Document No. 001-97233 Rev. ** ECN #: 4725523 Cypress Semiconductor Product Qualification Report QTP # 151304 VERSION** May, 2015 CCG1 Device Family S8PF-10R Technology, Fab 4 CMI CYPD1103** CYPD1104** CYPD1105** CYPD1120** CYPD1121** CYPD1122** CYPD1131** CYPD1132** CYPD1134** USB Type-C Port Controller with Power Delivery FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda (JYF) Reliability Engineer Reviewed By: Rene Rodgers (RT) Reliability Manager Approved By: Don Darling (DCDA) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 19 Document No. 001-97233 Rev. ** ECN #: 4725523 PRODUCT QUALIFICATION HISTORY QTP Number 083401 113905 151304 Description of Qualification Purpose Qualify SONOS S8DI-5R Technology in Fab 4 using PSoC 8C20066BC Krypton Device Qualify device 8C20400BC S8P12-10P Technology Fabricated at Fab4 (CMI) Qualify CCG1 device (8C44100A/ 8C44110A/ 8F44100A), S8PF-10R Technology in Fab 4 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 19 Date Jan 2009 Jan 2012 Apr 2015 Document No. 001-97233 Rev. ** ECN #: 4725523 PRODUCT DESCRIPTION (for qualification) Qualification Purpose: To qualify CCG1 device (8C44100A/ 8C44110A/ 8F44100A), S8PF-10R technology in Fab 4 CYPD1103**/ CYPD1104**/ CYPD1105**/ CYPD1120**/ CYPD1121**/ Marketing Part #: CYPD1122**CYPD1131**/ CYPD1132** CYPD1134** Device Description: USB Type-C Port Controller with Power Delivery Cypress Division: Cypress Semiconductor – Data Communication Division TECHNOLOGY/FAB PROCESS DESCRIPTION Number of Metal Layers: 5 Metal Composition: Metal 1: 100A Ti / 3200A Al 0.5%Cu / 300A TiW Metal 2: 100A Ti/3,200A Al 0.5% Cu/350A TiW Metal 3: 150A Ti / 7200A Al 0.5%Cu / 350A TiW Metal 4: 150A Ti / 7200A Al 0.5%Cu / 350A TiW Metal 5: 300A Ti / 12000A Al 0.5%Cu / 300A TiW 1,000A NFUSOX /6,000A Nitride Passivation Type and Thickness: Generic Process Technology/Design Rule ( -drawn): S8 / 0.13u SiO2 / 32A & SiO2 / 120A Gate Oxide Material/Thickness (MOS): Name/Location of Die Fab (prime) Facility: Fab 4, CMI-Minnesota Die Fab Line ID/Wafer Process ID: S8PF-10R PACKAGE AVAILABILITY PACKAGE ASSEMBLY FACILITY SITE WIRE MATERIAL QTP NUMBER 16L SOIC (150 mils) CML-RA Au QTP# 150801 40L QFN CML-RA CuPd QTP# 151904 35 WLCSP DT-Philippines - QTP# 144402 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 19 Document No. 001-97233 Rev. ** ECN #: 4725523 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: SZ161 16L SOIC (150 mils) KE-G3000DA/Kyocera Mold Compound Flammability Rating: UL-94 V-0 Oxygen Rating Index: >28% 54% Leadframe Designation FMP Lead Frame Material: Copper Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Die Separation Method: Backgrind Saw Die Attach Supplier: Henkel Die Attach Material: QMI 519 Bond Diagram Designation: 001-95720 Wire Bond Method: Thermosonic Wire Material/Size: Au/ 0.8 mil Thermal Resistance Theta JA °C/W: 85°C/W Package Cross Section Yes/No: No Assembly Process Flow: 11-21099 Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 19 Document No. 001-97233 Rev. ** ECN #: 4725523 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: LQ40A 40L Quad Flat No Lead (6x6x0.6mm) 7470LA/Nitto Mold Compound Flammability Rating: UL-94 V-0 Oxygen Rating Index: >28% 54% Leadframe Designation FMP Lead Frame Material: Copper Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Die Separation Method: Backgrind Saw Die Attach Supplier: Henkel Die Attach Material: QMI 519 Bond Diagram Designation: 001-72734 Wire Bond Method: Thermosonic Wire Material/Size: CuPd/ 0.8 mil Thermal Resistance Theta JA °C/W: 15.34°C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 11-21099 Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 19 Document No. 001-97233 Rev. ** ECN #: 4725523 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Die Backside Preparation Method: FN35A 35-Ball Wafer Level Chip Scale Package (WLCSP) (3.23 x 2.10 x 0.55mm) Backgrind Die Separation Method: Saw Solder Ball/Bump Material: SAC405 Bonding Method: Bump/ RDL Bond Diagram Designation: 001-95722 Thermal Resistance Theta JA °C/W: 28°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 001-69882 Name/Location of Assembly (prime) facility: DT-Philippines MSL Level 1 Reflow Profile 260C Package Outline, Type, or Name: ELECTRICAL TEST / FINISH DESCRIPTION Test Location: DT-Philippines Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 19 Document No. 001-97233 Rev. ** ECN #: 4725523 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260 C Reflow) 200C, 4hrs MIL-STD-883, Method 883-2011 Acoustic Microscopy Age Bond Strength MIL-STD-883 – Method 2011, Bond Pull Electrostatic Discharge Charge Device Model (ESD-CDM) Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Machine Model (ESD-MM) 150°C, No Bias JESD22-A117 and JESD22-A103 Test to determine the existence and extent of cracks, Criteria: No Package Crack 125°C, 8.5V JESD78 500V/1,000V/1,250V JESD22-C101 1,100V/1,600V/2,200V /3,300V JESD22, Method A114 200V, 220V, 275V, 330V JESD22-A115 Endurance Test MIL-STD-883, Method 883-1033/ JESD22-A117 Data Retention Dye Penetrant Test Dynamic Latch-up High Accelerated Saturation Test (HAST) High Temperature Operating Life Early Failure Rate High Temperature Operating Life Early Failure Rate, Regulator On High Temperature Operating Life Latent Failure Rate High Temperature Steady State life JEDEC STD 22-A110: 130°C, 85% RH, 5.25V/5.5V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260 C Reflow) Dynamic Operating Condition, Vcc Max=2.1V/2.07V, 150°C JESD22-A-108 Dynamic Operating Condition, Vcc Max=5V, 125°C/150°C Dynamic Operating Condition, Vcc Max=2.07V/6V, 150°C JESD22-A-108 Dynamic Operating Condition, Vcc Max=2.1V/2.07V, 150°C JESD22-A-108 Static Operating Condition, Vcc Max=2.1V, 150°C JESD22-A-108 Result P/F P P P P P P P P P P P P P P P Internal Visual MIL-STD-883-2014 P Low Temperature Operating Life Dynamic Operating Condition, -30°C, 2.1V JESD22-A108 P Low Temperature Storage Life -40°C, No Bias P Pressure Cooker JESD22-A102:121°C /100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260 C Reflow) P SEM Analysis MIL-STD-883, Method 2018 P Static Latch-up Temperature Cycle Thermal Shock 85C/125C, +/-140mA 85C, +/-180mA 85C, +/- 200mA JESD 78 MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260 C Reflow) MIL-STD-883, Method 1011, Condition B, -55°C to 125°C and JESD22-A106, Condition C, -55°C to 125°C Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 19 P P P Document No. 001-97233 Rev. ** ECN #: 4725523 RELIABILITY FAILURE RATE SUMMARY Stress/Test Device Tested/ Device Hours # Fails Activation Energy Thermal AF3 High Temperature Operating Life Early Failure Rate 4,491 Devices 0 N/A N/A 0 PPM High Temperature Operating Life Long Term Failure Rate 718,500 DHRs 0 0.7 170 8 FIT 1 2 3 Failure Rate (1) (2) Assuming an ambient temperature of 55 C and a junction temperature rise of 15 C. Chi-squared 60% estimations used to calculate the failure rate. Thermal Acceleration Factor is calculated from the Arrhenius equation AF = exp EA k 1 - 1 T2 T1 where: EA =The Activation Energy of the defect mechanism. K = Boltzmann’s constant = 8.62x10-5 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. (1) (2) Early Failure Rate was computed from QTP# 151304 Long Term Failure Rate was computed from QTP# 083401, QTP#113905 and QTP# 151304 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 19 Document No. 001-97233 Rev. ** ECN #: 4725523 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA COMP 15 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA COMP 15 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 15 0 STRESS: AGE BOND STRENGTH CY8C20566 (8C20566AC) 4827949 610844164 CML-R COMP 3 0 CY8C20466 (8C20466AC) 4804681 610822808 Malaysia-CA COMP 3 0 CY8C20666 (8C20666AC) 4836589 610852813 Malaysia-CA COMP 3 0 STRESS: DATA RETENTION, PLASTIC, 150C CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 78 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 1000 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 500 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 1000 78 0 CY8C20566 (8C20566AC) 4810486 610830786 CML-R 168 77 0 CY8C20566 (8C20566AC) 4815537 610835437 CML-R 168 77 0 CY8C20566 (8C20566AC) 4827949 610844164 CML-R 168 79 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 168 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 168 76 0 STRESS: ENDURANCE STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 500 9 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 9 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 9 0 N/A N/A COMP 1 0 STRESS: SEM CROSS SECTION CY8C20066 (8C20066AC) 4810486 STRESS: STATIC LATCH-UP (85C, 8.25V, +/-200mA) CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 6 0 CY8C20666 (8C20666AC) 4836589 610852813 Malaysia-CA COMP 6 0 CY8C20666 (8C20666AC) 4837410 410.23.02 Promex COMP 6 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 19 Document No. 001-97233 Rev. ** ECN #: 4725523 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (2,200V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 2200 8 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 2200 8 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 2200 8 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (3,300V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 3300 3 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 3300 3 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 3300 3 0 STRESS: ESD-MACHINE MODEL, (200V) CY8C20236A (8C202662A) 4126494 611143319 KOREA-L 200 5 0 CY8C20236A (8C202662A) 4125077 611143627 PHIL-MB 200 5 0 STRESS: ESD-MACHINE MODEL, (220V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 220 6 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 220 6 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 220 6 0 STRESS: ESD-MACHINE MODEL, (275V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 275 3 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 275 3 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 275 3 0 STRESS: ESD-MACHINE MODEL, (330V) CY8C20566 (8C20566AC) 4810486 610830371 CML-R 330 3 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 330 3 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 330 3 0 STRESS: DYNAMIC LATCH-UP (125C, 8.5V) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA COMP 5 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA COMP 5 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 5 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 19 Document No. 001-97233 Rev. ** ECN #: 4725523 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.1V, Vcc Max) CY8C20566 (8C20566AC) 4827949 610844164 CML-R 48 1002 0 CY8C20566 (8C20566AC) 4815537 610835437 CML-R 48 1008 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 48 1004 1 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 48 1004 0 STRESS: Read NV Latch (1) HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (150, 5V, Vcc Max) CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 48 45 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 48 45 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (125C, 5V, Vcc Max) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 96 45 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.1V, Vcc Max) CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 390 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 390 0 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 500 390 0 STRESS: HIGH TEMP STEADY STATE LIFE TEST (150C, 2.1V) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 80 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 80 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 168 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 80 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 168 77 0 STRESS: LOW TEMPERATURE DYNAMIC OPERATING LIFE, -30C, 2.1V CY8C20566 (8C20566AC) 4815537 610835437 CML-R 500 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 500 77 0 (1) Destroyed during failure analysis Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 19 Document No. 001-97233 Rev. ** ECN #: 4725523 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Lot Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.25V), PRE COND 192 HR 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 128 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 128 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 256 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 128 77 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 333 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 288 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 288 77 0 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 1000 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 12 of 19 Document No. 001-97233 Rev. ** ECN #: 4725523 Reliability Test Data ER114031 Device Fab Lot # Assy Lot # Assy Lot Duration Samp 1000 100 Rej Failure Mechanism STRESS: LOW TEMPERATURE STORAGE, -40C, No Bias CY8C20236A (8C202662A) 4137730 611155459 L-KOREA 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 13 of 19 Document No. 001-97233 Rev. ** ECN #: 4725523 Reliability Test Data QTP #: 113905 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA COMP 15 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN COMP 15 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN COMP 15 0 CY8CTMA443 (8C20401A) 4131142 611148867 G-TAIWAN COMP 15 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN COMP 10 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN COMP 10 0 CY8CTMA443 (8C20401A) 4131142 611148867 G-TAIWAN COMP 10 0 STRESS: BOND PULL STRESS: DATA RETENTION, 150C CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 500 80 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 1000 80 0 4130520 611147744 G-TAIWAN COMP 15 0 4130520 611147744 G-TAIWAN 168 80 0 CML-RA COMP 9 0 COMP 3 0 COMP 8 0 STRESS: DYE PENETRANT TEST CY8CTMA443 (8C20401A) STRESS : ENDURANCE CY8CTMA443 (8C20401A) STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8CTMA443 (8C20401B) 4140358 611153802 STRESS: ESD-HUMAN BODY MODEL PER JESD22, METHOD A114, (1100V) CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA STRESS: ESD-HUMAN BODY MODEL PER JESD22, METHOD A114, (1600V) CY8CTMA443 (8C20401B) 4140358 611153801 CML-RA STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.5V), PRE COND 192 HR 30C/60%RH (MSL3) CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 128 80 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 128 78 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REG-ON (150C, 6.0V, Vcc Max) CY8CTMA443 (8C20401A) 4130520 611147745 G-TAIWAN 48 45 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 14 of 19 Document No. 001-97233 Rev. ** ECN #: 4725523 Reliability Test Data QTP #: 113905 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 2.07V, Vcc Max) CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA 48 1492 0 CY8CTMA443 (8C20401B) 4140358 611153800 CML-RA 48 1074 2 ISB Deep Sleep, CAR#201201012 CY8CTMA443 (8C20401B) 4140358 611153800 CML-RA 48 418 1 ISB Deep Sleep, CAR#201201012 CY8CTMA443 (8C20401B) 4141585 611156224 G-TAIWAN 48 1500 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 48 1000 0 CY8CTMA443 (8C20401A) 4131142 611148870 G-TAIWAN 48 500 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max) CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 80 116 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 500 116 0 4130520 611147744 G-TAIWAN COMP 5 0 STRESS: INTERNAL VISUAL CY8CTMA443 (8C20401A) STRESS: PRESSURE COOKER TEST (121C, 100%RH, 15 Psig), PRE COND 192 HR 30C/60%RH (MSL3) CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA 168 77 0 CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA 288 77 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 168 80 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 288 80 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 168 80 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 288 80 0 STRESS: TEMPERATURE CYCLE (COND. C, -65C TO 150C), PRE COND 192 HR 30C/60%RH (MSL3) CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA 500 83 0 CY8CTMA443 (8C20401B) 4140358 611153802 CML-RA 1000 83 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 500 79 0 CY8CTMA443 (8C20401A) 4130520 611147744 G-TAIWAN 1000 79 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 500 80 0 CY8CTMA443 (8C20401A) 4129433 611148871 G-TAIWAN 1000 80 0 CY8CTMA443 (8C20401A) 4131142 611148867 G-TAIWAN 500 80 0 CY8CTMA443 (8C20401A) 4131142 611148867 G-TAIWAN 1000 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 15 of 19 Document No. 001-97233 Rev. ** ECN #: 4725523 Reliability Test Data QTP #: 113905 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CML-RA COMP 6 0 G-TAIWAN COMP 2 0 G-TAIWAN 200 80 0 Failure Mechanism STRESS: STATIC LATCH-UP TESTING (125C, 8.25V, +/-140mA) CY8CTMA443 (8C20401B) 4140358 611153802 STRESS: THERMAL JUNCTION MEASUREMENT CY8CTMA443 (8C20401A) 4130520 611147744 STRESS: THERMAL SHOCK (COND. B, -55C TO 125C) CY8CTMA443 (8C20401A) 4130520 611147744 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 16 of 19 Document No. 001-97233 Rev. ** ECN #: 4725523 Reliability Test Data QTP #: 151304 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: DATA RETENTION, PLASTIC, 150C CYPD1132 (8C44110A) 4251883 611301729 TAIIWAN-G 500 70 0 CYPD1132 (8C44110A) 4251883 611301729 TAIIWAN-G 1000 70 0 CYPD1132 (8C44110A) 4251883 611302906 TAIWAN-G 168 80 0 CYPD1132 (8C44110A) 4251883 611302906 TAIWAN-G 500 80 0 STRESS: ENDURANCE STRESS: ESD-CHARGE DEVICE MODEL, (500V) CYPD1132 (8C44110A) 4251883 611302905 TAIWAN-G COMP 9 0 CYPD1132 (8C44110A) 4251883 611303718 TAIWAN-G COMP 9 0 CYPD1132 (8C44110A) 4251883 611302173 CML-RA COMP 9 0 STRESS: ESD-CHARGE DEVICE MODEL, (1000V) CYPD1132 (8C44110A) 4251883 611302905 TAIWAN-G COMP 3 0 CYPD1132 (8C44110A) 4251883 611303718 TAIWAN-G COMP 3 0 CYPD1132 (8C44110A) 4251883 611302173 CML-RA COMP 3 0 STRESS: ESD-CHARGE DEVICE MODEL, (1250V) CYPD1132 (8C44110A) 4251883 611302905 TAIWAN-G COMP 3 0 CYPD1132 (8C44110A) 4251883 611303718 TAIWAN-G COMP 3 0 CYPD1132 (8C44110A) 4251883 611302173 CML-RA 3 0 9 0 3 0 COMP STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (2,200V) CYPD1132 (8C44110A) 4251883 611302905 TAIWAN-G COMP STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (3,300V) CYPD1132 (8C44110A) 4251883 611302905 TAIWAN-G COMP STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.07V, Vcc Max) CYPD1132 (8C44110A) 4251883 611303750 TAIWAN-G 48 189 0 CYPD1132 (8C44110A) 4251883 611302906 TAIWAN-G 48 1111 0 CYPD1132 (8C44110A) 4251883 611307128N TAIWAN-G 48 1093 0 CYPD1132 (8C44110A) 4251883 611308275 TAIWAN-G 48 1049 0 CYPD1132 (8C44110A) 4251883 611308282 TAIWAN-G 48 1049 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 17 of 19 Document No. 001-97233 Rev. ** ECN #: 4725523 Reliability Test Data QTP #: 151304 Device STRESS: Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (150, 2.07V, Vcc Max) CYPD1132 (8C44110A) 4251883 611302906 TAIWAN-G 48 39 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max) CYPD1132 (8C44110A) 4251883 611302906 TAIWAN-G 80 151 0 CYPD1132 (8C44110A) 4251883 611302906 TAIWAN-G 500 151 0 TAIWAN-G COMP 32 0 STRESS: PRE/POST LFR PARAMETER ASSESSMENT CYPD1132 (8C44110A) 4251883 611303750 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CYPD1132 (8C44110A) 4251883 611301729 TAIIWAN-G 168 77 0 CYPD1132 (8C44110A) 4251883 611301729 TAIIWAN-G 288 77 0 TAIWAN-G COMP 6 0 TAIWAN-G COMP 2 0 TAIWAN-G COMP 2 0 STRESS: STATIC LATCH-UP (85C, +/-140mA) CYPD1132 (8C44110A) 4251883 611302905 STRESS: STATIC LATCH-UP (85C, +/-180mA) CYPD1132 (8C44110A) 4251883 611302905 STRESS: STATIC LATCH-UP (125C, +/-140mA) CYPD1132 (8C44110A) 4251883 611302905 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CYPD1132 (8C44110A) 4251883 611301729 TAIIWAN-G 500 77 0 CYPD1132 (8C44110A) 4251883 611301729 TAIIWAN-G 1000 76 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 18 of 19 Document No. 001-97233 Rev. ** ECN #: 4725523 Document History Page Document Title: Document Number: Rev. ECN No. ** QTP# 151304: CCG1 DEVICE FAMILY S8PF-10R TECHNOLOGY, FAB 4 CMI 001-97233 Orig. of Change 4725523 JYF Description of Change Initial spec release. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 19 of 19