ANPEC APA2037QBI-TRL

APA2037
3W Stereo Fully Differential Audio Power Amplifier
Features
to 5V and is available in a TQFN5x5-20A package.
The built-in feedback resistors can minimize the external
High PSRR and Excellent RF Rectification
Immunity
Low Crosstalk
component counts and save the PCB space. High PSRR
and fully differential architecture increase immunity to
3W Per Channel Output Power into 3Ω
Load at VDD=5V
noise and RF rectification. In addition to these features, a
short startup time and small package size make the
Thermal and Over-Current Protections
APA2037 is an ideal choice for LCD TVs and notebook
PCs and Portable devices.
Built-in Feedback Resistors Eliminate
The APA2037 also integrates the de-pop circuitry that reduces the pops and click noises during power on/off and
External Components Counts
•
Space Saving Package
– TQFN5x5-20A
shutdown mode operation. Both Thermal and over-current protections are integrated to avoid the IC to be de-
Lead Free and Green Devices Available
(RoHS Compliant)
stroyed by over temperature and short-circuit.
The APA2037 is capable of driving 3W at 5V into 3Ω
speaker.
Applications
LCD TVs
Pin Configuration
Notebook, PCs
Portable Devices
15 RBYPASS
•
•
•
Simplified Application Circuit
11 LBYPASS
•
12 LINP
•
•
The APA2037 is a stereo, fully differential Class-AB audio
amplifier which can operate with supply voltage from 2.4V
Fully Differential Class-AB Amplifier
13 LINN
•
•
Operating Voltage: 2.4V~5.5V
14 RSD
•
•
•
General Description
10 NC
RINP 16
LOUTN
NC 18
RINN
ROUTP
7 LVDD
NC 20
Right
Channel
Speaker
6 LOUTN
ROUTP 1
ROUTN
RINP
8 NC
RVDD 19
APA2037
Right
Channel
Input
TQFN5x5-20A
Top View
GND 5
LINP
9 LSD
RINN 17
Left
Channel
Speaker
LOUTP 4
LOUTP
ROUTN 3
LINN
GND 2
Left
Channel
Input
=Thermal Pad (connected the Thermal Pad to
GND plane for better heat dissipation)
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Aug., 2008
1
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APA2037
Ordering and Marking Information
Package Code
QB : TQFN5x5-20A
Operating Ambient Temperature Range
I : -40 to 85 ° C
Handling Code
TR : Tape & Reel
Assembly Material
L : Lead Free Device G : Halogen and Lead Free Device
APA2037
Assembly Material
Handling Code
Temperature Range
Package Code
APA2037 QB :
XXXXX - Date Code
APA2037
XXXXX
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish;
which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and
halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed
1500ppm by weight).
Absolute Maximum Ratings
(Note 1)
(Over operating free-air temperature range unless otherwise noted.)
Symbol
Parameter
VDD
Supply Voltage (LVDD, RVDD to GND)
VIN
Input Voltage (LINN, LINP, RINN, RINP, LSD, RSD to GND)
TJ
Maximum Junction Temperature
TSTG
TSDR
PD
Storage Temperature Range
Maximum Lead Soldering Temperature, 10 Seconds
Power Dissipation
Rating
Unit
-0.3 to 6
V
-0.3 to VDD+0.3
V
150
ο
-65 to +150
ο
260
ο
C
C
C
Internally Limited
W
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Thermal Characteristics
Symbol
Parameter
θJA
Thermal Resistance -Junction to Ambient
θJC
Thermal Resistance -Junction to Case
Typical Value
Unit
TQFN5x5-20A (Note 2)
40
ο
TQFN5x5-20A (Note 3)
8
ο
C/W
C/W
Note 2: Please refer to “ Layout Recommendation”, the Thermal Pad on the bottom of the IC should soldered directly to the PCB’s
ThermalPad area that with several thermal vias connect to the ground plan, and the PCB is a 2-layer, 5-inch square area with
2oz copper thickness.
Note 3: The case temperature is measured at the center of the Thermal Pad on the underside of the TQFN5X5-32A package.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Aug., 2008
2
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APA2037
Recommended Operating Conditions
Symbol
Parameter
Range
Unit
2.4 ~ 5.5
V
VDD
Supply Voltage
VIH
High Level Threshold Voltage
LSD, RSD
1.8 ~VDD
V
VIL
Low Level Threshold Voltage
LSD, RSD
0 ~ 0.35
V
VIC
Common Mode Input Voltage
0.5 ~ VDD-0.5
Operating Ambient Temperature Range
-40 ~ 85
ο
Operating Junction Temperature Range
-40 ~ 125
ο
Speaker Resistance
C
C
Ω
3~
Electrical Characteristics
o
VDD=5V, Gnd=0V, TA= 25 C (unless otherwise noted)
Symbol
Parameter
IDD
Supply Current
ISD
Shutdown Current
II
Input Current
Gain
TSTART-UP
RSD
Test Conditions
APA2037
Typ.
Max.
6
12
Unit
mA
LSD = RSD = 0V
-
1
5
µA
LSD, RSD
-
0.1
-
µA
36kΩ
Ri
40kΩ
Ri
44kΩ
Ri
V/V
RL=4Ω
Start-Up Time from End of Shutdown
Min.
-
-
65
-
ms
90
100
110
kΩ
RL = 3Ω
-
2.4
-
RL = 4Ω
-
2.1
-
RL = 8Ω
1
1.3
-
RL = 3Ω
-
3
-
RL = 4Ω
-
2.6
-
RL = 8Ω
-
1.6
-
-
0.05
-
-
0.035
-
-
105
-
-
80
-
-
60
-
-
105
-
dB
Cb1=Cb2 = 0.22µF
Resistance from Shutdown to GND
VDD=5V, TA=25°
C
THD+N = 1%
PO
Output Power
THD+N = 10%
fin = 1kHz
THD+N
Crosstalk
Total Harmonic Distortion Pulse Noise
Channel separation
PSRR
Power Supply Rejection Ratio
CMRR
Common-Mode Rejection Ratio
fin = 1kHz
RL = 4Ω
PO= 1.5W
RL = 8Ω
PO= 0.9W
PO=130mW, RL =8Ω, fin = 1kHz
Cb1 = Cb2= 0.22µF, RL = 8Ω,
VRR=0.2VPP, fin = 217Hz
Cb1 = Cb2= 0.22µF, RL = 8Ω,
VIC=0.2VPP, fin = 217Hz
With A-weighting Filter
PO = 1.3W, RL = 8Ω
W
%
dB
S/N
Signal to Noise Ratio
VOS
Output Offset Voltage
RL = 8Ω
-
5
20
mV
Vn
Noise Output Voltage
Cb1 = Cb2= 0.22µF, With A-weighting
Filter
-
15
-
µV
(rms)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Aug., 2008
3
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APA2037
Electrical Characteristics (Cont.)
o
VDD=5V, GND=0V, TA= 25 C (unless otherwise noted)
Symbol
Parameter
APA2037
Test Conditions
Unit
Min.
Typ.
Max.
RL = 3Ω
-
1.2
-
RL = 4Ω
-
1
-
RL = 8Ω
-
0.65
-
RL = 3Ω
-
1.5
-
THD+N = 10%
fin = 1kHz
RL = 4Ω
-
1.3
-
RL = 8Ω
-
0.8
-
Total Harmonic Distortion Pulse
Noise
-
0.07
-
fin = 1kHz
RL = 4Ω
PO = 0.7W
RL = 8Ω
PO= 0.45W
-
0.05
-
Channel separation
PO=65mW, RL=8Ω, fin=1kHz
-
105
-
-
78
-
-
60
-
-
103
-
VDD=3.6V, TA=25°
C
THD+N = 1%
PO
THD+N
Crosstalk
Output Power
PSRR
Power Supply Rejection Ratio
CMRR
Common-Mode Rejection Ratio
Cb1 = Cb2= 0.22µF, RL = 8Ω,
VRR=0.2VPP, fin = 217Hz
Cb1 = Cb2= 0.22µF, RL = 8Ω, VIC=0.2VPP,
fin = 217Hz
With A-weighting Filter
PO = 0.65W, RL = 8Ω
W
%
dB
S/N
Signal to Noise Ratio
VOS
Output Offset Voltage
RL = 8Ω
-
5
20
mV
Noise Output Voltage
Cb1 = Cb2= 0.22µF, With A-weighting
Filter
-
15
-
µV
(rms)
RL = 3Ω
-
0. 5
-
RL = 4Ω
-
0.45
-
RL = 8Ω
-
0.3
-
RL = 3Ω
-
0.7
-
RL = 4Ω
-
0.6
-
-
0.35
-
-
0.1
-
-
0.08
-
-
105
-
-
75
-
-
60
-
-
100
-
-
5
20
mV
-
15
-
µV
(rms)
Vn
VDD=2.4V, TA=25°
C
THD+N = 1%
PO
Output Power
THD+N = 10%
fin = 1kHz
THD+N
Crosstalk
Total Harmonic Distortion Pulse
Noise
Channel Separation
PSRR
Power Supply Rejection Ratio
CMRR
Common-Mode Rejection Ratio
S/N
Signal to Noise Ratio
VOS
Output Offset Voltage
Vn
Noise Output Voltage
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Aug., 2008
RL = 8Ω
PO = 0.3W,
RL = 4Ω
fin = 1kHz
PO = 0.2W,
RL = 8Ω
PO=30mW, RL=8Ω, fin=1kHz
Cb1 = Cb2= 0.22µF, RL = 8Ω,
VRR=0.2VPP, fin = 217Hz
Cb1 = Cb2= 0.22µF, RL = 8Ω, VIC=0.2VPP,
fin = 217Hz
With A-weighting Filter
PO = 0.3W, RL = 8Ω
RL = 8Ω
Cb1 = Cb2= 0.22µF, With A-weighting
Filter
4
W
%
dB
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APA2037
Pin Description
PIN
NO.
NAME
I/O/P
FUNCTION
1
ROUTP
O
The right channel positive output terminal of speaker amplifier.
2,5
GND
P
Ground connection for circuitry.
3
ROUTN
O
The right channel negative output terminal of speaker amplifier
4
LOUTP
O
The left channel positive output terminal of speaker amplifier.
6
LOUTN
O
The left channel negative output terminal of speaker amplifier.
7
LVDD
P
Left channel supply voltage input pin.
8,10,18,20
NC
-
No connection.
I
Left channel shutdown mode control signal input pin, place left channel speaker
amplifier in shutdown mode when held low.
9
LSD
11
LBYPASS
P
Left channel bypass voltage input pin.
12
LINP
I
The non-inverting input of left channel amplifier. LINP is connected to ground (Gnd
node) via a capacitor for single-end (SE) input signal.
13
LINN
I
The inverting input of left channel amplifier. LINN is used as audio input terminal,
typically.
14
RSD
I
Right channel shutdown mode control signal input pin, place left channel speaker
amplifier in shutdown mode when held low.
15
RBYPASS
P
Right channel bypass voltage input pin.
16
RINP
I
The non-inverting input of right channel amplifier. RINP is connected to ground
(Gnd node) via a capacitor for single-end (SE) input signal.
17
RINN
I
The inverting input of right channel amplifier. RINN is used as audio input terminal,
typically.
19
RVDD
P
Right channel supply voltage input pin
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Aug., 2008
5
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APA2037
Typical Operating Characteristics
THD+N vs. Output Power
10
THD+N vs. Output Power
10
RL=3Ω
fin=1kHz
Ci=0.22µF
AV=12dB
BW<80kHz
1
THD+N (%)
THD+N (%)
1
RL=4Ω
fin=1kHz
Ci=0.22µF
AV=12dB
BW<80kHz
VDD=2.4V
0.1
VDD=2.4V
0.1
VDD=3.6V
VDD=3.6V
VDD=5.0V
0.01
10m
100m
1
0.01
10m
5
Output Power (W)
5
THD+N vs. Frequency
1
VDD=2.4V
0.1
VDD=3.6V
0.01
10m
VDD=5.0V
RL=3Ω
Ci=0.22µF
AV=12dB
BW<80kHz
1
PO=1W
0.1
PO=1.7W
VDD=5.0V
100m
1
0.01
3
20
100
Output Power (W)
THD+N vs. Frequency
THD+N vs. Frequency
THD+N (%)
PO=1W
0.1
VDD=5.0V
RL=8Ω
Ci=0.22µF
AV=12dB
BW<80kHz
1
PO=0.5W
0.1
PO=1.5W
20
100
10k 20k
10
VDD=5.0V
RL=4Ω
Ci=0.22µF
AV=12dB
BW<80kHz
1
1k
Frequency (Hz)
10
THD+N (%)
1
10
RL=8Ω
fin=1kHz
Ci=0.22µF
AV=12dB
BW<80kHz
THD+N (%)
THD+N (%)
100m
Output Power (W)
THD+N vs. Output Power
10
0.01
VDD=5.0V
1k
PO=0.9W
0.01
10k 20k
20
Frequency (Hz)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Aug., 2008
100
1k
10k 20k
Frequency (Hz)
6
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APA2037
Typical Operating Characteristics (Cont.)
THD+N vs. Frequency
THD+N vs. Frequency
10
VDD=3.6V
RL=4Ω
Ci=0.22µF
AV=12dB
BW<80kHz
1
PO=0.1W
PO=0.5W
0.1
PO=0.7W
VDD=3.6V
RL=8Ω
Ci=0.22µF
AV=12dB
BW<80kHz
1
THD+N (%)
THD+N (%)
10
PO=0.1W
PO=0.25W
0.1
PO=0.45W
0.01
20
100
1k
0.01
10k 20k
20
100
Frequency (Hz)
THD+N vs. Frequency
PO=0.1W
THD+N (%)
THD+N (%)
0.01
10
VDD=2.4V
RL=4Ω
Ci=0.22µF
AV=12dB
BW<80kHz
0.1
PO=0.3W
VDD=2.4V
RL=8Ω
Ci=0.22µF
AV=12dB
BW<80kHz
1
PO=0.1W
0.1
20
100
1k
0.01
10k 20k
Frequency (Hz)
20
VDD=5V,THD+N=1%
RL=4Ω,THD+N=1%
1.5
1.0
0.5
0.0
RL=8Ω,THD+N=1%
3.0
3.5
4.0
4.5
VDD=3.6V,THD+N=10%
VDD=3.6V,THD+N=1%
2.0
VDD=2.4V,THD+N=10%
1.5
VDD=2.4V,THD+N=1%
1.0
0.0
3
5.0
8
13
18
23
28
32
Load Resistance (Ω)
Supply Volume (V)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Aug., 2008
2.5
0.5
RL=8Ω,THD+N=10%
2.4
fin=1kHz
AV=12dB
Mono
VDD=5V,THD+N=10%
3.0
RL=3Ω,THD+N=1%
2.0
10k 20k
Output Power vs. Load Resistance
Output Power (W)
Output Power (W)
2.5
1k
3.5
fin=1kHz
RL=3Ω,THD+N=10%
AV=12dB
Mono
RL=4Ω,THD+N=10%
3.0
100
PO=0.2W
Frequency (Hz)
Output Power vs. Supply Voltage
3.5
10k 20k
THD+N vs. Frequency
10
1
1k
Frequency (Hz)
7
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APA2037
Typical Operating Characteristics (Cont.)
Power Dissipation vs. Output Power
Power Dissipation vs. Output Power
1.0
1.5
RL=3Ω
RL=4Ω
1.0
0.5
VDD=5V
fin=1kHz
AV=12dB
Mono
RL=8Ω
0.0
0.0
0.8
Power Dissipation (W)
Power Dissipation (W)
2.0
RL=3Ω
0.6
RL=4Ω
0.4
RL=8Ω
0.0
0.5
1.0
1.5
2.0
VDD=3.6V
fin=1kHz
AV=12dB
Mono
0.2
2.5
3.0
0.0
0.3
0.6
0.9
1.2
1.5
1.8
Output Power (W)
Output Power (W)
Supply Current vs. Output Power
Supply Current vs. Output Power
0.8
1.0
RL=3Ω
RL=3Ω
0.6
Supply Current (A)
Supply Current (A)
0.8
0.6
RL=4Ω
0.4
RL=8Ω
VDD=5V
fin=1kHz
AV=12dB
Mono
0.2
0.0
0.0
0.5
1.0
1.5
2.0
2.5
RL=4Ω
0.4
RL=8Ω
0.2
VDD=3.6V
fin=1kHz
Av=12dB
Mono
0.0
0.0
3.0
0.3
Output Power (W)
Crosstalk vs. Frequency
-20
Crosstalk (dB)
-40
-20
-40
-60
-80
Right to Left
1.2
1.5
1.8
TT
VDD=5.0V
RL=4Ω
AV=12dB
Ci=0.22µF
PO=210mW
-60
-80
Right to Left
-100
-100
Left to Right
-120
-140
20
0.9
Crosstalk vs. Frequency
+0
TT
VTDDT=5.0V
RL=3Ω
AV=12dB
Ci=0.22µF
PO=240mW
Crosstalk (dB)
+0
0.6
Output Power (W)
-140
100
1k
10k 20k
20
100
1k
10k 20k
Frequency (Hz)
Frequency (Hz)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Aug., 2008
Left to Right
-120
8
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APA2037
Typical Operating Characteristics (Cont.)
Crosstalk vs. Frequency
-20
Crosstalk (dB)
-40
-60
-80
Right to Left
-100
-120
100
1k
TTT TT
VDD=3.6V
-20 RL=4Ω
AV=12dB
Ci=0.22µF
-40 P =100mW
O
-60
-80
Right to Left
-100
Left to Right
-140
20
Crosstalk vs. Frequency
+0
T
VDD=5.0V
RL=8Ω
AV=12dB
Ci=0.22µF
PO=130mW
Crosstalk (dB)
+0
Left to Right
-120
-140
20
10k 20k
100
Frequency (Hz)
Crosstalk (dB)
Crosstalk (dB)
-60
-80
Right to Left
+0 TTTTT T T
VDD=2.4V
RL=4Ω
-20
AV=12dB
Ci=0.22µF
-40 PO=45mW
-60
-80
Right to Left
-100
-100
Left to Right
Left to Right
-120
20
100
1k
-120
-140
10k 20k
20
100
Crosstalk vs. Frequency
Output Noise Voltage vs. Frequency
+0
TTTTT TT
VDD=2.4V
-20 RL=8Ω
AV=12dB
Ci=0.22µF
-40 PO=30mW
Output Noise Voltage (Vrms)
50u
-60
-80
Right to Left
-100
Left to Right
-120
-140
20
100
10k 20k
1k
Frequency (Hz)
Frequency (Hz)
Crosstalk (dB)
10k 20k
Crosstalk vs. Frequency
Crosstalk vs. Frequency
+0 TTTTT
VDD=3.6V
RL=8Ω
-20
AV=12dB
Ci=0.22µF
-40 PO=65mW
-140
1k
Frequency (Hz)
1k
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Aug., 2008
Right channel
10u
1u
20
10k 20k
Frequency (Hz)
Left channel
20u
VDD=5.0V
RL=8Ω
AV=12dB
Ci=0.22µF
A-Weighting
100
10k 20k
1k
Frequency (Hz)
9
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APA2037
Typical Operating Characteristics (Cont.)
Output Noise Voltage vs. Frequency
Output Noise Voltage vs. Frequency
50u
20u
Output Noise Voltage (Vrms)
Output Noise Voltage (Vrms)
50u
Right channel
Left channel
10u
VDD=3.6V
RL=8Ω
AV=12dB
Ci=0.22µF
A-Weighting
1u
20
100
1k
20u
Right channel
10u
Left channel
VDD=2.4V
RL=8Ω
AV=12dB
Ci=0.22µF
A-Weighting
1u
10k 20k
20
100
Frequency (Hz)
PSRR vs. Frequency
-30
+0
RL=8Ω
AV=12dB
Cb=0.22µF
Ci=0.22µF
Vrr=0.2Vrms
Power Supply Rejection Ratio (dB)
Power Supply Rejection Ratio (dB)
-20
-40
-50
-60
-70
VDD=2.4V
-80
-90
-100
20
VDD=3.6V
VDD=5.0V
100
1k
-10
-20
-30
-40
-50
Cb=0.01µF
Cb=0.1µF
-60
-70 Cb=0.47µF
-80
Cb=1µF
-90
-100
20
10k 20k
VDD=3.6V
RL=8Ω
AV=12dB
Ci=0.22µF
Vrr=0.2Vrms
100
Frequency (Hz)
Common Mode Rejection Ratio (dB)
Common Mode Rejection Ratio (dB)
RL=8Ω
AV=12dB
Vin=0.2V PP
Ci=0.22µF
-30
-40
-50
VDD=2.4V
-60
-70
-80
20
VDD=3.6V
VDD=5.0V
100
1k
+0
-10
-20
RL=8Ω
AV=12dB
fin=1kHz
Ci=0.22µF
-30
-40
-50
VDD=2.4V
VDD=3.6V
-60
VDD=5.0V
-70
-80
-90
-100
10k 20k
Frequency (Hz)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Aug., 2008
10k 20k
CMRR vs. Common Mode Input Voltage
CMRR vs. Frequency
-20
1k
Frequency (Hz)
+0
-10
10k 20k
PSRR vs. Frequency
+0
-10
1k
Frequency (Hz)
1
2
3
4
5
Common Mode Input Voltage (Vrms)
10
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APA2037
Typical Operating Characteristics (Cont.)
Frequency Response
Frequency Response
+14
+220
+12
+140
+8
VDD=5.0V
AV=12dB
RL=8Ω
Ci=0.22µF
+6
+4
100
1k
10k
200k
+220
+10
+180
Phase
+8
+140
VDD=3.6V
AV=12dB
RL=8Ω
Ci=0.22µF
+100
+6
+60
+4
10
100
Frequency Response
Supply Current vs. Supply Voltage
+14
10
+260
AV=12dB
No Load
Gain
8
+10
+180
Phase
+8
+140
VDD=2.4V
AV=12dB
RL=8Ω
Ci=0.22µF
+6
100
1k
10k
200k
Supply Current (mA)
+220
Phase (deg)
Gain (dB)
+12
10
6
4
+100
2
+60
0
2.4
3.5
4.0
4.5
5.0
Frequency (Hz)
Start-up Time vs. Bypass Capacitor
GSM Power Supply Rejection vs.
Frequency
VDD=5.0V
AV=12dB
No Load
5.5
+0
-40
-80
-120
Output Voltage (dBV)
Start-up Time (ms)
3.0
Supply Voltage (V)
200
150
+60
200k
10k
Frequency (Hz)
Frequency (Hz)
+4
1k
+100
100
50
-160
+0
Supply Voltage (dBV)
10
+260
Phase (deg)
+180
Phase
Gain (dB)
+10
Phase (deg)
Gain (dB)
+14
Gain
Gain
+12
+260
-40
-80
-120
0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
-160 0
Bypass Capacitor (µF)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Aug., 2008
400
800
1.2k
1.6k
2k
Frequency (Hz)
11
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APA2037
Operating Waveforms
GSM Power Supply Rejection vs. Time
Power On
VDD
1
VDD
1
2
VROUT
VROUT
2
CH1: VDD, 2V/Div, DC
CH1: VDD, 100mV/Div, DC
Voltage Offset = 5.0V
CH2: VROUT, 20mV/Div, DC
CH2: VROUT, 50mV/Div, DC
TIME: 20ms/Div
TIME: 2ms/Div
Shutdown Release
Power Off
VRSD
VDD
1
1
2
VROUT
VROUTN
2
CH1: VRSD, 2V/Div, DC
CH2: VROUTN, 2V/Div, DC
CH1: VDD, 2V/Div, DC
CH2: VROUT, 50mV/Div, DC
TIME: 20ms/Div
TIME: 50ms/Div
Copyright  ANPEC Electronics Corp.
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APA2037
Operating Waveforms (Cont.)
Shutdown
VRSD
1
VROUTN
2
CH1: VRSD, 2V/Div, DC
CH2: VROUTN, 2V/Div, DC
TIME: 20ms/Div
Copyright  ANPEC Electronics Corp.
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APA2037
Block Diagram
LINN
LOUTP
LOUTN
LINP
LBYPASS
LSD
RSD
Bias and Control Circuitrys
RINP
RBYPASS
ROUTN
ROUTP
RINN
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APA2037
Typical Application Circuits
Single-ended input mode
VDD
Cs2
Cs1
0.1µF
Gnd
10µF
7 LVDD
19 RVDD
40kΩ Rf1
Left
Channel
Input
Ci1
0.22µF
Ci2
0.22µF
Ri1
LINN 13
4 LOUTP
10kΩ
Ri2
6 LOUTN
LINP 12
4Ω
10kΩ
40kΩ Rf2
11 LBYPASS
LSD 9
SHUTDOWN
Control
Bias and Control
Circuitrys
RSD 14
RLSD
100kΩ
RRSD
Right
Channel
Input
Ci3
Ri3
0.22µF
10kW
Ci4
Ri4
0.22µF
Cb1
Cb2
40kΩ Rf3
100kΩ
RINP 16
13 RBYPASS
GND
3 ROUTN
1 ROUTP
RINN 17
4Ω
10kW
40kΩ Rf4
2 GND
5 GND
Gnd
Copyright  ANPEC Electronics Corp.
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APA2037
Typical Application Circuits (Cont.)
Differential input mode
VDD
Cs2
Cs1
0.1µF Gnd 10µF
7 LVDD
19 RVDD
40kΩ Rf1
Ci1
Left
Channel
Input
0.22µF
Ci2
0.22µF
Ri1
LINN 13
4 LOUTP
10kΩ
Ri2
6 LOUTN
LINP 12
4Ω
10kΩ
40kΩ Rf2
11 LBYPASS
LSD 9
SHUTDOWN
Control
Bias and Control
Circuitrys
RSD 14
RLSD
100kΩ
RRSD
Right
Channel
Input
Ci3
Ri3
0.22µF
10kΩ
Ci4
Ri4
0.22µF
Cb1
Cb2
40kΩ Rf3
100kΩ
RINP 16
13 RBYPASS
GND
3 ROUTN
1 ROUTP
RINN 17
4Ω
10kΩ
40kΩ Rf4
2 GND
5 GND
Gnd
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APA2037
Function Description
Application Information
Fully Differential Amplifier
The power amplifiers are fully differential amplifiers with
Input Resistance (Ri)
The gain for the APA2037 is set by the external input resistors (Ri) and internal feedback resistors (Rf).
differential inputs and outputs. The fully differential amplifier has some advantages versus traditional amplifiers.
AV =
First, don’t need the input coupling capacitors because
the common-mode feedback compensates the input bias.
Rf
Ri
(1)
The internal feedback resistors are 40kΩ typical. For the
The inputs can be biased from 0.5V~VDD-0.5V, and the
outputs are still biased at mid-supply of the power
performance of a fully differential amplifier, it’s better to
select matching input resistors R i1 , Ri2 , Ri3 ,and R i4 .
amplifier. If the inputs are biased at out of the input range,
the coupling capacitors are required. Second, the fully
Therefore, 1% tolerance resistors are recommended. If
the input resistors are not matched, the CMRR and PSRR
differential amplifier has outstanding immunity against
supply voltage ripple (217Hz) cuased by the GSM RF trans-
performance are worse than using matching devices.
mitters’ signal which is better than the typical audio
amplifier.
Input Capacitor (Ci)
When the APA2037 is driven by a differential input source,
Mono Operation
the input capacitor may not be required.
The APA2037 has independent shutdown to control each
channel’s power amplifier, this allows user switching au-
In the single-ended input application, an input capacitor,
Ci, is required to allow the amplifier to bias the input sig-
dio amplifier to stereo or mono operation and giving flexible control at design.
nal to the proper DC level for optimum operation. In this
case, Ci and the input resistance Ri form a high-pass filter
with the corner frequency determined in the following
equation:
1
FC(highpass) =
(2)
2πR iCi
The value of Ci must be considered carefully because it
Thermal Protection
The over-temperature circuit limits the junction temperature of the APA2037. When the junction temperature exceeds T J = +150 oC, a thermal sensor turns off the
amplifiers, allowing the device to cool. The thermal sensor allows the amplifiers to start-up after the junction tem-
directly affects the low frequency performance of the circuit.
Consider the example where Ri is 10kΩ and the specifi-
o
perature cools down to about 125 C. The thermal protection is designed with a 25 oC hysteresis to lower the aver-
cation that calls for a flat bass response down to 100Hz.
The equation is reconfigured below:
age TJ during continuous thermal overload conditions,
increasing lifetime of the IC.
Ci =
1
2πRiFc
(3)
Over-Current Protection
The APA2037 monitors the output buffers’current. When
the over current occurs, the output buffers’current will be
Consider the input resistance variation, the Ci should be
0.16µF. Therefore, one would likely choose a value in the
reduced and limited to a fold-back current level.
The power amplifier will go back to normal operation until
range of 0.22µF to 0.47µF. A further consideration for this
capacitor is the leakage path from the input source through
the over-current situation has been removed. In addition,
if the over-current period is long enough and the IC’s
the input network (Ri + Rf, Ci) to the load.
junction temperature reaches the thermal protection
threshold, the IC enters thermal protection mode.
input of the amplifier. The offset reduces useful
headroom, especially in high gain applications. For this
Shutdown Function
reason a low-leakage tantalum or ceramic capacitor is
the best choice. When polarized capacitors are used, the
This leakage current creates a DC offset voltage at the
The APA2037 has separated shutdown control for each
channel. User can shutdown left channel amplifier by
positive side of the capacitor should face the amplifier
input in most applications because the DC level of the
LSD, or shutdown right channel amplifier by RSD. If all
the amplifiers are shutdown, APA2037 only consumes
amplifiers’ inputs are held at VDD/2. Please note that it is
important to confirm the capacitor polarity in the application.
1µA typical..
Copyright  ANPEC Electronics Corp.
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APA2037
Application Information (Cont.)
Effective Bypass Capacitor (CBYPASS)
The optimum decoupling is achieved by using two different types of capacitors that target on different types of
The BYPASS pin sets the VDD/2 for internal reference by
voltage divider. Adding capacitors at this pin to filter the
noises on the power supply leads. For higher frequency
transients, spikes, or digital hash on the line, a good low
noise and regulator the mid-supply rail will increase the
PSRR and noise performance.
equivalent-series- resistance (ESR) ceramic capacitor, typically 0.1µF, is placed as close as possible to the device
The capacitors should be as close to the device as
possible. The effect of a larger bypass capacitor will im-
VDD lead works best. For filtering lower frequency noise
signals, a large aluminum electrolytic capacitor of 10µF
prove PSRR due to increased supply stability.
or greater placed near the audio power amplifier is
recommended.
The bypass capacitance also affects to the start time. The
large capacitors will increase the start time when device
Fully Differential Amplifier Efficiency
exist shutdown.
The traditional class AB power amplifier efficiency can be
calculated starts out as being equal to the ratio of power
from the power supply to the power delivered to the load.
The following equations are the basis for calculating
amplifier efficiency.
P
(4)
Efficiency (η) = O
PSUP
Optimizing Depop Circuitry
Circuitry has been included in the APA2037 to minimize
the amount of popping noise at power-up and when coming out of shutdown mode. Popping occurs whenever a
voltage step is applied to the speaker. In order to eliminate clicks and pops, all capacitors must be fully discharged before turn-on. Rapid on/off switching of the de-
where:
2
PO =
The value of Ci will also affect turn-on pops. The bypass
VOrms =
voltage ramp up should be slower than input bias voltage.
2
VOrms
V
= P
RL
2RL
vice or the shutdown function will cause the click and pop
circuitry.
VP
2
2VDD VPP
πRL
Although the BYPASS pin current source cannot be
PSUP = VDD XIDD(AVG)=
modified, the size of CBYPASS can be changed to alter the
device turn-on time and the amount of clicks and pops.
IDD(AVG) =
2VP
πRL
By increasing the value of CBYPASS, turn-on pop can be
reduced. However, the tradeoff for using a larger bypass
So the Efficiency (η) is:
capacitor is to increase the turn-on time for this device.
There is a linear relationship between the size of CBYPASS
Efficiency ( η) =
and the turn-on time.
A high gain amplifier intensifies the problem as the small
(5)
πVP π 2PORL
=
4VDD
4VDD
(6)
Table 1 calculates efficiencies for four different output
power levels. Note that the efficiency of the amplifier is
quite low for lower power levels and rises sharply as
power to the load is increased resulting in nearly flat internal power dissipation over the normal operating range.
Note that the internal dissipation at full output power is
less than in the half power range. Calculating the efficiency for a specific system is the key to proper power
supply design. For a stereo 1W audio system with 8Ω
loads and a 5V supply, the maximum draw on the power
supply is almost 1.63W.
delta in voltage is multiplied by the gain. Hence, it is advantageous to use low-gain configurations.
Power Supply Decoupling Capacitor (Cs)
The APA2037 is a high-performance CMOS audio amplifier that requires adequate power supply decoupling to
ensure the output total harmonic distortion (THD+N) is
as low as possible. Power supply decoupling also prevents the oscillations caused by long lead length between
the amplifier and the speaker.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Aug., 2008
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APA2037
Application Information (Cont.)
Fully Differential Amplifier Efficiency (Cont.)
R L (Ω)
8
4
3
P O (W)
Efficiency
(%)
IDD(A)
0.25
0.50
1
1.6
0.4
1.2
2
2.6
0.5
1
2
3
30.1
43.1
61.5
77.7
27.5
48.1
62.4
74.1
27.5
38.7
55.1
66.8
0.17
0.23
0.33
0.43
0.29
0.51
0.66
0.70
0.37
0.52
0.74
0.92
1. All components should be placed close to the APA2037.
For example, the input capacitor (Ci) should be close
to APA2037’s input pins to avoid causing noise cou-
P D (W) P SUP (W)
0.58
0.66
0.63
0.46
1.06
1.30
1.21
0.91
1.32
1.58
1.63
1.49
pling to APA2037’s high impedance inputs; the
decoupling capacitor (Cs ) should be placed by the
0.83
1.16
1.63
2.06
1.46
2.50
3.21
3.51
1.82
2.58
3.63
4.49
APA2037’s power pin to decouple the power rail noise.
2. The output traces should be short, wide ( >50mil), and
symmetric.
3. The input trace should be short and symmetric.
4. The power trace width should greater than 50mil.
5. The TQFN5X5-20A Thermal PAD should be soldered
on PCB, and the ground plane needs soldered mask
(to avoid short circuit) except the Thermal PAD area.
Table 1: Efficiency vs. Output Power in 5-V Differential
Amplifier Syetems
A final point to remember about linear amplifiers (either
SE or Differential) is how to manipulate the terms in the
efficiency equation to utmost advantage when possible.
Note that in equation, VDD is in the denominator. This indicates that as VDD goes down, efficiency goes up. In other
words, use the efficiency analysis to choose the correct
supply voltage and speaker impedance for the application.
Layout Recommendation
ThermalVi
a diameter
0.3mm X 9
1mm
4.8mm
5.8mm
0.49mm
0.65mm
3.1mm
Solder Mask
to Prevent
Short Circuit
Ground
plane for
Thermal
PAD
Figure 5. TQFN5x5-20A Land Pattern Recommendation
Copyright  ANPEC Electronics Corp.
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APA2037
Package Information
TQFN5x5-20A
A
E
D
b
Pin 1
D2
A1
A3
L k
E2
Pin 1
Corner
e
S
Y
M
B
O
L
TQFN5x5-20A
INCHES
MILLIMETERS
MIN.
MAX.
MIN.
MAX.
A
0.70
0.80
0.028
0.031
A1
0.00
0.05
0.000
0.002
A3
0.20 REF
0.008 REF
b
0.25
0.35
0.010
0.014
D
4.90
5.10
0.193
0.201
D2
3.00
3.40
0.118
0.134
E
4.90
5.10
0.193
0.201
E2
3.00
3.40
0.118
0.134
e
0.65 BSC
L
0.45
K
0.20
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Aug., 2008
0.026 BSC
0.018
0.65
0.026
0.008
20
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APA2037
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
TQFN5x5-20A
A
H
T1
C
12.4+2.00 13.0+0.50
-0.00
-0.20
d
D
1.5 MIN.
20.2 MIN.
W
E1
12.0±0.30 1.75±0.10
F
330.0±2.00
50 MIN.
5.5±0.10
P0
P1
P2
D0
D1
T
A0
B0
K0
4.0±0.10
8.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
5.30±0.20
5.30±0.20
1.30±0.20
(mm)
Devices Per Unit
Package Type
TQFN5x5-20A
Unit
Tape & Reel
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Aug., 2008
Quantity
2500
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APA2037
Taping Direction Information
TQFN5x5-20A
USER DIRECTION OF FEED
Reflow Condition
(IR/Convection or VPR Reflow)
tp
TP
Critical Zone
TL to TP
Ramp-up
Temperature
TL
tL
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25°C to Peak
Time
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B,A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Aug., 2008
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Description
245°C, 5 sec
1000 Hrs Bias @125°C
168 Hrs, 100%RH, 121°C
-65°C~150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms, 1tr > 100mA
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APA2037
Classification Reflow Profiles
Profile Feature
Average ramp-up rate
(TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature (Tp)
Time within 5°C of actual
Peak Temperature (tp)
Ramp-down Rate
Sn-Pb Eutectic Assembly
Pb-Free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
217°C
60-150 seconds
See table 1
See table 2
10-30 seconds
20-40 seconds
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Time 25°C to Peak Temperature
Note: All temperatures refer to topside of the package. Measured on the body surface.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
3
3
Volume mm
≥350
225 +0/-5°C
225 +0/-5°C
Volume mm
<350
<2.5 mm
240 +0/-5°C
≥2.5 mm
225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness
3
3
3
Volume mm
Volume mm
Volume mm
<350
350-2000
>2000
<1.6 mm
260 +0°C*
260 +0°C*
260 +0°C*
1.6 mm – 2.5 mm
260 +0°C*
250 +0°C*
245 +0°C*
≥2.5 mm
250 +0°C*
245 +0°C*
245 +0°C*
* Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated
classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL
level.
Package Thickness
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
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