ETC 2SB1219AR

Transistors
2SB1219, 2SB1219A
Silicon PNP epitaxial planer type
(0.425)
Unit: mm
For general amplification
Complementary to 2SD1820 and 2SD1820A
0.3+0.1
–0.0
0.15+0.10
–0.05
2.1±0.1
5°
1.25±0.10
• Large collector current IC
• S-mini type package, allowing downsizing of the equipment and
automatic insertion through the tape packing and the magazine
packing.
0.9+0.2
–0.1
■ Features
0.9±0.1
3
2
0.2±0.1
1
(0.65) (0.65)
1.3±0.1
2.0±0.2
■ Absolute Maximum Ratings Ta = 25°C
Collector to
base voltage
2SB1219
Collector to
emitter voltage
2SB1219
Symbol
Rating
Unit
VCBO
−30
V
0 to 0.1
Parameter
10°
−60
2SB1219A
−25
VCEO
V
1: Base
2: Emitter
3: Collector
−50
2SB1219A
Emitter to base voltage
VEBO
−5
V
Peak collector current
ICP
−1
A
Collector current
IC
−500
mA
Collector power dissipation
PC
150
mW
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
EIAJ: SC-70
S-Mini Type Package
Marking Symbol
• 2SB1219 : C
• 2SB1219A : D
■ Electrical Characteristics Ta = 25°C ± 3°C
Parameter
Symbol
2SB1219
Collector to
emitter voltage
2SB1219
Min
ICBO
VCB = −20 V, IE = 0
VCBO
IC = −10 µA, IE = 0
VCEO
IC = −2 mA, IB = 0
VEBO
IE = −10 µA, IC = 0
−5
Collector cutoff current
Collector to
base voltage
Conditions
Typ
Max
Unit
− 0.1
µA
−30
V
−60
2SB1219A
−25
V
−50
2SB1219A
Emitter to base voltage
V
VCE = −10 V, IC = −150 mA
85
hFE2
VCE = −10 V, IC = −500 mA
40
Collector to emitter saturation voltage *1
VCE(sat)
IC = −300 mA, IB = −30 mA
− 0.35
− 0.6
V
Base to emitter saturation voltage *1
VBE(sat)
IC = −300 mA, IB = −30 mA
−1.1
−1.5
V
VCB = −10 V, IE = 50 mA, f = 200 MHz
200
Forward current transfer ratio
*1
hFE1
Transition frequency
fT
Collector output capacitance
Cob
*2
VCB = −10 V, IE = 0, f = 1 MHz
340
6
MHz
15
pF
Note) *1: Pulse measurement
*2: Rank classification
Rank
hFE1
Q
R
S
No-rank
85 to 170
120 to 240
170 to 340
85 to 340
Marking
2SB1219
CQ
CR
CS
C
symbol
2SB1219A
DQ
DR
DS
D
Product of no-rank is not classified and have no indication for
rank.
1
2SB1219, 2SB1219A
Transistors
PC  Ta
IC  VCE
−500
−400
120
−400
−1 mA
−300
−200
−100
−100
40
80
120
0
160
−4
0
−10
−3
Ta = 75°C
25°C
−100
Base to emitter saturation voltage VBE(sat) (V)
IC / IB = 10
0
−20
−10
−3
25°C
Ta = −25°C
−1
−3
−10
75°C
− 0.01
− 0.01 − 0.03 − 0.1 − 0.3
200
160
120
80
40
2
3
5
10
20 30 50
Emitter current IE (mA)
100
Collector output capacitance Cob (pF)
VCB = −10 V
Ta = 25°C
−3
300
Ta = 75°C
25°C
−25°C
200
100
0
− 0.01 − 0.03 − 0.1 − 0.3
−10
16
12
8
4
0
−1
−2 −3 −5
−10
−1
−3
−10
Collector current IC (A)
VCER  RBE
IE = 0
f = 1 MHz
Ta = 25°C
20
−10
400
Cob  VCB
24
−8
500
−20−30 −50 −100
Collector to base voltage VCB (V)
−120
Collector to emitter voltage VCER (V)
fT  IE
240
−6
VCE = −10 V
Collector current IC (A)
Collector current IC (A)
1
−1
−4
600
− 0.03
− 0.03
−1
−2
Base current IB (mA)
IC / IB = 10
−30
− 0.1
− 0.01
− 0.01 − 0.03 − 0.1 − 0.3
0
hFE  IC
− 0.3
−25°C
− 0.1
−16
VBE(sat)  IC
−30
− 0.3
−12
Collector to emitter voltage VCE (V)
VCE(sat)  IC
−1
−8
Forward current transfer ratio hFE
0
−100
Collector to emitter saturation voltage VCE(sat) (V)
−500
−2 mA
−200
40
−600
−3 mA
−300
80
Ambient temperature Ta (°C)
Transition frequency fT (MHz)
−9 mA
−8 mA
−7 mA
–6 mA
−5 mA
−4 mA
Collector current IC (mA)
IB = −10 mA
160
VCE = −10 V
Ta = 25°C
−700
Collector current IC (mA)
Collector power dissipation PC (mW)
Ta = 25°C
−600
0
−800
−700
200
0
2
IC  IB
−800
240
IC = −2 mA
Ta = 25°C
−100
−80
−60
2SB1219A
−40
2SB1219
−20
0
1
3
10
30
100
300
1 000
Base to emitter resistance RBE (kΩ)
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the
"Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial
property, the granting of relative rights, or the granting of any license.
(3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(4) The products and product specifications described in this material are subject to change without
notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to
make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, redundant design is recommended,
so that such equipment may not violate relevant laws or regulations because of the function of our
products.
(6) When using products for which dry packing is required, observe the conditions (including shelf life
and after-unpacking standby time) agreed upon when specification sheets are individually exchanged.
(7) No part of this material may be reprinted or reproduced by any means without written permission
from our company.
Please read the following notes before using the datasheets
A. These materials are intended as a reference to assist customers with the selection of Panasonic
semiconductor products best suited to their applications.
Due to modification or other reasons, any information contained in this material, such as available
product types, technical data, and so on, is subject to change without notice.
Customers are advised to contact our semiconductor sales office and obtain the latest information
before starting precise technical research and/or purchasing activities.
B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but
there is always the possibility that further rectifications will be required in the future. Therefore,
Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material.
C. These materials are solely intended for a customer's individual use.
Therefore, without the prior written approval of Panasonic, any other use such as reproducing,
selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited.
2001 MAR