TYSEMI BSS139

SMD Type
Product specification
BSS139
®
SIPMOS Small-Signal-Transistor
Product Summary
Features
• N-channel
• Depletion mode
V DS
250
V
R DS(on),max
30
Ω
I DSS,min
0.03
A
• dv /dt rated
SOT-23
Type
Package
Ordering Code
Tape and Reel Information
Marking
BSS139
SOT-23
Q62702-S612
E6327: 3000 pcs/reel
STs
Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter
Symbol Conditions
Continuous drain current
ID
T A=25 °C
0.10
T A=70 °C
0.08
0.4
Pulsed drain current
I D,pulse
T A=25 °C
Reverse diode dv /dt
dv /dt
I D=0.1 A, V DS=200 V,
di /dt =200 A/µs,
T j,max=150 °C
Gate source voltage
V GS
6
±20
ESD sensitivity (HBM) as per
MIL-STD 883
Unit
A
kV/µs
V
Class 1
Power dissipation
P tot
Operating and storage temperature
T j, T stg
T A=25 °C
IEC climatic category; DIN IEC 68-1
http://www.twtysemi.com
Value
[email protected]
0.36
W
-55 ... 150
°C
55/150/56
4008-318-123
1 of 3
SMD Type
Product specification
BSS139
Parameter
Values
Symbol Conditions
Unit
min.
typ.
max.
-
-
350
Thermal characteristics
Thermal resistance,
junction - minimal footprint
R thJA
K/W
Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V (BR)DSS V GS=-3 V, I D=250 µA
250
-
-
Gate threshold voltage
V GS(th)
V DS=3 V, I D=56 µA
-2.1
-1.4
-1
Drain-source leakage current
I D (off)
V DS=250 V,
V GS=-3 V, T j=25 °C
-
-
0.1
V DS=250 V,
V GS=-3 V, T j=125 °C
-
-
10
V
µA
Gate-source leakage current
I GSS
V GS=20 V, V DS=0 V
-
-
10
nA
Saturated drain current
I DSS
V GS=0 V, V DS=10 V
30
-
-
mA
Drain-source on-state resistance
R DS(on)
V GS=0 V, I D=15 mA
-
12.5
30
V GS=10 V, I D=0.1 A
-
7.8
14.0
|V DS|>2|I D|R DS(on)max,
I D=0.08 A
0.06
0.13
-
Transconductance
http://www.twtysemi.com
g fs
[email protected]
4008-318-123
Ω
S
2 of 3
SMD Type
Product specification
BSS139
Parameter
Values
Symbol Conditions
Unit
min.
typ.
max.
-
60
76
-
6.7
8.4
Dynamic characteristics
Input capacitance
C iss
Output capacitance
C oss
Reverse transfer capacitance
Crss
-
2.6
3.3
Turn-on delay time
t d(on)
-
5.8
8.7
Rise time
tr
-
5.4
8.1
Turn-off delay time
t d(off)
-
29
43
Fall time
tf
-
182
273
Gate to source charge
Q gs
-
0.14
0.21
Gate to drain charge
Q gd
-
1.3
2.0
Gate charge total
Qg
-
2.3
3.5
Gate plateau voltage
V plateau
-
-0.28
-
V
-
-
0.10
A
-
-
0.4
-
0.81
1.2
V
-
8.6
12.9
ns
-
2.1
3.1
nC
V GS=-3 V, V DS=25 V,
f =1 MHz
V DD=125 V,
V GS=-3...5 V,
I D=0.04 A, R G=6 Ω
pF
ns
Gate Charge Characteristics
V DD=200 V,
I D=0.04 A,
V GS=-3 to 5 V
nC
Reverse Diode
Diode continous forward current
IS
Diode pulse current
I S,pulse
Diode forward voltage
V SD
Reverse recovery time
t rr
Reverse recovery charge
Q rr
http://www.twtysemi.com
T A=25 °C
V GS=-3 V, I F=0.1 A,
T j=25 °C
V R=50 V, I F=0.04 A,
di F/dt =100 A/µs
[email protected]
4008-318-123
3 of 3