121– BGA (10 x 10 x 1.2 mm) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 BK B1: 202.9995mg B2: 200.7815 mg Body Size (mil/mm) Package Weight – Site 2 10x10x1.2mm B1 : 190.3900 mg B2 : 194.3800 mg SUMMARY The 121- BGA Pb-Free package is compliant to RoHS. Packages from different assembly sites are likely to have different materials composition. However, Cypress guarantees that product ordered with a part number containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meets all requirement of the EU RoHS directive. ASSEMBLY Site 1: Cypress Manufacturing Limited (CML) Package Qualification Report #s 110501, 120610 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-BK121CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70381 Rev.*H Page 1 of 7 121– BGA (10 x 10 x 1.2 mm) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3 Using Au Wire Material Substrate Purpose of Use Base Material Solder Ball External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Cured Resin Proprietary Glass Fabrics Proprietary Copper Foil 7440-50-8 Diethylene Glycol Monoethyl Ether Acetate Acetophenone Derirative Silica Crystalline Solvent naptha Sn Ag Cu Silver Bismaleimide Resin Synthetic Resin Additive Silicon Au Silica Epoxy Resin Phenol Resin Carbon Black Pigment Proprietary Weight by mg % weight of substance per Homogeneous material 23.2400 28.0000% 18.2600 22.0000% 89,951 8.9951% 24.9000 30.0000% 122,660 12.2660% 4.1500 5.0000% 20,443 2.0443% 4.1500 4.1500 4.1500 16.7450 0.1700 0.0850 0.5990 5.0000% 5.0000% 5.0000% 98.5000% 1.0000% 0.5000% 80.0000% 20,443 20,443 20,443 82,488 837 419 2,951 2.0443% 2.0443% 2.0443% 8.2488% 0.0837% 0.0419% 0.2951% 0.0749 0.0524 0.0225 21.4000 4.1580 67.4896 4.9850 3.8346 10.0000% 7.0000% 3.0000% 100.0000% 100.0000% 88.0000% 6.5000% 5.0000% 369 258 111 105,419 20,483 332,462 24,557 18,890 0.0369% 0.0258% 0.0111% 10.5419% 2.0483% 33.2462% 2.4557% 1.8890% 0.3835 0.5000% PPM 114,483 % weight of substance per package 11.4483% Proprietary 14808-60-7 Proprietary 7440-31-5 7440-22-4 7440-50-8 7440-22-4 Proprietary Proprietary Proprietary 7440-21-3 7440-57-5 60676-86-0 Proprietary Proprietary 1333-86-4 Package Weight (mg): 202.9995 1,889 % Total: 0.1889% 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70381 Rev.*H Page 2 of 7 121– BGA (10 x 10 x 1.2 mm) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3 Using CuPd Wire Material Substrate Purpose of Use Base Material Solder Ball External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Cured Resin Proprietary 23.2400 % weight of substance per Homogeneous material 28.0000% 115,748 % weight of substance per package 11.5748% Glass Fabrics Proprietary 18.2600 22.0000% 90,945 9.0945% Copper Foil Diethylene Glycol Monoethyl Ether Acetate Acetophenone Derirative Silica Crystalline Solvent naptha Sn Ag Cu Silver Bismaleimide Resin Synthetic Resin Additive Silicon Copper Palladium Silica Epoxy Resin (1) Epoxy Resin (2) Phenol Resin 7440-50-8 24.9000 30.0000% 124,015 12.4015% Proprietary 4.1500 5.0000% 20,669 2.0669% Proprietary 4.1500 5.0000% 20,669 2.0669% 14808-60-7 Proprietary 7440-31-5 7440-22-4 7440-50-8 7440-22-4 4.1500 4.1500 16.7450 0.1700 0.0850 0.5990 5.0000% 5.0000% 98.5000% 1.0000% 0.5000% 79.9947% 20,669 20,669 83,399 847 423 2,983 2.0669% 2.0669% 8.3399% 0.0847% 0.0423% 0.2983% 0.0749 10.0027% 373 0.0373% 0.0524 0.0225 21.4000 1.9200 0.0200 6.9979% 3.0047% 100.0000% 99.0000% 1.0000% 89.0000% 5.0000% 2.0000% 4.0000% 261 112 106,584 9,563 100 339,954 19,098 7,640 15,279 0.0261% 0.0112% 10.6584% 0.9563% 0.0100% 33.9954% 1.9098% 0.7640% 1.5279% Substance Composition CAS Number Proprietary Proprietary Proprietary 7440-21-3 7440-50-8 7440-05-3 60676-86-0 93705-66-9 Proprietary 106466-55-1 Package Weight (mg): Weight by mg 68.2565 3.8346 1.5339 3.0677 200.7815 PPM % Total: 100.0000 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Cover tape < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-R Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R CoA-SBAG-R CoA-PROB-R CoA-ABOX-R Material Lead PPM Cadmium PPM Cr VI PPM Mercury PPM PBB PPM PBDE PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70381 Rev.*H Page 3 of 7 121– BGA (10 x 10 x 1.2 mm) Pb-Free Package ASSEMBLY Site 2: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report #s 115001, 120403 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-BK121ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70381 Rev.*H Page 4 of 7 121– BGA (10 x 10 x 1.2 mm) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using CuPd Bond Wire Material Material Substrate Purpose of Use Base Material Solder Ball External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation SiO2 60676-86-0 8.1100 % weight of substance per Homogeneous material 10.9996% Acrylic 29690-82-2 7.3700 9.9959% Substance Composition CAS Number Weight by mg 42,595 % weight of substance per package 4.2595% 38,722 3.8722% PPM Epoxy 68541-56-0 5.9000 8.0022% 30,978 3.0978% Bisphenol 13676-54-5 11.0600 15.0007% 58,084 5.8084% Trazol 25722-66-1 12.9000 17.4963% 67,764 6.7764% Copper Gold Nickel Sn Ag Cu Silver Epoxy Resin Functionalize Ester Diester Silicon Copper Palladium Silica Epoxy Resin Phenol Resin Carbon Black Pigment 7440-50-8 7440-57-5 7440-02-0 7440-31-5 7440-22-4 7440-50-8 7440-22-4 Proprietary 26.8700 0.4100 1.1100 12.3300 0.1300 0.0600 3.7500 0.2700 36.4438% 0.5561% 1.5055% 98.5000% 1.0000% 0.5000% 76.5306% 5.5102% 141,143 2,130 5,808 64,776 658 329 19,705 1,417 14.1143% 0.2130% 0.5808% 6.4776% 0.0658% 0.0329% 1.9705% 0.1417% Proprietary 0.2700 5.5102% 1,417 0.1417% Proprietary 7440-21-3 7440-50-8 7440-05-3 60676-86-0 Proprietary Proprietary 0.6100 11.0200 1.8700 0.0500 77.4100 4.7500 3.8800 12.4490% 100.0000% 99.0000% 1.0000% 89.6987% 5.5041% 4.4959% 3,220 57,880 9,816 272 406,598 24,931 20,398 0.3220% 5.7880% 0.9816% 0.0272% 40.6598% 2.4931% 2.0398% 1333-86-4 0.2600 0.3013% 1,360 0.1360% Package Weight (mg): 190.3900 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70381 Rev.*H Page 5 of 7 121– BGA (10 x 10 x 1.2 mm) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Au Bond Wire Material Material Substrate Purpose of Use Base Material Solder Ball External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation SiO2 60676-86-0 8.1100 % weight of substance per Homogeneous material 10.9996% Acrylic 29690-82-2 7.3700 9.9959% Substance Composition CAS Number Weight by mg 41,722 % weight of substance per package 4.1722% 37,915 3.7915% PPM Epoxy 68541-56-0 5.9000 8.0022% 30,353 3.0353% Bisphenol 13676-54-5 11.0600 15.0007% 56,899 5.6899% Trazol 25722-66-1 12.9000 17.4963% 66,365 6.6365% Copper Gold Nickel Sn Ag Cu Silver Epoxy Resin Functionalize Ester Diester Silicon Gold Silica Epoxy Resin Phenol Resin Carbon Black Pigment 7440-50-8 7440-57-5 7440-02-0 7440-31-5 7440-22-4 7440-50-8 7440-22-4 Proprietary 26.8700 0.4100 1.1100 12.3300 0.1300 0.0600 3.7500 0.2700 36.4438% 0.5561% 1.5055% 98.5000% 1.0000% 0.5000% 76.5306% 5.5102% 138,234 2,109 5,710 63,432 669 309 19,292 1,389 13.8234% 0.2109% 0.5710% 6.3432% 0.0669% 0.0309% 1.9292% 0.1389% Proprietary 0.2700 5.5102% 1,389 0.1389% Proprietary 7440-21-3 7440-57-5 60676-86-0 Proprietary Proprietary 0.6100 11.0200 5.91 77.4100 4.7500 3.8800 12.4490% 100.0000% 100.0000% 89.6987% 5.5041% 4.4959% 3,138 56,693 30,404 398,241 24,437 19,961 0.3138% 5.6693% 3.0404% 39.8241% 2.4437% 1.9961% 1333-86-4 0.2600 0.3013% 1,338 0.1338% Package Weight (mg): 194.3800 % Total: 100.0000 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Cover tape < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-G Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-CART-G CoA-PLRL-G CoA-TRAY-G CoA-MBBG-G CoA-SBAG-G CoA-PROB-G CoA-ABOX-G Material Lead PPM Cadmium PPM Cr VI PPM Mercury PPM PBB PPM PBDE PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70381 Rev.*H Page 6 of 7 121– BGA (10 x 10 x 1.2 mm) Pb-Free Package Document History Page Document Title: Document Number: Rev. ** *A *B *C *D *E *F *G *H 121-BGA 10X10x1.2MM PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-70381 ECN No. Orig. of Description of Change Change 3290889 HLR Initial Spec 3587519 COPI Added PMMD for Assy Site 2. Reference QTP # 120610 – CML RA Copper Pd Wire Qualification. 3637762 MLA Removed 48FBGA data (site 2). Added new data for 121FBGA at ASE-G location, reference QTP # 115001. 3646058 MLA Correct total package weight from 200.7815 to 190.3900 grams for site #2 (CuPd wire). Add site #2 (Au wire) table. 3648817 GLAN Change reference QTP # of Assembly Site 2 from 115001 to 120403 3793547 JARG Added Material Composition B2 for Assembly Site 1 using CuPd wire. Reference QTP 120610 Added QTP 115001 for CuPd Wire Material Composition for Assembly Site 2-B1 4056911 HLR Changed Assembly Site Code to Assembly Site Name. Added Assembly Site Name on heading for Assembly Site 1 and 2. 4084026 YUM Corrected total package weight of Material Composition in Site 1:B1. 4445982 HLR Added CAS Number of Copper on Assembly Site 1. Corrected the CAS Number of Copper on Substrate Material for Assembly Site 2. Distribution: WEB Posting: None Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-70381 Rev.*H Page 7 of 7