IXYS IXFR180N07

HiPerFETTM Power MOSFETs
IXFR 180N07
TM
ISOPLUS247
(Electrically Isolated Back Surface)
VDSS = 70 V
ID25 = 180 A
RDS(on) =
6 mW
trr £ 250 ns
Single MOSFET Die
Preliminary data sheet
Symbol
Test Conditions
Maximum Ratings
VDSS
VDGR
TJ = 25°C to 150°C
TJ = 25°C to 150°C; RGS = 1 MW
VGS
VGSM
ISOPLUS 247TM
70
70
V
V
Continuous
Transient
±20
±30
V
V
ID25
ID(RMS)
IDM
IAR
TC = 25°C (MOSFET chip capability)
External lead (current limit)
TC = 25°C, Note 1
TC = 25°C
180
76
720
180
A
A
A
A
EAR
EAS
TC = 25°C
TC = 25°C
60
3
mJ
J
dv/dt
IS £ IDM, di/dt £ 100 A/ms, VDD £ VDSS
TJ £ 150°C, RG = 2 W
5
V/ns
PD
TC = 25°C
400
W
TJ
-55 ... +150
°C
Features
TJM
Tstg
150
-55 ... +150
°C
°C
300
°C
2500
V~
5
g
• Silicon chip on Direct-Copper-Bond
substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
• Low drain to tab capacitance(<25pF)
• Low RDS (on) HDMOSTM process
• Rugged polysilicon gate cell structure
• Unclamped Inductive Switching (UIS)
rated
• Fast intrinsic Rectifier
TL
1.6 mm (0.063 in.) from case for 10 s
VISOL
50/60 Hz, RMS
t = 1 min
Weight
Symbol
Test Conditions
VDSS
VGS = 0 V, ID = 3mA
70
VDS = VGS, ID = 8mA
2.0
VGS(th)
IGSS
VGS = ±20 V, VDS = 0
IDSS
VDS = VDSS
VGS = 0 V
RDS(on)
VGS = 10 V, ID = 0.5 ID25
Note 1
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
4.0 V
±100 nA
TJ = 25°C
TJ = 125°C
IXYS reserves the right to change limits, test conditions, and dimensions.
© 2000 IXYS All rights reserved
V
100 mA
2 mA
6 mW
G
D
Isolated back surface*
G = Gate
S = Source
D = Drain
* Patent pending
Applications
• DC-DC converters
• Battery chargers
• Switched-mode and resonant-mode
power supplies
• DC choppers
• AC motor control
Advantages
• Easy assembly
• Space savings
• High power density
98585A (6/99)
1-2
IXFR 180N07
Symbol
Test Conditions
gfs
VDS = 10 V; ID = 60A
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
Note 2
C iss
Coss
VGS = 0 V, VDS = 25 V, f = 1 MHz
C rss
td(on)
tr
VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 ID25
td(off)
RG = 1 W (External)
tf
Qg(on)
Qgs
VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 ID25
Qgd
55
90
S
9400
pF
4600
pF
2550
pF
65
ns
90
ns
140
ns
55
ns
420
nC
65
nC
220
nC
RthJC
0.30
0.15
RthCK
Source-Drain Diode
K/W
K/W
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
Symbol
Test Conditions
IS
VGS = 0 V
180
A
ISM
Repetitive;
pulse width limited by TJM
720
A
VSD
IF = 100A, VGS = 0 V, Note 1
1.3
V
250
ns
t rr
QRM
IF = 50A,-di/dt = 100 A/ms, VR = 50 V
IRM
1.2
mC
10
A
ISOPLUS 247 (IXFR) OUTLINE
1 Gate, 2 Drain (Collector)
3 Source (Emitter)
4 no connection
Dim.
Millimeter
Min. Max.
A
4.83
5.21
A1
2.29
2.54
A2
1.91
2.16
b
1.14
1.40
1.91
2.13
b1
b2
2.92
3.12
C
0.61
0.80
D 20.80 21.34
E
15.75 16.13
e
5.45 BSC
L
19.81 20.32
L1
3.81
4.32
Q
5.59
6.20
R
4.32
4.83
S
13.21 13.72
T
15.75 16.26
U
1.65
3.03
Inches
Min. Max.
.190 .205
.090 .100
.075 .085
.045 .055
.075 .084
.115 .123
.024 .031
.819 .840
.620 .635
.215 BSC
.780 .800
.150 .170
.220 .244
.170 .190
.520 .540
.620 .640
.065 .080
Note: 1. Pulse width limited by TJM
2. Pulse test, t £ 300 ms, duty cycle d £ 2 %
© 2000 IXYS All rights reserved
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents:
4,835,592
4,881,106
5,017,508
5,049,961
5,187,117
5,486,715
4,850,072
4,931,844
5,034,796
5,063,307
5,237,481
5,381,025
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