STD150NH02L-1 STD150NH02L N-channel 24V - 0.003Ω - 150A - ClipPAK™ - IPAK STripFET™ IlI Power MOSFET General features Type VDSSS RDS(on) ID STD150NH02L STD150NH02L-1 24V 24V <0.0035Ω <0.0035Ω 150A 150A 3 3 2 1 ■ RDS(on) * Qg industry’s benchmark ■ Conduction losses reduced ■ Switching losses reduced ■ Low threshold device Description ClipPAKTM 1 IPAK Internal schematic diagram The STD150NH02L utilizes the latest advanced design rules of ST’s proprietary STripFET™ technology. This novel 0.6µ process utilizes also unique metallization techniques that couple to a "bondless" assembly technique result in outstanding performance with standard DPAK outline. It is therefore ideal in high performance DC-DC converter applications where efficiency it to be achieved at very high out currents. Applications ■ Switching application Order codes Part number Marking Package Packaging STD150NH02LT4 D150NH02L ClipPAK™ Tape & reel STD150NH02L-1 D150NH02L IPAK Tube December 2006 Rev 9 1/16 www.st.com 16 Contents STD150NH02L Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................ 6 3 Test circuit 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2/16 ................................................ 8 STD150NH02L 1 Electrical ratings Electrical ratings Table 1. Absolute maximum ratings Symbol Parameter Value Unit 30 V Drain-source voltage (VGS = 0) 24 V Drain-gate voltage (RGS = 20KΩ) 24 V Drain-source voltage ± 20 V ID Drain current (continuous) at TC = 25°C 150 A ID Drain current (continuous) at TC=100°C 107 A Drain current (pulsed) 600 A Total dissipation at TC = 25°C 125 W Derating factor 0.83 W/°C Single pulse avalanche energy 500 mJ -55 to 175 °C Value Unit Vspike (1) Drain-source voltage rating VDS VDGR VGS IDM (2) PTOT EAS (3) Tstg TJ Storage temperature Max. operating junction temperature 1. Garanted when external Rg = 4.7 Ω and tf < tfmax. 2. Pulse width limited by safe operating area 3. Starting TJ = 25 oC, ID = 75A, VDD = 10V Table 2. Symbol Thermal data Parameter RthJC Thermal resistance junction-case Max 1.2 °C/W RthJA Thermal resistance junction-ambient Max 100 °C/W Tl Maximum lead temperature for soldering purpose 275 °C 3/16 Electrical characteristics 2 STD150NH02L Electrical characteristics (TCASE=25°C unless otherwise specified) Table 3. Symbol V(BR)DSS 1. On(1) /off states Parameter Drain-source breakdown voltage Test conditions ID = 25mA, VGS = 0 Typ. Zero gate voltage drain current (VGS = 0) IGSS Gate body leakage current (VDS = 0) VGS = ±20V VGS(th) Gate threshold voltage VDS= VGS, ID = 250µA RDS(on) Static drain-source on resistance VGS = 10V, ID = 75A Max. 24 VDS = 20V, TC = 125°C 1 VGS = 5V, ID = 37.5A Unit V VDS = 20V IDSS 1 10 µA µA ±100 nA 1.8 V 0.003 0.004 0.0035 0.0065 Ω Ω Typ. Max. Unit Pulsed: Pulse duration = 300 µs, duty cycle 1.5% Table 4. Symbol gfs (1) Ciss Coss Crss Qg Qgs Qgd Qoss(2) Qgls (3) RG Dynamic Parameter Test conditions Min. Forward transconductance VDS = 10 V, ID = 75A 60 S Input capacitance Output capacitance Reverse transfer capacitance VDS = 15V, f = 1 MHz, VGS = 0 4450 1126 141 pF pF pF Total gate charge Gate-source charge Gate-drain charge VDD = 16V, ID = 150A VGS = 10V 69 13 9 93 nC nC nC Output charge VDS = 16V, VGS = 0V 27 nC Third-quadrant gate charge VDS < 0V, VGS = 10V 64 nC Gate input resistance f = 1MHz gate DC Bias = 0 Test signal level = 20mV Open drain 1.6 Ω 1. Pulsed: pulse duration=300µs, duty cycle 1.5% 2. Qoss = Coss*∆ Vin , Coss = Cgd + Cds . See Appendix A 3. Gate charge for synchronous operation 4/16 Min. STD150NH02L Electrical characteristics Table 5. Symbol td(on) tr td(off) tf Table 6. Symbol ISD ISDM VSD(1) trr Qrr IRRM Switching times Parameter Max. Unit 14 224 69 40 54 ns ns ns ns Typ. Max Unit Source-drain current 150 A Source-drain current (pulsed) 600 A 1.15 V Turn-on delay time Rise time Turn-off delay time Fall time Test conditions Min. VDD = 10V, ID = 75A, RG = 4.7Ω, VGS = 10V Figure 13 on page 8 Typ. Source drain diode Parameter Test conditions Forward on voltage ISD = 75A, VGS = 0 Reverse recovery time Reverse recovery charge Reverse recovery current di/dt = 100A/µs, VDD = 15V, TJ = 150°C ISD = 150A, Figure 15 on page 8 Min 47 58 2.5 ns µC A 1. Pulsed: pulse duration=300µs, duty cycle 1.5% 5/16 Electrical characteristics STD150NH02L 2.1 Electrical characteristics (curves) Figure 1. Safe operating area Figure 2. Thermal impedance Figure 3. Output characterisics Figure 4. Transfer characteristics Figure 5. Transconductance Figure 6. Static drain-source on resistance 6/16 STD150NH02L Electrical characteristics Figure 7. Gate charge vs gate-source voltage Figure 8. Figure 9. Normalized gate threshold voltage vs temperature Figure 11. Source-drain diode forward characteristics Capacitance variations Figure 10. Normalized on resistance vs temperature Figure 12. Normalized breakdown voltage vs temperature 7/16 Test circuit 3 STD150NH02L Test circuit Figure 13. Switching times test circuit for resistive load Figure 14. Gate charge test circuit Figure 15. Test circuit for inductive load Figure 16. Unclamped Inductive load test switching and diode recovery times circuit Figure 17. Unclamped inductive waveform 8/16 STD150NH02L 4 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 9/16 Package mechanical data STD150NH02L TO-251 (IPAK) MECHANICAL DATA mm DIM. MIN. inch MAX. MIN. A 2.2 TYP. 2.4 0.086 0.094 A1 0.9 1.1 0.035 0.043 A3 0.7 1.3 0.027 0.051 B 0.64 0.9 0.025 0.031 B2 5.2 5.4 0.204 0.212 B3 TYP. MAX. 0.85 B5 0.033 0.3 0.012 B6 0.95 C 0.45 C2 0.48 D 6 E 6.4 6.6 0.037 0.6 0.017 0.023 0.6 0.019 0.023 6.2 0.236 0.244 0.252 0.260 G 4.4 4.6 0.173 0.181 H 15.9 16.3 0.626 0.641 L 9 9.4 0.354 0.370 L1 0.8 1.2 0.031 0.047 L2 0.8 1 0.031 0.039 A1 C2 A3 A C H B B6 = 1 = 2 G = = = E B2 = 3 B5 L D B3 L2 L1 0068771-E 10/16 STD150NH02L Package mechanical data 11/16 Packaging mechanical data 5 STD150NH02L Packaging mechanical data DPAK FOOTPRINT All dimensions are in millimeters TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. mm MIN. A B DIM. mm MIN. MAX. A0 6.8 7 0.267 0.275 B0 10.4 10.6 0.409 0.417 B1 12/16 inch MIN. MAX. 12.1 0.476 1.6 0.059 0.063 D 1.5 D1 1.5 E 1.65 1.85 F 7.4 7.6 0.291 0.299 K0 2.55 2.75 0.100 0.108 P0 3.9 4.1 0.153 0.161 P1 7.9 8.1 0.311 0.319 P2 1.9 2.1 0.075 0.082 R 40 W 15.7 0.059 0.065 0.073 1.574 16.3 0.618 0.641 MAX. MIN. 330 1.5 C 12.8 D 20.2 G 16.4 N 50 T TAPE MECHANICAL DATA inch MAX. 12.992 0.059 13.2 0.504 0.520 18.4 0.645 0.724 0.795 1.968 22.4 0.881 BASE QTY BULK QTY 2500 2500 STD150NH02L Buck converter - power losses estimation Appendix A Buck converter - power losses estimation Figure 18. Buck converter: power losses estimation The power losses associated with the FETs in a synchronous buck converter can be estimated using the equations shown in the table below. The formulas give a good approximation, for the sake of performance comparison, of how different pairs of devices affect the converter efficiency. However a very important parameter, the working temperature, is not considered. The real device behavior is really dependent on how the heat generated inside the devices is removed to allow for a safer working junction temperature. ● The low side (SW2) device requires: ● Very low RDS(on) to reduce conduction losses ● Small Qgls to reduce the gate charge losses ● Small Coss to reduce losses due to output capacitance ● Small Qrr to reduce losses on SW1 during its turn-on ● The Cgd/Cgs ratio lower than Vth/Vgg ratio especially with low drain to source ● voltage to avoid the cross conduction phenomenon; ● The high side (SW1) device requires: ● Small Rg and Ls to allow higher gate current peak and to limit the voltage feedback on the gate ● Small Qg to have a faster commutation and to reduce gate charge losses ● Low RDS(on) to reduce the conduction losses. 13/16 Buck converter - power losses estimation Table 7. STD150NH02L Power losses calculation High side switching (SW1) Low side switch (SW2) R DS(on)SW1 * I 2L * δ R DS(on)SW2 * I 2L * (1 − δ ) Pconduction Vin * (Q gsth(SW1) + Q gd(SW1) ) * f * Pswitching Recovery IL Ig Zero Voltage Switching (1) Not applicable Vin * Q rr(SW2) * f Conductio n Not applicable Vf(SW2) * I L * t deadtime * f Pgate(QG) Q g(SW1) * Vgg * f Q gls(SW2) * Vgg * f PQoss Vin * Q oss(SW1) * f Vin * Q oss(SW2) * f 2 2 Pdiode 1. Dissipated by SW1 during turn-on Table 8. Paramiters meaning Parameter d Duty-cycle Qgsth Post threshold gate charge Qgls Third quadrant gate charge Pconduction Pswitching 14/16 Meaning On state losses On-off transition losses Pdiode Conduction and reverse recovery diode losses Pgate Gate drive losses PQoss Output capacitance losses STD150NH02L 6 Revision history Revision history Table 9. Revision history Date Revision Changes 09-Sep-2004 6 Preliminary data 21-Jun-2005 7 Complete version with curves 28-Jul-2006 8 The document has been reformatted 20-Dec-2006 9 Typo mistake on Table 3. 15/16 STD150NH02L Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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