Data Sheet Fast Recovery Diode RF05VA1S lApplications General rectification lDimensions (Unit : mm) lLand size figure (Unit : mm) 1.1 0.17±0.1 0.05 1.9±0.1 2.5±0.2 lFeatures 1)Small mold type. (TUMD2) 2)Ultra high switching speed 3)Low VF 0.8 0.5 2.0 1.3±0.05 TUMD2 lConstruction Silicon epitaxial planer lStructure 0.8±0.05 0.6±0.2 ROHM : TUMD2 0.1 dot (year week factory) + day lTaping dimensions (Unit : mm) 8.0±0.2 2.75 lAbsolute maximum ratings (Ta=25C) Parameter Symbol VRM Reverse voltage (repetitive) VR Reverse voltage (DC) Average rectified forward current (*1) Io IFSM Forward current surge peak (60Hz・1cyc) Junction temperature Tj Storage temperature Tstg (*1)On the Glass epoxy substrate lElectrical characteristics (Ta=25C) Parameter Symbol VF Forward voltage φ 1.0±0.2 0 4.0±0.1 1.43±0.05 Limits 100 100 0.5 6 150 0.9±0.08 Unit V V A A C C -55 to +150 Min. Typ. Max. Unit - - 0.98 V IF=0.5A VR=100V IF=0.5A,IR=1A,Irr=0.25*IR Reverse current IR - - 10 μA Reverse recovery time trr - - 25 ns www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2.8±0.05 0.25±0.05 1.75±0.1 φ 1.55±0.1 0 2.0±0.05 3.5±0.05 4.0±0.1 1/4 Conditions 2011.10 - Rev.A Data Sheet RF05VA1S 10 1000 REVERSE CURRENT:IR(nA) FORWARD CURRENT:IF(A) Tj=150°C Tj=150°C 1 Tj=125°C Tj=25°C 0.1 Tj=125°C 100 Tj=75°C 10 Tj=25°C 1 Tj=75°C 0 0.01 0 300 400 500 600 700 800 900 1000 1100 1200 1300 20 40 60 100 100 850 f=1MHz IF=0.5A FORWARD VOLTAGE:VF(mV) CAPACITANCE BETWEEN TERMINALS:Ct(pF) 80 REVERSE VOLTAGE:VR(V) VR-IR CHARACTERISTICS FORWARD VOLTAGE:VF(mV) VF-IF CHARACTERISTICS 10 840 830 820 AVE:819.3mV 810 1 800 0 10 20 30 VF DISPERSION MAP REVERSE VOLTAGE:VR(V) VR-Ct CHARACTERISTICS 30 1 AVE:0.80nA Ta=25°C 29 VR=100V n=20pcs 28 CAPACITANCE BETWEEN TERMINALS:Ct(pF) REVERSE CURRENT:IR(nA) 10 27 f=1MHz VR=0V AVE:28.18pF 26 25 24 23 22 21 0.1 20 IR DISPERSION MAP www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Ct DISPERSION MAP 2/4 2011.10 - Rev.A Data Sheet RF05VA1S 30 25 1cyc IFSM REVERSE RECOVERY TIME:trr(ns) PEAK SURGE FORWARD CURRENT:IFSM(A) 30 8.3ms 20 15 10 AVE:12.2A 5 0 IF=0.5A IR=1A Irr=0.25×IR 25 20 15 10 AVE:12.2ns 5 0 trr DISPERSION MAP IFSM DISPERSION MAP 100 100 8.3ms PEAK SURGE FORWARD CURRENT:IFSM(A) PEAK SURGE FORWARD CURRENT:IFSM(A) IFSM 8.3ms 1cyc 10 1 IFSM 10 1 1 10 100 1 10 TIME:t(ms) IFSM-t CHARACTERISTICS NUMBER OF CYCLES IFSM-CYCLE CHARACTERISTICS 1000 100 0.9 Rth(j-a) On glass-epoxy substrate soldering land 6mm□ 0.8 100 Rth(j-l) Rth(j-a) On glass-epoxy substrate soldering land 10mm□ 10 D.C. D=0.8 0.7 FORWARD POWER DISSIPATION:Pf(W) TRANSIENT THERMAL IMPEDANCE:Rth (°C/W) t 0.6 D=0.5 half sin wave 0.5 0.4 D=0.2 D=0.1 0.3 D=0.05 0.2 0.1 1 0.001 0 0.1 10 0 1000 TIME:t(s) Rth-t CHARACTERISTICS www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 3/4 0.2 0.4 0.6 0.8 AVERAGE RECTIFIED FORWARD CURRENT:Io(A) Io-Pf CHARACTERISTICS 1 2011.10 - Rev.A 1.2 1.2 T 0.6 0.4 half sin wave D=0.2 AVERAGE RECTIFIED FORWARD CURRENT:Io(A) VR 0.8 D=0.8 D=0.5 VR t 1 t D.C. Io 0A 0V Io 0A 0V 1 AVERAGE RECTIFIED FORWARD CURRENT:Io(A) Data Sheet RF05VA1S D=t/T VR=150V Tj=150°C D=0.1 0.2 T D.C. 0.8 D=t/T VR=150V Tj=150°C D=0.8 0.6 D=0.5 0.4 half sin wave D=0.2 D=0.1 0.2 D=0.05 D=0.05 0 0 0 30 60 90 120 150 0 30 60 90 120 150 CASE TEMPERATURE:Tc(°C) DERATING CURVE (Io-Tc) AMBIENT TEMPERATURE:Ta(°C) DERATING CURVE (Io-Ta) 30 No break at 30kV ELECTROSTATIC DISCHARGE TEST ESD(kV) 25 20 15 10 AVE:13.3kV 5 0 C=200pF R=0Ω C=100pF R=1.5kΩ ESD DISPERSION MAP www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4/4 2011.10 - Rev.A Notice Notes Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. R1120A