100L –TQFP (14 x 14 mm) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 Package Weight – Site 3 AZ B1: 569.9900 mg B2: 660.0100 mg B3: 644.9998 mg B4: 657.2885 mg B5 : 632.8000 mg B1: 660.0100 mg B2: 651.0699 mg Body Size (mil/mm) Package Weight – Site 2 14 x 14 mm B1: 661.0004 mg B2: 658.6038 mg B3: 668.7599 mg SUMMARY The 100L-TQFP package is qualified at three assembly sites. Packages from different assembly sites may have different material composition. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1 – Cypress Manufacturing Limited (CML) Package Qualification Report # 040806, 052805, 062603, 112302, 133307, 125105, 134503, ***152607 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AZ100CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04270 Rev *S Page 1 of 17 100L –TQFP (14 x 14 mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1: NiPdAu with Standard Mold Compound Material Leadframe Purpose of Use Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Encapsulation Mold Compound Cu 7440-50-8 39.7595 96.2000% 69,755 %Weight of Substance per package 6.9755 Mg 7439-95-4 0.2686 0.6500% 471 0.0471 Si 7440-21-3 0.0620 0.1500% 109 0.0109 Ni Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Au SiO2 Epoxy Resin Phenol Resin Brominated Epoxy Resin Antimony Trioxide Others 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret Trade Secret 1.2399 0.1930 0.0035 0.0035 0.8300 0.1200 0.0600 0.0200 0.0200 0.0100 14.9500 3.3400 448.0168 25.4555 25.4555 4.0729 3.0000% 96.5200% 1.7400% 1.7400% 78.3000% 11.3200% 5.6600% 1.8900% 1.8900% 0.9400% 100.0000% 100.0000% 88.0000% 5.0000% 5.0000% 0.8000% 2,175 339 6 6 1,456 211 105 35 35 17 26,229 5,860 786,008 44,660 44,660 7,146 0.2175 0.0339 0.0006 0.0006 0.1456 0.0211 0.0105 0.0035 0.0035 0.0017 2.6229 0.5860 78.6008 4.4660 4.4660 0.7146 1309-64-4 2.0364 0.4000% 3,573 0.3573 Trade Secret 4.0729 0.8000% 7,146 0.7146 % Total: 100.0000 Substance Composition CAS Number Package Weight (mg): Weight by mg % weight of substance per Homogeneous 569.9900 PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04270 Rev *S Page 2 of 17 100L –TQFP (14 x 14 mm) Pb-Free Package B2: NiPdAu with Green Mold Compound Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Cu 7440-50-8 140.7791 96.2000% 213,298 %Weight of Substance per package 21.3298 Si 7440-21-3 0.9512 0.6500% 1,441 0.1441 Mg Ni Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Au SiO2 Phenol Resin Epoxy Resin 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 0.2195 4.3902 3.5326 0.0637 0.0637 2.0320 0.2286 0.1270 0.0508 0.0508 0.0508 35.4700 5.0700 415.5677 23.3465 28.0158 0.1500% 3.0000% 96.5200% 1.7400% 1.7400% 80.0000% 9.0000% 5.0000% 2.0000% 2.0000% 2.0000% 100.0000% 100.0000% 89.0000% 5.0000% 6.0000% 333 6,652 5,352 96 96 3,079 346 192 77 77 77 53,742 7,682 629,638 35,373 42,448 0.0333 0.6652 0.5352 0.0096 0.0096 0.3079 0.0346 0.0192 0.0077 0.0077 0.0077 5.3742 0.7682 62.9638 3.5373 4.2448 % Total: 100.0000 Substance Composition CAS Number Package Weight (mg): Weight by mg % weight of substance per Homogeneous 660.0100 PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04270 Rev *S Page 3 of 17 100L –TQFP (14 x 14 mm) Pb-Free Package B3: NiPdAu with Green Mold Compound using CuPd Bonding Wire Material Leadframe Lead Finish Die Attach Purpose of Use Base Material External Plating Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Weight by mg % weight of substance per Homogeneous 7440-50-8 187.7022 96.2000 291,011 %Weight of Substance per package 29.1011 Substance Composition CAS Number Cu PPM Si 7440-21-3 1.2683 0.6500 1,966 0.1966 Mg 7439-95-4 0.2927 0.1500 454 0.0454 Ni 7440-02-0 5.8535 3.0000 9,075 0.9075 Ni 7440-02-0 4.7134 96.5204 7,308 0.7308 Pd 7440-05-3 0.0848 1.7370 132 0.0132 Au 7440-57-5 0.0851 1.7427 132 0.0132 Ag 7440-22-4 1.1858 80.0000 1,839 0.1839 Trade Secret 0.1334 9.0000 207 0.0207 Trade Secret 0.0741 5.0000 115 0.0115 Trade Secret 0.0296 2.0000 46 0.0046 Acrylate ester Trade Secret 0.0296 2.0000 46 0.0046 Organic Peroxide Trade Secret 0.0296 2.0000 46 0.0046 Si Cu Pd SiO2 Phenol Resin Epoxy Resin 7440-21-3 7440-50-8 7440-05-3 60676-86-0 Trade Secret Trade Secret 20.7523 6.3822 0.0645 370.5237 20.8159 24.9791 100.0000 99.0000 1.0000 89.0000 5.0000 6.0000 32,174 9,895 100 574,455 32,273 38,727 3.2174 0.9895 0.0100 57.4455 3.2273 3.8727 Package Weight (mg): 644.9998 Proprietary bismaleimide Proprietary polymer Methacrylate % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04270 Rev *S Page 4 of 17 100.0000 100L –TQFP (14 x 14 mm) Pb-Free Package B4: Using Copper wire with NiPdAu and Kyocera Molding Compound Material Purpose of Use Leadframe Based Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Si Mg Ni Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Cu SiO2 Phenol Resin Epoxy Resin Carbon Black CAS Number 7440-50-8 7440-21-3 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 60676-86-0 Trade Secret Trade Secret 1333-86-4 Package Weight (mg): Weight by mg 142.5498 3.5122 0.1024 0.1756 3.5326 0.0637 0.0637 2.0320 0.2286 0.1270 0.0508 0.0508 0.0508 35.4700 2.3485 415.5677 23.3465 26.8485 1.1673 657.2885 % Weight of Substance per Homogenous Material 97.4100% 2.4000% 0.0700% 0.1200% 96.5200% 1.7400% 1.7400% 80.0000% 9.0000% 5.0000% 2.0000% 2.0000% 2.0000% 100.0000% 100.0000% 89.0000% 5.0000% 5.7500% 0.2500% PPM % Weight of Substance per Package 216,876 5,343 156 267 5,375 97 97 3,091 348 193 77 77 77 53,964 3,573 632,247 35,519 40,847 1,776 21.6876% 0.5343% 0.0156% 0.0267% 0.5375% 0.0097% 0.0097% 0.3091% 0.0348% 0.0193% 0.0077% 0.0077% 0.0077% 5.3964% 0.3573% 63.2247% 3.5519% 4.0847% 0.1776% % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04270 Rev *S Page 5 of 17 100L –TQFP (14 x 14 mm) Pb-Free Package B5: NiPdAu-Ag termination finish with Green Mold Compound Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Cu 7440-50-8 Si 7440-21-3 Mg Ni Ni Pd Au-Ag 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Au SiO2 Phenol Resin Epoxy Resin Package Weight (mg): Weight by mg % weight of substance per Homogeneous 187.7022 96.2000% 0.6500% PPM 296,622 29.6622% 1.2683 0.2927 5.8535 4.7134 0.0848 0.1500% 3.0000% 96.5204% 1.7370% 2,004 463 9,250 7,448 134 0.2004% 0.0463% 0.9250% 0.7448% 0.0134% 0.0851 0.5686 0.0640 0.0355 0.0142 0.0142 0.0142 9.9508 7.4487 369.0739 20.7345 24.8814 1.7427% 80.0000% 9.0000% 5.0000% 2.0000% 2.0000% 2.0000% 100.0000% 100.0000% 89.0000% 5.0000% 6.0000% 134 899 101 56 22 22 22 15,725 11,771 583,239 32,766 39,320 0.0134% 0.0899% 0.0101% 0.0056% 0.0022% 0.0022% 0.0022% 1.5725% 1.1771% 58.3239% 3.2766% 3.9320% % Total: 100.0000 632.8000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04270 Rev *S %Weight of Substance per package Page 6 of 17 100L –TQFP (14 x 14 mm) Pb-Free Package ASSEMBLY Site 2: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 034101, 120201, 133306 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AZ100ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04270 Rev *S Page 7 of 17 100L –TQFP (14 x 14 mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1: Using Gold Wire Material Leadframe Purpose of Use Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Mold Compound Circuit Interconnect Encapsulation Cu 7440-50-8 123.5354 92.8000% 186,892 %Weight of Substance per package 18.6892% Ni 7440-02-0 3.8339 2.8800% 5,800 0.5800% Si 7440-21-3 0.8653 0.6500% 1,309 0.1309% Mg Ag Pure Sn Ag Epoxy Resin Copper GammaButyrolactone Aromatichydrocarbons Si Au Epoxy Resin Phenol Resin SiO2 Aromatic Phosphate Others 7439-95-4 7440-22-4 7440-31-5 7440-22-4 Trade Secret 7440-50-8 96-48-0 0.1997 4.6858 20.9500 2.5802 0.7300 0.0700 0.0700 0.1500% 3.5200% 100.0000% 73.3000% 20.7400% 1.9900% 1.9900% 302 7,089 31,694 3,903 1,104 106 106 0.0302% 0.7089% 3.1694% 0.3903% 0.1104% 0.0106% 0.0106% Trade Secret 0.0700 1.9900% 106 0.0106% 7440-21-3 7440-57-5 85954-11-6 26834-02-6 60676-86-0 139189-30-3 20.6900 4.4900 23.9115 19.0814 423.2336 7.2213 100.0000% 100.0000% 5.0000% 3.9900% 88.5000% 1.5100% 31,301 6,793 36,175 28,867 640,292 10,925 3.1301% 0.6793% 3.6175% 2.8867% 64.0292% 1.0925% Trade Secret 4.7823 1.0000% 7,235 0.7235% % Total: 100.0000 Substance Composition CAS Number Package Weight (mg): Weight by mg 661.0004 % weight of substance per Homogeneous PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04270 Rev *S Page 8 of 17 100L –TQFP (14 x 14 mm) Pb-Free Package B2: Using Copper Wire Material Purpose of Use Leadframe Base Material Lead Finish Die Attach Die Wire Mold Compound External Plating Adhesive Circuit Interconnect Encapsulation Cu 7440-50-8 123.5400 92.8000% 187,579 %Weight of Substance per package 18.7579% Ni 7440-02-0 3.8300 2.8800% 5,815 0.5815% Si 7440-21-3 0.8600 0.6500% 1,306 0.1306% Mg Ag 7439-95-4 7440-22-4 0.2000 4.6900 0.1500% 3.5200% 304 7,121 0.0304% 0.7121% Sn 7440-31-5 20.9500 100.0000% 31,810 3.1810% 7440-22-4 9003-36-5 Trade Secret Trade Secret Trade Secret 2.6048 0.1408 0.2112 0.1408 0.2112 74.0000% 4.0000% 6.0000% 4.0000% 6.0000% 3,955 214 321 214 321 0.3955% 0.0214% 0.0321% 0.0214% 0.0321% Trade Secret 0.1760 5.0000% 267 0.0267% 461-58-5 0.0176 0.5000% 27 0.0027% Trade Secret 0.0176 0.5000% 27 0.0027% 7440-21-3 7440-50-8 Trade Secret 20.6900 2.0938 23.9115 100.0000% 100.0000% 5.0000% 31,415 3,179 36,306 3.1415% 0.3179% 3.6306% 29690-82-2 23.9115 5.0000% 36,306 3.6306% Trade Secret Trade Secret 1333-86-4 60676-86-0 7631-86-9 14808-60-7 23.9115 23.9115 1.4347 331.8916 47.8230 1.4347 5.0000% 5.0000% 0.3000% 69.4000% 10.0000% 0.3000% 36,306 36,306 2,178 503,932 72,613 2,178 3.6306% 3.6306% 0.2178% 50.3932% 7.2613% 0.2178% % Total: 100.0000 Substance Composition Ag Epoxy resin A Epoxy resin B Diluent A Diluent B Phenolic Hardener Dicyandiamide Organic peroxide Si Copper Epoxy resin A Epoxy,Cresol Novolac Phenol resin Metal Hydroxide Carbon Black Silica Fused A Silica Fused B Silica,crystalline CAS Number Package Weight (mg): Weight by mg 658.6038 % weight of substance per Homogeneous PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04270 Rev *S Page 9 of 17 100L –TQFP (14 x 14 mm) Pb-Free Package B3: Using Copper Palladium Wire Material Purpose of Use Leadframe External Plating Copper Nickel Silicon Magnesium 7440-50-8 7440-02-0 7440-21-3 7439-95-4 138.8166 4.3290 0.9379 0.2164 96.2000% 3.0000% 0.6500% 0.1500% External Plating Matte Sn Tin 7440-31-5 20.8000 100.0000% Trade Secret 0.1416 12.5000% Trade Secret 0.1416 12.5000% 68611-44-9 0.0590 5.0000% Trade Secret 0.8378 70.0000% 7440-21-3 7440-50-8 7440-05-3 Trade secret Trade secret Trade secret 1333-86-4 60676-86-0 12.6700 2.2096 0.0004 21.9420 14.6280 32.1816 2.4380 416.4104 100.0000% 99.9800% 0.0200% 3.0000% 3.0000% 5.0000% 0.3000% 88.7000% Die Attach Adhesive Die Silicon Wire Interconnect Mold Compound Encapsulation Substance Composition Novolak Epoxy Resin Phenol Resin Amorphous Silica Acrylic Copolymer Silicon Copper Palladium Epoxy Resin-A Epoxy Resin-B Phenol Resin Carbon Black Silica (SiO2) CAS Number Package Weight (mg): Weight by mg % weight of substance per Homogeneous 668.7599 207,573 6,473 1,402 324 %Weight of Substance per package 20.7573% 0.6473% 0.1402% 0.0324% 31,102 3.1102% 212 212 0.0212% 0.0212% 88 0.0088% 1,253 18,946 3,304 1 32,810 21,873 48,121 3,646 622,661 0.1253% 1.8946% 0.3304% 0.0001% 3.2810% 2.1873% 4.8121% 0.3646% 62.2661% % Total: 100.0000 PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04270 Rev *S Page 10 of 17 100L –TQFP (14 x 14 mm) Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM Cadmium PPM Cr VI PPM Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 10.0 < 2.0 < 4.0 < 10.0 < 2.0 < 2.0 < 2.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R PBB PPM PBDE PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 <5.0 --------<5.0 <5.0 <5.0 <5.0 <5.0 --------<5.0 <5.0 < 2.0 < 4.0 < 2.0 < 5.0 <5.0 --------- <5.0 ----------- CoA-PROB-R CoA-ABOX-R < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 CoA-DESS-R CoA-BUBP-R CoA-TRAY-R CoA-SBAG –R CoA-MBBG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04270 Rev *S Page 11 of 17 100L –TQFP (14 x 14 mm) Pb-Free Package ASSEMBLY Site 3: Jiangsu Changjiang Electronics Technology (JCET) Package Qualification Report # 110909, 111817, 141302 , 124804 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AZ100JCET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04270 Rev *S Page 12 of 17 100L –TQFP (14 x 14 mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1.USING GOLD WIRE Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Cu 7440-50-8 140.7791 96.2000% 213,298 %Weight of Substance per package 21.3298 Si 7440-21-3 0.9512 0.6500% 1,441 0.1441 Mg Ni Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Au SiO2 Phenol Resin Epoxy Resin 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 0.2195 4.3902 3.5326 0.0637 0.0637 2.0320 0.2286 0.1270 0.0508 0.0508 0.0508 35.4700 5.0700 415.5677 23.3465 28.0158 0.1500% 3.0000% 96.5200% 1.7400% 1.7400% 80.0000% 9.0000% 5.0000% 2.0000% 2.0000% 2.0000% 100.0000% 100.0000% 89.0000% 5.0000% 6.0000% 333 6,652 5,352 96 96 3,079 346 192 77 77 77 53,742 7,682 629,638 35,373 42,448 0.0333 0.6652 0.5352 0.0096 0.0096 0.3079 0.0346 0.0192 0.0077 0.0077 0.0077 5.3742 0.7682 62.9638 3.5373 4.2448 % Total: 100.0000 Substance Composition CAS Number Package Weight (mg): Weight by mg % weight of substance per Homogeneous 660.0100 PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04270 Rev *S Page 13 of 17 100L –TQFP (14 x 14 mm) Pb-Free Package B2.USING COPPER PALLADIUM WIRE Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Nickel Silicon Magnesium Silver Copper Tin Silver Proprietary Bismaleimide Proprietary Polymer Methacrylate Acrylate Ester Organic Peroxide Silicon Copper Palladium Epoxy Resin A Epoxy Resin B Phenol Resin Silica(Amorphous) Carbon Black CAS Number 7440-02-0 7440-21-3 7439-95-4 7440-22-4 7440-50-8 7440-31-5 7440-22-4 Weight by mg 2.7060 0.5535 0.1845 2.8290 116.7270 20.8500 2.0320 Trade Secret 0.2286 Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 7440-05-3 Trade Secret Trade Secret Trade Secret 0.1270 0.0508 0.0508 0.0508 35.4700 2.1715 0.0384 14.0100 14.0100 23.3500 60676-86-0 1333-86-4 Package Weight (mg): 414.2290 1.4010 651.0699 % weight of substance per Homogeneo us 2.2000% 0.4500% 0.1500% 2.3000% 94.9000% 100.0000% 80.0000% 9.0000% 5.0000% 2.0000% 2.0000% 2.0000% 100.0000% 98.2600% 1.7400% 3.0000% 3.0000% 5.0000% 88.7000% 0.3000% 4,156 850 283 4,345 179,285 32,024 3,121 %% Weight of Substance per package 0.4156% 0.0850% 0.0283% 0.4345% 17.9285% 3.2024% 0.3121% 351 0.0351% 195 78 78 78 54,480 3,335 59 21,518 21,518 35,864 0.0195% 0.0078% 0.0078% 0.0078% 5.4480% 0.3335% 0.0059% 2.1518% 2.1518% 3.5864% 636,228 63.6228% 2,152 0.2152% % Total: 100.0000 PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04270 Rev *S Page 14 of 17 100L –TQFP (14 x 14 mm) Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM Cadmium PPM Cr VI PPM Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 10.0 < 2.0 < 4.0 < 10.0 < 2.0 < 2.0 < 2.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R PBB PPM PBDE PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 <5.0 --------<5.0 <5.0 <5.0 <5.0 <5.0 --------<5.0 <5.0 < 2.0 < 4.0 < 2.0 < 5.0 <5.0 --------- <5.0 ----------- CoA-PROB-R CoA-ABOX-R < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 CoA-DESS-R CoA-BUBP-R CoA-TRAY-R CoA-SBAG –R CoA-MBBG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04270 Rev *S Page 15 of 17 100L –TQFP (14 x 14 mm) Pb-Free Package Document History Page Document Title: DATASHEET Document Number: Rev. 100L - TQFP (14 X 14 MM) PB-FREE PACKAGE MATERIAL DECLARATION 001-04270 ** *A ECN No. Orig. of Change 390185 GFJ 391439 GFJ *B 1318604 MRB *C 1521844 MRB *D 2567367 HLR *E 2737814 MAHA *F 3040395 HLR *G *H 3219033 3340834 REYD CMG *I 3400881 CMG *J 3645691 COPI *K 3767019 HLR Description of Change New document Added compliance to Directive 2002/95/EC (RoHS) requirement in the summary. Changed the material composition of Assembly Site 1 and in Assembly Site 2. Added CoA references of indirect materials used in Assembly Site 2. Added reference QTP for Automotive part on Assembly site 1. 1. Updated Cypress Logo 2. Added on the material composition the percent weight per homogeneous material and weight of substance 3. Updated and added Lead, Cr+VI, PBB and PBDE on the Declaration of Packaging/Indirect Materials. 4. Added note 4: the package were based on Engineering calculation and performed on a package family basis. 5. Deleted Declaration of Packaging/Indirect Materials on Assembly site 1. Added CAS number of Antimony Trioxide and Silver. DCon: Replaced from CML to WEB in the distribution list. Added the following for assembly site 1: 1. Package weight for B2 2. Reference QTP # 062603 3. Table B2: NiPdAu with Green Mold Compound Changed the composition of Leadrame on Assemby Site1 (B1). Added Assembly Site 3 – JCET Added QTP# 111817 on Assembly Site 3 – JCET Revised Summary statement – changed package is qualified from “at two assembly sites” to “at three assembly sites” Added QTP# 112302 on Assembly Site 1 Added PMDD B2 for assembly site 2 – ASE Taiwan Copper wire qualification under QTP # 120201. Updated the material compositions of Assembly Site 1, Site 2.B1 and Site 3 to reflect 4 decimal places on values. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04270 Rev *S Page 16 of 17 100L –TQFP (14 x 14 mm) Pb-Free Package Rev. *L ECN No. Orig. of Change 4031297 YUM *M 4122589 JVP *N 3932683 UDR *O 4307613 HLR *P 4404959 REYD *Q 4726106 FZD Added Assembly site name in the Assembly heading. Changed Assembly code to Assembly Site Name. Removed entire Tube row in the Indirect Materials Section. Added package weight in Assembly Site 1 (B3) and Assembly Site 2 (B3) Added Section B3 for NiPdAu with Green Mold Compound using CuPd Bonding Wire for Assembly Site 1, CML , QTP#133307 Added Section B3 for CuPd Bonding Wire for Assembly Site 2, ASE-K, QTP#133306 Added Section B4 for Copper Wire using NiPdAu and Kyocera Mold Compound for Assembly Site 1, CML , QTP#125105 Added B5 material composition for Assembly Site 1 in reference to Automotive qualification for NiPdAu-Ag termination finish (Reference QTP No. 134503). Added B2 on Package Weight and QTP # 141302 under Site 3. Added subsections B1.USING GOLD WIRE and B2.USING COPPER PALLADIUM WIRE under Assembly Site 3. Added QTP# 124804 in Assembly Site 3. *R 5004863 HLR Changed the substances with “-------------“to “Trade Secret”. DCON Removed distribution and posting in the document history page. Added QTP 152607 in assembly site 1. *S 5181469 JSO Description of Change Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04270 Rev *S Page 17 of 17