44L - PLCC Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 JZ 2,373.0000 mg Body Size (mil/mm) Package Weight – Site 2 650x650 mil N/A SUMMARY The 44L-PLCC Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Amkor Technology Philippines (P1/P2) Package Qualification Report # 034601 / 111501 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-JZ44Amkor Philippines (P1/P2) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04293 Rev. *K Page 1 of 4 44L - PLCC Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number 507.2700 11.9600 0.1600 0.7800 22.2100 % weight of substance per Homogeno us material 97.5200% 2.2992% 0.0308% 0.1500% 100.0000% 213,767 5,040 67 329 9,361 21.3767% 0.5040% 0.0067% 0.0329% 0.9361% Weight by mg PPM % weight of substance per package Cu Fe P Zn Sn 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-31-5 Resin Ag Mixed aryl allyl glycidyl compounds Amine Gamma Butyrolactone Diglycidylether of bisphenol-F Si Au Multi-aromatic resin SiO2 Carbon black Cresol Novolac Epoxy Phenol resin Trade Secret 7440-22-4 Trade Secret 0.1500 1.5300 0.0700 6.8493% 69.8631% 3.1963% 65 645 28 0.0065% 0.0645% 0.0028% Trade Secret 96-48-0 Trade Secret 0.1100 0.1100 0.2200 5.0228% 5.0228% 10.0457% 46 46 92 0.0046% 0.0046% 0.0092% 7440-21-3 7440-57-5 Trade Secret 60676-86-0 1333-86-4 29690-82-2 Trade Secret 11.7700 1.2700 136.1500 1561.2300 9.0800 36.3100 72.6200 100.0000% 100.0000% 7.4998% 85.9997% 0.5002% 2.0001% 4.0002% 4,962 535 57,376 657,915 3,825 15,300 30,601 0.4962% 0.0535% 5.7376% 65.7915% 0.3825% 1.5300% 3.0601% % Total: 100.0000 Package Weight (mg): 2,373.0000 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Material Tape & Reel Tube Others Cover tape Carrier tape Plastic Reel Plastic Tube End Plug Shielding bag Lead PPM <20.0 <5.0 < 5.0 <2.0 <2.0 <2.0 Cadmium PPM <20.0 < 5.0 < 5.0 <2.0 <2.0 <2.0 Cr VI PPM <20.0 <5.0 < 5.0 <2.0 <2.0 <2.0 Mercury PPM <20.0 <10.0 < 10.0 <2.0 <2.0 <2.0 PBB PPM <20.0 <50 .0 <50.0 <0.0005 <0.0005 <5.0 PBDE PPM <20.0 <45.0 <45.0 <0.0005 <0.0005 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-PLTB-R CoA-EPLUG-R CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04293 Rev. *K Page 2 of 4 44L - PLCC Pb-Free Package Document History Page Document Title: Document Number: Rev. ** *A *B *C *D *E *F *G *H 44L - PLCC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-04293 ECN No. Orig. of Description of Change Change 390462 YXP New document. 391923 YXP Revised section II of the document to reflect both Amkor and CML’s indirect materials, where applicable. 599641 HLR Changed Cypress Logo. Add % weight of substance per Homogenous Material and % weight of substance per package on the Material Composition. Removed Ca and Ag on the material composition table under Goldwire material. Completed the RoHS Substances namely; Lead Cadmium, Mercury, Chromium VI, PBB and PBDE on Declaration of Packaging Indirect Materials table. Removed the following Indirect materials such as moisture barrier bag, protective band, shipping and inner/pizza box. 2602510 MAHA Added Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. DCON Changed CML to WEB in distribution list. 2796596 MAHA Corrected the CAS numbers of Cresol Novolac Epoxy and Phenol Resin on the material composition table of assembly site 1. 3094054 MAHA Deleted the information for tray and end pin on Table II. DECLARATION OF PACKAGING / INDIRECT MATERIALS. 3262214 ZJL Added QTP # 111501 as additional QTP reference on assembly site 1 title. Updated material composition on section I to incorporate change in leadframe base material. 3446802 MAHA Expressed the weight by mg, package weight, % weight of substance per Homogeneous material, and % weight of substance per package in four decimal places. 3825324 JARG Corrected the Material composition table % weight of substance per package to meet the total of 100.0000% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04293 Rev. *K Page 3 of 4 44L - PLCC Pb-Free Package Rev. *I *J *K ECN No. Orig. of Description of Change Change 4033421 YUM Added Assembly site name in the Assembly heading. Changed Assembly Code to Assembly Site Name. 4086966 YUM Added “P1/P2” in the assembly heading in site 1. 5095666 MRB Changed CAS # from “-----------“ to Trade Secret MEL Removed “Distribution: WEB” and “Posting: NONE” from the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04293 Rev. *K Page 4 of 4