32L – TSOP I (8x13.4 mm) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 Package Weight – Site 3 ZB B1: 238.6800 mg B2: 242.3997 mg B1: 242.3997 mg B2: 238.2336 mg Body Size (mil/mm) Package Weight – Site 2 8x13.4 mm B1: 263.0800 mg B2: 262.7492 mg SUMMARY The 32L-TSOP I (8x13.4 mm) Pb-Free package is qualified at two assembly sites. Packages from different assembly sites may have different material composition. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Cypress Manufacturing Limited (CML) Package Qualification Report # 021903, 064507, 093104 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-ZB32CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03057 Rev. *N Page 1 of 14 32L – TSOP I (8x13.4 mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1. NiPdAu with Standard Mold Compound Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation 118.6600 1.5300 0.3800 5.0900 0.1900 0.0100 0.0000 0.5000 % Weight of Substance per Homogeneo us Material 94.4294% 1.2176% 0.3024% 4.0506% 95.0000% 5.0000% 0.0000% 80.6452% 497,151 6,410 1,592 21,326 796 42 0 2,095 49.7151% 0.6410% 0.1592% 2.1326% 0.0796% 0.0042% 0.0000% 0.2095% --------------------- 0.0600 9.6774% 251 0.0251% --------------------- 0.0300 4.8387% 126 0.0126% ----------------------------------------- 0.0100 0.0100 1.6129% 1.6129% 42 42 0.0042% 0.0042% --------------------- 0.0100 1.6129% 42 0.0042% 7440-21-3 7440-57-5 129915-35-1 26834-02-6 8.7800 1.0800 5.1200 5.1200 100.0000% 100.0000% 5.0029% 5.0029% 36,786 4,525 21,451 21,451 3.6786% 0.4525% 2.1451% 2.1451% --------------------- 1.0200 0.9967% 4,274 0.4274% 1309-64-4 0.5100 0.4983% 2,137 0.2137% 7631-86-9 --------------------- 89.5500 1.0200 87.5025% 0.9967% 375,187 4,274 37.5187% 0.4274% Package Weight (mg): 238.6800 % Total: 100.0000 Substance Composition Cu Si Mg Ni Ni Pd Au Ag Proprietary bismaleimide Proprietary polymer Methacrylate Acrylate ester Organic peroxide Si Au Epoxy resin Phenol resin Brominated epoxy resin Antimony trioxide Silica Others CAS Number 7440-50-8 7440-21-3 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Weight by mg PPM % Weight of Substance per Package Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03057 Rev. *N Page 2 of 14 32L – TSOP I (8x13.4 mm) Pb-Free Package B2. NiPdAu with Green Mold Compound Material Purpose of Use Substance Composition Cu Si Lead frame Base Material Mg Ni Ni Lead External Plating Pd Finish Au Ag Proprietary bismaleimide Proprietary polymer Die Attach Adhesive Methacrylate Acrylate ester Organic peroxide Die Circuit Si Wire Interconnect Au SiO2 Mold Encapsulation Phenol Resin Compound Epoxy Resin CAS Number 7440-50-8 7440-21-3 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Weight by mg % Weight of Substance per Homogeneo us Material % Weight of Substance per Package PPM 78.2180 0.5285 0.1220 2.4392 1.6334 0.0294 0.0295 0.1416 96.2000% 0.6500% 0.1500% 3.0000% 96.5195% 1.7373% 1.7432% 80.0906% 322,682 2,180 503 10,063 6,738 121 122 584 32.2682% 0.2180% 0.0503% 1.0063% 0.6738% 0.0121% 0.0122% 0.0584% ---------------------- 0.0159 8.9932% 66 0.0066% ---------------------- 0.0088 4.9774% 36 0.0036% ------------------------------------------- 0.0035 0.0035 1.9796% 1.9796% 15 15 0.0015% 0.0015% ---------------------- 0.0035 1.9796% 15 0.0015% 7440-21-3 7440-57-5 60676-86-0 ------------------------------------------- 2.4774 2.3833 137.3824 7.7181 9.2617 100.0000% 100.0000% 89.0000% 5.0000% 6.0000% 10,220 9,832 566,760 31,840 38,208 1.0220% 0.9832% 56.6760% 3.1840% 3.8208% % Total: 100.0000 Package Weight (mg): 242.3997 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03057 Rev. *N Page 3 of 14 32L – TSOP I (8x13.4 mm) Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Desiccant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 --------<5.0 PBDE PPM <5.0 <5.0 <5.0 --------<5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-MBBG-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PROB-R < 10.0 < 4.0 < 4.0 < 5.0 --------- ----------- CoA-ABOX-R < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 CoA-DESS-R CoA-BUBP-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03057 Rev. *N Page 4 of 14 32L – TSOP I (8x13.4 mm) Pb-Free Package ASSEMBLY Site 2 – Orient Semiconductor Electronics Taiwan (OSET) Package Qualification Report # 043102, 120406 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-ZB32OSET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03057 Rev. *N Page 5 of 14 32L – TSOP I (8x13.4 mm) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Gold wire material Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Bonding Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Copper Magnesium Nickel Silicon Tin Epoxy Resin Metal Silver Silicon Gold Epoxy resin Phenol resin Aromatic Phosphate Carbon black Silica 7440-50-8 7439-95-4 7440-02-0 7440-21-3 7440-31-5 -----------------------------------------7440-22-4 7440-21-3 7440-57-5 ------------------------------------------- 69.7600 0.1300 2.3300 0.5300 2.2900 1.6900 0.5600 9.0300 10.9200 0.6200 7.4300 6.6100 % Weight of Substance per Homogeneous Material 95.8900% 0.1787% 3.2028% 0.7285% 100.0000% 14.9823% 4.9645% 80.0532% 100.0000% 100.0000% 4.4971% 4.0007% ---------------------- 2.1500 0.3300 148.7000 CAS Number 1333-86-4 60676-86-0 Package Weight (mg): Weight by mg 263.0800 PPM 265,167 494 8,857 2,015 8,705 6,424 2,129 34,324 41,508 2,357 28,242 25,125 26.5167% 0.0494% 0.8857% 0.2015% 0.8705% 0.6424% 0.2129% 3.4324% 4.1508% 0.2357% 2.8242% 2.5125% 1.3013% 8,172 0.8172% 0.1997% 90.0012% 1,254 565,227 0.1254% 56.5227% % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03057 Rev. *N % Weight of Substance per Package Page 6 of 14 32L – TSOP I (8x13.4 mm) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Copper wire material Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Bonding Wire Mold Compound Circuit Interconnect Encapsulation 7440-50-8 7439-95-4 7440-02-0 7440-21-3 7440-31-5 7440-22-4 9003-36-5 ---------------------------------------------------------------- 69.7600 0.1300 2.3300 0.5300 2.2900 8.3472 0.4512 0.6768 0.4512 0.6768 % Weight of Substance per Homogeneous Material 95.8900% 0.1787% 3.2028% 0.7285% 100.0000% 74.0000% 4.0000% 6.0000% 4.0000% 6.0000% ---------------------- 0.5640 5.0000% 2,147 0.2147% 461-58-5 0.0564 0.5000% 215 0.0215% ---------------------- 0.0564 0.5000% 215 0.0215% 7440-21-3 7440-50-8 ---------------------- 10.9200 0.2891 8.2610 100.0000% 100.0000% 5.0000% 41,561 1,100 31,441 4.1561% 0.1100% 3.1441% 8.2610 5.0000% 31,441 3.1441% ------------------------------------------1333-86-4 60676-86-0 7631-86-9 14808-60-7 8.2610 8.2610 0.4957 114.6627 16.5220 0.4957 5.0000% 5.0000% 0.3000% 69.4000% 10.0000% 0.3000% 31,441 31,441 1,886 436,395 62,881 1,886 3.1441% 3.1441% 0.1886% 43.6395% 6.2881% 0.1886% Package Weight (mg): 262.7492 % Total: 100.0000 Substance Composition Copper Magnesium Nickel Silicon Tin Silver Epoxy resin A Epoxy resin B Diluent A Diluent B Phenolic Hardener Dicyandiamide Organic peroxide Silicon Copper Epoxy resin A Epoxy,Cresol Novolac Phenol resin Metal Hydroxide Carbon Black Silica Fused Silica Fused Silica,crystalline CAS Number 29690-82-2 Weight by mg 265,499 495 8,868 2,017 8,716 31,769 1,717 2,576 1,717 2,576 % Weight of Substance per Package 26.5499% 0.0495% 0.8868% 0.2017% 0.8716% 3.1769% 0.1717% 0.2576% 0.1717% 0.2576% PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03057 Rev. *N Page 7 of 14 32L – TSOP I (8x13.4 mm) Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Desiccant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 --------<5.0 PBDE PPM <5.0 <5.0 <5.0 --------<5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-MBBG-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PROB-R < 10.0 < 4.0 < 4.0 < 5.0 --------- ----------- CoA-ABOX-R < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 CoA-DESS-R CoA-BUBP-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03057 Rev. *N Page 8 of 14 32L – TSOP I (8x13.4 mm) Pb-Free Package ASSEMBLY Site 3: Jiangsu Changjiang Electronics Technology (JCET) Package Qualification Report # 104816/ 104815, 105211, 141303 (See Note 1) I. DECLARATION OF PACKAGED UNITS 2. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-ZB32JCET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03057 Rev. *N Page 9 of 14 32L – TSOP I (8x13.4 mm) Pb-Free Package 2. MATERIAL COMPOSITION (Note 3) B1.USING GOLD WIRE Material Purpose of Use Substance Composition Cu Si Lead frame Base Material Mg Ni Ni Lead External Plating Pd Finish Au Ag Proprietary bismaleimide Proprietary polymer Die Attach Adhesive Methacrylate Acrylate ester Organic peroxide Die Circuit Si Wire Interconnect Au SiO2 Mold Encapsulation Phenol Resin Compound Epoxy Resin CAS Number 7440-50-8 7440-21-3 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Weight by mg % Weight of Substance per Homogeneo us Material % Weight of Substance per Package PPM 78.2180 0.5285 0.1220 2.4392 1.6334 0.0294 0.0295 0.1416 96.2000% 0.6500% 0.1500% 3.0000% 96.5195% 1.7373% 1.7432% 80.0906% 322,682 2,180 503 10,063 6,738 121 122 584 32.2682% 0.2180% 0.0503% 1.0063% 0.6738% 0.0121% 0.0122% 0.0584% ---------------------- 0.0159 8.9932% 66 0.0066% ---------------------- 0.0088 4.9774% 36 0.0036% ------------------------------------------- 0.0035 0.0035 1.9796% 1.9796% 15 15 0.0015% 0.0015% ---------------------- 0.0035 1.9796% 15 0.0015% 7440-21-3 7440-57-5 60676-86-0 ------------------------------------------- 2.4774 2.3833 137.3824 7.7181 9.2617 100.0000% 100.0000% 89.0000% 5.0000% 6.0000% 10,220 9,832 566,760 31,840 38,208 1.0220% 0.9832% 56.6760% 3.1840% 3.8208% Package Weight (mg): 242.3997 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03057 Rev. *N Page 10 of 14 32L – TSOP I (8x13.4 mm) Pb-Free Package B2.USING COPPER PALLADIUM WIRE Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Nickel Silicon Magnesium Silver Copper 7440-02-0 7440-21-3 7439-95-4 7440-22-4 7440-50-8 Tin Silver Proprietary Bismaleimide Proprietary Polymer Methacrylate Acrylate Ester Organic Peroxide Silicon Copper Palladium Epoxy Resin A Epoxy Resin B Phenol Resin Silica(Amorphous) Carbon Black 7440-31-5 7440-22-4 Weight by mg 1.8040 0.3690 0.1230 1.8860 77.8180 2.2903 0.1416 Proprietary 0.0159 Proprietary 0.0088 Proprietary Proprietary Proprietary 7440-21-3 7440-50-8 7440-05-3 Trade Secret Trade Secret Trade Secret 60676-86-0 1333-86-4 Package Weight (mg): 0.0035 0.0035 0.0035 2.4774 1.2664 0.0227 4.5000 4.5000 7.5000 133.0500 0.4500 238.2336 % weight of substance per Homogene ous 2.2000% 0.4500% 0.1500% 2.3000% 94.9000% 100.0000% 80.0910% PPM 7,572 1,549 516 7,917 326,646 0.7572% 0.1549% 0.0516% 0.7917% 32.6646% 9,614 0.9614% 594 0.0594% 67 0.0067% 37 0.0037% 15 15 15 10,399 5,316 95 18,889 18,889 31,482 558,485 1,889 0.0015% 0.0015% 0.0015% 1.0399% 0.5316% 0.0095% 1.8889% 1.8889% 3.1482% 55.8485% 0.1889% % Total: 100.0000 8.9930% 4.9770% 1.9800% 1.9800% 1.9800% 100.0000% 98.2400% 1.7600% 3.0000% 3.0000% 5.0000% 88.7000% 0.3000% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03057 Rev. *N %% Weight of Substanc e per package Page 11 of 14 32L – TSOP I (8x13.4 mm) Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Desiccant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 --------<5.0 PBDE PPM <5.0 <5.0 <5.0 --------<5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-MBBG-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PROB-R < 10.0 < 4.0 < 4.0 < 5.0 --------- ----------- CoA-ABOX-R < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 CoA-DESS-R CoA-BUBP-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03057 Rev. *N Page 12 of 14 32L – TSOP I (8x13.4 mm) Pb-Free Package Document History Page Document Title: Document Number: Rev. 32L-TSOP I (8X13.4 MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-03057 ** *A ECN No. Orig. of Change 385640 YXP 399402 YXP *B 2557988 MAHA *C 2578775 MAHA *D *E 2999899 NKZ 3037818 MAHA *F *G 3176700 REYD 3395551 MAHA *H *I 3645513 UDR 3750157 JARG Description of Change New document Edited Summary section and add package weight for reflect assembly site 2. Added PMDD data for assembly site 2 Updated Cypress logo. Revised the following for Assembly Site 2: 1. Analysis Report (Note 2) 2. Table B. MATERIAL COMPOSITION DCon: Change CML to WEB in the distribution list Added the following: 1. B2: 242 mg 2. QTP reference 064507 for Assembly site 1 3. CoA-ZB32-R1 for Assembly site 1 4. Added percent weight per homogeneous material and weight of substance per package in the material composition tables for Assembly sites 1 and 2. 5. Added Table B2. NiPdAu with Green Mold Compound for Assembly site 1. Updated and added Lead, Cr+VI, PBB and PBDE on the Declaration of Packaging/Indirect Materials table for assembly sites 1 and 2. Added Automotive QTP 093104 in Assembly 1. Changed the package weight of B1 of assembly site 1 on page 1 from 240 mg to 239 mg. Deleted Fe and Zn from the lead frame material composition of table B1 of assembly site 1. Revised the % Weight of Substance per Homogeneous Material values for the lead frame, PPM, and % Weight of Substance per Package values of table B1 of assembly site. Added Assembly Site 3 – JCET Expressed the Weight by mg, % weight of substance per Homogenous material, PPM, % weight per package, and total package weight in four decimal places for assembly sites 1, 2, and 3. Recalculated the PPM and % weight per package of assembly site 1-B2 and assembly site 3. Added B2 on Site 2 with reference QTP # 120406. Assembly Site 1 – B1 and B2 Corrected computation to meet 100.0000% Weight of Substance Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03057 Rev. *N Page 13 of 14 32L – TSOP I (8x13.4 mm) Pb-Free Package Rev. ECN No. Orig. of Change *J *K 3792722 NKZ 4032288 YUM *L 4106808 MRB *M 4405002 REYD *N 5004060 YUM DCON Description of Change per Package. Assembly Site 2 – B1 Corrected computation to meet 100.0000% Weight of Substance per Package. Assembly Site 3 Corrected computation to meet 100.0000% Weight of Substance per Package. Added reference automotive package QTP 105211 in Assembly 3. Added Assembly site name in the Assembly heading in site 1, 2 and 3. Changed Assembly Code to Assembly Site Name in Site 1, 2 and 3. Removed Tube row in the Indirect Materials section. Corrected Copper CAS number from 7440-95-4 to 7440-50-8 on Assy site 2 B1 Added B2 on Package Weight and QTP # 141303 under Site 3. Added subsections B1.USING GOLD WIRE and B2.USING COPPER PALLADIUM WIRE under Assembly Site 3. No Change. Removed Distribution and posting information from Document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03057 Rev. *N Page 14 of 14