STMICROELECTRONICS STTH3003CW

STTH3003CW
®
HIGH FREQUENCY SECONDARY RECTIFIER
MAJOR PRODUCT CHARACTERISTICS
IF(AV)
2 x 15 A
VRRM
300 V
Tj (max)
175 °C
VF (max)
1V
trr (max)
40 ns
A2
K
A1
FEATURES AND BENEFITS
TO-247
COMBINES HIGHEST RECOVERY AND
REVERSE VOLTAGE PERFORMANCE
ULTRA-FAST, SOFT AND NOISE-FREE
RECOVERY
DESCRIPTION
Dual center tap Fast Recovery Epitaxial Diodes
suited for Switch Mode Power Supply and high
frequency DC to DC converters.
Packaged in TO-247 this device is intended for
secondary rectification.
ABSOLUTE RATINGS (limiting values, per diode)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
300
V
IF(RMS)
RMS forward current
30
A
15
30
A
140
A
7
A
-65 +175
°C
+175
°C
IF(AV)
Average forward current
Tc = 135°C
δ = 0.5
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
IRSM
Non repetitive peak reverse current
tp = 20 µs square
Tstg
Storage temperature range
Tj
Maximum operating junction temperature
October 1999 - Ed: 5A
Per diode
Per device
1/5
STTH3003CW
THERMAL RESISTANCES
Symbol
Rth (j-c)
Parameter
Junction to case
Rth (c)
Value
Unit
Per diode
2.0
°C/W
Total
1.05
Coupling
0.1
STATIC ELECTRICAL CHARACTERISTICS (per diode)
Symbol
IR *
VF **
Parameter
Tests conditions
Reverse leakage
current
VR = 300 V
Forward voltage drop
IF = 15 A
Min.
Typ.
Tj = 25°C
40
Tj = 125°C
Max.
Unit
40
µA
400
1.25
Tj = 25°C
Tj = 125°C
V
0.85
1
Typ.
Max.
Unit
30
ns
Pulse test : * tp = 5 ms, δ < 2 %
** tp = 380 µs, δ < 2%
To evaluate the maximum conduction losses use the following equation :
P = 0.75 x IF(AV) + 0.017 IF2(RMS)
RECOVERY CHARACTERISTICS
Symbol
trr
Tests conditions
IF = 0.5 A
IF = 1 A
tfr
VFP
Sfactor
IRM
2/5
Irr = 0.25 A
IR = 1A
Min.
Tj = 25°C
40
dIF/dt = - 50 A/µs VR = 30V
IF = 15 A dIF/dt = 100 A/µs
VFR = 1.1 x VF max.
Tj = 25°C
Vcc = 200 V
IF = 15 A
dIF/dt = 200A/µs
Tj = 125°C
300
ns
3.5
V
0.3
8.5
A
STTH3003CW
Fig. 1: Conduction losses versus average current
(per diode).
Fig. 2: Forward voltage drop versus forward
current (maximum values, per diode).
P1(W)
20
18
16
14
12
10
8
6
4
2
0
IFM(A)
δ = 0.1
δ = 0.05
δ = 0.2
200
δ = 0.5
100
δ=1
Tj=125°C
Tj=25°C
10
Tj=75°C
T
IF(av) (A)
0
2
4
6
8
10
δ=tp/T
12
14
VFM(V)
tp
16
18
20
Fig. 3: Relative variation of thermal impedance
junction to case versus pulse duration.
1
0.50
1.00
1.25
1.50
1.75
2.50
IRM(A)
IF=2*IF(av)
VR=200V
Tj=125°C
14
IF=IF(av)
12
δ = 0.5
10
8
δ = 0.2
0.2
IF=0.5*IF(av)
6
δ = 0.1
T
4
Single pulse
δ=tp/T
tp(s)
0.0
1E-3
1E-2
1E-1
tp
1E+0
Fig. 5: Reverse recovery time versus dIF/dt (90%
confidence, per diode).
2
0
dIF/dt(A/µs)
0
50
100 150 200 250 300 350 400 450 500
Fig. 6: Softness factor versus dIF/dt (typical
values, per diode).
trr(ns)
S factor
100
0.60
VR=200V
Tj=125°C
80
VR=200V
Tj=125°C
0.50
0.40
60
IF=2*IF(av)
IF=IF(av)
40
0.30
0.20
IF=0.5*IF(av)
20
dIF/dt(A/µs)
0
2.25
16
0.8
0.4
2.00
Fig. 4: Peak reverse recovery current versus
dIF/dt (90% confidence, per diode).
Zth(j-c)/Rth(j-c)
1.0
0.6
0.75
0
50 100 150 200 250 300 350 400 450 500
0.10
0.00
dIF/dt(A/µs)
0
50 100 150 200 250 300 350 400 450 500
3/5
STTH3003CW
Fig. 7: Relative variation of dynamic parameters
versus junction temperature (reference: Tj = 125°C).
Fig. 8: Transient peak forward voltage versus
dIF/dt (90% confidence, per diode).
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
25
8
VFP(V)
6
S factor
5
4
3
IRM
2
1
Tj(°C)
50
75
0
100
125
Fig. 9: Forward recovery time versus dIF/dt (90%
confidence, per diode).
tfr(ns)
500
450
400
350
300
250
200
150
100
50
0
4/5
VFR=1.1*VF max.
IF=IF(av)
Tj=125°C
dIF/dt(A/µs)
0
IF=IF(av)
Tj=125°C
7
50 100 150 200 250 300 350 400 450 500
dIF/dt(A/µs)
0
50
100 150 200 250 300 350 400 450 500
STTH3003CW
PACKAGE MECHANICAL DATA
TO-247
DIMENSIONS
REF.
V
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
Dia.
V
A
H
L5
L
L2 L4
F2
F1
L1
F3
V2
F4
D
L3
F(x3)
M
G
=
E
=
Ordering code
Marking
Package
STTH3003CW STTH3003CW
TO-247
Cooling method: by conduction (C)
Recommended torque value: 0.8 N.m.
Maximum torque value: 1.0 N.m.
Epoxy meets UL 94,V0
A
4.85
5.15 0.191
D
2.20
2.60 0.086
E
0.40
0.80 0.015
F
1.00
1.40 0.039
F1
3.00
F2
2.00
F3 2.00
2.40 0.078
F4 3.00
3.40 0.118
G
10.90
H 15.45
15.75 0.608
L 19.85
20.15 0.781
L1 3.70
4.30 0.145
L2
18.50
L3 14.20
14.80 0.559
L4
34.60
L5
5.50
M
2.00
3.00 0.078
V
5°
V2
60°
Dia. 3.55
3.65 0.139
Weight
4.36g
Base qty
30
0.203
0.102
0.031
0.055
0.118
0.078
0.094
0.133
0.429
0.620
0.793
0.169
0.728
0.582
1.362
0.216
0.118
5°
60°
0.143
Delivery mode
Tube
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia
Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.
http://www.st.com
5/5