PANASONIC FG6943010R

FG6943010R
FG6943010R
Silicon N-channel MOSFET(FET1)
Unit: mm
Silicon P-channel MOSFET(FET2)
For switching
„ Features
y Low drive voltage: 2.5 V drive
y Halogen-free / RoHS compliant
(EU RoHS / UL-94 V-0 / MSL:Level 1 compliant)
„ Marking Symbol: V7
„ Basic Part Number
1. Source(FET1)
2. Gate(FET1)
3. Drain(FET2)
FJ330301 + FK330301 (Individual)
4. Source(FET2)
5. Gate(FET2)
6. Drain(FET1)
„ Packaging
FG6943010R Embossed type (Thermo-compression sealing):
8 000 pcs / reel (standard)
SSMin6-F3-B
SC-107C
SOT-666
Panasonic
JEITA
Code
„ Absolute Maximum Ratings Ta = 25 °C
Internal Connection
Parameter
Drain-Source Voltage
FET1 Gate-source Voltage
(N-ch.) Drain Current
Drain Current (Pulsed)
Drain-source Voltage
FET2 Gate-source Voltage
(P-ch.) Drain Current
Drain Current (Pulsed)
Total Power Dissipation
Overall Channel Temperature
Storage Temperature
Symbol
Rating
Unit
VDS
VGS
ID
IDp
VDS
VGS
ID
IDp
PD
Tch
Tstg
30
±12
100
200
-30
±12
-100
-200
125
150
-55 to +150
V
V
mA
mA
V
V
mA
mA
mW
°C
°C
6
5
FET 1
FET 2
1
2
Ver. BED
3
Pin Name
1. Source(FET1)
2. Gate(FET1)
3. Drain(FET2)
Publication date: September 2012
4
4. Source(FET2)
5. Gate(FET2)
6. Drain(FET1)
1
FG6943010R
„ Electrical Characteristics Ta = 25 °C ± 3 °C
FET1(N-ch.)
Parameter
Symbol
Drain-source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-source Leakage Current
Gate-source Threshold Voltage
Drain-source On-state Resistance
Forward transfer admittance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
VDSS
IDSS
IGSS
Vth
RDS(on)1
RDS(on)2
|Yfs|
Ciss
Coss
Crss
Turn-on Time *1
ton
Turn-off Tme *1
toff
Conditions
ID = 1.0 mA, VGS = 0 V
VDS = 30 V, VGS = 0 V
VGS = ±10 V, VDS = 0 V
ID = 1.0 μA, VDS = 3.0 V
ID = 10 mA, VGS = 2.5 V
ID = 10 mA, VGS = 4.0 V
ID = 10 mA, VDS = 3.0 V
Min
Typ
Max
30
0.5
20
VDS = 3 V, VGS = 0 V, f = 1 MHz
VDD = 3 V, VGS = 0 to 3 V,
ID = 10 mA
VDD = 3 V, VGS = 3 to 0 V,
ID = 10 mA
1.0
3
2
55
12
7
3
1.0
±10
1.5
6
3
Unit
V
μA
μA
V
Ω
Ω
mS
pF
pF
pF
100
ns
100
ns
Note Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 Measuring methods for transistors.
*1 FET1 ton,toff measurement circuit
„ Electrical Characteristics Ta = 25 °C ± 3 °C
FET2(P-ch.)
Parameter
Symbol
Drain-source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-source Leakage Current
Gate-source Threshold Voltage
Drain-source On-state Resistance
Forward transfer admittance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
VDSS
IDSS
IGSS
Vth
RDS(on)1
RDS(on)2
|Yfs|
Ciss
Coss
Crss
Turn-on Time *2
ton
Turn-off Tme *2
toff
Conditions
ID = -1.0 mA, VGS = 0 V
VDS = -30 V, VGS = 0 V
VGS = ±10 V, VDS = 0 V
ID = -1.0 μA, VDS = -3.0 V
ID = -10 mA, VGS = -2.5 V
ID = -10 mA, VGS = -4.0 V
ID = -10 mA, VDS = -3.0 V
VDS = -3 V, VGS = 0 V, f = 1 MHz
VDD = -3 V, VGS = 0 to -3 V,
ID = -10 mA
VDD = -3 V, VGS = -3 to 0 V,
ID = -10 mA
Min
Typ
Max
-30
-0.5
20
-1.0
7
4
40
12
7
3
-1.0
±10
-1.5
17
7
Unit
V
μA
μA
V
Ω
Ω
mS
pF
pF
pF
100
ns
100
ns
Note Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 Measuring methods for transistors.
*2 FET2 ton,toff measurement circuit
Ver. BED
2
FG6943010R
*1 FET1 ton,toff measurement circuit
VDD = 3 V
ID = 10 mA
RL = 300 Ω
Vout
D
Vin
VGS=0~3 V
G
50 Ω
S
90 %
Vin
10 %
90 %
Vout
10 %
ton
toff
Ver. BED
3
FG6943010R
VDD = -3 V
*2 FET2 ton,toff measurement circuit
ID = -10 mA
RL = 300 Ω
Vout
D
Vin
VGS=0~-3 V
G
50 Ω
S
10 %
Vin
90 %
10 %
Vout
90 %
ton
toff
Ver. BED
4
FG6943010R
FET1(N-ch.)
1.E+00
Drain Current ID (A)
Drain Current ID (A)
0.1
VGS = 4.0 V
0.05
2.5 V
2.0 V
1.5 V
Ta = 85 °C
1.E-02
25 °C
1.E-03
-30 °C
1.E-04
1.E-05
1.E-06
0
0
1.E-01
0.5
0
1
Drain-source Voltage VDS (V)
ID - VDS
2
3
ID - VGS
0.3
10000
Drain-source On-State Resistance
RDS(on) (Ω)
Drain-source Voltage VDS (V)
1
Gate-source Voltage VGS (V)
10 mA
0.2
ID= 20 mA
0.1
5 mA
0
10
2.5 V
1
VGS = 4.0 V
1000
0.1
100
0
1
2
3
4
5
Gate to Source Voltage VGS(V)
0.001
0.01
0.1
Drain Current ID (A)
VDS - VGS
RDS(on) - ID
Capacitance C (pF)
100
Ciss
10
Coss
Crss
1
0.1
1
10
100
Drain-source Voltage VDS (V)
Capacitance - VDS
Ver. BED
5
FG6943010R
FET1(N-ch.)
Drain-source On-state Resistance
RDS(on) (Ω)
Gate-source Threshold Voltage Vth (V)
2
1.5
1
-50
0
50
100
150
3
2.5 V
2
VGS = 4.0 V
1
0
-50
0
Temperature Ta (°C)
50
100
150
Temperature Ta (°C)
Vth - Ta
RDS(on) - Ta
Total Power Dissipation PD (W)
0.2
0.1
0
0
50
100
150
Temperature Ta (°C)
PD - Ta
10
1
Drain current ID(A)
Thermal Resistance Rth (°C/W)
1000
100
10
IDp = 0.2 A
10 ms
100 ms
0.01
Operation in this area
is limited by RDS(on)
1s
DC
0.001
1
0.001
1 ms
0.1
Ta = 25 °C, Glass epoxy board
(25.4 × 25.4 × t0.8mm)coated with copper foil,
which has more than 300 mm2.
0.01
0.1
1
10
100
0.0001
0.01
1000
Pulse Width tsw (s)
0.1
1
10
100
Drain-source Voltage VDS(V)
Rth -tsw
Safe Operating Area
Ver. BED
6
FG6943010R
FET2(P-ch.)
-0.05
-0.1
Drain Current ID (A)
Drain Current ID (A)
VGS = -4.0 V
-2.5 V
-0.05
-1.5 V
Ta = 85 °C
-0.04
-0.03
25 °C
-0.02
-0.01
-30 °C
-2.0 V
0
0
-1
0
-0.2
-0.4
-0.6
-0.8
-3
Gate-source Voltage VGS (V)
Drain-source Voltage VDS (V)
ID - VDS
ID - VGS
1000000
Drain-source On-state Resistance
RDS(on) (Ω)
-0.5
Drain-source Voltage VDS (V)
-2
-1
-0.4
-0.3
ID= -20 mA
-0.2
-5 mA
-0.1
-10 mA
0
1000
100000
100
-2.5 V
10000
10
VGS = -4.0 V
1
1000
0.1
100
0
-1
-2
-3
-4
-5
-6
-0.001
-0.01
-0.1
Drain Current ID (A)
Gate-source Voltage VGS (V)
VDS - VGS
RDS(on) - ID
Capacitance C (pF)
100
Ciss
10
Coss
Crss
1
-0.1
-1
-10
-100
Drain-source Voltage VDS (V)
Capacitance - VDS
Ver. BED
7
FG6943010R
2
Drain-source On-state Resistance
RDS(on) (Ω)
Gate-source Threshold Voltage Vth (V)
FET2(P-ch.)
1.5
1
-50
0
50
100
150
12
10
-2.5 V
8
6
VGS = -4.0 V
4
2
0
-50
0
50
Temperature Ta (°C)
100
150
200
Temperature Ta (°C)
Vth - Ta
RDS(on) - Ta
Total Power Dissipation PD (W)
0.2
0.1
0
0
50
100
150
Temperature Ta (°C)
PD - Ta
-10
Drain Current ID (A)
Thermal Resistance Rth (°C/W)
1000
100
10
1
0.1
0.001
-1
IDp = -0.2 A
1 ms
-0.1
10 ms
100 ms
-0.01
Operation in this area
is limited by RDS(on)
-0.001
1s
DC
Ta = 25 °C, Glass epoxy board
(25.4 × 25.4 × t0.8 mm)coated with copper foil,
which has more than 300 mm2.
0.01
0.1
1
10
100
-0.0001
-0.01
1000
Pulse Width tsw (s)
-0.1
-1
-10
-100
Drain-source Voltage VDS (V)
Rth -tsw
Safe Operating Area
Ver. BED
8
FG6943010R
SSMin6-F3-B
Unit: mm
„ Land Pattern (Reference) (Unit: mm)
Ver. BED
9
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20100202
Mouser Electronics
Authorized Distributor
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FG6943010R