ANPEC APA2068KAI-TRG

APA2068
Stereo 2.6W Audio Power Amplifier (With DC_Volume Control)
Features
General Description
•
•
APA2068 is a monolithic integrated circuit, which provides
precise DC volume control, and a stereo bridged audio
Low Operating Current with 9mA
Improved Depop Circuitry to Eliminate Turn-on
power amplifiers capable of producing 2.6W (1.8W) into
4Ω with less than 10% (1.0%) THD+N. The attenuator
and Turn-off Transients in Outputs
•
•
High PSRR
range of the volume control in APA2068 is from 20dB
(DC_Vol=0V) to -80dB (DC_Vol=3.54V) with 32 steps. The
32 Steps Volume Adjustable by DC Voltage with
Hysteresis
•
2.6W per Channel Output Power into 4Ω Load at
•
Two Output Modes Allowable with BTL and SE
advantage of internal gain setting can be less components and PCB area. Both of the depop circuitry and the
5V, BTL Mode
thermal shutdown protection circuitry are integrated in
APA2068, that reduce pops and clicks noise during power
up or shutdown mode operation. It also improves the
power off pop noise and protects the chip from being
Modes Selected by SE/BTL pin
•
Low Current Consumption in Shutdown Mode
destroyed by over temperature and short current failure.
To simplify the audio system design, APA2068 combines
(1µA)
•
•
Short-Circuit Protection
a stereo bridge-tied loads (BTL) mode for speaker drive
and a stereo single-end (SE) mode for headphone drive
Thermal Shutdown Protection and Over-Current
Protection Circuitry
•
•
•
•
into a single chip, where both modes are easily switched
by the SE/BTL input control pin signal.
Maximum Output Swing Clamping Function
The OUT+ Signal and the IN- Signal are Outphase
Applications
SOP-16P Packages with Thermal Pad Package
Lead Free and Green Devices Available
•
•
(RoHS Compliant)
NBs
LCD Monitor or TVs
Ordering and Marking Information
Package Code
KA : SOP-16P
Operating Ambient Temperature Range
I : - 40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
L : Lead Free Device
G : Halogen and Lead Free Device
APA2068
Assembly Material
Handling Code
Temperature Range
Package Code
APA2068 KA :
APA2068
XXXXX
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.8 - May., 2012
1
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APA2068
Pin Configuration
MUTE
SHUTDOWN
RINBYPASS
GND
LINVOLUME
VOLMAX
1
2
3
4
5
6
7
8
APA2068
16
15
14
13
12
11
10
9
ROUTVDD
ROUT+
SE/BTL
GND
LOUT+
VDD
LOUT-
= Thermal Pad
(Connected to GND for better heat dissipation)
Absolute Maximum Ratings
(Note 1)
(Over operating free-air temperature range unless otherwise noted.)
Symbol
Parameter
VDD
Supply Voltage Range
VIN
Input Voltage Range, SE/BTL, SHUTDOWN, MUTE
TJ
Maximum Junction Temperature
TSTG
Storage Temperature Range
TSDR
Maximum Lead Soldering Temperature,10 Seconds
PD
Power Dissipation
Rating
Unit
-0.3 to 6
V
-0.3 to VDD+0.3
V
150
°C
-65 to +150
°C
260
°C
Internal Limited
W
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Thermal Characteristics
Symbol
θJA
θJC
Parameter
Typical Value
Unit
45
°C/W
10
°C/W
Thermal Resistance from Junction to Ambient (Note 2)
SOP-16P
Thermal Resistance from Junction to Case
(Note 3)
SOP-16P
Note 2: The Thermal-Pad on the bottom of the IC should soldered directly to the PCB’s Thermal-Pad area that with several thermal vias
connect to the ground plan, and the PCB is a 2-layer, 5-inch square area with 2oz copper thickness.
Note 3: The case temperature is measured at the center of the Thermal-Pad on the underside of the SOP-16P package.
Recommended Operating Conditions
Symbol
Range
Parameter
Unit
Min.
Max.
VDD
Supply Voltage
4.5
5.5
V
TA
Operating Ambient Temperature Range
-40
85
°C
TJ
Operating Junction Temperature
°C
VIH
High Level Threshold Voltage
Copyright  ANPEC Electronics Corp.
Rev. A.8 - May., 2012
2
-
125
SHUTDOWN, MUTE
2
-
SE/BTL
4
-
V
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APA2068
Recommended Operating Conditions (Cont.)
Symbol
Range
Parameter
VIL
Low Level Threshold Voltage
VICM
Common Mode Input Voltage
Min.
Max.
SHUTDOWN, MUTE
-
1.0
SE/BTL
-
1
VDD-1.0
-
Unit
V
V
Electrical Characteristics
VDD = 5V, TA=25°C (unless otherwise noted)
Symbol
Parameter
APA2068
Test Conditions
Unit
Min.
Typ.
Max.
SE/BTL=0V
-
9
20
SE/BTL=5V
-
4
10
-
1
-
µA
IDD
Supply Current
ISD
Supply Current in Shutdown Mode
IIH
High Input Current
-
900
-
nA
IIL
Low Input Current
-
900
-
nA
Output Differential Voltage
-
5
-
mV
-
1
-
S
SE/BTL=0V
VOS
TSTART-UP
Start-Up Time from Shutdown
SHUTDOWN=0V
Bypass Capacitor, Cb=2.2µF
mA
Operating Characteristics, BTL mode
VDD = 5V, TA = 25°C, RL = 4Ω, Gain = 2V/V (unless otherwise noted)
Symbol
PO
THD+N
PSRR
Parameter
Maximum Output Power
Total Harmonic Distortion Plus Noise
Power Ripple Rejection Ratio
Crosstalk Channel Separation
S/N
Signal to Noise Ratio
APA2068
Test Conditions
Unit
Min.
Typ.
Max.
THD+N=10%, RL=3Ω, fin = 1kHz
-
2.9
-
THD+N=10%, RL=4Ω, fin = 1kHz
-
2.6
-
THD+N=10%, RL=8Ω, fin = 1kHz
-
1.6
-
THD+N=1%, RL=3Ω, fin = 1kHz
-
2.4
-
THD+N=1%, RL=4Ω, fin = 1kHz
-
1.8
-
THD+N=1%, RL=8Ω, fin = 1kHz
1
1.3
-
PO = 1.2W, RL = 4Ω, fin = 1kHz
-
0.07
-
PO = 0.9W, RL = 8Ω, fin = 1kHz
-
0.08
-
Vrr = 0.1Vrms, RL = 8Ω, CB = 1µF, fin = 120Hz
-
60
-
dB
CB = 1µF, RL = 8Ω, fin = 1kHz
-
90
-
dB
PO = 1.1W, RL = 8Ω, A_Weighting
-
95
-
dB
W
%
Operating Characteristics, SE mode. VDD = 5V,TA = 25°C, Gain = 1V/V (unless otherwise noted)
Symbol
PO
Parameter
Maximum Output Power
Copyright  ANPEC Electronics Corp.
Rev. A.8 - May., 2012
APA2068
Test Conditions
Unit
Min.
Typ.
Max.
THD+N= 10%, RL = 16Ω, fin = 1kHz
-
220
-
THD+N= 10%, RL = 32Ω, fin = 1kHz
-
120
-
THD+N = 1%, RL = 16Ω, fin = 1kHz
-
160
-
THD+N = 1%, RL = 32Ω, fin = 1kHz
-
95
-
3
mW
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APA2068
Electrical Characteristics (Cont.)
Operating Characteristics, SE mode. VDD = 5V,TA = 25°C, Gain = 1V/V (unless otherwise noted)
Symbol
THD+N
PSRR
Parameter
Total Harmonic Distortion Plus Noise
Power Ripple Rejection Ratio
Crosstalk Channel Separation
S/N
APA2068
Test Conditions
Signal to Noise Ratio
Unit
Min.
Typ.
Max.
PO = 125mW, RL = 16Ω, fin = 1kHz
-
0.09
-
PO = 65mW, RL = 32Ω, fin = 1kHz
-
0.09
-
%
VIN = 0.1Vrms, RL = 8Ω, CB = 1µF, fin = 120Hz
-
60
-
dB
CB = 1µF, RL = 32Ω, fin = 1kHz
-
60
-
dB
PO = 75mW, SE, RL = 32Ω, A_Weighting
-
100
-
dB
Pin Description
PIN
I/O
FUNCTION
NO.
NAME
1
MUTE
I
Mute control signal input, hold low for normal operation, hold high to mute.
2
SHUTDOWN
I
It will be into shutdown mode when pull low. ISD = 1µA
3
RIN-
I
Right channel input terminal
4
BYPASS
I
Bias voltage generator
5,12
GND
-
Ground connection, Connected to thermal pad.
6
LIN-
I
Left channel input terminal
7
VOLUME
I
8
VOLMAX
I
Input signal for internal volume gain setting.
Setting the maximum output swing. Input a non-zero voltage (VC) to this pin, the
output voltage swing will be clamped between VOH (the maximum positive value) VC & VOL (the minimum negative value) + VC. Disable this function when tie this pin
to GND. Maximum input voltage ≤ 1/2 VDD.
9
LOUT-
O
Left channel negative output in BTL mode and high impedance in SE mode.
10,15
VDD
-
Supply voltage
11
LOUT+
O
Left channel positive output in BTL mode and SE mode.
13
SE/BTL
I
Output mode control input, high for SE output mode and low for BTL mode.
14
ROUT+
O
Right channel positive output in BTL mode and SE mode.
16
ROUT-
O
Right channel negative output in BTL mode and high impedance in SE mode.
Control Input Table
SHUTDOWN
MUTE
SE/BTL
Operating Mode
L
X
X
Shutdown mode
H
L
L
BTL out
H
L
H
SE out
H
H
X
Mute
Copyright  ANPEC Electronics Corp.
Rev. A.8 - May., 2012
4
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APA2068
Typical Application Circuit
VDD
0.1µF
VDD
VOLMAX Signal
100µF
GND
VOLMAX
LOUT+
220 µF
1 µF
L-CH
Input
LINVolume
Control
1 µF
R-Ch
Input
VDD
RIN-
Sleeve
Tip
Headphone
Jack
2.2 µF
220 µF
VOLUME
1kΩ
4Ω
100kΩ
SE/BTL
Signal
CB
BYPASS
ROUT+
VDD
Control
Pin Ring
SE/BTL
Signal
LOUT-
BYPASS
50kΩ
1kΩ
4W
100kΩ SE/BTL
Shutdown Signal
MUTE Signal
SHUTDOWN
MUTE
ROUT-
SE/BTL
Shutdown
ckt
Mute
A2068_AppCkt
Block Diagram
VOLMAX
LOUT
+
LINVolume
Control
LOUT-
RINBYPASS
BYPASS
ROUT+
VOLUME
SE/BTL
SHUTDOWN
MUTE
ROUT-
SE/BTL
Shutdown
ckt
Mute
VDD
Power and
Depop
Circuit
GND
APA2068_Block
Copyright  ANPEC Electronics Corp.
Rev. A.8 - May., 2012
5
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APA2068
Volume Control Table_BTL Mode
Supply Voltage VDD= 5V
Gain (dB)
High (V)
Low (V)
20
0.12
0.00
18
0.23
0.17
52
0.20
16
0.34
0.28
51
0.31
14
0.46
0.39
50
0.43
12
0.57
0.51
49
0.54
10
0.69
0.62
47
0.65
8
0.80
0.73
46
0.77
6
0.91
0.84
45
0.88
4
1.03
0.96
44
0.99
2
1.14
1.07
43
1.10
0
1.25
1.18
41
1.22
-2
1.37
1.29
40
1.33
-4
1.48
1.41
39
1.44
-6
1.59
1.52
38
1.56
-8
1.71
1.63
37
1.67
-10
1.82
1.74
35
1.78
-12
1.93
1.85
34
1.89
-14
2.05
1.97
33
2.01
-16
2.16
2.08
32
2.12
-18
2.28
2.19
30
2.23
-20
2.39
2.30
29
2.35
-22
2.50
2.42
28
2.46
-24
2.62
2.53
27
2.57
-26
2.73
2.64
26
2.69
-28
2.84
2.75
24
2.80
-30
2.96
2.87
23
2.91
-32
3.07
2.98
22
3.02
-34
3.18
3.09
21
3.14
-36
3.30
3.20
20
3.25
-38
3.41
3.32
18
3.36
-40
3.52
3.43
17
3.48
-80
5.00
3.54
16
5
Copyright  ANPEC Electronics Corp.
Rev. A.8 - May., 2012
Hysteresis (mV)
Recommended Voltage (V)
0
6
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APA2068
Typical Operating Characteristics
THD+N vs. Output Power
THD+N vs. Output Power
10
10
VDD = 5V
AV =20dB
fin = 1kHz
BTL
RL = 4Ω
RL = 3Ω
1
THD+N (%)
1
THD+N (%)
VDD = 5V
AV =14dB
fin = 1kHz
SE
RL = 8Ω
0.1
0.01
0
0.5
1
1.5
2
2.5
Output Power (W)
3
RL = 32Ω
0.1
0.01
3.5
RL = 16Ω
0
THD+N vs. Output Power
THD+N vs. Output Power
10
10
80m 120m 160m 200m 240m
Output Power (W)
40m
VDD = 5V
fin =1kHz
RL =3Ω
BTL
VDD = 5V
AV =20dB
RL =3Ω
BTL
THD+N (%)
THD+N (%)
1
AV = 20dB
0.1
1
0.5
1.5
fin= 20Hz
fin= 1kHz
AV = 6dB
0.01
0
fin = 20kHz
1
0.1
2
2.5
3
0.05
10m
3.5
100m
Output Power (W)
THD+N vs. Frequency
10
VDD = 5V
RL =3Ω
PO = 1.8W
BTL
THD+N (%)
THD+N (%)
1
AV = 20dB
0.1
5
Output Power (W)
THD+N vs. Frequency
10
1
VDD = 5V
AV = 6dB
RL =3Ω
BTL
1
0.1
PO = 0.9W
AV = 6dB
PO = 1.8W
0.01
20
100
1k
Frequency (Hz)
Copyright  ANPEC Electronics Corp.
Rev. A.8 - May., 2012
0.01
20
10k 20k
7
100
1k
Frequency (Hz)
10k 20k
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APA2068
Typical Operating Characteristics (Cont.)
THD+N vs. Output Power
10
THD+N vs. Output Power
10
VDD = 5V
fin =1kHz
RL =4Ω
BTL
fin= 20kHz
1
THD+N (%)
THD+N (%)
1
VDD = 5V
AV =20dB
RL =4Ω
BTL
AV = 20dB
0.1
fin = 20Hz
0.1
fin = 1kHz
AV = 6dB
0.01
0
0.5
1
1.5
2
2.5
3
0.01
10m
3.5
100m
1
Output Power (W)
Output Power (W)
THD+N vs. Frequency
THD+N vs. Frequency
10
VDD = 5V
RL=4Ω
PO=1.5W
BTL
1
AV = 6dB
0.1
VDD = 5V
AV= 6dB
RL=4Ω
BTL
1
THD+N (%)
THD+N (%)
10
PO = 0.8W
0.1
PO = 1.5W
AV = 20dB
0.01
20
0.01
20
10k 20k
100
1k
Frequency (Hz)
THD+N (%)
THD+N (%)
10
VDD = 5V
fin= 1kHz
RL=8Ω
BTL
1
AV = 6dB
1k
Frequency (Hz)
10k 20k
VDD = 5V
AV = 20dB
RL=8Ω
BTL
1
fin = 20kHz
fin = 20Hz
0.1
0.1
fin = 1kHz
AV = 20dB
0.01
100
THD+N vs. Output Power
THD+N vs. Output Power
10
5
0
0.5
1
1.5
2
2.5
3
0.01
10m
3.5
Output Power (W)
Copyright  ANPEC Electronics Corp.
Rev. A.8 - May., 2012
100m
1
5
Output Power (W)
8
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APA2068
Typical Operating Characteristics (Cont.)
THD+N vs. Frequency
THD+N vs. Frequency
10
VDD = 5V
AV = 6dB
RL=8Ω
BTL
THD+N (%)
THD+N (%)
10
1
PO = 0.5W
VDD=5V
RL=8Ω
PO=0.9W
BTL
1
0.1
AV = 6dB
0.1
PO = 0.9W
0.01
20
100
1k
AV = 20dB
0.01
10k 20k
20
100
1k
Frequency (Hz)
Frequency (Hz)
THD+N vs. Output Power
THD+N vs. Output Power
10
10
VDD=5V
fin=1kHz
RL=16Ω
SE
VDD=5V
AV=14dB
RL=16Ω
CO=1000µF
1 SE
THD+N (%)
THD+N (%)
1
AV = 0dB
0.1
fin = 20kHz
0
fin = 1kHz
0.01
40m 80m 120m 160m 200m 240m
10m
50m
Output Power (W)
THD+N vs. Frequency
THD+N vs. Frequency
10
VDD=5V
RL=16Ω
PO=125mW
CO=1000µF
1 SE
THD+N (%)
THD+N (%)
100m 200m 300m
Output Power (W)
10
AV = 0dB
0.1
VDD=5V
AV=0dB
RL=16Ω
CO=1000µF
1 SE
PO = 125mW
0.1
PO = 60mW
AV = 14dB
0.01
fin = 20Hz
0.1
AV = 14dB
0.01
10k 20k
20
1k
100
Frequency (Hz)
Copyright  ANPEC Electronics Corp.
Rev. A.8 - May., 2012
0.01
10k 20k
9
20
100
1k
Frequency (Hz)
10k 20k
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APA2068
Typical Operating Characteristics (Cont.)
THD+N vs. Output Power
THD+N vs. Output Power
10
VDD=5V
AV=14dB
RL=32Ω
CO=1000µF
SE
VDD=5V
fin=1kHz
RL=32Ω
SE
1
THD+N (%)
AV = 0dB
1
fin = 20Hz
fin = 20kHz
0.1
0.1
AV = 14dB
0.01
0
40m
80m
fin = 1kHz
0.01
10m
120m 160m 200m 240m
50m
Output Power (W)
THD+N vs. Frequency
THD+N vs. Frequency
THD+N (%)
THD+N (%)
10
VDD=5V
RL=32Ω
PO=65mW
CO=1000µF
1 SE
AV = 0dB
VDD=5V
AV=14dB
RL=32Ω
CO=1000µF
1 SE
PO = 30mΩ
0.1
0.1
AV = 14dB
20
PO = 65mΩ
100
1k
Frequency (Hz)
0.01
20
10k 20k
100
Frequency Response
+20
+320
+320
+16
+300
+190
+8
Phase( 6dB)
VDD=5V
RL=4Ω
PO=0.8W
BTL
Gain( 6dB)
100
1k
10k
Frequency (Hz)
Copyright  ANPEC Electronics Corp.
Rev. A.8 - May., 2012
+180
Gain(dB)
Phase( 20dB)
Phase (Degrees)
Gain(dB)
+330
Gain( 20dB)
+310
+0
10
10k 20k
Frequency Response
+16
+4
1k
Frequency (Hz)
+20
+330
Gain( 20dB)
+12
200m300m
Output Power (W)
10
0.01
100m
Phase( 20dB)
+12
+300
+190
+8
+170
+4
+160
Phase( 6dB)
VDD=5V
RL=8Ω
PO=0.5W
BTL
+0
10
100k 200k
10
+310
100
Phase (Degrees)
THD+N (%)
10
+180
Gain( 6dB)
+170
1k
10k
Frequency (Hz)
+160
100k 200k
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APA2068
Typical Operating Characteristics (Cont.)
Frequency Response
Gain(14dB)
+10
+210
+260
+220
+2
Gain(0dB)
+200
+180
-2
VDD=5V
RL=16Ω
CO=1000µF
PO=60mW
SE
-6
20
100
Phase(0dB)
+6
Gain(dB)
+240
Phase(14dB)
Phase (Degrees)
Phase(14dB)
+6
-10
+220
Gain(14dB)
+280
+10
Gain(dB)
Frequency Response
+14
+300
+160
+200
+2
-2
-6
-10
+120
100k 200k
20
VDD=5V
RL=8Ω
PO=0.9 W
BTL
-50
-60
-70
-80
-90
-100
Right to Left
Left to Right
-110
-120
20
100
1k
Frequency (Hz)
+0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
Crosstalk(dB)
-20
-30
Left to Right
-10
-20
-40
-60
Left to Right
-30
Right to Left
-60
-80
-80
-90
-90
-100
20
-100
10k 20k
VDD=5V
RL=32Ω
CO=1000µF
PO=65mW
SE
-50
-70
Copyright  ANPEC Electronics Corp.
Rev. A.8 - May., 2012
10k 20k
-40
-70
100
1k
Frequency (Hz)
1k
Crosstalk vs. Response
VDD=5V
RL=16Ω
CO=1000µF
PO=125mW
SE
Right to Left
100
Frequency (Hz)
+0
-50
+165
100k 200k
Right to Left
-120
20
10k 20k
Crosstalk(dB)
+0
1k
10k
Frequency (Hz)
VDD=5V
RL=4Ω
PO=1.5 W
BTL
Crosstalk vs. Response
-10
100
+170
Crosstalk vs. Frequency
Crosstalk(dB)
Crosstalk(dB)
Crosstalk vs. Frequency
+0
-10
-20
-30
-40
Phase(0dB) +180
VDD=5V
RL=32Ω
CO=1000µF
PO=30mW
SE
+140
1k
10k
Frequency (Hz)
+190
Gain(0dB)
Phase (Degrees)
+14
Left to Right
20
100
1k
10k 20k
Frequency (Hz)
11
www.anpec.com.tw
APA2068
Typical Operating Characteristics (Cont.)
Output Noise Voltage vs. Frequency
Output Noise Voltage vs. Frequency
100µ
Output Noise Voltage(V)
Output Noise Voltage(V)
100µ
Filter BW<22kHz
20µ
A-Weighting
10µ
VDD=5V
AV=6dB
RL=4Ω
BTL
1µ
20
1k
100
Frequency (Hz)
20µ
Filter BW<22kHz
10µ
A-Weighting
1µ
20
10k 20k
PSRR vs. Frequency
PSRR(dB)
-30
VDD=5V
RL=4Ω
Vrr=200mV
AV=20dB
BTL
-20
-30
-50
-60
-40
-50
-60
-70
-70
-80
-80
-90
-90
20
100
1k
Frequency (Hz)
-100
20
10k 20k
+0 T
VDD=5V
-10
R =8Ω
-20 V L =1Vrms
IN
-30 A =6dB
V
-40 BTL
-50
-60
-70
-80
-90
-100
-110
-120
-130
20
100
100
1k
Frequency (Hz)
10k 20k
Shutdown Attenuation vs. Frequency
Shutdown Attenuation(dB)
Mute Attenuation vs. Frequency
Mute Attenuation(dB)
10k 20k
VDD=5V
RL=32Ω
Vrr=200mV
AV=14dB
SE
-10
-40
-100
1k
PSRR vs. Frequency
+0
PSRR(dB)
-20
100
Frequency (Hz)
+0
-10
VDD=5V
AV=0dB
RL=32Ω
SE
+0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
VDD=5V
RL=8Ω
VIN=1Vrms
AV=6dB
BTL
-110
1k
10k
-120
20
20k
Frequency (Hz)
Copyright  ANPEC Electronics Corp.
Rev. A.8 - May., 2012
100
1k
10k 20k
Frequency (Hz)
12
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APA2068
Typical Operating Characteristics (Cont.)
Gain vs. Volume Voltage
Supply Current vs. Supply Voltage
20
10.0
10
9.0
No Load
Gain(dB)
-10
Supply Current (mA)
0
Down
-20
Up
-30
-40
-50
-60
-70
VDD=5V
No Load
BTL
BTL
8.0
7.0
6.0
5.0
SE
4.0
3.0
-80
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
DC Voltage (V)
2.0
3.0
Power Dissipation vs.Output Power
200
1.8
RL=3Ω
Power Dissipation(mW)
Power Dissipation(W)
RL=4Ω
1.2
1.0
0.8
RL=8Ω
0.6
0.4
VDD=5V
THD+N<1%
BTL
0.2
0.50
1.00
1.50
2.00
5.5
160
140
120
RL=16Ω
100
80
RL=32Ω
60
VDD=5V
THD+N<1%
SE
40
20
0
2.50
Output Power (W)
Copyright  ANPEC Electronics Corp.
Rev. A.8 - May., 2012
5.0
RL=8Ω
180
1.6
1.4
4.0
4.5
Supply Voltage(V)
Power Dissipation vs. Output Power
2.0
0.0
0.00
3.5
13
0
50
100
150
200
Output Power(W)
250
www.anpec.com.tw
APA2068
Application Information
BTL Operation
The APA2068 output stage (power amplifier) has two pairs
of operational amplifiers internally, which allows different
a single supply, SE configuration.
Single-Ended Operation
To consider the single-supply SE configuration shown
amplifier configurations.
Application Circuit, a coupling capacitor is required to block
the DC offset voltage from reaching the load. These caOUT+
Volume Control
amplifier output
signal
pacitors can be quite large (approximately 33µF to
1000µF), so they tend to be expensive, occupy valuable
OP1
PCB area, and have the additional drawback of limiting
low-frequency performance of the system (refer to the
RL
Output Coupling Capacitor).The rules described still hold
with the addition of the following relationship:
OUT-
Vbias
Circuit
OP2
1
CB x 150kΩ
Figure 1: APA2068 Internal Configuration
≤
1
<< 1
RiC i
RLCC
(1)
Output SE/BTL Operation
(each channel)
The best cost saving feature of APA2068 is that it can be
switched easily between BTL and SE modes. This feature eliminates the requirement for an additional head-
The power amplifier’s OP1 gain is set by internal unitygain and input audio signal comes from internal volume
control amplifier while the second amplifier OP2 is inter-
phone amplifier in applications where internal stereo
speakers are driven in BTL mode but external headphone
nally fixed in a unity-gain, inverting configuration. Figure 1
shows that the output of OP1 is connected to the input to
or speakers must be accommodated.
OP2, which results in the output signals of with both amplifiers with identical in magnitude but out of phase 180°.
Inside of the APA2068, two separate amplifiers drive OUT+
and OUT- (see Figure 1). The SE/BTL input controls the
Consequently, the differential gain for each channel is 2 x
(Gain of SE mode).
By driving the load differentially through outputs OUT+
and OUT-, an amplifier configuration is commonly referred
operation of the follower amplifier that drives LOUT- and
ROUT-.
• When SE/BTL keeps low, the OP2 turns on and the
APA2068 is in the BTL mode.
to bridged mode is established. BTL mode operation is
different from the classical single-ended SE amplifier con-
• When SE/BTL keeps high, the OP2 is in a high output
impedance state, which configures the APA2068 as SE
figuration where one side of its load is connected to the
ground.
A BTL amplifier design has a few distinct advantages over
the SE configuration, as it provides differential drive to the
driver from OUT+. IDD is reduced by approximately onehalf in SE mode.
Control of the SE/BTL input can be a logic-level TTL source
or a resistor divider network or the stereo headphone jack
load, thus, doubles the output swing for aspecified supply voltage.
When placed under the same conditions, a BTL amplifier
with switch pin as shown in the Application Circuit.
has four times the output power of a SE amplifier. A BTL
configuration, such as the one used in APA2068, also
creates a second advantage over SE amplifiers. Since
the differential outputs, ROUT+, ROUT-, LOUT+, and
LOUT-, are biased at half-supply, it’s not necessary for
DC voltage to be across the load. This eliminates the
need for an output coupling capacitor which is required in
Copyright  ANPEC Electronics Corp.
Rev. A.8 - May., 2012
14
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APA2068
Application Information (Cont.)
Output SE/BTL Operation (Cont.)
APA2068 DC Volume Control Curve (BTL)
20
10
1kΩ
100kΩ
0
Control
Pin
Forward
-10
Ring
Gain (dB)
VDD
SE/BTL
Tip
Sleeve
-20
Backward
-30
-40
-50
Headphone Jack
-60
Figure 2: SE/BTL Input Selection by Phonejack Plug
-70
In Figure 2, input SE/BTL operates as below :
When the phonejack plug is inserted, the 1kΩ resistor is
-80
0.0
disconnected and the SE/BTL input is pulled high and
enables the SE mode. When the input goes high, the
Figure 3: Gain Setting vs. VOLUME Pin Voltage
For the highest accuracy, the voltage shown in the ‘rec-
OUT- amplifier is shutdown causing the speaker to mute.
The OUT+ amplifier then drives through the output ca-
ommended voltage’column of the table is used to select
a desired gain. This recommended voltage is exactly half-
pacitor (CO) into the headphone jack. When there is no
headphone plugged into the system, the contact pin of
way between the two nearest transitions. The gain levels
are 2dB/step from 20dB to -40dB in BTL mode, and the
the headphone jack is connnected from the signal pin,
the voltage divider set up by resistors 100kΩ and 1kΩ.
last step at -80dB as mute mode.
Resistor 1kΩ then pulls low the SE/BTL pin, enabling the
BTL function.
The gain for each audio input of the APA2068 is set by the
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
DC volume (V)
Input Resistance, Ri
internal resistors (Ri and RF) of volume control amplifier
in inverting configuration.
Volume Control Function
The APA2068 has an internal stereo volume control that
SE Gain = AV = −
setting is the function of the DC voltage applied to the
VOLUME input pin. The APA2068 volume control consists
RF
Ri
(2)
RF
(3)
Ri
BTL mode operation brings the factor of 2 in the gain
BTL Gain = -2 ×
of 32 steps that are individually selected by a variable DC
voltage level on the VOLUME control pin. The range of the
steps, controlled by the DC voltage, are from 20dB to
-80dB. Each gain step corresponds to a specific input
equation due to the inverting amplifier mirroring the voltage swing across the load. For varying gain settings, the
voltage range, as shown in table. To minimize the effect of
noise on the volume control pin, which can affect the se-
APA2068 generates each input resistance on figure 4.
The input resistance will affect the low frequency perfor-
lected gain level, hysteresis and clock delay are
implemented. The amount of hysteresis corresponds to
mance of audio signal. The minmum input resistance is
10kΩ when gain setting is 20dB and the resistance will
half of the step width, as shown in the volume control
graph.
ramp up when close loop gain below 20dB. The input
resistance has wide variation (+/-10%) caused by process variation.
Copyright  ANPEC Electronics Corp.
Rev. A.8 - May., 2012
15
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APA2068
Application Information (Cont.)
Input Resistance, Ri (Cont.)
polarity in the application.
Ri vs. Gain (BTL)
160
Effective Bypass Capacitor, CB
A power amplifier, proper supply bypassing, is critical for
low noise performance and high power supply rejection.
The capacitor location on the BYPASS pin should be as
140
120
close to the device as possible. The effect of a larger
supply bypass capacitor is to improve PSRR due to in-
Ri (kΩ)
100
80
creased half-supply stability. Two critical criteria of bypass capacitor (CB): 1st, it depends upon desired PSRR
60
requirements and click-and-pop performance; 2 nd, the
leakage current of CB will induce the voltage drop of VBYPASS
40
20
0
-40
-30
-20
-10
0
Gain (BTL)
10
(voltage of BYPASS pin), and if the VBYPASS is less than
0.49VDD, APA2068 will enter mute condition. The value of
20
VBYPASS can be calculated as below:
Figure 4: Input Resistance vs. Gain Setting
VBYPASS = 0.5V DD - ILeakage × 150k Ω
Input Capacitor, Ci
(6)
Where
In the typical application, an input capacitor, Ci, is required
ILeakage =Leakage current of CB
to allow the amplifier to bias the input signal to the proper
DC level for optimum operation. In this case, Ci and the
Therefore, it is recommended that CB‘s leakage current
should be no more then 0.4µA for properly work of
APA2068.
minimum input impedance Ri (25kΩ) form a high-pass
filter with the corner frequency determined in the follow-
To avoid the start-up pop noise, the bypass voltage should
rise slower than the input bias voltage and the relation-
ing equation :
1
(4)
2π × 25kΩ × Ci
The value of Ci is important to consider as it directly afFC(highpass ) =
ship shown in equation should be maintained.
1
1
<<
( CB X150k Ω )
Ci X150k Ω
fects the low frequency performance of the circuit. Consider the example where Ri is 25kΩ and the specification
(7)
The capacitor is fed from a 150kΩ resistor inside of the
amplifier and the 150kΩ is the maximum input resistance of (Ri+RF). Bypass capacitor, CB, values of 2.2µF to
calls for a flat bass response down to 50Hz. Equation is
reconfigured as below :
1
Ci =
(5)
2π × 25kΩ × FC
10µF ceramic or tantalum low-ESR capacitors are recommended for the best THD+N and noise performance.
The bypass capacitance also affects the start up time. It is
determined in the following equation:
When the input resistance variation is considered, the Ci
is 0.13µF, therefore, a value in the range of 0.33µF to
Tstart up = 5X(CBYPASS X150k Ω )
1.0µF would be chosen. A further consideration for this
capacitor is the leakage path from the input source through
(8)
Output Coupling Capacitor, CC
the input network (Ri+RF, Ci) to the load. This leakage
current creates a DC offset voltage at the input to the
In the typical single-supply SE configuration, an output
amplifier that reduces useful headroom, especially in high
gain applications. For this reason, a low-leakage tanta-
coupling capacitor (CC) is required to block the DC bias at
the output of the amplifier thus preventing DC currents in
lum or ceramic capacitor is the best choice. When polarized capacitors are used, the positive side of the capacitor
the load. As with the input coupling capacitor, the output
coupling capacitor and impedance of the load form a high-
should face the amplifier input in most applications because the DC level of the amplifiers’input is held at VDD/2.
pass filter governed by the equation.
1
FC(highpass ) =
2πRLCC
Please note that it is important to confirm the capacitor
Copyright  ANPEC Electronics Corp.
Rev. A.8 - May., 2012
16
(9)
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APA2068
Application Information (Cont.)
Output Coupling Capacitor, CC (Cont.)
ship between the size of CBYPASS and the turn-on time. In a
SE configuration, the output coupling capacitor, CC, is of
For example, a 330µF capacitor with an 8Ω speaker would
attenuate low frequencies below 60.6Hz. The main
particular concern.
This capacitor discharges through the internal 10KΩ
disadvantage, from a performance standpoint, is the load
impedance and is typically small, which drives the low-
resistors. Depending on the size of CC, the time constant
can be relatively large. To reduce transients in SE mode,
frequency corner higher degrading the bass response.
Large values of CC are required to pass low frequencies
an external 1kΩ resistor can be placed in parallel with the
internal 10kΩ resistor. The tradeoff for using this resistor
into the load.
is an increase in quiescent current. In most cases, choosing a small value of Ci in the range of 0.33µF to 1µF, Cb
Power Supply Decoupling, CS
The APA2068 is a high-performance CMOS audio amplifier that requires adequate power supply decoupling to
being equal to 4.7µF and an external 1kΩ resistor should
be placed in parallel with the internal 10kΩ resistor should
ensure the output total harmonic distortion (THD+N) is
as low as possible. Power supply decoupling also pre-
produce a virtually clickless and popless turn-on.
A high gain amplifier intensifies the problem as the small
delta in voltage is multiplied by the gain, so it is advanta-
vents the oscillations being caused by long lead length
between the amplifier and the speaker. The optimum
geous to use low-gain configurations.
decoupling is achieved by using two different types of
capacitors that target on different types of noise on the
Shutdown Function
In order to reduce power consumption when not in use,
power supply leads.
For higher frequency transients, spikes, or digital hash
the APA2068 contains a shutdown pin to externally turn
off the amplifier bias circuitry. This shutdown feature
on the line, a good low equivalent-series-resistance
(ESR) ceramic capacitor, typically 0.1µF, is placed as close
turns the amplifier off when a logic low is placed on the
SHUTDOWN pin. The trigger point between a logic high
and logic low level is typically 2.0V. It is best to switch
as possible to the device VDD lead works best. For filtering
lower-frequency noise signals, it is recommended to
between the ground and the supply VDD to provide maximum device performance.
place a large aluminum electrolytic capacitor of 10µF or
greater near the audio power amplifier.
By switching the SHUTDOWN pin to low, the amplifier
Optimizing Depop Circuitry
Circuitry has been included in the APA2068 to minimize
enters a low-current state, IDD<1µA. APA2068 is in shutdown mode. On normal operating, SHUTDOWN pin pull
the amount of popping noise at power-up and when coming out of shutdown mode. Popping occurs whenever a
to high level to keep the IC out of the shutdown mode. The
SHUTDOWN pin should be tied to a definite voltage to
voltage step is applied to the speaker. In order to eliminate clicks and pops, all capacitors must be fully dis-
avoid unwanted state changing.
charged before turn-on. Rapid on/off switching of the device or the shutdown function will cause the click and pop
The APA2068 mutes the amplifier outputs when logic high
circuitry.
is applied to the MUTE pin. Applying logic low to the MUTE
pin returns the APA2068 to normal operation. Prevent
Mute Function
The value of Ci will also affect turn-on pops (Refer to
Effective Bypass Capacitance). The bypass voltage ramp
unanticipated mute behavior by connecting the Mute pin
to logic high or low. Do not let the Mute pin float.
up should be slower than input bias voltage. Although the
bypass pin current source cannot be modified, the size of
CBYPASS can be changed to alter the device turn-on time
and the amount of clicks and pops. By increasing the value
of CBYPASS, turn-on pop can be reduced. However, the
tradeoff for using a larger bypass capacitor is to increase
the turn-on time for this device. There is a linear relationCopyright  ANPEC Electronics Corp.
Rev. A.8 - May., 2012
17
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APA2068
Application Information (Cont.)
Maximum Output Swing Clamping Function (VolMax)
loads and a 5V supply, the maximum draw on the power
supply is almost 3W.
The APA2068 provides the maximum output swing clamping function to protect the speaker.
When input a non-zero voltage (VX) to VolMax pin, BTL
mode output amplitude (VOP) is be limited at VOP=VDD-2VX.
A final point to remember about linear amplifiers (either
SE or BTL) is how to manipulate the terms in the efficiency equation to utmost advantage when possible. Note
that in equation, VDD is in the denominator. This indicates
SE mode output amplitude (VOP) is be limited at VOP =
1/2VDD-2VX. This function can effectively limite the output
that as VDD goes down, efficiency goes up. In other words,
use the efficiency analysis to choose the correct supply
power across the speaker and avoid damaging the
speaker.
voltage and speaker impedance for the application.
Table 1: Efficiency vs. Output Power in 5-V/8Ω BTL Systems.
The maximum setting voltage of VolMax is Vdd/2, and
when this function is not used, connect the VolMax to the
GND.
BTL Amplifier Efficiency
An easy-to-use equation to calculate efficiency starts out
as being equal to the ratio of power from the power supply to the power delivered to the load.
Efficiency =
(10)
PD (W)
2.00
0.55
0.50
47.62
0.21
2.83
0.55
1.00
66.67
0.30
4.00
0.5
1.25
78.13
0.32
4.47
0.35
tion14 states the maximum power dissipation point for a
SE mode operating at a given supply voltage and driving
a specified load.
PO =
SE mode: PD,MAX =
(11)
VDD2
2π2RL
(14)
In BTL mode operation, the output voltage swing is
doubled as in SE mode. Thus, the maximum power dis-
(12)
sipation point for a BTL mode operating at the same given
conditions is 4 times as in SE mode.
BTL mode : PD, MAX =
(13)
4VDD2
2π2RL
(15)
Since the APA2068 is a dual channel power amplifier, the
maximum internal power dissipation is 2 times that both
of equations depend on the mode of operation. Even with
Table 1 calculates efficiencies for four different output
power levels.
this substantial increase in power dissipation, the
APA2068 does not require extra heatsink. The power dis-
Note that the efficiency of the amplifier is quite low for
lower power levels and rises sharply as power to the load
sipation from equation14, assuming a 5V-power supply
and an 8Ω load, must not be greater than the power dis-
is increased resulting in a nearly flat internal power dissipation over the normal operating range.
sipation that results from the equation16:
Note that the internal dissipation at full output power is
less than in the half power range. Calculating the effi-
PD, MAX =
ciency for a specific system is the key to proper power
supply design. For a stereo 1W audio system with 8Ω
Copyright  ANPEC Electronics Corp.
Rev. A.8 - May., 2012
VPP(V)
0.16
Whether the power amplifier is operated in BTL or SE
mode, power dissipation is the major concern. Equa-
Where
VP × VP
(
)
PO
πVP
2RL
=
=
PSUP ( VDD × 2 VP ) 4VDD
πRL
IDD(A)
31.25
Power Dissipation
PSUP
Vorms × Vorms ( VP × VP )
=
2RL
RL
VP
Vorms =
2
2VP
PSUP = VDD × LDDSVG = VDD ×
πRL
Efficiency of a BTL configuration :
Efficiency (%)
0.25
**High peak voltages cause the THD+N to increase.
The following equations are the basis for calculating
amplifier efficiency.
1
Po (W)
18
TJ, MAX - TA
θJA
(16)
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APA2068
Application Information (Cont.)
Power Dissipation (Cont.)
To calculate maximum ambient temperatures, first consideration is that the numbers from the Power Dissipa-
For SOP16-P package with thermal pad, the thermal re-
tion vs. Output Power graphs are per channel values, so
the dissipation of the IC heat needs to be doubled for
sistance (θJA) is equal to 45οC/W.
Since the maximum junction temperature (TJ,MAX ) of
APA2068 is 150οC and the ambient temperature (TA) is
two-channel operation. Given θJA, the maximum allowable junction temperature (TJMAX), and the total internal
defined by the power system design, the maximum power
dissipation which the IC package is able to handle can be
dissipation (PD), the maximum ambient temperature can
be calculated with the following equation. The maximum
obtained from equation16.
Once the power dissipation is greater than the maximum
recommended junction temperature for the APA2068 is
150°C. The internal dissipation figures are taken from
limit (P D,MAX ), either the supply voltage (V DD) must be
decreased, the load impedance (RL) must be increased
the Power Dissipation vs. Output Power graphs.
or the ambient temperature should be reduced.
TAMax = TJMax -θJAPD
Thermal Pad Consideration
150 - 45(0.8*2) = 78°C
(16)
The thermal pad must be connected to the ground. The
package with thermal pad of the APA2068 requires spe-
The APA2068 is designed with a thermal shutdown protection that turns the device off when the junction tem-
cial attention on thermal design. If the thermal design
issues are not properly addressed, the APA2068 4Ω will
perature surpasses 150°C to prevent damaging the IC.
go into thermal shutdown when driving a 4Ω load.
The thermal pad on the bottom of the APA2068 should be
soldered down to a copper pad on the circuit board. Heat
can be conducted away from the thermal pad through the
copper plane to ambient. If the copper plane is not on the
top surface of the circuit board, 8 to 10 vias of 13 mil or
smaller in diameter should be used to thermally couple
the thermal pad to the bottom plane.
For good thermal conduction, the vias must be plated
through and solder filled. The copper plane used to conduct heat away from the thermal pad should be as large
as practical.
If the ambient temperature is higher than 25°C, a larger
copper plane or forced-air cooling will be required to keep
the APA2068 junction temperature below the thermal
shutdown temperature (150°C). In higher ambient
temperature, higher airflow rate and/or larger copper area
will be required to keep the IC out of thermal shutdown.
Thermal Consideration
Linear power amplifiers dissipate a significant amount of
heat in the package under normal operating conditions.
Copyright  ANPEC Electronics Corp.
Rev. A.8 - May., 2012
19
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APA2068
Package Information
SOP-16P
D
SEE VIEW A
h X 45o
E
E2
EXPOSED
PAD
E1
D1
b
A
0.25
c
L
0
GAUGE PLANE
SEATING PLANE
A1
A2
e
VIEW A
S
Y
M
B
O
L
SOP-16P
INCHES
MILLIMETERS
MIN.
MAX.
MIN.
MAX.
A
0.069
1.75
0.006
0.000
0.15
A1
0.00
A2
1.25
b
0.31
0.51
0.012
0.020
c
0.17
0.25
0.007
0.010
D
9.80
10.00
0.386
0.394
D1
3.50
4.50
0.138
0.177
E
5.80
6.20
0.228
0.244
E1
3.80
4.00
0.150
0.157
3.00
0.079
0.118
E2
0.049
2.00
e
1.27 BSC
0.050 BSC
h
0.25
0.50
0.010
0.020
L
0.40
1.27
0.016
0.050
θ
0o
8o
0o
8o
Note : 1. Follow from JEDEC MS-012 BC.
2. Dimension "D" does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion or gate burrs shall not exceed 6 mil per side.
3. Dimension "E" does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
Copyright  ANPEC Electronics Corp.
Rev. A.8 - May., 2012
20
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APA2068
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
SOP-16P
A
H
T1
C
d
D
W
E1
F
330.0±2.00
50 MIN.
16.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
16.0±0.30
1.75±0.10
7.5±0.10
P0
P1
P2
D0
D1
T
A0
B0
K0
2.0±0.10
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
6.40±0.20
10.30±0.20
2.10±0.20
4.0±0.10
8.0±0.10
(mm)
Devices Per Unit
Package Type
Unit
Quantity
SOP-16P
Tape & Reel
2500
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Taping Direction Information
SOP-16P
USER DIRECTION OF FEED
Classification Profile
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Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
<2.5 mm
≥2.5 mm
Volume mm
<350
235 °C
220 °C
3
Volume mm
≥350
220 °C
220 °C
3
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm
Volume mm
<350
260 °C
260 °C
250 °C
3
Volume mm
350-2000
260 °C
250 °C
245 °C
3
Volume mm
>2000
260 °C
245 °C
245 °C
3
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
HBM
MM
Latch-Up
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
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Description
5 Sec, 245°C
1000 Hrs, Bias @ 125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
VMM≧200V
10ms, 1tr≧100mA
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Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
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