DISCRETE SEMICONDUCTORS DATA SHEET BFG541 NPN 9 GHz wideband transistor Product specification File under Discrete Semiconductors, SC14 September 1995 Philips Semiconductors Product specification NPN 9 GHz wideband transistor FEATURES BFG541 PINNING • High power gain PIN • Low noise figure 1 emitter • High transition frequency 2 base • Gold metallization ensures excellent reliability. 3 emitter 4 collector DESCRIPTION 4 page DESCRIPTION NPN silicon planar epitaxial transistor, intended for wideband applications in the GHz range, such as analog and digital cellular telephones, cordless telephones (CT1, CT2, DECT, etc.), radar detectors, satellite TV tuners (SATV), MATV/CATV amplifiers and repeater amplifiers in fibre-optic systems. 1 Fig.1 SOT223. The transistors are mounted in a plastic SOT223 envelope. September 1995 2 Top view 2 3 MSB002 - 1 Philips Semiconductors Product specification NPN 9 GHz wideband transistor BFG541 QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VCBO collector-base voltage open emitter − − 20 V VCES collector-emitter voltage RBE = 0 − − 15 V IC DC collector current − − 120 mA mW Ptot total power dissipation up to Ts = 140 °C; note 1 − − 650 hFE DC current gain IC = 40 mA; VCE = 8 V; Tj = 25 °C 60 120 250 Cre feedback capacitance IC = 0; VCB = 8 V; f = 1 MHz − 0.7 − pF fT transition frequency IC = 40 mA; VCE = 8 V; f = 1 GHz; Tamb = 25 °C − 9 − GHz GUM maximum unilateral power gain IC = 40 mA; VCE = 8 V; f = 900 MHz; Tamb = 25 °C − 15 − dB IC = 40 mA; VCE = 8 V; f = 2 GHz; Tamb = 25 °C − 9 − dB S212 insertion power gain IC = 40 mA; VCE = 8 V; f = 900 MHz; Tamb = 25 °C 13 14 − dB F noise figure Γs = Γopt; IC = 10 mA; VCE = 8 V; f = 900 MHz; Tamb = 25 °C − 1.3 1.8 dB PL1 output power at 1 dB gain compression IC = 40 mA; VCE = 8 V; RL = 50 Ω; f = 900 MHz; Tamb = 25 °C − 21 − dBm ITO third order intercept point IC = 40 mA; VCE = 8 V; RL = 50 Ω; f = 900 MHz; Tamb = 25 °C − 34 − dBm LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCBO collector-base voltage open emitter − 20 V VCES collector-emitter voltage RBE = 0 − 15 V VEBO emitter-base voltage open collector − 2.5 V IC DC collector current − 120 mA Ptot total power dissipation − 650 mW Tstg storage temperature −65 150 °C Tj junction temperature − 175 °C up to Ts = 140 °C; note 1 THERMAL RESISTANCE SYMBOL Rth j-s PARAMETER thermal resistance from junction to soldering point CONDITIONS up to Ts = 140 °C; note 1 Note 1. Ts is the temperature at the soldering point of the collector tab. September 1995 3 THERMAL RESISTANCE 55 K/W Philips Semiconductors Product specification NPN 9 GHz wideband transistor BFG541 CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS IE = 0; VCB = 8 V MIN. TYP. MAX. − − 50 UNIT ICBO collector cut-off current nA hFE DC current gain IC = 40 mA; VCE = 8 V 60 120 250 Ce emitter capacitance IC = ic = 0; VEB = 0.5 V; f = 1 MHz − 2 − pF Cc collector capacitance IE = ie = 0; VCB = 8 V; f = 1 MHz − 1 − pF Cre feedback capacitance IC = 0; VCB = 8 V; f = 1 MHz − 0.7 − pF fT transition frequency IC = 40 mA; VCE = 8 V; f = 1 GHz; Tamb = 25 °C − 9 − GHz GUM maximum unilateral power gain (note 1) IC = 40 mA; VCE = 8 V; f = 900 MHz; Tamb = 25 °C − 15 − dB IC = 40 mA; VCE = 8 V; f = 2 GHz; Tamb = 25 °C − 9 − dB S212 insertion power gain Ic = 40 mA; VCE = 8 V; f = 900 MHz; Tamb = 25 °C 13 14 − dB F noise figure Γs = Γopt; IC = 10 mA; VCE = 8 V; f = 900 MHz; Tamb = 25 °C − 1.3 1.8 dB Γs = Γopt; IC = 40 mA; VCE = 8 V; f = 900 MHz; Tamb = 25 °C − 1.9 2.4 dB Γs = Γopt; IC = 10 mA; VCE = 8 V; f = 2 GHz; Tamb = 25 °C − 2.1 − dB PL1 output power at 1 dB gain compression Ic = 40 mA; VCE = 8 V; RL = 50 Ω; f = 900 MHz; Tamb = 25 °C − 21 − dBm ITO third order intercept point note 2 − 34 − dBm Vo output voltage note 3 − 500 − mV d2 second order intermodulation distortion note 4 − −50 − dB Notes 1. GUM is the maximum unilateral power gain, assuming S12 is zero and 2 S 21 - dB. G UM = 10 log ------------------------------------------------------------2 2 1 – S 11 1 – S 22 2. IC = 40 mA; VCE = 8 V; RL = 50 Ω; f = 900 MHz; Tamb = 25 °C; fp = 900 MHz; fq = 902 MHz; measured at f(2p−q) = 898 MHz and at f(2p−q) = 904 MHz. 3. dim = −60 dB (DIN 45004B); IC = 40 mA; VCE = 8 V; ZL = Zs = 75 Ω; Tamb = 25 °C; Vp = Vo; Vq = Vo −6 dB; Vr = Vo −6 dB; fp = 795.25 MHz; fq = 803.25 MHz; fr = 805.25 MHz; measured at f(p+q−r) = 793.25 MHz 4. IC = 40 mA; VCE = 8 V; Vo = 325 mV; Tamb = 25 °C; fp = 250 MHz; fq = 560 MHz; measured at f(p+q) = 810 MHz September 1995 4 Philips Semiconductors Product specification NPN 9 GHz wideband transistor BFG541 MRA654 - 1 1000 Ptot MRA655 250 handbook, halfpage handbook, halfpage hFE (mW) 800 200 600 150 400 100 200 50 0 10−2 0 0 50 100 150 200 10−1 1 102 10 IC (mA) T ( o C) s VCE ≤ 10 V. VCE = 8 V; Tj = 25 °C. Fig.2 Power derating curve. Fig.3 MRA656 1.0 DC current gain as a function of collector current. MRA657 12 handbook, halfpage handbook, halfpage Cre (pF) fT (GHz) 0.8 VCE = 8 V 8 4V 0.6 0.4 4 0.2 0 10−1 0 0 4 8 VCB (V) 12 IC = 0; f = 1 MHz. f = 1 GHz; Tamb = 25 °C. Fig.4 Fig.5 Feedback capacitance as a function of collector-base voltage. September 1995 5 1 10 IC (mA) 102 Transition frequency as a function of collector current. Philips Semiconductors Product specification NPN 9 GHz wideband transistor BFG541 In Figs 6 to 9, GUM = maximum power gain; MSG = maximum stable gain; Gmax = maximum available gain. MRA658 25 MRA659 25 handbook, halfpage handbook, halfpage gain (dB) gain (dB) 20 20 Gmax MSG 15 15 GUM Gmax 10 10 GUM 5 5 0 0 0 20 40 0 80 60 20 40 60 80 IC (mA) IC (mA) VCE = 8 V; f = 900 MHz. VCE = 8 V; f = 2 GHz. Fig.7 Gain as a function of collector current. Fig.6 Gain as a function of collector current. MRA660 50 MRA661 50 handbook, halfpage handbook, halfpage gain (dB) gain (dB) 40 40 GUM MSG GUM 30 30 MSG 20 20 Gmax Gmax 10 10 0 10 102 103 f (MHz) 0 10 104 IC = 10 mA; VCE = 8 V. 103 f (MHz) 104 IC = 40 mA; VCE = 8 V. Fig.8 Gain as a function of frequency. September 1995 102 Fig.9 Gain as a function of frequency. 6 Philips Semiconductors Product specification NPN 9 GHz wideband transistor BFG541 MEA977 MEA976 –20 –20 handbook, halfpage handbook, halfpage d im (dB) –30 d2 (dB) –30 –40 –40 –50 –50 –60 –60 –70 20 10 30 40 –70 50 60 I C (mA) Fig.10 Intermodulation distortion as a function of collector current. MRA666 5 handbook, halfpage Gass (dB) (dB) f = 900 MHz 15 30 Gass 2000 MHz 2 C =10 mA Fmin 4 10 3 5 2 20 Gass (dB) 15 (dB) Gass 10 0 IC (mA) Fmin 1 10 mA 0 10 5 40 mA 1000 MHz 900 MHz 500 MHz 1 40 mA 2000 MHz Fmin 1 50 60 I C (mA) MRA667 5 handbook, halfpageI 1000 MHz 3 40 Fig.11 Second order intermodulation distortion as a function of collector current. 20 Fmin 4 20 10 −5 100 0 102 0 103 f (MHz) −5 104 VCE = 8 V. VCE = 8 V. Fig.12 Minimum noise figure and associated available gain as functions of collector current. Fig.13 Minimum noise figure and associated available gain as functions of frequency. September 1995 7 Philips Semiconductors Product specification NPN 9 GHz wideband transistor BFG541 90° handbook, full pagewidth 1.0 1 135° 0.8 45° 2 0.5 0.6 G = 13 dB 0.2 G = 14 dB G = 15 dB Γ0.2 MS 180° 0 Gmax = 15.3 dB Fmin = 1.3 dB ΓOPT 0.5 1 0.4 5 0.2 2 5 0° 0 F = 1.5 dB 0.2 5 F = 2 dB F = 3 dB 0.5 −135° 2 −45° 1 MRA668 1.0 −90° IC = 10 mA; VCE = 8 V; Zo = 50 Ω; f = 900 MHz. Fig.14 Noise circle figure. 90° handbook, full pagewidth 1.0 1 135° 0.8 45° 2 0.5 G = 7 dB G = 6 dB ΓMS G = 8 dB Gmax = 8.5 dB 0.6 0.2 0.4 5 0.2 180° 0.2 0 0.5 1 2 5 0° 0 ΓOPT 0.2 Fmin = 2.1 dB 5 F = 2.5 dB F = 3 dB −135° 0.5 F = 4 dB 2 −45° 1 MRA669 −90° IC = 10 mA; VCE = 8 V; Zo = 50 Ω; f = 2 GHz. Fig.15 Noise circle figure. September 1995 8 1.0 Philips Semiconductors Product specification NPN 9 GHz wideband transistor BFG541 90° handbook, full pagewidth 1.0 1 135° 0.8 45° 2 0.5 0.6 3 GHz 0.2 0.4 5 0.2 180° 0.2 0 0.5 1 2 5 0° 40 MHz 0.2 0.5 −135° 0 5 2 −45° 1 MRA662 −90° IC = 40 mA; VCE = 8 V. Zo = 50 Ω. Fig.16 Common emitter input reflection coefficient (S11). 90° handbook, full pagewidth 45° 135° 40 MHz 180° 3 GHz 50 40 30 20 0° 10 −135° −45° −90° MRA663 IC = 40 mA; VCE = 8 V. Fig.17 Common emitter forward transmission coefficient (S21). September 1995 9 1.0 Philips Semiconductors Product specification NPN 9 GHz wideband transistor BFG541 90° handbook, full pagewidth 135° 45° 3 GHz 0.5 0.4 0.3 0.2 0.1 40 MHz 180° 0° −135° −45° −90° MRA664 IC = 40 mA; VCE = 8 V. Fig.18 Common emitter reverse transmission coefficient (S12). 90° handbook, full pagewidth 1.0 1 135° 0.8 45° 2 0.5 0.6 0.2 0.4 5 0.2 3 GHz 180° 0.2 0 0.5 1 2 5 0° 0 5 0.2 40 MHz −135° 0.5 2 −45° 1 MRA665 −90° IC = 40 mA; VCE = 8 V. Zo = 50 Ω. Fig.19 Common emitter output reflection coefficient (S22). September 1995 10 1.0 Philips Semiconductors Product specification NPN 9 GHz wideband transistor BFG541 PACKAGE OUTLINE Plastic surface mounted package; collector pad for good heat transfer; 4 leads D SOT223 E B A X c y HE v M A b1 4 Q A A1 1 2 3 Lp bp e1 w M B detail X e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp b1 c D E e e1 HE Lp Q v w y mm 1.8 1.5 0.10 0.01 0.80 0.60 3.1 2.9 0.32 0.22 6.7 6.3 3.7 3.3 4.6 2.3 7.3 6.7 1.1 0.7 0.95 0.85 0.2 0.1 0.1 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 96-11-11 97-02-28 SOT223 September 1995 EUROPEAN PROJECTION 11 Philips Semiconductors Product specification NPN 9 GHz wideband transistor BFG541 DEFINITIONS Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1995 12