32L - PLCC Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 JZ 1,384.0000 mg Body Size (mil/mm) Package Weight – Site 2 450x550 mil 1212.5000 mg SUMMARY The 32L-PLCC Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Amkor Technology Philippines (P1/P2) Package Qualification Report # 034601/111501 (Note 1) I. DECLARATION OF PACKAGED UNITS II. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-JZ32Amkor Philippines (P1/P2) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Document No. 001-04292 Rev. *H Page 1 of 5 32L - PLCC Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-31-5 Trade Secret 7440-22-4 Trade Secret 329.0100 7.7600 0.1000 0.5100 16.1500 0.0700 0.7500 0.0300 % weight of substance per Homogenous material 97.5200 2.3000 0.0300 0.1500 100.0000 6.6000 70.7500 2.8300 Trade Secret 96-48-0 0.0500 0.0500 4.7200 4.7200 38 38 0.0038% 0.0038% Trade Secret 0.1100 10.3800 77 0.0077% 7440-21-3 7440-57-5 Trade Secret 60676-86-0 1333-86-4 Trade Secret 3.7000 1.0100 76.8500 881.2500 5.1200 20.4900 100.0000 100.0000 7.5000 86.0000 0.5000 2.0000 2,676 732 55,530 636,742 3,702 14,808 0.2676% 0.0732% 5.5530% 63.6742% 0.3702% 1.4808% 40.9900 4.0000 29,600 2.9600% % Total: 100.0000 CAS Number Cu Fe P Zn Sn Resin Ag Mixed aryl allyl glycidyl compounds Amine Gamma Butyrolactone Diglycidylether of bisphenol-F Si Au Multi-aromatic resin SiO2 Carbon black Cresol Novolac Epoxy Phenol resin 26834-02-6 Package Weight (mg): Weight by mg 1,384.0000 PPM % weight of substance per package 237,724 5,607 72 368 11,670 54 539 23 23.7724% 0.5607% 0.0072% 0.0368% 1.1670% 0.0054% 0.0539% 0.0023% II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Material Tape & Reel Tube Others Cover tape Carrier tape Plastic Reel Plastic Tube End Plug Shielding bag Lead PPM <20.0 <5.0 < 5.0 <2.0 <2.0 <2.0 Cadmium PPM <20.0 < 5.0 < 5.0 <2.0 <2.0 <2.0 Cr VI PPM <20.0 <5.0 < 5.0 <2.0 <2.0 <2.0 Mercury PPM <20.0 <10.0 < 10.0 <2.0 <2.0 <2.0 PBB PPM <20.0 <50 .0 <50.0 <0.0005 <0.0005 <5.0 PBDE PPM <20.0 <45.0 <45.0 <0.0005 <0.0005 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-PLTB-R CoA-EPLUG-R CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Document No. 001-04292 Rev. *H Page 2 of 5 32L - PLCC Pb-Free Package ASSEMBLY Site 2: Millennium Microtech Thailand (MMT) Package Qualification Report # 113309 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-JZ28MMT As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Document No. 001-04292 Rev. *H Page 3 of 5 32L - PLCC Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Mn Zn Sn Ag Aromatic Amine Epoxy Resin Si Au Silica Fused Epoxy Resin Cresol Novolac Epoxy Phenol resin Carbon black 7440-50-8 7439-96-5 7440-20-0 7440-31-5 7440-22-4 Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret 29690-82-2 299.6850 0.0150 0.3000 200.0000 63.6000 4.4000 12.0000 100.0000 32.5000 438.5000 25.0000 10.0000 % weight of substance per Homogenous material 99.8950 0.0050 0.1000 100.0000 79.5000 5.5000 15.0000 100.0000 100.0000 87.7000 5.0000 2.0000 Trade Secret 1333-86-4 25.0000 1.5000 5.0000 0.3000 CAS Number Package Weight (mg): Weight by mg 1,212.5000 PPM % weight of substance per package 247,163 12 247 164,948 52,454 3,629 9,897 82,474 26,804 361,650 20,619 8,247 24.7163% 0.0012% 0.0247% 16.4948% 5.2454% 0.3629% 0.9897% 8.2474% 2.6804% 36.1650% 2.0619% 0.8247% 20,619 1,237 2.0619% 0.1237% % Total: 100.0000 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Material Tape & Reel Tube Others Cover tape Carrier tape Plastic Reel Plastic Tube End Plug Shielding bag Lead PPM <20.0 <5.0 < 5.0 <2.0 <2.0 <2.0 Cadmium PPM <20.0 < 5.0 < 5.0 <2.0 <2.0 <2.0 Cr VI PPM <20.0 <5.0 < 5.0 <2.0 <2.0 <2.0 Mercury PPM <20.0 <10.0 < 10.0 <2.0 <2.0 <2.0 PBB PPM <20.0 <50 .0 <50.0 <0.0005 <0.0005 <5.0 PBDE PPM <20.0 <45.0 <45.0 <0.0005 <0.0005 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-PLTB-R CoA-EPLUG-R CoA-SBAG –R CoA-SBAG –X Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Document No. 001-04292 Rev. *H Page 4 of 5 32L - PLCC Pb-Free Package Document History Page Document Title: Document Number: Rev. ** *A *B *C 32L - PLCC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-04292 ECN No. Orig. of Description of Change Change 390462 YXP New document. 391923 YXP Revised section II of the document to reflect both Amkor and CML’s indirect materials, where applicable. 596943 HLR Change Cypress Logo. Add % weight of substance per Homogenous Material and % weight of substance per package on the Material Composition. Removed Ca and Ag on the material composition table under Goldwire material. Complete the RoHS Substances namely; Lead Cadmium, Mercury, Chromium VI, PBB and PBDE on Declaration of Packaging Indirect Materials table. Removed the following Indirect materials such as moisture barrier bag, protective band, shipping and inner/pizza box. 3262214 ZJL Added QTP # 111501 as additional QTP reference on assembly site 1 title. Updated material composition on section I to incorporate change in leadframe base material. *D Dcon 3453203 ZJL *E 3855071 JARG *F 4033421 YUM *G *H 4086966 YUM 5107020 MRB DCON Replaced inactive bookset CML with WEB in distribution. Added PMDD for site 2 – MMT (X) as another approved assembly site for JZ32 package. Align site 1 PMDD to 4 decimal places. Changed Document Title from 32L – PLCC Pb-Free PMDD to 32L – PLCC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Added Assembly Site name in the Assembly heading. Changed Assembly Code to Assembly Site Name. Removed Tray and End Pin in the Indirect Materials Section. Added “P1/P2” in the assembly heading in site 1. Changed CAS # from Proprietary and “--------“ to Trade Secret Removed Distribution: WEB and Posting: None in the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Document No. 001-04292 Rev. *H Page 5 of 5