STU437S STD437S

Green
Product
STU437S
STD437S
S a mHop Microelectronics C orp.
Ver 1.0
P-Channel Logic Level Enhancement Mode Field Effect Transistor
PRODUCT SUMMARY
V DSS
R DS(ON) (m Ω) Max
ID
FEATURES
Super high dense cell design for low R DS(ON).
Rugged and reliable.
16 @ VGS=-10V
-40V
Suface Mount Package.
-32A
30 @ VGS=-4.5V
G
G
D
S
STU SERIES
TO - 252AA( D - PAK )
S
STD SERIES
TO - 251 ( I - PAK )
ABSOLUTE MAXIMUM RATINGS ( T C=25 °C unless otherwise noted )
Symbol
Parameter
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
ID
IDM
EAS
Drain Current-Continuous
TC=25°C
TC=70°C
a e
b
-Pulsed
Sigle Pulse Avalanche Energy
d
PD
Maximum Power Dissipation
TJ, TSTG
Operating Junction and Storage
Temperature Range
Limit
-40
Units
±20
-32
V
A
-25.6
A
-94
A
V
121
mJ
TC=25°C
42
W
TC=70°C
27
W
-55 to 150
°C
3
50
°C/W
THERMAL CHARACTERISTICS
R JC
Thermal Resistance, Junction-to-Case
R JA
Thermal Resistance, Junction-to-Ambient
Details are subject to change without notice.
°C/W
Sep,09,2013
1
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STU437S
STD437S
Ver 1.0
ELECTRICAL CHARACTERISTICS ( T C=25 °C unless otherwise noted )
Symbol
Parameter
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
BVDSS
Zero Gate Voltage Drain Current
IDSS
Gate-Body Leakage Current
IGSS
ON CHARACTERISTICS
Gate Threshold Voltage
VGS(th)
Conditions
Min
VGS=0V , ID=-250uA
-40
Drain-Source On-State Resistance
gFS
Forward Transconductance
Max
Units
V
uA
1
±100
nA
-1.9
-3
V
VGS=-10V , ID=-16A
13
16
VGS=-4.5V , ID=-12A
VDS=-10V , ID=-16A
22
32
30
m ohm
m ohm
VDS=-32V , VGS=0V
VGS= ±20V , VDS=0V
VDS=VGS , ID=-250uA
RDS(ON)
Typ
-1
S
c
DYNAMIC CHARACTERISTICS
Input Capacitance
CISS
Output Capacitance
COSS
Reverse Transfer Capacitance
CRSS
SWITCHING CHARACTERISTICS
tD(ON)
Turn-On Delay Time
tr
Rise Time
tD(OFF)
Turn-Off Delay Time
tf
Fall Time
Qg
Qgs
Qgd
VDS=-20V,VGS=0V
f=1.0MHz
244
180
pF
pF
pF
36
32
109
28
ns
ns
ns
ns
2200
c
VDD=-20V
ID=-1.0A
VGS=-10V
RGEN= 6 ohm
Total Gate Charge
VDS=-20V,ID=-16A,VGS=-10V
37
nC
Gate-Source Charge
VDS=-20V,ID=-16A,
VGS=-10V
4.3
nC
nC
VGS=0V,IS= -4A
-0.8
Gate-Drain Charge
12
DRAIN-SOURCE DIODE CHARACTERISTICS
VSD
Diode Forward Voltage
-1.3
V
Notes
_ 10sec.
a.Surface Mounted on FR4 Board,t <
_ 300us, Duty Cycle <
_ 2%.
b.Pulse Test:Pulse Width <
c.Guaranteed by design, not subject to production testing.
d.Starting TJ=25°C,L=0.5mH,VDD = 20V .(See Figure13)
e.Drain current limited by maximum junction temperature.
Sep,09,2013
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STU437S
STD437S
Ver 1.0
40
30
V G S =-4V
32
-I D, Drain Current(A)
-ID, Drain Current(A)
V G S =-10V
V G S =-4.5V
24
16
V G S =-3.5V
8
V G S =-3V
24
18
12
T j=125 C
6
25 C
0
0
0
0.5
1.5
1.0
2.5
2.0
3.0
0
-VDS, Drain-to-Source Voltage(V)
48
1.5
40
1.4
R DS(on), On-Resistance
Normalized
RDS(on)(m Ω)
3.2
4.8
4.0
Figure 2. Transfer Characteristics
32
V G S =-4.5V
24
16
V G S =-10V
V G S =-10V
I D =-16A
1.3
1.2
1.1
V G S =-4.5V
I D =-12A
1.0
0
1
1
16
8
24
32
0
40
25
50
75
100
150
125
T j( C )
-I D, Drain Current(A)
Tj, Junction Temperature(° C )
Figure 3. On-Resistance vs. Drain Current
and Gate Voltage
Figure 4. On-Resistance Variation with Drain
Current and Temperature
BVDSS, Normalized
Drain-Source Breakdown Voltage
1.6
Vth, Normalized
Gate-Source Threshold Voltage
2.4
-V GS, Gate-to-Source Voltage(V)
Figure 1. Output Characteristics
8
1.6
0.8
-55 C
V DS =V G S
I D =-250uA
1.4
1.2
1.0
0.8
0.6
0.4
0.2
-50
-25
0
25
50
75 100 125 150
Tj, Junction Temperature( ° C )
1.15
1.10
I D =-250uA
1.05
1.00
0.95
0.90
0.85
-50
-25
0
25
50
75 100 125 150
Tj, Junction Temperature(° C )
Figure 5. Gate Threshold Variation
with Temperature
Figure 6. Breakdown Voltage Variation
with Temperature
Sep,09,2013
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STU437S
STD437S
Ver 1.0
20
60
-Is, Source-drain current(A)
I D =-16A
RDS(on)(m Ω)
50
40
30
125 C
20
75 C
10
0
0
2
25 C
8
6
4
10
125 C
75 C
25 C
1
10
0
-VGS, Gate-to-Source Voltage(V)
0.9
0.6
1.2
1.5
-VSD, Body Diode Forward Voltage(V)
Figure 7. On-Resistance vs.
Gate-Source Voltage
Figure 8. Body Diode Forward Voltage
Variation with Source Current
10
-V GS, Gate to Source Voltage(V)
3000
2500
C, Capacitance(pF)
0.3
C is s
2000
1500
1000
Cos s
500
C rs s
0
0
10
5
15
20
25
6
4
2
0
30
V DS = -20V
I D =-16A
8
0
-VDS, Drain-to-Source Voltage(V)
5
10
15
20
25
30
35
40
Qg, Total Gate Charge(nC)
Figure 9. Capacitance
Figure 10. Gate Charge
1000
-ID, Drain Current(A)
100
Switching Time(ns)
TD(off )
100
TD(on)
Tr
Tf
10
VDS=-20V,ID=-1A
VGS=-10V
1
1
10
R
10
1
0.2
0.1
100
Rg, Gate Resistance(Ω)
DS
(
)
ON
L im
it
10
1m
10
DC
0u
s
s
ms
VGS=-10V
Single Pulse
TC=25 C
1
10
100
-VDS, Drain-Source Voltage(V)
Figure 12. Maximum Safe Operating Area
Figure 11. switching characteristics
Sep,09,2013
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STU437S
STD437S
Ver 1.0
V ( BR )D S S
tp
L
VDS
D.U.T
RG
+
- VDD
IAS
20V
tp
0.01
IAS
Unclamped Inductive Waveforms
Uncamped Inductive Test Circuit
F igure 13b.
Figure 13a.
2
1
Normalized Transient
Thermal Resistance
D=0.5
0.2
0.1
P DM
0.1
0.05
t1
t2
0.02
1.
2.
3.
4.
0.01
S ING LE P ULS E
R ӰJ C (t)=r (t) * R ӰJ C
R ӰJ C =S ee Datas heet
T J M-T C = P DM* R ӰJ C (t)
Duty C ycle, D=t1/t2
0.01
10
-5
10
-4
10
-3
10
-2
10
-1
1
10
Square Wave Pulse Duration(sec)
Figure 14. Normalized Thermal Transient Impedance Curve
Sep,09,2013
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STU437S
STD437S
Ver 1.0
PACKAGE OUTLINE DIMENSIONS
A
E
E2
TO-251
C
L
D1
D2
E1
1
2
H
B2
D
3
L2
L1
B1
D3
P
SYMBOL
A
A1
B
B1
B2
C
D
D1
D2
D3
H
E
E1
E2
L
L1
L2
P
A1
B
MILLIMETERS
MIN
MAX
2.100
2.500
0.350
0.650
0.400
0.800
0.650
1.050
0.500
0.900
0.400
0.600
5.300
5.700
5.300
4.900
6.700
7.300
8.000
7.000
11.430
10.830
6.700
6.300
4.600
4.900
4.800
5.200
1.300
1.700
1.400
1.800
0.500
0.900
2.300 BSC
INCHES
MIN
MAX
0.083
0.098
0.014
0.026
0.031
0.016
0.041
0.026
0.035
0.020
0.024
0.016
0.224
0.209
0.209
0.193
0.287
0.264
0.315
0.276
0.426
0.450
0.264
0.248
0.193
0.181
0.189
0.205
0.051
0.067
0.071
0.055
0.020
0.035
0.091 BSC
Sep,09,2013
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STU437S
STD437S
Ver 1.0
E
TO-252
A
b2
C
L3
1
D1
D
E1
H
1
2
3
DETAIL "A"
L4
b1
e
b
L2
L
A1
DETAIL "A"
L1
SYMBOLS
A
A1
b
b1
b2
C
D
D1
E
E1
e
H
L
L1
L2
L3
L4
1
MILLIMETERS
MIN
2.100
0.000
0.400
0.770
4.800
0.400
5.300
4.900
6.300
4.400
2.290
8.900
1.397
2.743
0.508
0.890
0.500
0°
7°
INCHES
MAX
2.500
0.200
0.889
1.140
5.460
0.600
6.223
5.515
6.731
5.004
REF
10.400
1.770
REF.
REF.
1.700
1.100
10°
REF.
MIN
0.083
0.000
0.016
0.030
0.189
0.016
0.209
0.193
0.248
0.173
0.090
0.350
0.055
0.108
0.020
0.035
0.020
0°
7°
MAX
0.098
0.008
0.035
0.045
0.215
0.024
0.245
0.217
0.265
0.197
BSC
0.409
0.070
REF.
REF.
0.067
0.043
10 °
REF.
Sep,09,2013
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STU437S
STD437S
Ver 1.0
TO-251 Tube/TO-252 Tape and Reel Data
TO-251 Tube
0.4
5.25
4.5
1.4
2.25
" A"
1.65
5.5
2~ӿ3.0
7.50
1.25
1.90
540 + 1.5
6.60
19.75
TO-252 Carrier Tape
B0
E
E2
T
E1
P1
P2
D1
K0
FEED DIRECTION
A0
D0
P0
UNIT:р
PACKAGE
TO-252
(16 р*
A0
6.96
²0.1
B0
10.49
²0.1
K0
2.79
²0.1
D0
D1
E
E1
E2
P0
P1
P2
T
ӿ2
ӿ1.5
+ 0.1
- 0
16.0
²0.3
1.75
²0.1
7.5
²0.15
8.0
²0.1
4.0
²0.1
2.0
²0.15
0.3
²0.05
TO-252 Reel
T
S
M
N
K
G
V
R
H
W
UNIT:р
TAPE SIZE
16 р
REEL SIZE
ӿ 330
M
ӿ330
² 0.5
N
W
ӿ97
² 1.0
17.0
+ 1.5
- 0
T
H
2.2
ӿ13.0
+ 0.5
- 0.2
K
S
10.6
2.0
²0.5
G
R
V
Sep,09,2013
8
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STU437S
STD437S
Ver 1.0
TOP MARKING DEFINITION
TO-252
SamHop Logo
STU437S
XXXXXX
Product No.
SMC internal code No. (A,B,C...Z)
Wafer Lot No.
Production Date (1,2 ~ 9, A,B.....)
Production Month (1,2 ~ 9, A,B,C)
Production Year (2009 = 9, 2010 = A.....)
Sep,09,2013
9
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STU437S
STD437S
Ver 1.0
TOP MARKING DEFINITION
TO-251
SamHop Logo
STD437S
XXXXXX
Product No.
SMC internal code No. (A,B,C...Z)
Wafer Lot No.
Production Date (1,2 ~ 9, A,B.....)
Production Month (1,2 ~ 9, A,B,C)
Production Year (2009 = 9, 2010 = A.....)
Sep,09,2013
10
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