Combine Type Connector (for SD Memory Card, MultiMediaCard™, MultiMediaCard Plus™, Memory Stick™, xD-Picture Card™) SCDG Series New generation 5-in-1 for MultiMediaCard Plus™ For SD Memory Card NEW For microSD™ Card For SIM Card 8pins For W-SIM Features For Memory Stick Micro™ ● For Memory Stick™ ● Applications Applicable to four memory card standards - SD Memory Card, MultiMediaCard™, MultiMediaCard Plus™, Memory Stick™ and xD-Picture Card™. Push-push ejection mechanism applied in both card types. ● ● ● Combine Type For Compact Flash™ ● For desktop PCs, notebook PCs, various personal digital assistants, digital still cameras, digital camcorders, digital photo frames, facsimile machines and printers. For home audio equipment (TVs and set top boxes) For audio systems For headphone players Typical Specifications Items Specifications For PC cards supporting CardBus SD Memory Card MultiMediaCardTM For Express Card™ Applicable media MultiMediaCard PlusTM For CMOS Camera Module Memory Stick™ Structure xD-Picture Card™ Performance Mounting type Surface mounting type Mounting style Standard mount / Reverse mount Media ejection structure Push-push type Operating temperature range −10℃ to +60℃ Voltage proof 250V AC 1minute Insulation resistance(Initial) Contact resistance (Initial) 1,000MΩ min. Connector contacts 150mΩ max. Detection switch 500mΩ max. Insertion and removal cycle 5,000cycles Product Line Media ejection structure Mounting system Stand-off(mm) Packing system Standard mount Push-push type 0 Reverse mount 42 Product No. Drawing No. SCDG1A0101 1 SCDG2A0101 2 Taping Combine Type Connector(for SD Memory Card, MultiMediaCard™, MultiMediaCard Plus™, Memory Stick™, xD-Picure Card™) SCDG Dimensions Unit:mm PC board mounting hole dimensions (Viewed from the mounting face side) +,!8 +,1 +,@5 φ For SD Memory Card () () () () () * () Pin assign #5 #4 #3 #2 #1 #5 #12 #6 #13 #7 #8 SW.COM Number 25 26 27 28 29 30 31 32 33 34 35 36 FOR SD XD XD XD XD XD XD XD XD XD XD XD Pin assign SW.CD #1 #0(CD) #2 #3 #4 #5 #6 #7 #8 #9 #10 Number 37 38 39 40 41 42 43 44 45 FOR XD XD XD XD XD XD XD XD SD For Compact Flash™ Pin assign #11 #12 #13 #14 #15 #16 #17 #18 SW.WP For PC cards supporting CardBus For Express Card™ For CMOS Camera Module ' #6 ( ) ' @6 ( ) ( ) () () $%"#(& &) !"#(& &) ( ) () () ' !7 ' 8 ' 7 ' 1 ' $5 () Number 25 26 27 28 29 30 31 32 33 34 35 36 FOR SD XD XD XD XD XD XD XD XD XD XD XD ' #5 ! "())* +) ' !8 ' @5 () () () For Memory Stick™ Combine Type $% "#() ! "#() For Memory Stick Micro™ ( ) () FOR MemoryStick MemoryStick MemoryStick MemoryStick MemoryStick SD MMC Plus SD MMC Plus SD SD SD () () Number 13 14 15 16 17 18 19 20 21 22 23 24 !"" # $" +,$5 For SIM Card 8pins For W-SIM φ () Pin assign #9 #1 #10 #2 #11 #3 #4 #10 #9 #8 #7 #6 () * () * () % FOR SD SD MMC Plus SD MMC Plus SD SD MemoryStick MemoryStick MemoryStick MemoryStick MemoryStick 2 +,@6 () Number 1 2 3 4 5 6 7 8 9 10 11 12 , % () ( ) ( ) () () () () () For microSD™ Card () ! +,!7 +,7 () () () +,8 () &' Style No. 1 Series Number 1 2 3 4 5 6 7 8 9 10 11 12 FOR SD SD MMC Plus SD MMC Plus SD SD MemoryStick MemoryStick MemoryStick MemoryStick MemoryStick Pin assign #9 #1 #10 #2 #11 #3 #4 #10 #9 #8 #7 #6 Number 13 14 15 16 17 18 19 20 21 22 23 24 FOR MemoryStick MemoryStick MemoryStick MemoryStick MemoryStick SD MMC Plus SD MMC Plus SD SD SD Pin assign #5 #4 #3 #2 #1 #5 #12 #6 #13 #7 #8 SW.COM Pin assign SW.CD #1 #0(CD) #2 #3 #4 #5 #6 #7 #8 #9 #10 Number 37 38 39 40 41 42 43 44 45 FOR XD XD XD XD XD XD XD XD SD Pin assign #11 #12 #13 #14 #15 #16 #17 #18 SW.WP 43 Small Memory Card Connectors Soldering Conditions Example of Reflow Soldering Condition(Reference) For SD Memory Card 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA(K)or CC(T). 3. Temperature profile(Surface of products). For microSD™ Card For W-SIM For Memory Stick Micro™ For Memory Stick™ Temperature (˚C ) For SIM Card 8pins 240℃(max.) 230℃(min.) 200 180℃ 150℃ 100 Room temperature Time (s) Pre-heating 90±30 sec. 10 sec.(max.) Combine Type Heating time sec. For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 50 Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice.