FREESCALE AO4240

AO4240
40V N-Channel MOSFET
General Description
The AO4240 uses trench MOSFET technology that is uniquely optimized to provide the most efficient high
frequency switching performance.Power losses are minimized due to an extremely low combination of R DS(ON)
and Crss. In addition,switching behavior is wellcontrolled with a "Schottky style" soft recovery body diode.
Features
VDS
40V
ID (at VGS=10V)
24A
RDS(ON) (at VGS=10V)
< 3.3mΩ
RDS(ON) (at VGS=4.5V)
< 4.3mΩ
SOIC-8
D
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Symbol
Parameter
VDS
Drain-Source Voltage
Gate-Source Voltage
VGS
TA=25°C
Continuous Drain
Current
Pulsed Drain Current
C
±20
V
19
A
170
IDM
Avalanche Current C
IAS
75
A
Avalanche energy L=0.1mH C
TA=25°C
EAS
281
mJ
Power Dissipation B
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A D
Maximum Junction-to-Lead
3.1
PD
TA=70°C
Junction and Storage Temperature Range
1/6
Units
V
24
ID
TA=70°C
Maximum
40
TJ, TSTG
Symbol
t ≤ 10s
Steady-State
Steady-State
W
2
RθJA
RθJL
-55 to 150
Typ
31
59
16
°C
Max
40
75
24
Units
°C/W
°C/W
°C/W
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AO4240
40V N-Channel MOSFET
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
Drain-Source Breakdown Voltage
BVDSS
Conditions
Min
ID=250µA, VGS=0V
IGSS
Gate-Body leakage current
VDS=0V, VGS=±20V
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250µA
1.2
ID(ON)
On state drain current
VGS=10V, VDS=5V
170
TJ=55°C
5
100
nA
2.3
V
2.7
3.3
4
4.9
VGS=4.5V, ID=20A
3.4
4.3
mΩ
90
1
V
4.5
A
Static Drain-Source On-Resistance
TJ=125°C
gFS
Forward Transconductance
VDS=5V, ID=20A
VSD
Diode Forward Voltage
IS=1A,VGS=0V
IS
Maximum Body-Diode Continuous Current
Reverse Transfer Capacitance
Rg
Gate resistance
A
0.67
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Crss
µA
1.7
VGS=10V, ID=20A
Output Capacitance
Units
V
1
Zero Gate Voltage Drain Current
Coss
Max
40
VDS=40V, VGS=0V
IDSS
RDS(ON)
Typ
VGS=0V, VDS=20V, f=1MHz
mΩ
S
4245
pF
1170
pF
69
pF
1
1.5
Ω
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge
62
87
nC
Qg(4.5V) Total Gate Charge
28
40
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
VGS=0V, VDS=0V, f=1MHz
VGS=10V, VDS=20V, ID=20A
0.5
nC
8
nC
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
Turn-Off Fall Time
trr
Body Diode Reverse Recovery Time
IF=20A, dI/dt=500A/µs
Qrr
Body Diode Reverse Recovery Charge IF=20A, dI/dt=500A/µs
74
VGS=10V, VDS=20V, RL=1.0Ω,
RGEN=3Ω
nC
10.5
9
ns
11.5
ns
42
ns
21
ns
23
ns
nC
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialTJ=25°C.
D. The RθJA is the sum of the thermal impedance from junction to lead RθJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedance which is measured with the device mounted on 1in2 FR-4 board with
2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
2/6
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AO4240
40V N-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
100
100
VDS=5V
4.5V
80
80
10V
60
ID(A)
ID (A)
60
3V
125°C
40
40
20
20
25°C
VGS=2.5V
0
0
0
1
2
3
4
0
5
6
2
3
4
5
6
Normalized On-Resistance
1.8
5
RDS(ON) (mΩ
Ω)
1
VGS(Volts)
Figure 2: Transfer Characteristics (Note E)
VDS (Volts)
Fig 1: On-Region Characteristics (Note E)
4
VGS=4.5V
3
2
VGS=10V
1
VGS=10V
ID=20A
1.6
1.4
17
5
2
VGS=4.5V10
1.2
ID=20A
1
0.8
0
0
5
0
10
15
20
25
30
ID (A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage (Note E)
25
50
75
100
125
150
175
0
Temperature (°C)
Figure 4: On-Resistance vs. Junction
18Temperature
(Note E)
8
1.0E+02
ID=20A
1.0E+01
40
125°C
4
1.0E-01
1.0E-02
25°C
1.0E-03
2
25°C
1.0E-04
1.0E-05
0
2
6
8
10
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
(Note E)
3/6
125°C
1.0E+00
IS (A)
RDS(ON) (mΩ
Ω)
6
4
0.0
0.2
0.4
0.6
0.8
1.0
1.2
VSD (Volts)
Figure 6: Body-Diode Characteristics (Note E)
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AO4240
40V N-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
6000
10
VDS=20V
ID=20A
5000
Capacitance (pF)
VGS (Volts)
8
6
4
2
4000
3000
Coss
2000
1000
0
Crss
0
0
10
20
30
40
50
60
Qg (nC)
Figure 7: Gate-Charge Characteristics
70
0
1000
10
20
30
VDS (Volts)
Figure 8: Capacitance Characteristics
40
1000.0
TA=100°C
TA=25°C
100
TA=150°C
TA=125°C
100.0
ID (Amps)
IAR (A) Peak Avalanche Current
Ciss
RDS(ON)
limited
10µs
10.0
100µs
1.0
10
1ms
10ms
TJ(Max)=150°C
TA=25°C
0.1
10s
DC
0.0
1
1
0.01
10
100
1000
Time in avalanche, tA (µ
µs)
Figure 12: Single Pulse Avalanche capability
(Note C)
0.1
1
VDS (Volts)
10
100
Figure 10: Maximum Forward Biased
Safe Operating Area (Note F)
10000
TA=25°C
Power (W)
1000
100
10
1
1E-05
0.001
0.1
10
1000
Pulse Width (s)
Figure 11: Single Pulse Power Rating Junction-to-Ambient (Note F)
4/6
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AO4240
40V N-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
Zθ JA Normalized Transient
Thermal Resistance
10
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
1
RθJA=75°C/W
0.1
PD
0.01
Single Pulse
Ton
T
0.001
1E-05
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 12: Normalized Maximum Transient Thermal Impedance (Note F)
5/6
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AO4240
40V N-Channel MOSFET
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
+ Vds
VDC
-
Qgs
Qgd
VDC
-
DUT
Vgs
Ig
Charge
Resistive Switching Test Circuit & Waveforms
RL
Vds
Vds
90%
+ Vdd
DUT
Vgs
VDC
-
Rg
10%
Vgs
Vgs
t d(on)
tr
t d(off)
t on
tf
toff
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
2
E AR = 1/2 LIAR
Vds
BVDSS
Vds
Id
+ Vdd
Vgs
Vgs
I AR
VDC
-
Rg
Id
DUT
Vgs
Vgs
Diode Recovery Test Circuit & Waveforms
Q rr = - Idt
Vds +
DUT
Vds Isd
Vgs
Ig
6/6
Vgs
L
Isd
+ Vdd
t rr
dI/dt
I RM
Vdd
VDC
-
IF
Vds
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