DATA SHEET BIPOLAR DIGITAL INTEGRATED CIRCUIT PPB1509GV 1GHz INPUT DIVIDE BY 2, 4, 8 PRESCALER IC FOR PORTABLE SYSTEMS PPB1509GV is a divide by 2, 4, 8 prescaler IC for portable radio or cellular telephone applications. PPB1509GV is a shrink package version of PPB587G so that this small package contributes to reduce the mounting space. PPB1509GV is manufactured using NEC’s high fT NESATTM IV silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability. FEATURES x High toggle frequency : fin = 50 MHz to 700 MHz @ y 2, 50 MHz to 800 MHz @ y 4, 50 MHz to 1000 MHz @ y 8 x Low current consumption : 5.0 mA @ V CC = 3.0 V x High-density surface mounting : 8 pin plastic SSOP (175mil) x Supply voltage : VCC = 2.2 to 5.5 V x Selectable division : y 2, y 4, y 8 APPLICATION x Portable radio systems x Cellular/cordless telephone 2nd Local prescaler and so on. ORDERING INFORMATION PART NUMBER PPB1509GV-E1 PACKAGE MARKING SUPPLYING FORM 8 pin plastic SSOP 1509 Embossed tape 8 mm wide. Pin 1 is in tape pull-out (175 mil) direction. 1000p/reel. Remarks : To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: PPB1509GV) Caution:Electro-static sensitive devices Document No. P10769EJ2V0DS00 (2nd edition) Date Published September 1997 N Printed in Japan © 1996 PPB1509GV PIN CONNECTION (Top View) 1 8 2 7 3 6 4 5 Pin NO. Pin Name 1 VCC1 2 IN 3 IN 4 GND 5 SW1 6 SW2 7 OUT 8 VCC2 PRODUCT LINE-UP y2 y4 ICC VCC fin fin fin (mA) (V) (MHz) (MHz) (MHz) PPB587 G 5.5 2.2 to 3.5 50 to 300 50 to 600 50 to 1000 8 pin SOP (225 mil) PPB1509 GV 5.0 2.2 to 5.5 50 to 700 50 to 800 50 to 1000 8 pin SSOP (175 mil) Product No. y8 Package Pin Connection NEC Original Remarks This table shows the TYP values of main parameters. Please refer to ELECTRICAL CHARACTERISTICS. PPB587G is discontinued. INTERNAL BLOCK DIAGRAM D IN IN Q CLK D Q CLK Q Q CLK Q SW1 2 D OUT Q SW2 PPB1509GV SYSTEM APPLICATION EXAMPLE One of the example for usage DEMO RX I Q VCO VCO ÷N PLL PLL SW ÷N 0° TX PA µ PB1509GV I φ 90° Q This block diagram schematically shows the PPB1509GV’s location in one of the example application system. The other applications are also acceptable for divider use. 3 PPB1509GV Pin Explanations Applied Pin Voltage Voltage VCC1 2.2 to 5.5 • 2 IN • 1.7 to 4.95 Signal input pin. This pin should be coupled to signal source with capacitor (eg 1000 pF) for DC cut. 3 IN • 1.7 to 4.95 Signal input bypass pin. This pin must be equipped with bypass capacitor (eg 1000 pF) to minimize ground impedance. 4 GND 0 • Ground pin. Ground pattern on the board should be formed as wide as possible to minimize ground impedance. 5 SW1 H/L • Divide ratio control pin. Divide ratio can be determined by following applied level to these pins. 6 SW2 H/L • Pin No. Symbol 1 Functions and Explanation Power supply pin of a input amplifier and dividers. This pin must be equipped with bypass capacitor (eg 1000 pF) to minimize ground impedance. SW2 SW1 H L H 1/2 1/4 L 1/4 1/8 These pins must be each equipped with bypass capacitor to minimize their impedance. 7 OUT • 1.0 to 4.7 Divided frequency output pin. This pin is designed as emitter follower output. This pin can output 0.1 VP-P min with 200 : load. This pin should be coupled to load device with capacitor (eg 1000 pF) for DC cut. 8 4 VCC2 2.2 to 5.5 • Power supply pin of output buffer amplifier. This pin must be equipped with bypass capacitor (eg 1000 pF) to minimize ground impedance. PPB1509GV ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL CONDITION RATINGS UNIT Supply voltage VCC TA = +25 qC 6.0 V Input voltage Vin TA = +25 qC, SW1, SW2 pins 6.0 V Total power dissipation PD Mounted on double sided copper clad 50 u 50 u 1.6 mm epoxy glass PWB (TA = +85 qC) 250 mW Operating ambient temperature TA ð40 to +85 qC Storage temperature Tstg ð55 to +150 qC RECOMMENDED OPERATING CONDITIONS PARAMETER SYMBOL MIN. TYP. MAX. UNIT Supply voltage VCC 2.2 3.0 5.5 V Operating ambient temperature TA ð40 +25 +85 qC NOTICE ELECTRICAL CHARACTERISTICS (TA = ð40 to +85 qC, VCC = 2.2 to 5.5 V) PARAMETERS Circuit current SYMBOLS ICC TEST CONDITIONS MIN. TYP. MAX. UNIT No signals, VCC = 3.0 V 3.5 5.0 5.9 mA Upper Limit Operating Frequency 1 fin(U)1 Pin = ð20 to 0 dBm 500 • • MHz Upper Limit Operating Frequency 2 fin(U)2 Pin = ð20 to ð5 dBm @ y 2 @y4 @y8 700 800 1000 • • • • • • MHz Lower Limit Operating Frequency 1 fin(L)1 Pin = ð20 to 0 dBm • • 50 MHz Lower Limit Operating Frequency 2 fin(L)2 Pin = ð20 to ð5 dBm • • 500 MHz Input Power 1 Pin1 fin = 50 MHz to 1000 MHz ð20 • ð5 dBm Input Power 2 Pin2 fin = 50 MHz to 500 MHz ð20 • 0 dBm Output Voltage Vout RL = 200 : 0.1 0.2 • VP-P Divide ratio control input high VIH1 Connection in the test circuit VCC VCC VCC • Divide ratio control input low VIL1 Connection in the test circuit OPEN or GND OPEN or OPEN or • GND GND Divide ratio control input high VIH2 Connection in the test circuit VCC VCC VCC • Divide ratio control input low VIL2 Connection in the test circuit OPEN or OPEN or OPEN or • GND GND GND 5 PPB1509GV TEST CIRCUIT 1000 pF Power Supply C7 C1 1 VCC1 VCC2 8 High impedance C2 2 IN OUT Oscilloscope 7 C6 50 Ω 3 IN SW2 R1 150 Ω 6 C5 C3 Signal Generator 4 GND SW1 50 Ω 5 C4 Counter (or Spectrum Analizer) EQUIPMENTS Signal Generator (HP-8665A) Counter (HP-5350B) for measuring input sensitivity (Spectrum Analyzer for measuring output frequency) Oscilloscope for measuring output swing (In measuring output power on Spectrum Analyzer, oscilloscope should be turned off.) Divide Ratio Setting SW2 SW1 H L H 1/2 1/4 L 1/4 1/8 H: SW pin should be connected to VCC1 pin. L: SW pin should be opened or connected to GND. 6 PPB1509GV ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD 1P VCC1 VCC2 C1 IN IN C7 OUT C6 R1 OUT C4 C 5 C3 C2 SW2 µ PB1506/08/09GV SW1 Component List Notes for evaluation board No. Value C1 to C7 1000 pF (1) 35 Pm thick double sided copper clad 50 u 50 u 0.4 mm polyimide board 150 : (2) Back side : GND pattern R1 Note (3) Solder plated on pattern (4) O O : Through holes (5) : Remove pattern Note For Output load of IC, R1 is determined as follows; R1 + Impedance of measurement equipment = 200 :. The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. The usage and applications of PPB1509GV should be referred to the application note (Document No. P12611E). 7 PPB1509GV CHARACTERISTIC CURVES Circuit Current vs. Supply Voltage 9 8 T A = –40°C Circuit Current ICC (mA) 7 6 T A = +25°C 5 T A = +85°C Recommended operating range 4 3 2 1 0 0 1 4 2 3 Supply Voltage VCC (V) 5 6 Divide by 2 mode (Guaranteed operating window: VCC = 2.2 to 5.5 V, TA = –40 to +85°C) Input power vs. Input frequency Input power vs. Input frequency 20 20 0 –10 10 V CC V CC = 3.0 V = 5.5 V V CC = 2.2 V Guaranteed operating window –20 –30 V CC = 2.2 V –40 –50 V CC = 3.0 V V CC = 5.5 V TA = +25°C –60 10 100 Input frequency fin (MHz) 8 0 Input power Pin (dBm) Input power Pin (dBm) 10 T A = +85°C Guaranteed operating window –10 –20 T A = +85°C –30 –40 –50 1000 2000 T A = +25°C T A = –40°C –60 10 T A = –40°C VCC = 3.0 V T A = +25°C 100 Input frequency fin (MHz) 1000 2000 PPB1509GV Input power vs. Input frequency 20 Input power vs. Input frequency 20 T A = +25°C 10 T A = –40°C 0 Input power Pin (dBm) T A = +85°C 0 Input power Pin (dBm) T A = +25°C T A = –40°C T A = +85°C 10 Guaranteed operating window –10 –20 –30 T A = +85°C –40 Guaranteed operating window –10 –20 –30 T A = +85°C –40 T A = +25°C –50 T A = –40°C –50 T A = +25°C T A = –40°C –60 10 VCC = 2.2 V 100 Input frequency fin (MHz) –60 10 1000 2000 Output voltage swing vs. Input frequency T A = +85°C T A = +25°C T A = –40°C T A = +85°C T A = –40°C 0.1 0 10 100 Input frequency fin (MHz) 0.2 V CC = 2.2 V 0.1 0 10 1000 2000 TA = +85°C Pin = 0 dBm V CC = 5.5 V 0.2 V CC = 2.2 V 0.1 100 Input frequency fin (MHz) 1000 2000 V CC = 5.5 V 0.3 V CC = 3.0 V 0 10 100 Input frequency fin (MHz) Output voltage swing vs. Input frequency Output voltage swing VP-P (V) Output voltage swing VP-P (V) 0.3 V CC = 5.5 V V CC = 3.0 V Output voltage swing vs. Input frequency TA = –40°C Pin = 0 dBm 1000 2000 0.3 Output voltage swing VP-P (V) Output voltage swing VP-P (V) TA = +25°C Pin = 0 dBm T A = +25°C 0.2 100 Input frequency fin (MHz) Output voltage swing vs. Input frequency VCC = 3.0 V Pin = 0 dBm 0.3 VCC = 5.5 V 1000 2000 V CC = 3.0 V 0.2 V CC = 2.2 V 0.1 0 10 100 Input frequency fin (MHz) 1000 2000 9 PPB1509GV Divide by 4 mode (Guaranteed operating window: VCC = 2.2 to 5.5 V, TA = –40 to +85°C) Input power vs. Input frequency Input power vs. Input frequency 20 20 10 V CC 0 V CC = 2.2 V Input power Pin (dBm) Input power Pin (dBm) 0 10 V CC = 5.5 V = 3.0 V Guaranteed operating window –10 –20 V CC = 2.2 V –30 –40 V CC = 5.5 V –50 –60 10 V CC = 3.0 V V CC = 5.5 V 100 1000 2000 Input frequency fin (MHz) –40 10 Input power Pin (dBm) Input power Pin (dBm) Guaranteed operating window T A = +85°C T A = –40°C 10 VCC = 2.2 V 1000 2000 T A = +85°C T A = +25°C Guaranteed operating window –20 T A = –40°C –30 T A = +85°C –40 –50 100 Input frequency fin (MHz) T A = –40°C –10 T A = +25°C –50 –60 10 T A = +25°C 100 1000 2000 Input frequency fin (MHz) 0 –20 –40 VCC = 3.0 V Input power vs. Input frequency T A = +25°C T A = –40°C –30 T A = –40°C 20 10 –10 T A = +85°C –30 –60 10 T A = +85°C 0 Guaranteed operating window –20 Input power vs. Input frequency 20 T A = –40°C T A = +25°C –10 –50 TA = +25°C T A = +85°C –60 10 T A = –40°C T A = +25°C VCC = 5.5 V 100 Input frequency fin (MHz) 1000 2000 PPB1509GV Divide by 8 mode (Guaranteed operating window: VCC = 2.2 to 5.5 V, TA = –40 to +85°C) Input power vs. Input frequency Input power vs. Input frequency 20 20 10 V CC = 5.5 V 10 V CC = 2.2 V = 3.0 V 0 Guaranteed operating window –10 –20 V CC = 2.2 V –30 –40 Input power Pin (dBm) Input power Pin (dBm) 0 V CC T A = +25°C T A = –40°C T A = –40°C T A = +85°C Guaranteed operating window –10 –20 –30 T A = +85°C –40 T A = –40°C –50 –60 10 TA = +25°C –50 V CC = 5.5 V V CC = 3.0 V 100 Input frequency fin (MHz) –60 10 1000 2000 Input power vs. Input frequency 20 T A = +85°C T A = +25°C Guaranteed operating window T A = +85°C –30 –40 –50 –30 T A = +85°C –40 T A = +25°C 1000 2000 T A = +85°C T A = +25°C –20 –50 100 Input frequency fin (MHz) 1000 2000 Guaranteed operating window –10 T A = –40°C VCC = 2.2 V T A = –40°C 0 Input power Pin (dBm) Input power Pin (dBm) T A = –40°C –20 –60 10 100 Input frequency fin (MHz) Input power vs. Input frequency 10 –10 T A = +25°C 20 10 0 T A = +25°C VCC = 3.0 V –60 10 T A = –40°C VCC = 5.5 V T A = +25°C 100 Input frequency fin (MHz) 1000 2000 11 PPB1509GV S11 vs. Input Frequency S11 REF 1.0 Units/ 2 200.0 mUnits/ 55.375 Ω – 142.79 Ω VCC1 = VCC2 = 3.0 V, SW1 = SW2 = 3.0 V FREQUENCY MHz MARKER 2 700.0 MHz 1 2 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 3 START 0.050000000 GHz STOP 1.000000000 GHz S22 vs. Output Frequency S22 REF 1.0 Units/ 200.0 mUnits/ Z 50 MHz 149.09 Ω + j 14.86 Ω 350 MHz 194.21 Ω – j 36.64 Ω START STOP 12 0.050000000 GHz 0.350000000 GHz S11 MAG .929 .898 .866 .840 .834 .819 .803 .792 .787 .771 ANG –6.7 –10.5 –13.6 –15.9 –19.1 –21.9 –24.7 –27.0 –30.0 –32.7 PPB1509GV PACKAGE DIMENSIONS (UNIT: mm) 8 PIN PLASTIC SSOP (175 mil) 8 5 3° –3° +7° Detail of lead end 1 4 4.94±0.2 3.2±0.1 0.15–0.05 0.65 0.1±0.1 0.87±0.2 +0.10 1.5±0.1 1.8 MAX. 3.0 MAX. 0.5±0.2 0.575 MAX. +0.10 0.3 –0.05 0.10 M 0.15 13 PPB1509GV NOTE ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation). (3) Keep the wiring length of the ground pins as short as possible. (4) Connect a bypass capacitor (e.g. 1000 pF) to the VCC pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. PPB1509GV Recommended Soldering method Infrared ray reflow Soldering conditions condition symbol Package peak temperature: 235qC, Hour: within 30 s. (more than 210qC), IR35-00-3 Time: 3 times, Limited days: no.* VPS Package peak temperature: 215qC, Hour: within 40 s. (more than 200qC), VP15-00-3 Time: 3 times, Limited days: no.* Wave soldering Soldering tub temperature: less than 260qC, Hour: within 10 s. WS60-00-1 Time: 1 time, Limited days: no. Pin part heating Pin area temparature: less than 300qC, Hour: within 3 s./pin Limited days: no.* * It is the storage days after opening a dry pack, the storage conditions are 25qC, less than 65% RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). 14 PPB1509GV [MEMO] 15 PPB1509GV ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96. 5