484-FBGA (23x23mm) Non Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 BB 1254.7600 mg 1312.0509 mg Body Size (mil/mm) Package Weight – Site 2 23 x 23 mm N/A SUMMARY The 484L-FBGA is a Non Pb-Free package. Standard components (Non Pb-Free) currently in production are RoHS 5 compliant. Standard components may contain Pb, but do not contain the other 5 substances (above allowable levels). ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report #s 011707, 130803 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS are listed in section 1A. Materials from this list may be contained or intentionally added to this product, as it is not considered Pb-Free or RoHS compliant. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM Analysis Report (Note 2) 0 0 38.1100 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 30,372 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-75822 Rev *C Page 1 of 5 484-FBGA (23x23mm) Non Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Single die, silver filled epoxy die attach Material Substrate Purpose of Use Base Material Solder Ball External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg % Weight of Substance per Homogenous Material PPM % Weight of Substance per Package SiO2 60676-86-0 46.2300 10.4899 36,844 3.6844 Acrylic 29690-82-2 40.5400 9.1988 32,309 3.2309 Epoxy 68541-56-0 Bisphenol Triazol Cu 13676-54-5 25722-66-1 7440-50-8 27.0600 66.0200 78.9600 173.3300 6.1401 14.9804 17.9165 39.3297 21,566 52,616 62,928 138,138 2.1566 5.2616 6.2928 13.8138 Ni 7440-02-0 Au Br Sn Pb Ag Amine Epoxy Resin Si Au Ion Impurities Silica Fused Epoxy Resin Phenolic Resin Mixed Siloxanes Brominated Resin Silica Antimony Trioxide Carbon Black Silica Cristobalite Antimony Pentoxide 7440-57-5 7726-95-6 7440-31-5 7439-92-1 7440-22-4 Trade Secret Trade Secret 7440-21-3 7440-57-5 Trade Secret 60676-86-0 Trade Secret Trade Secret Trade Secret Trade Secret 14808-60-7 1309-64-4 1333-86-4 14464-46-1 6.1300 2.1600 0.2800 64.8900 38.1100 79.1600 3.5100 17.5400 67.0000 16.8383 0.0017 368.9000 73.7800 31.6200 21.0800 9.4860 4.2160 4.2160 4.2160 4.2160 1.3909 0.4901 0.0635 63.0000 37.0000 78.9941 3.5026 17.5032 100.0000 99.9899 0.0101 70.0000 14.0000 6.0000 4.0000 1.8000 0.8000 0.8000 0.8000 0.8000 4,885 1,721 223 51,715 30,372 63,088 2,797 13,979 53,397 13,420 1 294,000 58,800 25,200 16,800 7,560 3,360 3,360 3,360 3,360 0.4885 0.1721 0.0223 5.1715 3.0372 6.3088 0.2797 1.3979 5.3397 1.3420 0.0001 29.4000 5.8800 2.5200 1.6800 0.7560 0.3360 0.3360% 0.3360 0.3360 5.2700 1.0000 4,200 0.4200 1309-64-4 Package Weight (mg): 1254.7600 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-75822 Rev *C Page 2 of 5 484-FBGA (23x23mm) Non Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Stacked Die using DAF die attach Material Substrate Solder Ball Die Attach SiO2 60676-86-0 46.2300 % Weight of Substance per Homogenous Material 10.4899 Acrylic 29690-82-2 40.5400 9.1988 30,898 3.0898 Epoxy 68541-56-0 27.0600 6.1401 20,624 2.0624 Bisphenol Triazol Cu 13676-54-5 25722-66-1 7440-50-8 66.0200 78.9600 173.3300 14.9804 17.9165 39.3297 50,318 60,181 132,106 5.0318 6.0181 13.2106 Ni 7440-02-0 6.1300 1.3909 4,672 0.4672 Au Br Sn Pb Modified epoxy resin Epoxy resin 1 Dapsone Siloxanes and silicones di-Me Silane Elastomeric polymer Epoxy resin Si Au Ion Impurities Silica Fused Epoxy Resin Phenolic Resin Carbon Black 7440-57-5 7726-95-6 7440-31-5 7439-92-1 2.1600 0.2800 96.6200 56.7500 0.4901 0.0635 63.0000 37.0000 1,646 213 73,640 43,253 0.1646 0.0213 7.3640 4.3253 Trade Secret 24.3700 59.9951 18,574 1.8574 Trade Secret 80-08-0 10.1500 1.2200 24.9877 3.0034 7,736 930 0.7736 0.0930 67762-90-7 1.2200 3.0034 930 0.0930 Trade Secret 1.2200 3.0034 930 0.0930 Trade Secret 1.2200 3.0034 930 0.0930 Trade Secret 7440-21-3 7440-57-5 Trade Secret 60676-86-0 Trade Secret Trade Secret 1333-86-4 1.2200 103.2500 9.45 0.0009 496.9000 36.7000 28.2300 2.8200 3.0034 100.0000 99.9899 0.0101 88.0014 6.4996 4.9996 0.4994 930 78,694 7,202 1 378,720 27,971 21,516 2,149 0.0930 7.8694 0.7202 0.0001 37.8720 2.7971 2.1516 0.2149 Purpose of Use Base Material External Plating Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Package Weight (mg): Weight by mg 1312.0509 PPM % Weight of Substance per Package 35,235 3.5235 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-75822 Rev *C Page 3 of 5 484-FBGA (23x23mm) Non Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Lead PPM Cadmium PPM Cr VI PPM Mercury PPM Cover tape < 5.0 < 5.0 < 5.0 Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Material PBB PPM PBDE PPM < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R CoA-SBAG-R CoA-PROB-R CoA-ABOX-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-75822 Rev *C Page 4 of 5 484-FBGA (23x23mm) Non Pb-Free Package Document History Page Document Title: 484-FBGA (23 X 23MM) NON PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Document Number: 001-75822 ** Orig. of Change 3509455 HLR *A 4064088 YUM *B 4642231 MLA *C 5142476 Rev. ECN No. HLR DCON Description of Change New document Added assembly site name in the assembly heading. Changed Assembly code to Assembly site name. Added table B2 to support QTP# 130803. Add package weight and QTP# to first page. Changed the substances with “------------- “to “Trade Secret Removed “Distribution: WEB” and “Posting: None” from history page Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-75822 Rev *C Page 5 of 5