TYSEMI BSS215P

Product specification
BSS215P
OptiMOS™ P2 Small-Signal-Transistor
Product Summary
Features
V DS
• P-channel
R DS(on),max
• Enhancement mode
• Super Logic Level (2.5V rated)
-20
V
V GS=-4.5 V
150
mΩ
V GS=-2.5 V
280
ID
-1.5
A
• Avalanche rated
PG-SOT23
• Qualified according to AEC Q101
3
• 100% lead-free; RoHS compliant
• Halogen-free according to IEC61249-2-21
1
2
Type
Package
Tape and Reel Information
Marking
Lead Free
Packing
BSS215P
PG-SOT23
H6327: 3000 pcs/ reel
YDs
Yes
Non dry
Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter
Symbol Conditions
Continuous drain current
ID
Value
T A=25 °C
-1.5
T A=70 °C
-1.18
Unit
A
Pulsed drain current
I D,pulse
T A=25 °C
-6
Avalanche energy, single pulse
E AS
I D=-1.5 A, R GS=25 Ω
11
mJ
Reverse diode dv /dt
dv /dt
I D=-1.5 A,
V DS=-16V,
di /dt =-200A/µs,
T j,max=150 °C
6
kV/µs
Gate source voltage
V GS
Power dissipation1)
P tot
Operating and storage temperature
T j, T stg
ESD Class
T A=25 °C
JESD22-A114 -HBM
Soldering Temperature
IEC climatic category; DIN IEC 68-1
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±12
V
0.5
W
-55 ... 150
°C
0 (<250V)
V
260 °C
°C
55/150/56
°C
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Product specification
BSS215P
Parameter
Values
Symbol Conditions
Unit
min.
typ.
max.
-
-
250
-20
-
-
Thermal characteristics
Thermal resistance,
junction - ambient
R thJA
minimal footprint1)
K/W
Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V (BR)DSS V GS=0 V, I D=-250 µA
Gate threshold voltage
V GS(th)
V DS=VGS, I D=-11 µA
-1.2
-0.9
-0.6
Drain-source leakage current
I DSS
V DS=-20V, V GS=0 V,
T j=25 °C
-
-
-1
V DS=-20V, V GS=0V,
T j=150 °C
-
-
-100
V
μA
Gate-source leakage current
I GSS
V GS=-12V, V DS=0V
-
-
-100
nA
Drain-source on-state resistance
R DS(on)
V GS=2.5 V,
I D=-1.1 A
-
166
280
mΩ
V GS=4.5 V,
I D=-1.5 A
-
105
150
|V DS|>2|I D|R DS(on)max,
I D=1.18 A
-
4.5
-
Transconductance
g fs
S
1)
Performed on 40mm2 FR4 PCB. The traces are 1mm wide, 70μm thick and 20mm long; they are present on both sides
of the PCB.
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Product specification
BSS215P
Parameter
Values
Symbol Conditions
Unit
min.
typ.
max.
-
260
346
-
102
135
Dynamic characteristics
Input capacitance
C iss
Output capacitance
C oss
Reverse transfer capacitance
Crss
-
85
128
Turn-on delay time
t d(on)
-
6.7
-
Rise time
tr
-
9.7
-
Turn-off delay time
t d(off)
-
14.5
-
Fall time
tf
-
14.0
-
Gate to source charge
Q gs
-
-0.49
-
Gate to drain charge
Q gd
-
-1.9
-
Gate charge total
Qg
-
-3.6
-
Gate plateau voltage
V plateau
-
-1.9
-
V
-
-
-0.5
A
-
-
-6
-
-0.8
-1.1
V
-
21.0
-
ns
-
-3.7
-
nC
V GS=0 V,
V DS=-15 V, f =1 MHz
V DD=-10 V,
V GS=-4.5 V,
I D=-1.5 A, R G=6 Ω
pF
ns
Gate Charge Characteristics
V DD=16 V,
I D=-1.5 A,
V GS=0 to -4.5 V
nC
Reverse Diode
Diode continous forward current
IS
T A=25 °C
Diode pulse current
I S,pulse
Diode forward voltage
V SD
Reverse recovery time
t rr
Reverse recovery charge
Q rr
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V GS=0 V, I F=-1.5 A,
T j=25 °C
V R=10 V, I F=-1.5 A,
di F/dt =100 A/µs
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