PWM
PWM
11
12 V
47 µF
Remark
(47 µF in the above figure).
This circuit is for reference only and is not intended for use in mass production.
Moreover, set VCL and RS to values within the ratings.
12
Data Sheet S13447EJ1V0DS00
VCL
0.3 V
330 pF
RFIL 1.8 kΩ
Motor U
phase
Motor V
phase
CFIL
CL 15
ISEN 14
RF 13
RF 12
OUT0 11
VM 10
VM 9
OUT1 8
RF 7
VM 4
Q5
OUT2 5
Q6
RF 6
Q3
Q1
Phase
excitation
pulse
generator
Q4
Q2
Reverse
rotation
detection
circuit
Ganged
with STB
T.S.D
+
–
+
–
+
–
100 pF
16 GND
CPU
CPU
18 ST/SP
17 REV
CPU
200 Ω
HW
200 Ω
19 FGsel
20 HB
21 H0–
22 H0+
23 H1–
24 H1+
25 H2–
26 H2+
27 CT
HV
28 VDD
VM 3
OSC
controller
29 ECR
STB 2
CPU
UVLO
controller
30 EC
IND 1
15 µF
controller
Motor W phase
RS
0.3 Ω
+
+
HU
5V
µPD16856
APPLICATION CIRCUIT EXAMPLE
To eliminate noise during PWM, it is recommended to insert a tantalum capacitor between VM and GND
µPD16856
PACKAGE DRAWING
30-Pin Plastic Shrink SOP (300 mil) (Unit: mm)
30
16
3˚ +7
-3
Detail of lead end
1
15
1.55±0.1
13.0 MAX.
7.7±0.3
1.05±0.2
0.8
0.10
+0.10
0.35–0.05
0.9 MAX.
0.20 –0.05
0.1±0.1
+0.10
1.8 MAX.
5.6±0.2
0.6±0.2
0.10 M
Data Sheet S13447EJ1V0DS00
13
µPD16856
RECOMMENDED SOLDERING CONDITIONS
µPD16856 should be soldered and mounted under the following recommended conditions. For soldering methods
and conditions other than those recommended below, contact your NEC sales representative.
• For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
Soldering Method
Infrared reflow
Soldering Conditions
Package peak temperature: 235°C, Time: 30 sec. Max. (at 210°C or higher),
Recommended
Condition Symbol
IR35-00-3
Note
Count: three times or less, Exposure limit: none , Flux: Rosin-based flux
with little chlorine content (chlorine: 0.2 Wt% Max.) is recommended
VPS
Package peak temperature: 215°C, Time: 40 sec. Max. (at 200°C or higher),
VP15-00-3
Note
Count: three times or less, Exposure limit: none , Flux: Rosin-based flux
with little chlorine content (chlorine: 0.2 Wt% Max.) is recommended
Wave soldering
Package peak temperature: 260°C, Time: 10 sec. Max., Proheating
temperature: 120°C Max., Count: once, Flux: Rosin-based flux with little
chlorine content (chlorine: 0.2 Wt% Max.) is recommended
WS60-00-1
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution
14
Do not use different soldering methods together.
Data Sheet S13447EJ1V0DS00
µPD16856
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC
product in your application, pIease contact the NEC office in your country to obtain a list of authorized
representatives and distributors. They will verify:
•
Device availability
•
Ordering information
•
Product release schedule
•
Availability of related technical literature
•
Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
•
Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.
NEC Electronics Inc. (U.S.)
NEC Electronics (Germany) GmbH
NEC Electronics Hong Kong Ltd.
Santa Clara, California
Tel: 408-588-6000
800-366-9782
Fax: 408-588-6130
800-729-9288
Benelux Office
Eindhoven, The Netherlands
Tel: 040-2445845
Fax: 040-2444580
Hong Kong
Tel: 2886-9318
Fax: 2886-9022/9044
NEC Electronics (France) S.A.
Velizy-Villacoublay, France
Tel: 01-30-67 58 00
Fax: 01-30-67 58 99
Seoul Branch
Seoul, Korea
Tel: 02-528-0303
Fax: 02-528-4411
NEC Electronics (France) S.A.
NEC Electronics Singapore Pte. Ltd.
Spain Office
Madrid, Spain
Tel: 91-504-2787
Fax: 91-504-2860
United Square, Singapore 1130
Tel: 65-253-8311
Fax: 65-250-3583
NEC Electronics (Germany) GmbH
Duesseldorf, Germany
Tel: 0211-65 03 02
Fax: 0211-65 03 490
NEC Electronics (UK) Ltd.
Milton Keynes, UK
Tel: 01908-691-133
Fax: 01908-670-290
NEC Electronics Hong Kong Ltd.
NEC Electronics Taiwan Ltd.
NEC Electronics Italiana s.r.l.
NEC Electronics (Germany) GmbH
Milano, Italy
Tel: 02-66 75 41
Fax: 02-66 75 42 99
Scandinavia Office
Taeby, Sweden
Tel: 08-63 80 820
Fax: 08-63 80 388
Taipei, Taiwan
Tel: 02-2719-2377
Fax: 02-2719-5951
NEC do Brasil S.A.
Electron Devices Division
Rodovia Presidente Dutra, Km 214
07210-902-Guarulhos-SP Brasil
Tel: 55-11-6465-6810
Fax: 55-11-6465-6829
J99.1
Data Sheet S13447EJ1V0DS00
15
µPD16856
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on
a customer designated "quality assurance program" for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96. 5