NBB-502 4 CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 4GHz Typical Applications • Narrow and Broadband Commercial and • Gain Stage or Driver Amplifiers for MWRadio/Optical Designs (PTP/PMP/ Military Radio Designs LMDS/UNII/VSAT/WLAN/Cellular/DWDM) • Linear and Saturated Amplifiers GENERAL PURPOSE AMPLIFIERS 4 Product Description The NBB-502 cascadable broadband GaInP/GaAs MMIC amplifier is a low-cost, high-performance solution for general purpose RF and microwave amplification needs. This 50Ω gain block is based on a reliable HBT proprietary MMIC design, providing unsurpassed performance for small-signal applications. Designed with an external bias resistor, the NBB-502 provides flexibility and stability. The NBB-502 is packaged in a low-cost, surface-mount ceramic package, providing ease of assembly for highvolume tape-and-reel requirements. It is available in either 1,000 or 3,000 piece-per-reel quantities. Optimum Technology Matching® Applied Si BJT GaAs HBT GaAs MESFET Si Bi-CMOS SiGe HBT Si CMOS !GaInP/HBT 2.94 min 3.28 max Pin 1 Indicator 1.00 min 1.50 max N5 Lid ID 1.70 min 1.91 max 2.39 min 2.59 max 0.025 min 0.125 max 0.50 nom 0.50 nom Pin 1 Indicator RF OUT Ground Ground RF IN 0.98 min 1.02 max 0.38 nom All Dimensions in Millimeters 0.37 min 0.63 max Notes: 1. Solder pads are coplanar to within ±0.025 mm. 2. Lid will be centered relative to frontside metallization with a tolerance of ±0.13 mm. 3. Mark to include two characters and dot to reference pin 1. Package Style: MPGA, Bowtie, 3x3, Ceramic Features GaN HEMT • Reliable, Low-Cost HBT Design • 19.0dB Gain, +13.0dBm P1dB@2GHz • High P1dB of [email protected] Pin 1 Indicator • Single Power Supply Operation 1 2 3 8 9 4 RF OUT • 50Ω I/O Matched for High Freq. Use Ground Ground RF IN 7 6 5 Ordering Information NBB-502 Cascadable Broadband GaAs MMIC Amplifier DC to 4GHz NBB-502-T1 or -T3Tape & Reel, 1000 or 3000 Pieces (respectively) NBB-502-E Fully Assembled Evaluation Board Functional Block Diagram Rev A0 020115 RF Micro Devices, Inc. 7628 Thorndike Road Greensboro, NC 27409, USA Tel (336) 664 1233 Fax (336) 664 0454 http://www.rfmd.com 4-365 NBB-502 Absolute Maximum Ratings Parameter RF Input Power Power Dissipation Device Current Channel Temperature Operating Temperature Storage Temperature GENERAL PURPOSE AMPLIFIERS 4 Rating Unit +20 300 70 200 -45 to +85 -65 to +150 dBm mW mA °C °C °C Caution! ESD sensitive device. RF Micro Devices believes the furnished information is correct and accurate at the time of this printing. However, RF Micro Devices reserves the right to make changes to its products without notice. RF Micro Devices does not assume responsibility for the use of the described product(s). Exceeding any one or a combination of these limits may cause permanent damage. Parameter Specification Min. Typ. Max. Unit Overall Small Signal Power Gain, S21 19.0 16.0 Gain Flatness, GF Input and Output VSWR Bandwidth, BW Output Power @ -1dB Compression, P1dB Noise Figure, NF Third Order Intercept, IP3 Reverse Isolation, S12 Device Voltage, VD Gain Temperature Coefficient, δGT/δT 3.6 20.5 19.0 17.0 ±0.8 1.55:1 1.50:1 1.55:1 4.2 dB dB dB dB GHz 13.0 14.0 4.0 +23.0 -17.0 3.9 -0.0015 dBm dBm dB dBm dB V dB/°C 4.2 Condition VD =+3.9V, ICC =35mA, Z0 =50Ω, TA =+25°C f=0.1GHz to 1.0GHz f=1.0GHz to 2.0GHz f=2.0GHz to 4.0GHz f=1.0GHz to 3.0GHz f=0.1GHz to 4.0GHz f=4.0GHz to 6.0GHz f=6.0GHz to 10.0GHz BW3 (3dB) f=2.0GHz f=6.0GHz f=3.0GHz f=2.0GHz f=0.1GHz to 10.0GHz MTTF versus Temperature @ ICC =35mA Case Temperature Junction Temperature MTTF 85 109.4 >1,000,000 °C °C hours 179 °C/W Thermal Resistance θJC 4-366 Thermal Resistance, at any temperature (in °C/Watt) can be estimated by the following equation: θJC (°C/Watt)=179[TJ(°C)/109.4] Rev A0 020115 NBB-502 Function GND 2 3 4 GND GND RF IN 5 6 7 8 GND GND GND RF OUT Description Interface Schematic Ground connection. For best performance, keep traces physically short and connect immediately to ground plane. Same as pin 1. Same as pin 1. RF input pin. This pin is NOT internally DC blocked. A DC blocking capacitor, suitable for the frequency of operation, should be used in most applications. DC coupling of the input is not allowed, because this will override the internal feedback loop and cause temperature instability. Same as pin 1. Same as pin 1. Same as pin 1. RF output and bias pin. Biasing is accomplished with an external series resistor and choke inductor to VCC. The resistor is selected to set the DC current into this pin to a desired level. The resistor value is determined by the following equation: ( V CC – V DEVICE ) R = ------------------------------------------I CC 9 GND Rev A0 020115 4 RF OUT RF IN Care should also be taken in the resistor selection to ensure that the current into the part never exceeds maximum datasheet operating current over the planned operating temperature. This means that a resistor between the supply and this pin is always required, even if a supply near 5.0V is available, to provide DC feedback to prevent thermal runaway. Alternatively, a constant current supply circuit may be implemented. Because DC is present on this pin, a DC blocking capacitor, suitable for the frequency of operation, should be used in most applications. The supply side of the bias network should also be well bypassed. Same as pin 1. 4-367 GENERAL PURPOSE AMPLIFIERS Pin 1 NBB-502 Typical Bias Configuration Application notes related to biasing circuit, device footprint, and thermal considerations are available on request. VCC RCC 4 GENERAL PURPOSE AMPLIFIERS 1,2,3 L choke (optional) 4 In 8 Out C block C block 5,6,7,9 VDEVICE VD = 3.9 V Recommended Bias Resistor Values Supply Voltage, VCC (V) Bias Resistor, RCC (Ω) 5 31 8 117 10 174 12 231 15 317 20 460 Application Notes Die Attach The die attach process mechanically attaches the die to the circuit substrate. In addition, it electrically connects the ground to the trace on which the chip is mounted, and establishes the thermal path by which heat can leave the chip. Wire Bonding Electrical connections to the chip are made through wire bonds. Either wedge or ball bonding methods are acceptable practices for wire bonding. Assembly Procedure Epoxy or eutectic die attach are both acceptable attachment methods. Top and bottom metallization are gold. Conductive silver-filled epoxies are recommended. This procedure involves the use of epoxy to form a joint between the backside gold of the chip and the metallized area of the substrate. A 150°C cure for 1 hour is necessary. Recommended epoxy is Ablebond 84-1LMI from Ablestik. Bonding Temperature (Wedge or Ball) It is recommended that the heater block temperature be set to 160°C±10°C. 4-368 Rev A0 020115 NBB-502 Tape and Reel Dimensions All Dimensions in Millimeters T A O B S D 4 330 mm (13") REEL ITEMS Diameter Micro-X, MPGA SYMBOL SIZE (mm) B 330 +0.25/-4.0 FLANGE Thickness Space Between Flange HUB GENERAL PURPOSE AMPLIFIERS F T F Outer Diameter Spindle Hole Diameter O S Key Slit Width Key Slit Diameter A D SIZE (inches) 13.0 +0.079/-0.158 18.4 MAX 12.4 +2.0 0.724 MAX 0.488 +0.08 102.0 REF 4.0 REF 13.0 +0.5/-0.2 0.512 +0.020/-0.008 1.5 MIN 20.2 MIN 0.059 MIN 0.795 MIN PIN 1 User Direction of Feed 4.0 All dimensions in mm See Note 1 2.00 ± 0.05 1.5 See Note 6 0.30 ± 0.05 +0.1 -0.0 A 1.5 MIN. 1.75 R0.3 MAX. 5.50 ± 0.05 See Note 6 12.00 ± 0.30 Bo Ko Ao 8.0 A R0.5 TYP SECTION A-A NOTES: 1. 10 sprocket hole pitch cumulative tolerance ±0.2. 2. Camber not to exceed 1 mm in 100 mm. 3. Material: PS+C 4. Ao and Bo measured on a plane 0.3 mm above the bottom of the pocket. 5. Ko measured from a plane on the inside bottom of the pocket to the surface of the carrier. 6. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole. Rev A0 020115 Ao = 3.6 MM Bo = 3.6 MM Ko = 1.7 MM 4-369 NBB-502 Device Voltage versus Amplifier Current P1dB versus Frequency at 25°C 4.00 20.0 P1dB (dBm) 10.0 3.90 5.0 3.85 0.0 20.00 25.00 30.00 35.00 40.00 45.00 50.00 1.0 2.0 POUT/Gain versus PIN at 2 GHz 4.0 5.0 6.0 POUT/Gain versus PIN at 6 GHz 20.0 18.0 18.0 16.0 16.0 14.0 14.0 POUT (dBm), Gain (dB) POUT (dBm), Gain (dB) 3.0 Frequency (GHz) Amplifier Current, ICC (mA) 12.0 10.0 8.0 6.0 12.0 10.0 8.0 6.0 4.0 4.0 Pout (dBm) 2.0 Pout (dBm) 2.0 Gain (dB) Gain (dB) 0.0 0.0 -14.0 -12.0 -10.0 -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 PIN (dBm) -14.0 -12.0 -10.0 -8.0 -6.0 -4.0 -2.0 0.0 2.0 PIN (dBm) Third Order Intercept versus Frequency at 25°C 30.0 25.0 Output IP3 (dBm) GENERAL PURPOSE AMPLIFIERS 4 Device Voltage, V D (V) 15.0 3.95 20.0 15.0 10.0 5.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Frequency (GHz) 4-370 Rev A0 020115 NBB-502 Note: The s-parameter gain results shown below include device performance as well as evaluation board and connector loss variations. The insertion losses of the evaluation board and connectors are as follows: 1GHz to 4GHz=-0.06dB 5GHz to 9GHz=-0.22dB 10GHz to 14GHz=-0.50dB 15GHz to 20GHz=-1.08dB S11 versus Frequency at +25°C S12 versus Frequency at +25°C -5.0 -10.0 -10.0 GENERAL PURPOSE AMPLIFIERS -5.0 4 S12 (dB) 0.0 S11 (dB) 0.0 -15.0 -15.0 -20.0 -20.0 -25.0 -25.0 0.0 5.0 10.0 0.0 5.0 Frequency (GHz) 10.0 Frequency (GHz) S21 versus Frequency at +25°C S22 versus Frequency at +25°C 25.0 0.0 -5.0 20.0 -10.0 S22 (dB) S21 (dB) 15.0 -15.0 10.0 -20.0 5.0 -25.0 0.0 -30.0 0.0 5.0 Frequency (GHz) Rev A0 020115 10.0 0.0 5.0 10.0 15.0 20.0 Frequency (GHz) 4-371 NBB-502 GENERAL PURPOSE AMPLIFIERS 4 4-372 Rev A0 020115