BDX53, BDX53A, BDX53B, BDX53C NPN SILICON POWER DARLINGTONS Copyright © 1997, Power Innovations Limited, UK ● MAY 1989 - REVISED MARCH 1997 Designed for Complementary Use with BDX54, BDX54A, BDX54B and BDX54C TO-220 PACKAGE (TOP VIEW) ● 60 W at 25°C Case Temperature ● 8 A Continuous Collector Current B 1 ● Minimum hFE of 750 at 3 V, 3 A C 2 E 3 Pin 2 is in electrical contact with the mounting base. MDTRACA absolute maximum ratings at 25°C case temperature (unless otherwise noted) RATING SYMBOL BDX53 Collector-base voltage (IE = 0) Collector-emitter voltage (IB = 0) BDX53A BDX53B VALUE VCBO 60 80 BDX53C 100 BDX53 45 BDX53A BDX53B UNIT 45 VCEO BDX53C 60 80 V V 100 V EBO 5 V Continuous collector current IC 8 A Continuous base current IB 0.2 A Continuous device dissipation at (or below) 25°C case temperature (see Note 1) Ptot 60 W Continuous device dissipation at (or below) 25°C free air temperature (see Note 2) Ptot 2 W Tj -65 to +150 °C Tstg -65 to +150 °C TA -65 to +150 °C Emitter-base voltage Operating junction temperature range Operating temperature range Operating free-air temperature range NOTES: 1. Derate linearly to 150°C case temperature at the rate of 0.48 W/°C. 2. Derate linearly to 150°C free air temperature at the rate of 16 mW/°C. PRODUCT INFORMATION Information is current as of publication date. Products conform to specifications in accordance with the terms of Power Innovations standard warranty. Production processing does not necessarily include testing of all parameters. 1 BDX53, BDX53A, BDX53B, BDX53C NPN SILICON POWER DARLINGTONS MAY 1989 - REVISED MARCH 1997 electrical characteristics at 25°C case temperature (unless otherwise noted) PARAMETER V (BR)CEO ICEO ICBO IEBO hFE V BE(sat) VCE(sat) VEC TEST CONDITIONS Collector-emitter MIN 45 BDX53A 60 BDX53B 80 BDX53C 100 TYP MAX IC = 100 mA IB = 0 VCE = 30 V IB = 0 BDX53 0.5 Collector-emitter V CE = 30 V IB = 0 BDX53A 0.5 cut-off current V CE = 40 V IB = 0 BDX53B 0.5 V CE = 50 V IB = 0 BDX53C 0.5 VCB = 45 V IE = 0 BDX53 0.2 Collector cut-off V CB = 60 V IE = 0 BDX53A 0.2 current V CB = 80 V IE = 0 BDX53B 0.2 V CB = 100 V IE = 0 BDX53C 0.2 VEB = 5V IC = 0 VCE = 3V IC = 3 A (see Notes 3 and 4) IB = 12 mA IC = 3 A IB = 12 mA IC = 3 A IE = 3A breakdown voltage Emitter cut-off current Forward current transfer ratio Base-emitter saturation voltage Collector-emitter saturation voltage Parallel diode forward voltage (see Note 3) BDX53 UNIT V mA mA 2 mA (see Notes 3 and 4) 2.5 V (see Notes 3 and 4) 2 V 2.5 V 750 IB = 0 NOTES: 3. These parameters must be measured using pulse techniques, tp = 300 µs, duty cycle ≤ 2%. 4. These parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts. thermal characteristics MAX UNIT RθJC Junction to case thermal resistance PARAMETER MIN TYP 2.08 °C/W RθJA Junction to free air thermal resistance 62.5 °C/W MAX UNIT resistive-load-switching characteristics at 25°C case temperature PARAMETER † † MIN TYP ton Turn-on time IC = 3 A IB(on) = 12 mA IB(off) = -12 mA 1 µs toff Turn-off time V BE(off) = -4.5 V RL = 10 Ω tp = 20 µs, dc ≤ 2% 5 µs Voltage and current values shown are nominal; exact values vary slightly with transistor parameters. PRODUCT 2 TEST CONDITIONS INFORMATION BDX53, BDX53A, BDX53B, BDX53C NPN SILICON POWER DARLINGTONS MAY 1989 - REVISED MARCH 1997 TYPICAL CHARACTERISTICS TYPICAL DC CURRENT GAIN vs COLLECTOR CURRENT VCE(sat) - Collector-Emitter Saturation Voltage - V TCS120AG 40000 hFE - Typical DC Current Gain COLLECTOR-EMITTER SATURATION VOLTAGE vs COLLECTOR CURRENT TC = -40°C TC = 25°C TC = 100°C 10000 1000 VCE = 3 V tp = 300 µs, duty cycle < 2% 100 0·5 1·0 10 TCS120AH 3·0 tp = 300 µs, duty cycle < 2% IB = IC / 100 2·5 2·0 1·5 1·0 TC = -40°C TC = 25°C TC = 100°C 0·5 0 0·5 IC - Collector Current - A 1·0 10 IC - Collector Current - A Figure 1. Figure 2. BASE-EMITTER SATURATION VOLTAGE vs COLLECTOR CURRENT TCS120AI VBE(sat) - Base-Emitter Saturation Voltage - V 3·0 2·5 TC = -40°C TC = 25°C TC = 100°C 2·0 1·5 1·0 IB = IC / 100 tp = 300 µs, duty cycle < 2% 0·5 0·5 1·0 10 IC - Collector Current - A Figure 3. PRODUCT INFORMATION 3 BDX53, BDX53A, BDX53B, BDX53C NPN SILICON POWER DARLINGTONS MAY 1989 - REVISED MARCH 1997 MAXIMUM SAFE OPERATING REGIONS MAXIMUM FORWARD-BIAS SAFE OPERATING AREA 100 SAS120AD IC - Collector Current - A DC Operation tp = 300 µs, d = 0.1 = 10% 10 1·0 BDX53 BDX53A BDX53B BDX53C 0·1 1·0 10 100 1000 VCE - Collector-Emitter Voltage - V Figure 4. THERMAL INFORMATION MAXIMUM POWER DISSIPATION vs CASE TEMPERATURE TIS120AB Ptot - Maximum Power Dissipation - W 80 70 60 50 40 30 20 10 0 0 25 50 75 100 TC - Case Temperature - °C Figure 5. PRODUCT 4 INFORMATION 125 150 BDX53, BDX53A, BDX53B, BDX53C NPN SILICON POWER DARLINGTONS MAY 1989 - REVISED MARCH 1997 MECHANICAL DATA TO-220 3-pin plastic flange-mount package This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. TO220 4,70 4,20 ø 10,4 10,0 3,96 3,71 1,32 1,23 2,95 2,54 see Note B 6,6 6,0 15,90 14,55 see Note C 6,1 3,5 1,70 1,07 0,97 0,61 1 2 14,1 12,7 3 2,74 2,34 5,28 4,88 VERSION 1 0,64 0,41 2,90 2,40 VERSION 2 ALL LINEAR DIMENSIONS IN MILLIMETERS NOTES: A. The centre pin is in electrical contact with the mounting tab. B. Mounting tab corner profile according to package version. C. Typical fixing hole centre stand off height according to package version. Version 1, 18.0 mm. Version 2, 17.6 mm. PRODUCT MDXXBE INFORMATION 5 BDX53, BDX53A, BDX53B, BDX53C NPN SILICON POWER DARLINGTONS MAY 1989 - REVISED MARCH 1997 IMPORTANT NOTICE Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the information being relied on is current. PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except as mandated by government requirements. PI accepts no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Nor is any license, either express or implied, granted under any patent right, copyright, design right, or other intellectual property right of PI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS. Copyright © 1997, Power Innovations Limited PRODUCT 6 INFORMATION