CYStech Electronics Corp. Low VCE(sat) NPN Epitaxial Planar Transistor BTD882AM3 BVCEO IC RCESAT (Typ) Spec. No. : C848M3-H Issued Date : 2003.06.17 Revised Date : 2013.08.12 Page No. : 1/7 50V 3A 125mΩ Features • Low VCE(sat), typically 0.25V at IC / IB = 2A / 0.2A • Excellent current gain characteristics • Complementary to BTB772AM3 • Pb-free lead plating package Symbol Outline BTD882AM3 SOT-89 B：Base C：Collector E：Emitter B C E Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Collector Current (Pulse) Power Dissipation Symbol VCBO VCEO VEBO IC ICP Pd Thermal Resistance, Junction to Ambient RθJA Junction Temperature Storage Temperature Tj Tstg Note : 1. Single Pulse Pw≦350μs, Duty≦2%. 2. When mounted on FR-4 PCB with area measuring 10×10×1 mm 3. When mounted on ceramic with area measuring 40×40×1 mm BTD882AM3 Limit Unit 80 50 5 3 7 (Note 1) 600 1 (Note 2) 2 (Note 3) 208 125 (Note 2) 62.5 (Note 3) 150 -55~+150 V V V A A mW W W °C/W °C/W °C/W °C °C CYStek Product Specification Spec. No. : C848M3-H Issued Date : 2003.06.17 Revised Date : 2013.08.12 Page No. : 2/7 CYStech Electronics Corp. Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 *hFE3 fT Cob Min. 80 50 5 150 180 100 - Typ. 0.25 90 45 Max. 1 1 0.5 2 820 - Unit V V V μA μA V V MHz pF Test Conditions IC=50μA, IE=0 IC=1mA, IB=0 IE=50μA, IC=0 VCB=50V. IE=0 VEB=3V,IC=0 IC=2A, IB=0.2A IC=2A, IB=0.2A VCE=2V, IC=100mA VCE=2V, IC=500mA VCE=2V, IC=1A VCE=5V, IC=0.1A, f=100MHz VCB=10V, f=1MHz *Pulse Test : Pulse Width ≤380μs, Duty Cycle≤2% Classification Of hFE2 Rank R S T Range 180~390 270~560 390~820 Ordering Information Device BTD882AM3 BTD882AM3 Package SOT-89 (Pb-free) Shipping Marking 1000 pcs / Tape & Reel CF CYStek Product Specification CYStech Electronics Corp. Spec. No. : C848M3-H Issued Date : 2003.06.17 Revised Date : 2013.08.12 Page No. : 3/7 Characteristic Curves Emitter Grounded Output Characteristics Emitter Grounded Output Characteristics 0.25 1 0.2 IB=400uA 0.15 IB=300uA IB=200uA 0.1 IB=100uA 0.05 0.9 0.8 Collector Current---IC(A) Collector Current---IC(A) IB=500uA IB=2.5mA IB=2mA 0.7 0.6 IB=1.5mA 0.5 IB=1mA 0.4 0.3 IB=500uA 0.2 0.1 IB=0 IB=0 0 0 0 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) 0 6 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) Emitter Grounded Output Characteristics Emitter Grounded Output Characteristics 3 4.5 IB=10mA 2.5 IB=8mA IB=6mA 2 IB=25mA 4 Collector Current---IC(A) Collector Current---IC(A) 6 IB=4mA 1.5 IB=2mA 1 0.5 IB=20mA 3.5 IB=15mA 3 IB=10mA 2.5 2 IB=5mA 1.5 1 0.5 IB=0 0 IB=0 0 0 1 2 3 4 5 6 0 Collector-to-Emitter Voltage---VCE(V) Current Gain vs Collector Current 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) 6 Saturation Voltage vs Collector Current 1000 10000 Saturation Voltage---(mV) Current Gain---HFE VCE=5V VCE=2V 100 VCE=1V VCE(SAT) 1000 IC=100IB IC=50IB 100 IC=20IB 10 10 1 BTD882AM3 10 100 1000 Collector Current---IC(mA) 10000 1 10 100 1000 Collector Current---IC(mA) 10000 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C848M3-H Issued Date : 2003.06.17 Revised Date : 2013.08.12 Page No. : 4/7 Characteristic Curves(Cont.) Capacitance vs Reverse-Biased Voltage Saturation Voltage vs Collector Current 1000 VBE(SAT)@IC=10IB Capacitance---(pF) Saturation Voltage---(mV) 10000 1000 Cib 100 10 Cob 1 100 1 10 100 1000 Collector Current---IC(mA) 10000 0.1 1 10 Reverse-Biased Voltage---(V) 100 Power Derating Curves Power Dissipation---PD(W) 2.5 2 See Note 2 on Page 1 1.5 See Note 1 on Page 1 1 0.5 0 0 BTD882AM3 50 100 150 Ambient Temperature---TA(℃) 200 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C848M3-H Issued Date : 2003.06.17 Revised Date : 2013.08.12 Page No. : 5/7 Reel Dimension Carrier Tape Dimension BTD882AM3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C848M3-H Issued Date : 2003.06.17 Revised Date : 2013.08.12 Page No. : 6/7 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. BTD882AM3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C848M3-H Issued Date : 2003.06.17 Revised Date : 2013.08.12 Page No. : 7/7 SOT-89 Dimension Marking: A 2 1 3 Year code : 6→2006, 7→2007,… HFE rank Product Code H C month code: 1~9, A,B,C D B Style: Pin 1. Base 2. Collector 3. Emitter E I F 3-Lead SOT-89 Plastic Surface Mounted Package CYStek Package Code: M3 G Inches Min. Max. 0.1732 0.1811 0.1551 0.1673 0.0610 REF 0.0906 0.1024 0.0126 0.0205 DIM A B C D E Millimeters Min. Max. 4.40 4.60 3.94 4.25 1.55 REF 2.30 2.60 0.32 0.52 DIM F G H I Inches Min. Max. 0.0591 TYP 0.1181 TYP 0.0551 0.0630 0.0138 0.0173 Millimeters Min. Max. 1.50 TYP 3.00 TYP 1.40 1.60 0.35 0.44 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: KFC ;Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTD882AM3 CYStek Product Specification